JPS5030471A - - Google Patents

Info

Publication number: JPS5030471A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP7989573A

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-07-17

Filing date

1973-07-17

Publication date

1975-03-26

1973-07-17 Application filed filed Critical

1973-07-17 Priority to JP7989573A priority Critical patent/JPS5030471A/ja

1975-03-26 Publication of JPS5030471A publication Critical patent/JPS5030471A/ja

Status Pending legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

Wire Bonding (AREA)
Die Bonding (AREA)

JP7989573A 1973-07-17 1973-07-17 Pending JPS5030471A (zh)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP7989573A JPS5030471A (zh)	1973-07-17	1973-07-17

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP7989573A JPS5030471A (zh)	1973-07-17	1973-07-17

Publications (1)

Publication Number	Publication Date
JPS5030471A true JPS5030471A (zh)	1975-03-26

Family

ID=13702998

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP7989573A Pending JPS5030471A (zh)	1973-07-17	1973-07-17

Country Status (1)

Country	Link
JP (1)	JPS5030471A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2022137288A1 (ja) *	2020-12-21	2022-06-30	株式会社新川	ワイヤ構造及びワイヤ構造形成方法

1973
- 1973-07-17 JP JP7989573A patent/JPS5030471A/ja active Pending

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2022137288A1 (ja) *	2020-12-21	2022-06-30	株式会社新川	ワイヤ構造及びワイヤ構造形成方法
JPWO2022137288A1 (zh) *	2020-12-21	2022-06-30
TWI816255B (zh) *	2020-12-21	2023-09-21	日商新川股份有限公司	打線結構、打線結構形成方法以及電子裝置

Publication	Publication Date	Title
AR201758A1 (zh)	1975-04-15
AU476761B2 (zh)	1976-09-30
AU465372B2 (zh)	1975-09-25
AR201235Q (zh)	1975-02-21
AR201231Q (zh)	1975-02-21
AU474593B2 (zh)	1976-07-29
AU474511B2 (zh)	1976-07-22
AU474838B2 (zh)	1976-08-05
AU471343B2 (zh)	1976-04-15
AU465453B2 (zh)	1975-09-25
AU465434B2 (zh)	1975-09-25
AU450229B2 (zh)	1974-07-04
AU476714B2 (zh)	1976-09-30
AR201229Q (zh)	1975-02-21
AU472848B2 (zh)	1976-06-03
AU466283B2 (zh)	1975-10-23
AU476696B2 (zh)	1976-09-30
AR199451A1 (zh)	1974-08-30
AU477823B2 (zh)	1975-06-19
AR201432A1 (zh)	1975-03-14
AU471461B2 (zh)	1976-04-29
AU447540B2 (zh)	1974-03-25
AR196382A1 (zh)	1973-12-18
AR210729A1 (zh)	1977-09-15
AU477824B2 (zh)	1975-07-17