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JPS5229749A - Optical equipment and its manufacturing process - Google Patents

Optical equipment and its manufacturing process

Info

Publication number
JPS5229749A
JPS5229749A JP10619875A JP10619875A JPS5229749A JP S5229749 A JPS5229749 A JP S5229749A JP 10619875 A JP10619875 A JP 10619875A JP 10619875 A JP10619875 A JP 10619875A JP S5229749 A JPS5229749 A JP S5229749A
Authority
JP
Japan
Prior art keywords
manufacturing process
optical
optical equipment
optical element
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10619875A
Other languages
Japanese (ja)
Other versions
JPS5731665B2 (en
Inventor
Kenji Ikeda
Wataru Suzaki
Toshio Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10619875A priority Critical patent/JPS5229749A/en
Publication of JPS5229749A publication Critical patent/JPS5229749A/en
Publication of JPS5731665B2 publication Critical patent/JPS5731665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:Optical element and optical guide section are connected free to be detached by connecting the optical guide section to the optical transmission section which receives or emits light of the optical element mounted on a substrate 20 thru a guide hole formed on its enveloping material.
JP10619875A 1975-09-02 1975-09-02 Optical equipment and its manufacturing process Granted JPS5229749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10619875A JPS5229749A (en) 1975-09-02 1975-09-02 Optical equipment and its manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10619875A JPS5229749A (en) 1975-09-02 1975-09-02 Optical equipment and its manufacturing process

Publications (2)

Publication Number Publication Date
JPS5229749A true JPS5229749A (en) 1977-03-05
JPS5731665B2 JPS5731665B2 (en) 1982-07-06

Family

ID=14427465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10619875A Granted JPS5229749A (en) 1975-09-02 1975-09-02 Optical equipment and its manufacturing process

Country Status (1)

Country Link
JP (1) JPS5229749A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410469A (en) * 1980-11-28 1983-10-18 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a module for a fiber optic link
EP0563010A2 (en) * 1992-03-23 1993-09-29 Ciba-Geigy Ag Method of preparation of nucleosides
JPH06204622A (en) * 1992-10-14 1994-07-22 Internatl Business Mach Corp <Ibm> Optical module and sealing of capsule
WO2014196263A1 (en) * 2013-06-07 2014-12-11 株式会社村田製作所 Optical component, optical plug, optical connector, and optical-component production method
US20190129108A1 (en) * 2017-10-31 2019-05-02 Versalume LLC Modular Laser Connector Packaging System and Method
US10551542B1 (en) 2018-12-11 2020-02-04 Corning Incorporated Light modules and devices incorporating light modules

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015180914A (en) * 2014-03-04 2015-10-15 株式会社東芝 Optical link device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918344A (en) * 1972-06-12 1974-02-18
JPS524852A (en) * 1975-06-05 1977-01-14 Western Electric Co Sealing of device capsule unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918344A (en) * 1972-06-12 1974-02-18
JPS524852A (en) * 1975-06-05 1977-01-14 Western Electric Co Sealing of device capsule unit

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410469A (en) * 1980-11-28 1983-10-18 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a module for a fiber optic link
EP0563010A2 (en) * 1992-03-23 1993-09-29 Ciba-Geigy Ag Method of preparation of nucleosides
EP0563010A3 (en) * 1992-03-23 1994-09-14 Ciba Geigy Ag Method of preparation of nucleosides
JPH06204622A (en) * 1992-10-14 1994-07-22 Internatl Business Mach Corp <Ibm> Optical module and sealing of capsule
WO2014196263A1 (en) * 2013-06-07 2014-12-11 株式会社村田製作所 Optical component, optical plug, optical connector, and optical-component production method
JP5892292B2 (en) * 2013-06-07 2016-03-23 株式会社村田製作所 Optical plug and optical connector
US20190129108A1 (en) * 2017-10-31 2019-05-02 Versalume LLC Modular Laser Connector Packaging System and Method
US10838158B2 (en) 2017-10-31 2020-11-17 Corning Incorporated Modular laser connector packaging system and method
US10551542B1 (en) 2018-12-11 2020-02-04 Corning Incorporated Light modules and devices incorporating light modules
US10598840B1 (en) 2018-12-11 2020-03-24 Corning Incorporated Light modules and devices incorporating light modules
US10768352B2 (en) 2018-12-11 2020-09-08 Corning Incorporated Light modules and devices incorporating light modules

Also Published As

Publication number Publication date
JPS5731665B2 (en) 1982-07-06

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