JPS4963382A - - Google Patents
Info
- Publication number
- JPS4963382A JPS4963382A JP10448172A JP10448172A JPS4963382A JP S4963382 A JPS4963382 A JP S4963382A JP 10448172 A JP10448172 A JP 10448172A JP 10448172 A JP10448172 A JP 10448172A JP S4963382 A JPS4963382 A JP S4963382A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10448172A JPS4963382A (ja) | 1972-10-20 | 1972-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10448172A JPS4963382A (ja) | 1972-10-20 | 1972-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4963382A true JPS4963382A (ja) | 1974-06-19 |
Family
ID=14381739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10448172A Pending JPS4963382A (ja) | 1972-10-20 | 1972-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4963382A (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55127027A (en) * | 1979-03-26 | 1980-10-01 | Toshiba Corp | Semiconductor device |
| JPS59189625A (ja) * | 1983-04-13 | 1984-10-27 | Nec Corp | 半導体装置の製造方法 |
| JPH03255637A (ja) * | 1990-02-28 | 1991-11-14 | Toshiba Corp | ダイボンディング用半田 |
| WO2006016479A1 (ja) * | 2004-08-10 | 2006-02-16 | Neomax Materials Co., Ltd. | ヒートシンク部材およびその製造方法 |
| JP2009255176A (ja) * | 2009-07-22 | 2009-11-05 | Senju Metal Ind Co Ltd | はんだ付け組成物および電子部品 |
| WO2023139976A1 (ja) * | 2022-01-20 | 2023-07-27 | 株式会社日立パワーデバイス | はんだおよび半導体装置 |
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1972
- 1972-10-20 JP JP10448172A patent/JPS4963382A/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55127027A (en) * | 1979-03-26 | 1980-10-01 | Toshiba Corp | Semiconductor device |
| JPS59189625A (ja) * | 1983-04-13 | 1984-10-27 | Nec Corp | 半導体装置の製造方法 |
| JPH03255637A (ja) * | 1990-02-28 | 1991-11-14 | Toshiba Corp | ダイボンディング用半田 |
| WO2006016479A1 (ja) * | 2004-08-10 | 2006-02-16 | Neomax Materials Co., Ltd. | ヒートシンク部材およびその製造方法 |
| US7776452B2 (en) | 2004-08-10 | 2010-08-17 | Neomax Materials Co. Ltd. | Heat sink member and method of manufacturing the same |
| JP2009255176A (ja) * | 2009-07-22 | 2009-11-05 | Senju Metal Ind Co Ltd | はんだ付け組成物および電子部品 |
| WO2023139976A1 (ja) * | 2022-01-20 | 2023-07-27 | 株式会社日立パワーデバイス | はんだおよび半導体装置 |