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JPS522277A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS522277A
JPS522277A JP7670475A JP7670475A JPS522277A JP S522277 A JPS522277 A JP S522277A JP 7670475 A JP7670475 A JP 7670475A JP 7670475 A JP7670475 A JP 7670475A JP S522277 A JPS522277 A JP S522277A
Authority
JP
Japan
Prior art keywords
soldering device
voids
solder
soldering
development
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7670475A
Other languages
Japanese (ja)
Inventor
Kunishige Kishi
Akira Kikuta
Mitsuo Ito
Kenji Akeyama
Yoshio Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7670475A priority Critical patent/JPS522277A/en
Publication of JPS522277A publication Critical patent/JPS522277A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent the development of voids in a soldering material such as solder.
COPYRIGHT: (C)1977,JPO&Japio
JP7670475A 1975-06-24 1975-06-24 Soldering device Pending JPS522277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7670475A JPS522277A (en) 1975-06-24 1975-06-24 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7670475A JPS522277A (en) 1975-06-24 1975-06-24 Soldering device

Publications (1)

Publication Number Publication Date
JPS522277A true JPS522277A (en) 1977-01-08

Family

ID=13612892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7670475A Pending JPS522277A (en) 1975-06-24 1975-06-24 Soldering device

Country Status (1)

Country Link
JP (1) JPS522277A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56143853U (en) * 1980-03-27 1981-10-30
US4320865A (en) * 1980-03-21 1982-03-23 National Semiconductor Corporation Apparatus for attachment of die to heat sink
JPS57138144A (en) * 1981-02-20 1982-08-26 Hitachi Ltd Attaching method for pellet
JPS62183131A (en) * 1986-02-06 1987-08-11 Fuji Electric Co Ltd Manufacturing method of semiconductor device
JPH0331087U (en) * 1989-08-01 1991-03-26
JPH0336361U (en) * 1989-08-17 1991-04-09
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
US5090651A (en) * 1990-01-31 1992-02-25 Electrovert Ltd. Gas curtain additives and zoned tunnel for soldering
JPH0426669U (en) * 1990-06-29 1992-03-03
JPH0475665U (en) * 1990-11-15 1992-07-02

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4320865A (en) * 1980-03-21 1982-03-23 National Semiconductor Corporation Apparatus for attachment of die to heat sink
JPS56143853U (en) * 1980-03-27 1981-10-30
JPS57138144A (en) * 1981-02-20 1982-08-26 Hitachi Ltd Attaching method for pellet
JPS62183131A (en) * 1986-02-06 1987-08-11 Fuji Electric Co Ltd Manufacturing method of semiconductor device
JPH0331087U (en) * 1989-08-01 1991-03-26
JPH0336361U (en) * 1989-08-17 1991-04-09
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
US5090651A (en) * 1990-01-31 1992-02-25 Electrovert Ltd. Gas curtain additives and zoned tunnel for soldering
JPH0426669U (en) * 1990-06-29 1992-03-03
JPH0475665U (en) * 1990-11-15 1992-07-02

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