JPS5123074A - - Google Patents
Info
- Publication number
- JPS5123074A JPS5123074A JP49095055A JP9505574A JPS5123074A JP S5123074 A JPS5123074 A JP S5123074A JP 49095055 A JP49095055 A JP 49095055A JP 9505574 A JP9505574 A JP 9505574A JP S5123074 A JPS5123074 A JP S5123074A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49095055A JPS5123074A (en) | 1974-08-21 | 1974-08-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49095055A JPS5123074A (en) | 1974-08-21 | 1974-08-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5123074A true JPS5123074A (en) | 1976-02-24 |
Family
ID=14127349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49095055A Pending JPS5123074A (en) | 1974-08-21 | 1974-08-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5123074A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587833A (en) * | 1981-06-30 | 1983-01-17 | インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン | Circuit device assembly |
-
1974
- 1974-08-21 JP JP49095055A patent/JPS5123074A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587833A (en) * | 1981-06-30 | 1983-01-17 | インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン | Circuit device assembly |