JPS5215263A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5215263A JPS5215263A JP9145675A JP9145675A JPS5215263A JP S5215263 A JPS5215263 A JP S5215263A JP 9145675 A JP9145675 A JP 9145675A JP 9145675 A JP9145675 A JP 9145675A JP S5215263 A JPS5215263 A JP S5215263A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor chip
- manhours
- oppose
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To decrease manhours, to improve heat radiating characteristic and to obtain a high output by inserting a semiconductor chip in a cavity formed in an insulator and by assembling the semiconductor chip so that the bumps and the tips of the leads oppose each other.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9145675A JPS5215263A (en) | 1975-07-25 | 1975-07-25 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9145675A JPS5215263A (en) | 1975-07-25 | 1975-07-25 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5215263A true JPS5215263A (en) | 1977-02-04 |
JPS576258B2 JPS576258B2 (en) | 1982-02-04 |
Family
ID=14026858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9145675A Granted JPS5215263A (en) | 1975-07-25 | 1975-07-25 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5215263A (en) |
-
1975
- 1975-07-25 JP JP9145675A patent/JPS5215263A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS576258B2 (en) | 1982-02-04 |
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