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JPS519578A - Handotaisochino seizoho - Google Patents

Handotaisochino seizoho

Info

Publication number
JPS519578A
JPS519578A JP49080428A JP8042874A JPS519578A JP S519578 A JPS519578 A JP S519578A JP 49080428 A JP49080428 A JP 49080428A JP 8042874 A JP8042874 A JP 8042874A JP S519578 A JPS519578 A JP S519578A
Authority
JP
Japan
Prior art keywords
handotaisochino
seizoho
handotaisochino seizoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49080428A
Other languages
Japanese (ja)
Inventor
Mitsuo Matsunami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP49080428A priority Critical patent/JPS519578A/en
Publication of JPS519578A publication Critical patent/JPS519578A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Wire Bonding (AREA)
JP49080428A 1974-07-12 1974-07-12 Handotaisochino seizoho Pending JPS519578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49080428A JPS519578A (en) 1974-07-12 1974-07-12 Handotaisochino seizoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49080428A JPS519578A (en) 1974-07-12 1974-07-12 Handotaisochino seizoho

Publications (1)

Publication Number Publication Date
JPS519578A true JPS519578A (en) 1976-01-26

Family

ID=13717993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49080428A Pending JPS519578A (en) 1974-07-12 1974-07-12 Handotaisochino seizoho

Country Status (1)

Country Link
JP (1) JPS519578A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561593A (en) * 1979-06-15 1981-01-09 Matsushita Electric Ind Co Ltd Method of fabricating circuit board
JPS5754356A (en) * 1980-08-05 1982-03-31 Gao Ges Automation Org
JPH0360138A (en) * 1989-07-28 1991-03-15 Nec Kansai Ltd Bonding method
JPH04186731A (en) * 1990-11-20 1992-07-03 Nippon Mektron Ltd Circuit board with terminal for mounting circuit parts and manufacture thereof
JPH07122590A (en) * 1993-10-20 1995-05-12 Nec Corp Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860873A (en) * 1971-11-30 1973-08-25
JPS48102575A (en) * 1972-04-04 1973-12-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860873A (en) * 1971-11-30 1973-08-25
JPS48102575A (en) * 1972-04-04 1973-12-22

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561593A (en) * 1979-06-15 1981-01-09 Matsushita Electric Ind Co Ltd Method of fabricating circuit board
JPS6230514B2 (en) * 1979-06-15 1987-07-02 Matsushita Electric Ind Co Ltd
JPS5754356A (en) * 1980-08-05 1982-03-31 Gao Ges Automation Org
JPH0158657B2 (en) * 1980-08-05 1989-12-13 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh
JPH0360138A (en) * 1989-07-28 1991-03-15 Nec Kansai Ltd Bonding method
JPH04186731A (en) * 1990-11-20 1992-07-03 Nippon Mektron Ltd Circuit board with terminal for mounting circuit parts and manufacture thereof
JPH07122590A (en) * 1993-10-20 1995-05-12 Nec Corp Semiconductor device

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