JPS51126765A - Resin sealed semiconductor unit manufacturing process - Google Patents
Resin sealed semiconductor unit manufacturing processInfo
- Publication number
- JPS51126765A JPS51126765A JP5044975A JP5044975A JPS51126765A JP S51126765 A JPS51126765 A JP S51126765A JP 5044975 A JP5044975 A JP 5044975A JP 5044975 A JP5044975 A JP 5044975A JP S51126765 A JPS51126765 A JP S51126765A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor unit
- sealed semiconductor
- manufacturing process
- resin sealed
- unit manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005336 cracking Methods 0.000 abstract 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To prevent resin seal layer from cracking and thus to eliminate gaps from resin sealed semiconductor unit.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5044975A JPS51126765A (en) | 1975-04-25 | 1975-04-25 | Resin sealed semiconductor unit manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5044975A JPS51126765A (en) | 1975-04-25 | 1975-04-25 | Resin sealed semiconductor unit manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51126765A true JPS51126765A (en) | 1976-11-05 |
| JPS5241191B2 JPS5241191B2 (en) | 1977-10-17 |
Family
ID=12859161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5044975A Granted JPS51126765A (en) | 1975-04-25 | 1975-04-25 | Resin sealed semiconductor unit manufacturing process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51126765A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1215724A1 (en) * | 2000-11-20 | 2002-06-19 | Texas Instruments Incorporated | Wire bonded semiconductor device with low capacitance coupling |
-
1975
- 1975-04-25 JP JP5044975A patent/JPS51126765A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1215724A1 (en) * | 2000-11-20 | 2002-06-19 | Texas Instruments Incorporated | Wire bonded semiconductor device with low capacitance coupling |
| US6822340B2 (en) | 2000-11-20 | 2004-11-23 | Texas Instruments Incorporated | Low capacitance coupling wire bonded semiconductor device |
| US7195954B2 (en) | 2000-11-20 | 2007-03-27 | Texas Instruments Incorporated | Low capacitance coupling wire bonded semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5241191B2 (en) | 1977-10-17 |
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