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JPS52155052A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52155052A
JPS52155052A JP7236776A JP7236776A JPS52155052A JP S52155052 A JPS52155052 A JP S52155052A JP 7236776 A JP7236776 A JP 7236776A JP 7236776 A JP7236776 A JP 7236776A JP S52155052 A JPS52155052 A JP S52155052A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
damaging
contamination
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7236776A
Other languages
Japanese (ja)
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7236776A priority Critical patent/JPS52155052A/en
Publication of JPS52155052A publication Critical patent/JPS52155052A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To prevent the damaging and contamination of semiconductor substrate and wiring materials by removing unnecessary metal films without using strong acid or strong alkali solutions at the time of forming a semiconductor device having metal bumps.
COPYRIGHT: (C)1977,JPO&Japio
JP7236776A 1976-06-18 1976-06-18 Production of semiconductor device Pending JPS52155052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7236776A JPS52155052A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7236776A JPS52155052A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52155052A true JPS52155052A (en) 1977-12-23

Family

ID=13487259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7236776A Pending JPS52155052A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52155052A (en)

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