JPH1195069A - Package for storing optical semiconductor elements - Google Patents

Abstract

(57) [Summary] [Problem] An optical fiber comes off, the hermetic sealing of a container is broken, the optical semiconductor element cannot be operated stably, and a position shift occurs between the optical semiconductor element and the optical fiber, and the optical fiber The efficiency of transmitting and receiving light between the semiconductor device and the optical semiconductor element is greatly reduced. A mounting portion for an optical semiconductor element is provided at a central portion of an upper surface.
Is mounted on a base 1 having an outer peripheral portion provided with a frame portion 2 surrounding the mounting portion 1a, and a lid which is attached to an upper surface of the frame portion 2 via a sealing material 6 and closes the inside of the frame portion 2. A package for housing an optical semiconductor element comprising a body and a notch formed on an upper surface of the frame and penetrating the frame and in which an optical fiber is fixed by the sealing material. At the same time, a recess 9 was provided around the notch 7 on the outer surface side of the frame 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element.

[0002]

2. Description of the Related Art Conventionally, an optical semiconductor element housing package for housing an optical semiconductor element such as a laser diode for converting an electric signal used for optical communication into an optical signal and a photodiode for converting an optical signal into an electric signal. As shown in FIG. 2, is made of an electrically insulating material such as an aluminum oxide sintered body or an epoxy resin, and has a mounting portion 21a for mounting the optical semiconductor element S at a substantially central portion of its upper surface. 21 having a frame portion 22 provided with a through hole 23 in the outer peripheral portion of the upper surface
And an optical fiber 25 inserted through a through-hole 23 provided in the frame portion 22 of the base 21 and fixedly attached thereto via an adhesive 24 such as glass or resin, and both ends of the optical fiber 25 in the frame portion 22 of the base 21. A plurality of lead members 26 which are provided so as to protrude inside and outside the frame portion 22 and have one ends protruding outside the frame portion 22 connected to an external electric circuit;
A lid 27 is attached to the upper surface via a sealing material and hermetically seals the inside of the frame portion 22. An optical transmission module substrate 28 made of silicon is mounted on the mounting portion 21 a of the base 21. The mounted optical semiconductor element S is mounted and fixed, and each electrode of the optical semiconductor element S is electrically connected to the lead member 26 through an electrical connection means 29 such as a bonding wire. The lid 27 is joined to the upper surface via a sealing material, and the base 21 having the frame portion 22 and the lid 27 are joined together.
The optical semiconductor device S is completed as a product by hermetically storing the optical semiconductor element S inside the container composed of

In such an optical semiconductor device, an electric signal supplied from an external electric circuit is applied to the optical semiconductor element S through a lead member 26 to excite the optical semiconductor element S with light and to transmit the excited light to the optical fiber 25. By transmitting the light, or irradiating the light transmitted through the optical fiber 25 to the optical semiconductor element S, and generating an electric signal corresponding to the light irradiated to the optical semiconductor element S, the generated electric signal is transmitted to the lead member 26. Used for optical communication by extracting through.

In FIG. 1, reference numeral 30 denotes a protective film for protecting the optical fiber 25, for example, a first film made of a silicone resin or an ultraviolet curable resin on the surface of the optical fiber 25.
It is formed by sequentially depositing a layer and a second layer of nylon.

When the base 21 having the frame portion 22 on the outer peripheral portion of the upper surface is made of, for example, an aluminum oxide sintered body, an organic material is added to a ceramic raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. A binder, a solvent, etc. are added and mixed to form a slurry, and the slurry is formed into a sheet by a doctor blade method, a calendar roll method, or the like to obtain a ceramic green sheet, and thereafter, a predetermined punching is performed on the ceramic green sheet. Processing and laminating multiple pieces, about 1500
When it is manufactured by baking at a high temperature of ℃ and is formed of an organic resin such as an epoxy resin, a transfer mold method is employed, and specifically, a bisphenol A type, 0- In the form of tablets consisting of epoxy resin such as clay sol novolac, filler such as silica and alumina, and other curing agents, flexible agents, flame retardant aids, coloring agents, release agents, etc. It is manufactured by injecting a raw material powder of a molded epoxy resin and thermally curing the same at a temperature of 150 ° C to 200 ° C.

[0006]

However, in this conventional package for housing an optical semiconductor element, the fixing of the optical fiber 25 to the frame 22 is performed by inserting the optical fiber 25 into the through hole 23 provided in the frame 22. The inner surface of the through hole 23 and the outer surface of the optical fiber 25 are made of glass,
It is performed by bonding with an adhesive such as resin,
Since the facing area between the inner surface of the through hole 23 and the outer surface of the optical fiber 25 is small, the fixing strength of the optical fiber 25 is weak, and when an external force is applied to the optical fiber 25, the optical fiber 25 separates from the through hole 23 to remove the frame portion 22. The hermetic sealing of the container composed of the base 21 and the lid 27 having the substrate is broken, and the optical semiconductor element S accommodated in the container is normal for a long time.
Further, it has a disadvantage that it cannot be operated stably.

When the optical fiber 25 is removed from the through hole 23, the optical fiber 25 and the optical semiconductor element S do not face each other accurately, and the efficiency of light transmission and reception between the optical fiber 25 and the optical semiconductor element S is greatly reduced. There was also a disadvantage.

Furthermore, recently, there has been a strong demand for optical semiconductor devices used for communication equipment to be small and inexpensive, and in order to meet this demand, the manufacturing process is simpler than conventional optical semiconductor devices. Therefore, it has become necessary to provide products with a small number of parts.

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to precisely oppose an optical fiber and an optical semiconductor element, and to improve the efficiency of light transmission and reception between the optical fiber and the optical semiconductor element. Provided is an optical semiconductor element housing package that can normally and stably operate an optical semiconductor element housed therein for a long period of time, and can simplify the manufacturing process of the obtained optical semiconductor device at low cost. It is in.

[0010]

According to the present invention, there is provided a base having an optical semiconductor element mounting portion provided in the center of the upper surface, a frame surrounding the mounting portion in the outer peripheral portion, and an upper surface of the frame. An optical semiconductor element storage package comprising a lid attached via a sealing material and closing the inside of the frame, wherein the optical fiber penetrates the frame on the upper surface of the frame, and has an optical fiber therein. A cutout portion fixed by the sealing material is formed, and a concave portion is provided around the cutout portion on the outer surface side of the frame portion.

According to the package for housing an optical semiconductor element of the present invention, a notch is formed in the upper surface of the frame provided on the outer peripheral portion of the upper surface of the base, and the optical fiber is fitted in the notch and the lid is attached to the upper surface of the frame. When the optical fiber is fixed to the frame part by using the sealing material, an adhesive for fixing the optical fiber to the frame part becomes unnecessary, and when the container including the base having the frame part and the lid is hermetically sealed via the sealing material, The optical fiber can be fixed to the frame at the same time, so that the optical semiconductor device obtained as a product can be manufactured by an extremely simple manufacturing process with a small number of parts.

According to the package for housing an optical semiconductor element of the present invention, a notch is formed on the outer surface side of the frame provided on the outer peripheral portion of the upper surface of the base, around the notch where the optical fiber is fixed. When the optical fiber is fixed to the portion via the sealing material, a part of the sealing material enters into the concave portion provided around the cutout portion to reinforce the fixing strength of the optical fiber to the frame portion, and thus, the external force is applied to the optical fiber. Even if the voltage is applied, the optical fiber is effectively prevented from coming off from the cutout portion, and the container including the base having the frame portion and the lid is completely hermetically sealed, and the optical semiconductor element housed in the container can be normally used for a long time. , And can be operated stably.

Further, since the optical fiber does not come off from the cutout portion, the optical fiber and the optical semiconductor element always face each other accurately, and the efficiency of transmitting and receiving light between the optical fiber and the optical semiconductor element is extremely high. Can be.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of the package for housing an optical semiconductor element according to the present invention. The base 1 having the frame 2 and the lid 3 constitute a container for housing the optical semiconductor element S inside.

The base 1 functions as a support member for supporting the optical semiconductor element S, and has a mounting portion 1a for mounting the optical semiconductor element S at substantially the center of the upper surface thereof.
An optical semiconductor element S mounted on an optical transmission module substrate L made of silicon or the like is mounted and fixed on the mounting portion 1a.

A frame 2 is formed on the outer periphery of the upper surface of the base 1 so as to surround a mounting section 1a on which the optical semiconductor element S is mounted. This serves to form a space for accommodating the optical semiconductor element S.

The base 1 having the frame 2 at the outer periphery of the upper surface is made of a ceramic material such as an aluminum oxide sintered body or an organic resin such as an epoxy resin. An organic binder, a solvent, and the like are added to and mixed with ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry, and the slurry is formed into a sheet by a doctor blade method, a calendar roll method, or the like. Then, a ceramic green sheet is obtained. Thereafter, the ceramic green sheet is manufactured by performing a predetermined punching process, laminating a plurality of sheets, and firing at a high temperature of about 1500 ° C., and is formed of an organic resin such as an epoxy resin. If the transfer mold method is used, Bisphenol A type into the mold, 0-
Epoxy resin such as clay sol novolak type, silica,
Fillers such as alumina and other curing agents,
By injecting tablet-shaped epoxy resin raw material powder composed of a flexibilizing agent, a flame retardant aid, a coloring agent, a release agent, and the like, and thermally curing the same at a temperature of 150 ° C to 200 ° C. Be produced.

When the base 1 having the frame 2 at the outer peripheral portion of the upper surface is formed of an organic resin such as an epoxy resin, the organic resin such as the epoxy resin has excellent impact resistance. Even when an impact force is applied to the base 1 from the outside, no cracks, cracks, or the like occur in the base 1 having the frame 2, and as a result, the airtightness of the container composed of the base 1 having the frame 2 and the lid 3. The reliability of hermetic sealing is greatly improved, and the optical semiconductor element S housed in the container can be normally and stably operated for a long period of time.

When the substrate 1 having the frame portion 2 is formed of an organic resin such as an epoxy resin, the organic resin generally has poor moisture resistance, so that the surface thereof has a radius of 10 to 100 inside.
1.0 to 5 hygroscopic materials having angstrom pores
If the content is 0% by weight, even if the moisture contained in the air tries to enter the inside through the base 1 having the frame portion 2, the entry is effectively prevented by the hygroscopic material. Oxidative corrosion does not occur in the electrodes of the optical semiconductor element S, the electrical connection means 5 such as bonding wires described later, or the external lead terminals 4, so that the optical semiconductor element S can always operate normally and stably. It becomes possible. Therefore, it is preferable that the base 1 having the frame portion 2 contains 1 to 50% by weight of a hygroscopic material having pores having a radius of 10 to 100 angstroms on its surface.

Further, when the substrate 1 having the frame portion 2 is formed of an organic resin such as an epoxy resin and a hygroscopic material is contained therein, the base material 1 having the frame portion 2 is formed by transfer molding an epoxy resin raw material powder. When forming
By making the raw material powder of the epoxy resin contain a predetermined amount of a hygroscopic material composed of spherical silica particles in advance, the frame 2
Contained in the substrate 1 having

Further, when the substrate 1 having the frame portion 2 is formed of an organic resin such as an epoxy resin and a moisture absorbing material is contained therein, if the pore radius of the surface of the moisture absorbing material is less than 10 angstroms, It is difficult to completely adsorb the moisture invading the moisture absorbent 1, and if it exceeds 100 angstroms, the specific gravity of the moisture absorbent becomes light, and the moisture absorbent is dispersed and contained in the entire base 1 having the frame 2. It will be difficult. Therefore, when a hygroscopic material is contained inside the base 1 having the frame portion 2, the pore radius of the surface of the hygroscopic material is 1
It is preferable to set the range of 0 Å to 100 Å.

Further, when the base 1 having the frame 2 is formed of an organic resin such as an epoxy resin and a moisture absorbing material is contained therein, if the content of the moisture absorbing material is less than 1% by weight, the frame 1 When the amount exceeds 50% by weight, the flow of the epoxy resin when forming the base 1 having the frame 2 by transfer molding the raw material powder of the epoxy resin when the amount exceeds 50% by weight. There is a risk that the substrate 1 having the frame portion 2 having a desired shape may not be obtained due to poor properties. Therefore, the base 1 having the frame 2
When a hygroscopic material is contained in the inside of the base material, the content of the hygroscopic material is preferably in the range of 1 to 50% by weight.

A base 1 having a frame 2 at the outer periphery of the upper surface
The base 1 having the frame 2 is formed by joining the lid 3 to the upper surface of the frame 2 via a sealing material 6 made of an organic resin, glass, or the like, and closing the inside of the frame 2 with the lid 3. The optical semiconductor element S is hermetically accommodated in a container constituted by the cover 3 and the lid 3.

The cover 3 is made of a ceramic material such as an aluminum oxide sintered body, an organic resin such as an epoxy resin, or a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. When the cover 3 is made of a ceramic material such as an aluminum oxide sintered body or an organic resin such as an epoxy resin, the lid 3 is formed in the same manner as in the case of the base 1 having the frame 2 on the outer periphery of the upper surface. When it is formed of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy, it is rolled or punched into an ingot (lump) of an iron-nickel-cobalt alloy or the like. It is formed in a predetermined shape by employing a metal working method.

A sealing member 6 for joining a lid 3 to the upper surface of the frame 2 and hermetically sealing a container formed of the base 1 having the frame 2 and the lid 3 is made of epoxy resin or the like. Titanic acid is used as a glass component containing organic resin or lead oxide 30 to 50% by weight, lead fluoride 10 to 20% by weight, bismuth oxide 3 to 13% by weight, boron oxide 1 to 5% by weight, zinc oxide 1 to 5% by weight. It consists of a low-melting glass or the like having a softening melting temperature of 400 ° C. or less in which a lead-based compound is added as a filler in an amount of 25 to 45% by weight. The glass paste obtained in this manner is applied to the upper surface of the frame portion 2 and the opposing surface of the lid 3 to a predetermined thickness, and then heated to a predetermined temperature to thermally cure the organic resin precursor. Or melting the glass paste by heating. It is attached so as to hermetically seal the container between the upper surface and the lid 3 the lower surface of the frame part 2 by.

Further, the frame portion 2 provided on the base 1 has a cutout 7 formed on the upper surface thereof so as to penetrate inside and outside of the frame portion 2. The optical fiber 8 is disposed so as to fix the optical fiber 8 in a state where the optical fiber 8 faces the optical semiconductor element S, and the outer surface of the optical fiber 8 and the inner surface of the cutout 7 are connected to each other. The optical fiber 8 is fixed in the cutout 7 of the frame portion 2 by bonding the sealing member 6 to the upper surface of the frame portion 2 via the sealing material 6.

In this case, since the optical fiber 8 is fixed in the cutout portion 7 using the sealing material 6 for attaching the lid 3 to the upper surface of the frame portion 2, an adhesive for fixing the optical fiber 8 to the frame portion 2 is used. It is not necessary to prepare separately, and the base 1 having the frame 2
The optical semiconductor device obtained as a product has a small number of parts because the optical fiber 8 can be simultaneously fixed to the frame portion 2 when the container including the lid 3 and the container 3 is hermetically sealed via the sealing material 6. In addition, it can be manufactured with an extremely simple manufacturing process.

The notch 6 formed on the upper surface of the frame portion 2 is formed by grinding the upper surface of the frame portion 2 when the base 1 having the frame portion 2 is formed of a ceramic material, laser processing, or the like. Or by forming a hole in a predetermined position of a ceramic green sheet serving as a substrate 1 having a frame portion 2 in advance, or when formed of an organic resin such as an epoxy resin. Is formed at a predetermined position on the upper surface of the frame 2 by devising a mold in advance when forming the base 1 having the frame 2.

The frame 2 has a notch 7 on its outer surface.
A concave portion 9 is formed in the periphery of the optical fiber 8. When the optical fiber 8 is fixed to the cutout portion 7 via the sealing material 6, a part of the sealing material 6 enters and the frame portion 2 of the optical fiber 8 is formed. Since the fixing strength of the optical fiber 8 with respect to the frame 2 is reinforced by the sealing material 6 that has entered the concave portion 9, the optical fiber 8 is protected even when an external force is applied to the optical fiber 8. It hardly comes off the notch 7, and as a result, the hermetic sealing of the container comprising the base 1 having the frame portion 2 and the lid 3 is completed, and the optical semiconductor element S accommodated in the container can be kept normal for a long time. And it can operate stably. At the same time, since the optical fiber 8 does not come off from the cutout 7, the optical fiber 8 and the optical semiconductor element S always face each other accurately, and the efficiency of light transmission and reception between the optical fiber 8 and the optical semiconductor element S is extremely good. Becomes

The concave portion 9 is formed in the same manner as the cutout portion 7, specifically by using a grinding process, a laser process or the like, or when forming the base body 1 having the frame portion 2, a mold is devised in advance. For example, it is formed on the outer surface side of the frame portion 2 around the cutout portion 7.

An optical fiber 8 is inserted and fixed in the cutout 7 of the frame portion 2. The optical fiber 8 transmits light emitted from the optical semiconductor element S to the outside or transmits light from the outside to the optical semiconductor element S. Acts as a light transmission path for transmission to

Further, between the base 1 having the frame portion 2 and the lid, a plurality of lead members 4 whose both ends protrude inside and outside the frame portion 2 are provided. Each electrode of the optical semiconductor element S is connected to a region protruding inward through an electrical connection means 5 such as a bonding wire, and a region protruding outside the frame portion 2 is electrically connected to an external electric circuit. For example, each electrode of the optical semiconductor element S is electrically connected to an external electric circuit via the lead member 4.

The lead member 4 is made of a metal plate such as an iron-nickel-cobalt alloy or an iron-nickel alloy.
It is led out from the inside to the outside of the frame portion 2 through the sealing material 6 that joins the cover 2 and the cover 3.

The exposed outer surface of the lead member 4 is coated with a metal such as nickel or gold having good conductivity and excellent corrosion resistance and good wettability with a brazing material by a plating method to a predetermined thickness (1 to 20 μm). In this case, the lead member 4 can be effectively prevented from being oxidized and corroded, and the lead member 4 can be connected to an electrical connection means 5 such as a bonding wire, and the lead member 4 can be connected to an external electric circuit. Can be made highly reliable. Accordingly, the lead member 4 has good conductivity and excellent corrosion resistance on its exposed outer surface,
It is preferable that a metal such as nickel or gold having good wettability with the brazing material is applied to a thickness of 1 to 20 μm by plating.

Thus, according to the package for storing an optical semiconductor element of the present invention, the optical semiconductor element S mounted on the optical transmission module substrate L is mounted and fixed on the mounting portion 1a of the base 1 and each of the optical semiconductor elements S The electrode is connected to a predetermined lead member 4
Is electrically connected via an electrical connection means 5 such as a bonding wire, and then an optical fiber 8 is inserted into a cutout 7 provided on the upper surface of the frame 2 so that the tip thereof faces the optical semiconductor element S. After that, the upper surface of the frame portion 2 and the lid 3 are joined via the sealing material 6, and the optical semiconductor element S is placed inside the container including the base 1 having the frame portion 2 and the lid 3. And the optical fiber 8 is fixed in the cutout 7 provided on the upper surface of the frame 2 via the sealing material 6 to complete the optical semiconductor device as a product.

In such an optical semiconductor device, an electric signal supplied from an external electric circuit is applied to the optical semiconductor element S via the lead member 4 to excite the optical semiconductor element S with light and transmit the excited light to the optical fiber 8. By transmitting the light or irradiating the light transmitted through the optical fiber 8 to the optical semiconductor element S, an electric signal corresponding to the light irradiated to the optical semiconductor element S is generated, and the generated electric signal is transmitted through the lead member 4. Used for optical communication by taking out.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

[0038]

According to the package for housing an optical semiconductor element of the present invention, a notch is formed on the upper surface of the frame provided on the outer peripheral portion of the upper surface of the base, and the optical fiber is placed in the notch and the lid is mounted on the upper surface of the frame. Since the fixing is performed using the sealing material to be attached, the adhesive for fixing the optical fiber to the frame portion is not required, and the container including the base having the frame portion and the lid is hermetically sealed via the sealing material. In this case, the optical fiber can be fixed to the frame at the same time, whereby the optical semiconductor device obtained as a product can be manufactured by a very simple manufacturing process with a small number of parts.

According to the package for housing an optical semiconductor element of the present invention, the notch is formed on the outer surface side of the frame provided on the outer peripheral portion of the upper surface of the base, around the notch where the optical fiber is fixed. When the optical fiber is fixed to the portion via the sealing material, a part of the sealing material enters into the concave portion provided around the cutout portion to reinforce the fixing strength of the optical fiber to the frame portion, and thus, the external force is applied to the optical fiber. Even if the voltage is applied, the optical fiber is effectively prevented from coming off from the cutout portion, and the container including the base having the frame portion and the lid is completely hermetically sealed, and the optical semiconductor element housed in the container can be normally used for a long time. , And can be operated stably.

Further, since the optical fiber does not come off from the notch, the optical fiber and the optical semiconductor element always face each other accurately, and the efficiency of light transmission and reception between the optical fiber and the optical semiconductor element is extremely good. Can be.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a package for housing an optical semiconductor element of the present invention.

FIG. 2 is a cross-sectional view showing one embodiment of a conventional package for housing an optical semiconductor element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base 1a ... Placement part 2 ... Frame part 3 ... Lid 4 ... Lead member 6 ... Sealing material 7 ... Notch part 8 ... Optical fiber 9 ...・ Recess

Claims (1)

[Claims] An optical semiconductor device mounting portion is provided at a central portion of an upper surface, and a base body having a frame portion surrounding the mounting portion at an outer peripheral portion is attached to a base member via a sealing material on an upper surface of the frame portion. And a lid for closing the inside of the frame portion, wherein the package is an optical semiconductor element storage package, wherein the optical fiber penetrates the frame portion on the upper surface of the frame portion and an optical fiber is fixed inside by the sealing material. An optical semiconductor element housing package, wherein a notch is formed and a recess is provided around the notch on the outer surface side of the frame.