JPS51118038A - Cooling device of semiconductor rectifier - Google Patents
Cooling device of semiconductor rectifierInfo
- Publication number
- JPS51118038A JPS51118038A JP50043559A JP4355975A JPS51118038A JP S51118038 A JPS51118038 A JP S51118038A JP 50043559 A JP50043559 A JP 50043559A JP 4355975 A JP4355975 A JP 4355975A JP S51118038 A JPS51118038 A JP S51118038A
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- semiconductor rectifier
- rectifier
- semiconductor
- prevent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 238000009835 boiling Methods 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To make the boiling bubbles not prevent the convection current on the rectifier of ebullition cooling system.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50043559A JPS51118038A (en) | 1975-04-10 | 1975-04-10 | Cooling device of semiconductor rectifier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50043559A JPS51118038A (en) | 1975-04-10 | 1975-04-10 | Cooling device of semiconductor rectifier |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51118038A true JPS51118038A (en) | 1976-10-16 |
Family
ID=12667095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50043559A Pending JPS51118038A (en) | 1975-04-10 | 1975-04-10 | Cooling device of semiconductor rectifier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51118038A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149567U (en) * | 1977-04-30 | 1978-11-25 | ||
US5713413A (en) * | 1994-12-28 | 1998-02-03 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant |
US6073683A (en) * | 1995-07-05 | 2000-06-13 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same |
-
1975
- 1975-04-10 JP JP50043559A patent/JPS51118038A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149567U (en) * | 1977-04-30 | 1978-11-25 | ||
US5713413A (en) * | 1994-12-28 | 1998-02-03 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant |
US6073683A (en) * | 1995-07-05 | 2000-06-13 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same |
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