JPS4970571A - - Google Patents
Info
- Publication number
- JPS4970571A JPS4970571A JP11135672A JP11135672A JPS4970571A JP S4970571 A JPS4970571 A JP S4970571A JP 11135672 A JP11135672 A JP 11135672A JP 11135672 A JP11135672 A JP 11135672A JP S4970571 A JPS4970571 A JP S4970571A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135672A JPS4970571A (no) | 1972-11-07 | 1972-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135672A JPS4970571A (no) | 1972-11-07 | 1972-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4970571A true JPS4970571A (no) | 1974-07-08 |
Family
ID=14559106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11135672A Pending JPS4970571A (no) | 1972-11-07 | 1972-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4970571A (no) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58155744A (ja) * | 1982-03-12 | 1983-09-16 | Hitachi Ltd | 金属キヤツプのはんだ接続方法 |
| JPS58140792U (ja) * | 1982-03-19 | 1983-09-21 | 東洋電機製造株式会社 | ドラム形ｘ・ｙプロツタのバキユ−ムコラム装置 |
-
1972
- 1972-11-07 JP JP11135672A patent/JPS4970571A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58155744A (ja) * | 1982-03-12 | 1983-09-16 | Hitachi Ltd | 金属キヤツプのはんだ接続方法 |
| JPS6251496B2 (no) * | 1982-03-12 | 1987-10-30 | Hitachi Ltd | |
| JPS58140792U (ja) * | 1982-03-19 | 1983-09-21 | 東洋電機製造株式会社 | ドラム形ｘ・ｙプロツタのバキユ−ムコラム装置 |