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JPS5268369A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5268369A
JPS5268369A JP50145471A JP14547175A JPS5268369A JP S5268369 A JPS5268369 A JP S5268369A JP 50145471 A JP50145471 A JP 50145471A JP 14547175 A JP14547175 A JP 14547175A JP S5268369 A JPS5268369 A JP S5268369A
Authority
JP
Japan
Prior art keywords
streak
semiconductor device
unifying
enhance
insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50145471A
Other languages
Japanese (ja)
Other versions
JPS5846862B2 (en
Inventor
Manabu Bonshihara
Toshio Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50145471A priority Critical patent/JPS5846862B2/en
Publication of JPS5268369A publication Critical patent/JPS5268369A/en
Publication of JPS5846862B2 publication Critical patent/JPS5846862B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate position discrepancy of lead streak as well as to enhance the strength by unifying and reinforcing part of whole of the conductive area to be connected to semiconductor element electrode section using insulation streak of almost same shape.
JP50145471A 1975-12-05 1975-12-05 Hand tie souchi Expired JPS5846862B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50145471A JPS5846862B2 (en) 1975-12-05 1975-12-05 Hand tie souchi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50145471A JPS5846862B2 (en) 1975-12-05 1975-12-05 Hand tie souchi

Publications (2)

Publication Number Publication Date
JPS5268369A true JPS5268369A (en) 1977-06-07
JPS5846862B2 JPS5846862B2 (en) 1983-10-19

Family

ID=15386000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50145471A Expired JPS5846862B2 (en) 1975-12-05 1975-12-05 Hand tie souchi

Country Status (1)

Country Link
JP (1) JPS5846862B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134853U (en) * 1981-02-17 1982-08-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134853U (en) * 1981-02-17 1982-08-23
JPH0241866Y2 (en) * 1981-02-17 1990-11-08

Also Published As

Publication number Publication date
JPS5846862B2 (en) 1983-10-19

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