JPS4942292A - - Google Patents
Info
- Publication number
- JPS4942292A JPS4942292A JP8364572A JP8364572A JPS4942292A JP S4942292 A JPS4942292 A JP S4942292A JP 8364572 A JP8364572 A JP 8364572A JP 8364572 A JP8364572 A JP 8364572A JP S4942292 A JPS4942292 A JP S4942292A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Electric Clocks (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8364572A JPS4942292A (en) | 1972-08-23 | 1972-08-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8364572A JPS4942292A (en) | 1972-08-23 | 1972-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4942292A true JPS4942292A (en) | 1974-04-20 |
Family
ID=13808174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8364572A Pending JPS4942292A (en) | 1972-08-23 | 1972-08-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4942292A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5465326A (en) * | 1977-11-02 | 1979-05-25 | Hitachi Shomei Kk | Method of punching core |
JPH01221696A (en) * | 1988-01-19 | 1989-09-05 | Pacific Fuarukon:Kk | Binary timepiece |
JP2008544268A (en) * | 2005-06-23 | 2008-12-04 | タグ・ホイヤー・ソシエテ・アノニム | Digital or alphanumeric symbol display device |
-
1972
- 1972-08-23 JP JP8364572A patent/JPS4942292A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5465326A (en) * | 1977-11-02 | 1979-05-25 | Hitachi Shomei Kk | Method of punching core |
JPH01221696A (en) * | 1988-01-19 | 1989-09-05 | Pacific Fuarukon:Kk | Binary timepiece |
JP2008544268A (en) * | 2005-06-23 | 2008-12-04 | タグ・ホイヤー・ソシエテ・アノニム | Digital or alphanumeric symbol display device |
JP4808776B2 (en) * | 2005-06-23 | 2011-11-02 | エルブイエムエイチ・スイス・マニュファクチャーズ・ソシエテ・アノニム | Digital or alphanumeric symbol display device |