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JPS5263671A - Partial exposure of resin sealed type electronic parts - Google Patents

Partial exposure of resin sealed type electronic parts

Info

Publication number
JPS5263671A
JPS5263671A JP13982375A JP13982375A JPS5263671A JP S5263671 A JPS5263671 A JP S5263671A JP 13982375 A JP13982375 A JP 13982375A JP 13982375 A JP13982375 A JP 13982375A JP S5263671 A JPS5263671 A JP S5263671A
Authority
JP
Japan
Prior art keywords
electronic parts
type electronic
sealed type
partial exposure
resin sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13982375A
Other languages
Japanese (ja)
Other versions
JPS53273B2 (en
Inventor
Yoshio Uchida
Makoto Nozu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP13982375A priority Critical patent/JPS5263671A/en
Publication of JPS5263671A publication Critical patent/JPS5263671A/en
Publication of JPS53273B2 publication Critical patent/JPS53273B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To expose predetermined portions of electronic parts by selectively removing the resin on the portions to be exposed, and making the resin thickness there thinner than those on other portions, then dipping the electronic part into a resin solution.
COPYRIGHT: (C)1977,JPO&Japio
JP13982375A 1975-11-20 1975-11-20 Partial exposure of resin sealed type electronic parts Granted JPS5263671A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13982375A JPS5263671A (en) 1975-11-20 1975-11-20 Partial exposure of resin sealed type electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13982375A JPS5263671A (en) 1975-11-20 1975-11-20 Partial exposure of resin sealed type electronic parts

Publications (2)

Publication Number Publication Date
JPS5263671A true JPS5263671A (en) 1977-05-26
JPS53273B2 JPS53273B2 (en) 1978-01-06

Family

ID=15254291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13982375A Granted JPS5263671A (en) 1975-11-20 1975-11-20 Partial exposure of resin sealed type electronic parts

Country Status (1)

Country Link
JP (1) JPS5263671A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125097A (en) * 1994-10-27 1996-05-17 Nec Corp Lead frame

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427208U (en) * 1990-06-27 1992-03-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125097A (en) * 1994-10-27 1996-05-17 Nec Corp Lead frame

Also Published As

Publication number Publication date
JPS53273B2 (en) 1978-01-06

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