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JPS52108349A - Etching method - Google Patents

Etching method

Info

Publication number
JPS52108349A
JPS52108349A JP2499676A JP2499676A JPS52108349A JP S52108349 A JPS52108349 A JP S52108349A JP 2499676 A JP2499676 A JP 2499676A JP 2499676 A JP2499676 A JP 2499676A JP S52108349 A JPS52108349 A JP S52108349A
Authority
JP
Japan
Prior art keywords
etching method
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2499676A
Other languages
Japanese (ja)
Inventor
Shiyousei Fukuda
Toshiharu Itou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2499676A priority Critical patent/JPS52108349A/en
Publication of JPS52108349A publication Critical patent/JPS52108349A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP2499676A 1976-03-10 1976-03-10 Etching method Pending JPS52108349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2499676A JPS52108349A (en) 1976-03-10 1976-03-10 Etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2499676A JPS52108349A (en) 1976-03-10 1976-03-10 Etching method

Publications (1)

Publication Number Publication Date
JPS52108349A true JPS52108349A (en) 1977-09-10

Family

ID=12153577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2499676A Pending JPS52108349A (en) 1976-03-10 1976-03-10 Etching method

Country Status (1)

Country Link
JP (1) JPS52108349A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102827A (en) * 1989-09-18 1991-04-30 Hitachi Ltd Silicon wafer etching method
CN110904503A (en) * 2018-09-14 2020-03-24 株式会社东芝 Additive, additive dispersion, etching raw material unit, additive supply device, etching device, and etching method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102827A (en) * 1989-09-18 1991-04-30 Hitachi Ltd Silicon wafer etching method
CN110904503A (en) * 2018-09-14 2020-03-24 株式会社东芝 Additive, additive dispersion, etching raw material unit, additive supply device, etching device, and etching method
KR20200031502A (en) * 2018-09-14 2020-03-24 가부시끼가이샤 도시바 Additive, additive dispersion, etching raw material unit, additive feeding apparatus, etching device, and etching method
JP2020047657A (en) * 2018-09-14 2020-03-26 株式会社東芝 Additive, additive dispersion, etching raw material unit, additive supply device, etching device, and etching method
CN110904503B (en) * 2018-09-14 2022-03-25 株式会社东芝 Additive, additive dispersion liquid, etching raw material unit, additive supply device, etching device, and etching method

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