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JPS52154856A - Adherent silicone composition - Google Patents

Adherent silicone composition

Info

Publication number
JPS52154856A
JPS52154856A JP7194476A JP7194476A JPS52154856A JP S52154856 A JPS52154856 A JP S52154856A JP 7194476 A JP7194476 A JP 7194476A JP 7194476 A JP7194476 A JP 7194476A JP S52154856 A JPS52154856 A JP S52154856A
Authority
JP
Japan
Prior art keywords
silicone composition
adherent silicone
adherent
organohydrogenpolysiloxane
specific
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7194476A
Other languages
Japanese (ja)
Inventor
Shiro Gomiyo
Yoshiteru Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP7194476A priority Critical patent/JPS52154856A/en
Publication of JPS52154856A publication Critical patent/JPS52154856A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: Title composition adhering readily and firmly metal materials to inorganic material, comprising a specific two organopolysiloxane mixture, an organohydrogenpolysiloxane an inorganic filler and a platinum compound.
COPYRIGHT: (C)1977,JPO&Japio
JP7194476A 1976-06-18 1976-06-18 Adherent silicone composition Pending JPS52154856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7194476A JPS52154856A (en) 1976-06-18 1976-06-18 Adherent silicone composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7194476A JPS52154856A (en) 1976-06-18 1976-06-18 Adherent silicone composition

Publications (1)

Publication Number Publication Date
JPS52154856A true JPS52154856A (en) 1977-12-22

Family

ID=13475105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7194476A Pending JPS52154856A (en) 1976-06-18 1976-06-18 Adherent silicone composition

Country Status (1)

Country Link
JP (1) JPS52154856A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210976A (en) * 1982-06-02 1983-12-08 Showa Electric Wire & Cable Co Ltd Bonding resin composition
JPH0228280A (en) * 1988-07-15 1990-01-30 Toray Dow Corning Silicone Co Ltd Silicone rubber composition
JPH0273878A (en) * 1988-09-09 1990-03-13 Shin Etsu Chem Co Ltd Adhesive composition for hardened silicone rubber
EP0388092A2 (en) * 1989-03-13 1990-09-19 Dow Corning Corporation Clear organosiloxane compositions
EP0508610A2 (en) * 1991-03-14 1992-10-14 General Electric Company Laminates containing addition-curable silicone adhesive compositions
JPH07331220A (en) * 1994-06-07 1995-12-19 Shin Etsu Chem Co Ltd Silicone emulsion adhesive composition
JPH09500114A (en) * 1993-06-30 1997-01-07 ニユコメド・イメージング・アクシエセルカペト Improvements in or relating to polymeric materials
JP2005060549A (en) * 2003-08-13 2005-03-10 Shin Etsu Polymer Co Ltd Definite-form adhesive
JP2013139515A (en) * 2011-12-29 2013-07-18 Dow Corning Toray Co Ltd Silicone-based pressure-sensitive adhesive composition, laminate and silicone self-adhesive tape
JP2018507278A (en) * 2014-12-26 2018-03-15 ▲広▼▲東▼生益科技股▲ふん▼有限公司Ｓｈｅｎｇｙｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． Non-halogen / non-phosphorus silicone resin composition, and prepreg, laminate, copper-clad laminate and printed circuit board using the same
JP2018523592A (en) * 2015-08-19 2018-08-23 ▲広▼▲東▼生益科技股▲ふん▼有限公司Ｓｈｅｎｇｙｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． Organosilicone resin aluminum-based copper-clad laminate and preparation method thereof

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210976A (en) * 1982-06-02 1983-12-08 Showa Electric Wire & Cable Co Ltd Bonding resin composition
JPH0356271B2 (en) * 1982-06-02 1991-08-27
JPH0228280A (en) * 1988-07-15 1990-01-30 Toray Dow Corning Silicone Co Ltd Silicone rubber composition
JPH0721135B2 (en) * 1988-09-09 1995-03-08 信越化学工業株式会社 Adhesive composition for cured silicone rubber
JPH0273878A (en) * 1988-09-09 1990-03-13 Shin Etsu Chem Co Ltd Adhesive composition for hardened silicone rubber
EP0388092A2 (en) * 1989-03-13 1990-09-19 Dow Corning Corporation Clear organosiloxane compositions
EP0508610A2 (en) * 1991-03-14 1992-10-14 General Electric Company Laminates containing addition-curable silicone adhesive compositions
US6004679A (en) * 1991-03-14 1999-12-21 General Electric Company Laminates containing addition-curable silicone adhesive compositions
JPH09500114A (en) * 1993-06-30 1997-01-07 ニユコメド・イメージング・アクシエセルカペト Improvements in or relating to polymeric materials
JPH07331220A (en) * 1994-06-07 1995-12-19 Shin Etsu Chem Co Ltd Silicone emulsion adhesive composition
JP2005060549A (en) * 2003-08-13 2005-03-10 Shin Etsu Polymer Co Ltd Definite-form adhesive
JP2013139515A (en) * 2011-12-29 2013-07-18 Dow Corning Toray Co Ltd Silicone-based pressure-sensitive adhesive composition, laminate and silicone self-adhesive tape
JP2018507278A (en) * 2014-12-26 2018-03-15 ▲広▼▲東▼生益科技股▲ふん▼有限公司Ｓｈｅｎｇｙｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． Non-halogen / non-phosphorus silicone resin composition, and prepreg, laminate, copper-clad laminate and printed circuit board using the same
US10414136B2 (en) 2014-12-26 2019-09-17 Shengyi Technology Co., Ltd. Halogen-free and phosphorus-free silicone resin composition, prepreg, laminate board, copper-clad plate using the same, and printed circuit board
JP2018523592A (en) * 2015-08-19 2018-08-23 ▲広▼▲東▼生益科技股▲ふん▼有限公司Ｓｈｅｎｇｙｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． Organosilicone resin aluminum-based copper-clad laminate and preparation method thereof

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