JPS5127266B2 - - Google Patents
Info
- Publication number
- JPS5127266B2 JPS5127266B2 JP47066104A JP6610472A JPS5127266B2 JP S5127266 B2 JPS5127266 B2 JP S5127266B2 JP 47066104 A JP47066104 A JP 47066104A JP 6610472 A JP6610472 A JP 6610472A JP S5127266 B2 JPS5127266 B2 JP S5127266B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Molding Of Porous Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47066104A JPS5127266B2 (ja) | 1972-07-01 | 1972-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47066104A JPS5127266B2 (ja) | 1972-07-01 | 1972-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4925061A JPS4925061A (ja) | 1974-03-06 |
| JPS5127266B2 true JPS5127266B2 (ja) | 1976-08-11 |
Family
ID=13306232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47066104A Expired JPS5127266B2 (ja) | 1972-07-01 | 1972-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5127266B2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012137588A1 (ja) * | 2011-04-05 | 2012-10-11 | クミ化成株式会社 | 射出成形金型及び射出成形品の製造方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2401459A1 (fr) * | 1977-08-26 | 1979-03-23 | Cii Honeywell Bull | Support d'information portatif muni d'un microprocesseur et d'une memoire morte programmable |
| JPH04213139A (ja) * | 1990-12-05 | 1992-08-04 | Nec Corp | 不正着信防止システム |
| JPH0573732A (ja) * | 1991-09-11 | 1993-03-26 | Zexel Corp | カード処理装置 |
| JP4839728B2 (ja) | 2005-08-25 | 2011-12-21 | 宇部興産機械株式会社 | 熱可塑性樹脂の多層成形方法、及び多層成形装置 |
| JP5075506B2 (ja) * | 2007-07-12 | 2012-11-21 | 日本ポリプロ株式会社 | 発泡成形品の製造方法 |
-
1972
- 1972-07-01 JP JP47066104A patent/JPS5127266B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012137588A1 (ja) * | 2011-04-05 | 2012-10-11 | クミ化成株式会社 | 射出成形金型及び射出成形品の製造方法 |
| JP5806293B2 (ja) * | 2011-04-05 | 2015-11-10 | クミ化成株式会社 | 射出成形金型及び射出成形品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4925061A (ja) | 1974-03-06 |