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JPS51150275A - Semiconductor - Google Patents

Semiconductor

Info

Publication number
JPS51150275A
JPS51150275A JP7320275A JP7320275A JPS51150275A JP S51150275 A JPS51150275 A JP S51150275A JP 7320275 A JP7320275 A JP 7320275A JP 7320275 A JP7320275 A JP 7320275A JP S51150275 A JPS51150275 A JP S51150275A
Authority
JP
Japan
Prior art keywords
semiconductor
heat sink
vain
exciting
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7320275A
Other languages
Japanese (ja)
Other versions
JPS5826675B2 (en
Inventor
Makoto Morioka
Yuichi Ono
Mitsuhiro Mori
Kazuhiro Ito
Nobuo Kodera
Kazuhiro Kurata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50073202A priority Critical patent/JPS5826675B2/en
Publication of JPS51150275A publication Critical patent/JPS51150275A/en
Publication of JPS5826675B2 publication Critical patent/JPS5826675B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: To provide a heat sink submount electrically insulated from a heat sink material without any heat radiating in vain, in a semiconductor device, including a semiconductor laser and a light emission diode used for a light source of a photo communication device or for exciting a solid laser.
COPYRIGHT: (C)1976,JPO&Japio
JP50073202A 1975-06-18 1975-06-18 Hand tie souchi Expired JPS5826675B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50073202A JPS5826675B2 (en) 1975-06-18 1975-06-18 Hand tie souchi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50073202A JPS5826675B2 (en) 1975-06-18 1975-06-18 Hand tie souchi

Publications (2)

Publication Number Publication Date
JPS51150275A true JPS51150275A (en) 1976-12-23
JPS5826675B2 JPS5826675B2 (en) 1983-06-04

Family

ID=13511313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50073202A Expired JPS5826675B2 (en) 1975-06-18 1975-06-18 Hand tie souchi

Country Status (1)

Country Link
JP (1) JPS5826675B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516448A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Diode
JPS5599783A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Photodiode
JPS55140280A (en) * 1979-04-20 1980-11-01 Hitachi Ltd Light emitting diode
JPS62235787A (en) * 1986-04-07 1987-10-15 Koito Mfg Co Ltd lighting equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01209387A (en) * 1988-02-17 1989-08-23 Nishimu Denshi Kogyo Kk Fault current detection sensor and detection of fault section in transmission line using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493027A (en) * 1972-05-02 1974-01-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493027A (en) * 1972-05-02 1974-01-11

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516448A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Diode
JPS5599783A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Photodiode
JPS55140280A (en) * 1979-04-20 1980-11-01 Hitachi Ltd Light emitting diode
JPS62235787A (en) * 1986-04-07 1987-10-15 Koito Mfg Co Ltd lighting equipment

Also Published As

Publication number Publication date
JPS5826675B2 (en) 1983-06-04

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