JPS522111B1 - - Google Patents
Info
- Publication number
- JPS522111B1 JPS522111B1 JP47055694A JP5569472A JPS522111B1 JP S522111 B1 JPS522111 B1 JP S522111B1 JP 47055694 A JP47055694 A JP 47055694A JP 5569472 A JP5569472 A JP 5569472A JP S522111 B1 JPS522111 B1 JP S522111B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
- H05K13/0491—Hand tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15803371A | 1971-06-29 | 1971-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS522111B1 true JPS522111B1 (ja) | 1977-01-19 |
Family
ID=22566435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP47055694A Pending JPS522111B1 (ja) | 1971-06-29 | 1972-06-06 |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS522111B1 (ja) |
AU (1) | AU4245972A (ja) |
BR (1) | BR7204264D0 (ja) |
CA (1) | CA957908A (ja) |
DE (1) | DE2223195C3 (ja) |
FR (1) | FR2143967B1 (ja) |
GB (1) | GB1357066A (ja) |
IT (1) | IT953758B (ja) |
SE (1) | SE388322B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4159074A (en) * | 1976-05-12 | 1979-06-26 | Basseches Mark T | Desoldering method |
US5148969A (en) * | 1991-11-27 | 1992-09-22 | Digital Equipment Corporation | Component reclamation apparatus and method |
US5478009A (en) * | 1994-08-10 | 1995-12-26 | International Business Machines Corporation | Selective removal of a single solder ball from an array of solder balls |
GB2364011A (en) * | 2000-06-21 | 2002-01-16 | Michael John Radley Young | Ultrasonic cutting tool |
DE102004034091A1 (de) * | 2004-07-15 | 2006-02-02 | Sms Demag Ag | Verfahren und Vorrichtung zur Reduzierung der Haftreibung zwischen Haspel und Coil |
GB201416336D0 (en) | 2014-09-16 | 2014-10-29 | Rolls Royce Plc | Bonding patch |
CN211184442U (zh) * | 2019-11-26 | 2020-08-04 | 惠州市成泰自动化科技有限公司 | 同步拆pin机构 |
-
1972
- 1972-03-29 CA CA138,508A patent/CA957908A/en not_active Expired
- 1972-04-26 IT IT2351972A patent/IT953758B/it active
- 1972-05-12 DE DE19722223195 patent/DE2223195C3/de not_active Expired
- 1972-05-18 AU AU42459/72A patent/AU4245972A/en not_active Expired
- 1972-05-19 GB GB2356472A patent/GB1357066A/en not_active Expired
- 1972-05-26 SE SE691472A patent/SE388322B/xx unknown
- 1972-06-06 JP JP47055694A patent/JPS522111B1/ja active Pending
- 1972-06-27 FR FR7224038A patent/FR2143967B1/fr not_active Expired
- 1972-06-29 BR BR426472A patent/BR7204264D0/pt unknown
Also Published As
Publication number | Publication date |
---|---|
AU4245972A (en) | 1973-11-22 |
GB1357066A (en) | 1974-06-19 |
FR2143967B1 (ja) | 1974-07-26 |
SE388322B (sv) | 1976-09-27 |
FR2143967A1 (ja) | 1973-02-09 |
DE2223195C3 (de) | 1973-12-13 |
CA957908A (en) | 1974-11-19 |
DE2223195A1 (de) | 1973-01-11 |
IT953758B (it) | 1973-08-10 |
DE2223195B2 (de) | 1973-05-17 |
BR7204264D0 (pt) | 1973-05-17 |