JPS4860128U - - Google Patents
Info
- Publication number
- JPS4860128U JPS4860128U JP10488171U JP10488171U JPS4860128U JP S4860128 U JPS4860128 U JP S4860128U JP 10488171 U JP10488171 U JP 10488171U JP 10488171 U JP10488171 U JP 10488171U JP S4860128 U JPS4860128 U JP S4860128U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Safety Valves (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10488171U JPS4860128U (en) | 1971-11-09 | 1971-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10488171U JPS4860128U (en) | 1971-11-09 | 1971-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4860128U true JPS4860128U (en) | 1973-07-31 |
Family
ID=28017646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10488171U Pending JPS4860128U (en) | 1971-11-09 | 1971-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4860128U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12107070B2 (en) | 2020-07-15 | 2024-10-01 | Shinkawa Ltd. | Wire bonding apparatus and method for manufacturing semiconductor device |
-
1971
- 1971-11-09 JP JP10488171U patent/JPS4860128U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12107070B2 (en) | 2020-07-15 | 2024-10-01 | Shinkawa Ltd. | Wire bonding apparatus and method for manufacturing semiconductor device |