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JPS5253941A - Method for conductive coating and adhesives - Google Patents

Method for conductive coating and adhesives

Info

Publication number
JPS5253941A
JPS5253941A JP12967175A JP12967175A JPS5253941A JP S5253941 A JPS5253941 A JP S5253941A JP 12967175 A JP12967175 A JP 12967175A JP 12967175 A JP12967175 A JP 12967175A JP S5253941 A JPS5253941 A JP S5253941A
Authority
JP
Japan
Prior art keywords
adhesives
conductive coating
adhesive
conductive
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12967175A
Other languages
Japanese (ja)
Other versions
JPS5922754B2 (en
Inventor
Haruki Furukawa
Akira Nozawa
Tomofumi Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP12967175A priority Critical patent/JPS5922754B2/en
Publication of JPS5253941A publication Critical patent/JPS5253941A/en
Publication of JPS5922754B2 publication Critical patent/JPS5922754B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE: A conductive adhesive without causing crack initiation in the adhesive layer even in an environment over a wide temperature range, prepared by adding a conductive metallic powder and a granular component to the adhesive.
COPYRIGHT: (C)1977,JPO&Japio
JP12967175A 1975-10-28 1975-10-28 Conductive adhesive method Expired JPS5922754B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12967175A JPS5922754B2 (en) 1975-10-28 1975-10-28 Conductive adhesive method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12967175A JPS5922754B2 (en) 1975-10-28 1975-10-28 Conductive adhesive method

Publications (2)

Publication Number Publication Date
JPS5253941A true JPS5253941A (en) 1977-04-30
JPS5922754B2 JPS5922754B2 (en) 1984-05-29

Family

ID=15015262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12967175A Expired JPS5922754B2 (en) 1975-10-28 1975-10-28 Conductive adhesive method

Country Status (1)

Country Link
JP (1) JPS5922754B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006063120A (en) * 2004-08-25 2006-03-09 Sumitomo Bakelite Co Ltd Resin composition and semiconductor product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006063120A (en) * 2004-08-25 2006-03-09 Sumitomo Bakelite Co Ltd Resin composition and semiconductor product

Also Published As

Publication number Publication date
JPS5922754B2 (en) 1984-05-29

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