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JPS52109438A - Method of aging nonnelectrolytic nickel plating solution - Google Patents

Method of aging nonnelectrolytic nickel plating solution

Info

Publication number
JPS52109438A
JPS52109438A JP1783077A JP1783077A JPS52109438A JP S52109438 A JPS52109438 A JP S52109438A JP 1783077 A JP1783077 A JP 1783077A JP 1783077 A JP1783077 A JP 1783077A JP S52109438 A JPS52109438 A JP S52109438A
Authority
JP
Japan
Prior art keywords
nonnelectrolytic
aging
plating solution
nickel plating
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1783077A
Other languages
Japanese (ja)
Inventor
Efu Shiyumetsukenbets Aanorudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS52109438A publication Critical patent/JPS52109438A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP1783077A 1976-03-11 1977-02-22 Method of aging nonnelectrolytic nickel plating solution Pending JPS52109438A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US66582576A 1976-03-11 1976-03-11

Publications (1)

Publication Number Publication Date
JPS52109438A true JPS52109438A (en) 1977-09-13

Family

ID=24671709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1783077A Pending JPS52109438A (en) 1976-03-11 1977-02-22 Method of aging nonnelectrolytic nickel plating solution

Country Status (2)

Country Link
JP (1) JPS52109438A (en)
FR (1) FR2343816A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007270301A (en) * 2006-03-31 2007-10-18 Tdk Corp Electroless plating solution, and ceramic electronic component manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004031446A1 (en) * 2002-10-01 2004-04-15 Omg Americas, Inc. Electroless metal-plating baths

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007270301A (en) * 2006-03-31 2007-10-18 Tdk Corp Electroless plating solution, and ceramic electronic component manufacturing method
JP4605074B2 (en) * 2006-03-31 2011-01-05 Tdk株式会社 Electroless plating solution and method for manufacturing ceramic electronic component

Also Published As

Publication number Publication date
FR2343816B1 (en) 1979-03-09
FR2343816A1 (en) 1977-10-07

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