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JPS5123074A - - Google Patents

Info

Publication number
JPS5123074A
JPS5123074A JP49095055A JP9505574A JPS5123074A JP S5123074 A JPS5123074 A JP S5123074A JP 49095055 A JP49095055 A JP 49095055A JP 9505574 A JP9505574 A JP 9505574A JP S5123074 A JPS5123074 A JP S5123074A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49095055A
Other languages
Japanese (ja)
Inventor
Tetsuya Hayashida
Haruo Nozawa
Tadayoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49095055A priority Critical patent/JPS5123074A/ja
Publication of JPS5123074A publication Critical patent/JPS5123074A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP49095055A 1974-08-21 1974-08-21 Pending JPS5123074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49095055A JPS5123074A (en) 1974-08-21 1974-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49095055A JPS5123074A (en) 1974-08-21 1974-08-21

Publications (1)

Publication Number Publication Date
JPS5123074A true JPS5123074A (en) 1976-02-24

Family

ID=14127349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49095055A Pending JPS5123074A (en) 1974-08-21 1974-08-21

Country Status (1)

Country Link
JP (1) JPS5123074A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587833A (en) * 1981-06-30 1983-01-17 インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン Circuit device assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587833A (en) * 1981-06-30 1983-01-17 インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン Circuit device assembly

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