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JPS52155049A - Solder electrode formation method - Google Patents

Solder electrode formation method

Info

Publication number
JPS52155049A
JPS52155049A JP7198576A JP7198576A JPS52155049A JP S52155049 A JPS52155049 A JP S52155049A JP 7198576 A JP7198576 A JP 7198576A JP 7198576 A JP7198576 A JP 7198576A JP S52155049 A JPS52155049 A JP S52155049A
Authority
JP
Japan
Prior art keywords
solder
formation method
electrode formation
solder electrode
solder powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7198576A
Other languages
Japanese (ja)
Inventor
Masaaki Matsuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7198576A priority Critical patent/JPS52155049A/en
Publication of JPS52155049A publication Critical patent/JPS52155049A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: Solder electrode layers of nearly uniform solder filling shape are formed by selectively placing solder powder in the required portions of electrode deposited surface using a selection mask or the like thereafter subjecting the solder powder to heating to melt followed by cooling to solidify.
COPYRIGHT: (C)1977,JPO&Japio
JP7198576A 1976-06-18 1976-06-18 Solder electrode formation method Pending JPS52155049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7198576A JPS52155049A (en) 1976-06-18 1976-06-18 Solder electrode formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7198576A JPS52155049A (en) 1976-06-18 1976-06-18 Solder electrode formation method

Publications (1)

Publication Number Publication Date
JPS52155049A true JPS52155049A (en) 1977-12-23

Family

ID=13476257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7198576A Pending JPS52155049A (en) 1976-06-18 1976-06-18 Solder electrode formation method

Country Status (1)

Country Link
JP (1) JPS52155049A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139634A (en) * 1983-01-31 1984-08-10 Sanken Electric Co Ltd Manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139634A (en) * 1983-01-31 1984-08-10 Sanken Electric Co Ltd Manufacture of semiconductor device
JPH0230577B2 (en) * 1983-01-31 1990-07-06 Sanken Electric Co Ltd

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