JPS4916175B1 - - Google Patents
Info
- Publication number
- JPS4916175B1 JPS4916175B1 JP10935470A JP10935470A JPS4916175B1 JP S4916175 B1 JPS4916175 B1 JP S4916175B1 JP 10935470 A JP10935470 A JP 10935470A JP 10935470 A JP10935470 A JP 10935470A JP S4916175 B1 JPS4916175 B1 JP S4916175B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10935470A JPS4916175B1 (en) | 1970-12-11 | 1970-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10935470A JPS4916175B1 (en) | 1970-12-11 | 1970-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4916175B1 true JPS4916175B1 (en) | 1974-04-20 |
Family
ID=14508084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10935470A Pending JPS4916175B1 (en) | 1970-12-11 | 1970-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4916175B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005256167A (en) * | 2004-02-09 | 2005-09-22 | Besi Plating Bv | Method and apparatus for electrolytic thickening of conductive pattern on dielectric substrate, and dielectric substrate |
-
1970
- 1970-12-11 JP JP10935470A patent/JPS4916175B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005256167A (en) * | 2004-02-09 | 2005-09-22 | Besi Plating Bv | Method and apparatus for electrolytic thickening of conductive pattern on dielectric substrate, and dielectric substrate |