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JPS5149551B2 - - Google Patents

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Publication number
JPS5149551B2
JPS5149551B2 JP5370873A JP5370873A JPS5149551B2 JP S5149551 B2 JPS5149551 B2 JP S5149551B2 JP 5370873 A JP5370873 A JP 5370873A JP 5370873 A JP5370873 A JP 5370873A JP S5149551 B2 JPS5149551 B2 JP S5149551B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5370873A
Other versions
JPS4943576A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4943576A publication Critical patent/JPS4943576A/ja
Publication of JPS5149551B2 publication Critical patent/JPS5149551B2/ja
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP5370873A 1972-05-19 1973-05-16 Expired JPS5149551B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25517072A 1972-05-19 1972-05-19

Publications (2)

Publication Number Publication Date
JPS4943576A JPS4943576A (ja) 1974-04-24
JPS5149551B2 true JPS5149551B2 (ja) 1976-12-27

Family

ID=22967151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5370873A Expired JPS5149551B2 (ja) 1972-05-19 1973-05-16

Country Status (2)

Country Link
US (1) US3785892A (ja)
JP (1) JPS5149551B2 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094677A (en) * 1973-12-28 1978-06-13 Texas Instruments Incorporated Chemical fabrication of overhanging ledges and reflection gratings for surface wave devices
FR2360993A1 (fr) * 1976-08-03 1978-03-03 Lignes Telegraph Telephon Perfectionnement aux procedes de fabrication de diodes schottky a barriere or-silicium
JPH0722141B2 (ja) * 1984-03-07 1995-03-08 住友電気工業株式会社 半導体素子の製造方法
US4765865A (en) * 1987-05-04 1988-08-23 Ford Motor Company Silicon etch rate enhancement
JPH01203484A (ja) * 1988-02-09 1989-08-16 Hagoromo Bungu Kk チョーク
US5046656A (en) * 1988-09-12 1991-09-10 Regents Of The University Of California Vacuum die attach for integrated circuits
TW365057B (en) * 1997-12-31 1999-07-21 Ind Tech Res Inst Manufacturing method for micro-mirror on the silicon substrate
US20070231954A1 (en) * 2006-03-31 2007-10-04 Kai Liu Gold/silicon eutectic die bonding method
US7659191B2 (en) * 2006-11-27 2010-02-09 Alpha And Omega Semiconductor Incorporated Gold/silicon eutectic die bonding method
US11387373B2 (en) * 2019-07-29 2022-07-12 Nxp Usa, Inc. Low drain-source on resistance semiconductor component and method of fabrication
RU2737722C1 (ru) * 2020-04-03 2020-12-02 Акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" Способ изготовления полупроводникового прибора

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Publication number Publication date
JPS4943576A (ja) 1974-04-24
US3785892A (en) 1974-01-15

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