JPS52109438A - Method of aging nonnelectrolytic nickel plating solution - Google Patents
Method of aging nonnelectrolytic nickel plating solutionInfo
- Publication number
- JPS52109438A JPS52109438A JP1783077A JP1783077A JPS52109438A JP S52109438 A JPS52109438 A JP S52109438A JP 1783077 A JP1783077 A JP 1783077A JP 1783077 A JP1783077 A JP 1783077A JP S52109438 A JPS52109438 A JP S52109438A
- Authority
- JP
- Japan
- Prior art keywords
- nonnelectrolytic
- aging
- plating solution
- nickel plating
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title 2
- 230000032683 aging Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910052759 nickel Inorganic materials 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66582576A | 1976-03-11 | 1976-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52109438A true JPS52109438A (en) | 1977-09-13 |
Family
ID=24671709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1783077A Pending JPS52109438A (en) | 1976-03-11 | 1977-02-22 | Method of aging nonnelectrolytic nickel plating solution |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS52109438A (en) |
FR (1) | FR2343816A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007270301A (en) * | 2006-03-31 | 2007-10-18 | Tdk Corp | Electroless plating solution, and ceramic electronic component manufacturing method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004031446A1 (en) * | 2002-10-01 | 2004-04-15 | Omg Americas, Inc. | Electroless metal-plating baths |
-
1977
- 1977-01-18 FR FR7702071A patent/FR2343816A1/en active Granted
- 1977-02-22 JP JP1783077A patent/JPS52109438A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007270301A (en) * | 2006-03-31 | 2007-10-18 | Tdk Corp | Electroless plating solution, and ceramic electronic component manufacturing method |
JP4605074B2 (en) * | 2006-03-31 | 2011-01-05 | Tdk株式会社 | Electroless plating solution and method for manufacturing ceramic electronic component |
Also Published As
Publication number | Publication date |
---|---|
FR2343816B1 (en) | 1979-03-09 |
FR2343816A1 (en) | 1977-10-07 |
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