JPS5136800B2 - - Google Patents
Info
- Publication number
- JPS5136800B2 JPS5136800B2 JP2635972A JP2635972A JPS5136800B2 JP S5136800 B2 JPS5136800 B2 JP S5136800B2 JP 2635972 A JP2635972 A JP 2635972A JP 2635972 A JP2635972 A JP 2635972A JP S5136800 B2 JPS5136800 B2 JP S5136800B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2635972A JPS5136800B2 (de) | 1972-03-15 | 1972-03-15 | |
DE19732312525 DE2312525A1 (de) | 1972-03-15 | 1973-03-13 | Epoxyharzzusammensetzung fuer hochspannungsisolation |
FR7309189A FR2176073A1 (en) | 1972-03-15 | 1973-03-14 | Epoxy resin compsn - contg cycloaliphatic amine/silicon - amine hardener - for high voltage insulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2635972A JPS5136800B2 (de) | 1972-03-15 | 1972-03-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4893699A JPS4893699A (de) | 1973-12-04 |
JPS5136800B2 true JPS5136800B2 (de) | 1976-10-12 |
Family
ID=12191274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2635972A Expired JPS5136800B2 (de) | 1972-03-15 | 1972-03-15 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5136800B2 (de) |
DE (1) | DE2312525A1 (de) |
FR (1) | FR2176073A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5940109B2 (ja) * | 1978-10-06 | 1984-09-28 | ダイキン工業株式会社 | 積層体および積層体形成方法 |
US4511701A (en) * | 1984-02-27 | 1985-04-16 | General Electric Company | Heat curable epoxy resin compositions and epoxy resin curing agents |
PH27310A (en) * | 1988-05-13 | 1993-05-28 | M & T Chemicals Inc | Epoxy-aromatic polysiloxane compositions |
US6196730B1 (en) | 1998-06-22 | 2001-03-06 | 3M Innovative Properties Company | Fiber optic connector containing a curable adhesive composition |
US8431444B2 (en) * | 2011-08-16 | 2013-04-30 | General Electric Company | Epoxy encapsulating and lamination adhesive and method of making same |
CN117285698A (zh) * | 2015-03-26 | 2023-12-26 | 亨斯迈先进材料特许(瑞士)有限公司 | 用于制备室外制品的热固性环氧树脂组合物以及由此获得的制品 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1235413A (en) * | 1968-01-26 | 1971-06-16 | Dexter Corp | Epoxy resin encapsulant compositions for semiconductors |
-
1972
- 1972-03-15 JP JP2635972A patent/JPS5136800B2/ja not_active Expired
-
1973
- 1973-03-13 DE DE19732312525 patent/DE2312525A1/de active Pending
- 1973-03-14 FR FR7309189A patent/FR2176073A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS4893699A (de) | 1973-12-04 |
FR2176073A1 (en) | 1973-10-26 |
DE2312525A1 (de) | 1973-10-04 |
FR2176073B1 (de) | 1976-11-05 |