[go: up one dir, main page]

JPS52135666A - Arraying method for semiconductor pellets - Google Patents

Arraying method for semiconductor pellets

Info

Publication number
JPS52135666A
JPS52135666A JP5297676A JP5297676A JPS52135666A JP S52135666 A JPS52135666 A JP S52135666A JP 5297676 A JP5297676 A JP 5297676A JP 5297676 A JP5297676 A JP 5297676A JP S52135666 A JPS52135666 A JP S52135666A
Authority
JP
Japan
Prior art keywords
semiconductor pellets
sheet
arraying method
arraying
heting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5297676A
Other languages
Japanese (ja)
Other versions
JPS5846859B2 (en
Inventor
Hiroshi Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP51052976A priority Critical patent/JPS5846859B2/en
Publication of JPS52135666A publication Critical patent/JPS52135666A/en
Publication of JPS5846859B2 publication Critical patent/JPS5846859B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To obtain highly positioned pellet configuration by holding the circumferential edges of a flexible sheet affixed thereto with a multiplicity of diced semiconductor pellets and stretching said sheet with a heting body after evenly heating the sheet by flowing hot air.
COPYRIGHT: (C)1977,JPO&Japio
JP51052976A 1976-05-10 1976-05-10 How to align semiconductor pellets Expired JPS5846859B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51052976A JPS5846859B2 (en) 1976-05-10 1976-05-10 How to align semiconductor pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51052976A JPS5846859B2 (en) 1976-05-10 1976-05-10 How to align semiconductor pellets

Publications (2)

Publication Number Publication Date
JPS52135666A true JPS52135666A (en) 1977-11-12
JPS5846859B2 JPS5846859B2 (en) 1983-10-19

Family

ID=12929916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51052976A Expired JPS5846859B2 (en) 1976-05-10 1976-05-10 How to align semiconductor pellets

Country Status (1)

Country Link
JP (1) JPS5846859B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5453358U (en) * 1977-09-21 1979-04-13
JPH0334443A (en) * 1989-06-30 1991-02-14 Toshiba Seiki Kk Apparatus for stretching semiconductor wafer
JP2007299863A (en) * 2006-04-28 2007-11-15 Disco Abrasive Syst Ltd Laser processing apparatus, and method of removing wafer from chuck table

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4647831B2 (en) * 2001-05-10 2011-03-09 株式会社ディスコ Workpiece division processing method and chip interval expansion apparatus used in the division processing method
JP4647830B2 (en) * 2001-05-10 2011-03-09 株式会社ディスコ Workpiece division processing method and chip interval expansion apparatus used in the division processing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5453358U (en) * 1977-09-21 1979-04-13
JPH0334443A (en) * 1989-06-30 1991-02-14 Toshiba Seiki Kk Apparatus for stretching semiconductor wafer
JP2007299863A (en) * 2006-04-28 2007-11-15 Disco Abrasive Syst Ltd Laser processing apparatus, and method of removing wafer from chuck table

Also Published As

Publication number Publication date
JPS5846859B2 (en) 1983-10-19

Similar Documents

Publication Publication Date Title
JPS5382690A (en) Improved preparation of synthetic gas for ammonia
JPS52135666A (en) Arraying method for semiconductor pellets
JPS5367253A (en) Cooling and heating apparatus with hot water supply
JPS529054A (en) A method for cross-linking ethylene- propylene rubber
JPS52122939A (en) Heating device
JPS5214938A (en) Water warming device by sun heat
JPS51120451A (en) Cylindrical heater
JPS5211460A (en) Heat pipe
JPS52120641A (en) Micro program control system
JPS51129949A (en) Planar heater
JPS521641A (en) Solar hot water device
JPS524842A (en) Drying and fixing method of final image holder
JPS5222159A (en) Hot air heating device for filament body
JPS52104349A (en) Device for cooling and reducing humidity
JPS5287543A (en) Rapid warming device
JPS5349345A (en) Heating air mat
JPS5230930A (en) Manufacturing process for heater
JPS52154232A (en) Air conditioner
JPS5243157A (en) Thermal sleeve installed in a thermal stress relaxing device
JPS5217029A (en) Fixing device of hot air heater for the copying machine
JPS5248850A (en) Auxiliary heating equipment for a water heater applying the solar heat
JPS5211448A (en) Hot water supplying and room heating apparatus
JPS51148958A (en) Hot water supply air conditioner
JPS52135667A (en) Dicing method of semiconductor wafer
JPS53123264A (en) Heating apparatus for hair dryer