JPH1179542A - Film peeling method and apparatus - Google Patents

Abstract

(57) [Problem] To reduce the area of a film peeling device and shorten the time required for film peeling. SOLUTION: A film peeling device 10 is moved from a substrate carry-in side to a carry-out side, and lower and upper film peeling regions 12 and 14 are provided.
In the lower film peeling area 12, the lower film 20 is pulled and peeled by the lower tensile peeling device 54 in a state where the loaded substrate 22 is sucked by the upper suction disk 36. Substrate 22 after
The upper film peeling area 14 is
The upper film 18 is pulled and peeled by the upper pull-off device 60 in a state of being transferred to the lower suction plate 42 and being sucked by the lower suction plate 42, and the substrate 22 is transferred to the substrate unloading area 16. Then, the upper film 18 peeled off through the created space is dropped and discharged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for peeling a protective film attached to a substrate exemplified by a substrate for a printed wiring board, a substrate for a liquid crystal display panel, a substrate for a plasma display and the like.

[0002]

2. Description of the Related Art A printed wiring board as described above is manufactured by the following steps. First, a laminate comprising a photosensitive resin (photoresist) layer and a light-transmitting resin film (protective film) for protecting the conductive layer on a conductive layer provided on an insulating substrate is thermocompression-bonded with a laminating roll. Next, a wiring pattern film is overlaid, and the photosensitive resin layer is exposed for a predetermined time through the wiring pattern film and the translucent resin film.

Next, after the light-transmitting resin film is peeled off, the exposed photoresist layer is developed to form an etching mask pattern. Then, unnecessary portions of the conductive layer are removed by etching, and a predetermined wiring is formed. A printed wiring board having a pattern is formed.

Various film peeling apparatuses have been proposed for automatically peeling the protective film from the substrate in the process of manufacturing the printed wiring board.

When the film is automatically peeled from the substrate by such a film peeling device, first, the portion of the leading end of the film at which the peeling is to be started is pressed obliquely up and down or hooked by a needle-like member. Or

For example, as disclosed in Japanese Patent Publication No. 6-3550, vibration of a rod of a vibrator is applied to an end of a laminated film composed of a photosensitive resin layer and a translucent resin film attached to a substrate. In some cases, a part of the light-transmitting resin film is floated from the photosensitive resin layer by applying and tapping. Further, for example, Japanese Patent Application Laid-Open No. 62-83974
As disclosed in Japanese Patent Application Laid-Open Publication No. H10-209, there is also a type in which the film edge is lifted by running the pressure wheel along the film edge in a state where the protective film edge is sandwiched by the pressure wheel together with the substrate. is there.

In any case, after the leading edge of the film is floated, the film is flipped up from the rising edge by blowing a gas such as compressed air, and the flipped-up film edge is sandwiched between rollers and belts. The film is completely peeled off and the film is carried out of the line while advancing the substrate.

Here, when the film edge is pinched and peeled by a roller or a belt and carried out of the line, the film peeled from the upper surface of the substrate is removed in the width direction by a substrate transport device such as a transport roller. Since the device is carried out from the outside, the width of the device becomes large. Rollers and belts at the edges of the film increase the size of the device in the vertical direction.

In a device in which the film edge is sandwiched between rollers and belts, if the protective film is extremely thin,
In some cases, this cannot be reliably held.

[0010]

In order to reliably peel a thin film from a substrate, for example, Japanese Patent Application Laid-Open No.
As disclosed in Japanese Patent Application Laid-Open No. 99769, a peeling method and apparatus in which a flipped-up film edge is clamped by a clamping piece and the film is peeled by pulling it against a substrate is effective. In this case, in order to carry out the film peeled off from the upper surface of the substrate, there is a problem that the film must be moved to the side of the substrate transport surface and the film must be discharged out of the line.

Further, when the film is peeled off from the substrate by holding the leading end of the film which has been peeled by the holding piece and pulling it, for example, the above-mentioned Japanese Patent Application Laid-Open No. Hei 8-99769.
As disclosed in Japanese Patent Application Laid-Open Publication No. H10-260, the side of the substrate opposite to the film to be peeled must be fixed by suction using a suction device.

Therefore, the holding piece must be moved by the length in the direction of travel of the substrate in order to peel the film from the fixed substrate, thereby further increasing the device area. There is.

Further, since the film is peeled while the substrate is fixed by the suction device, it takes a long time to peel the film and carry out the substrate to the next step, and there is a problem that the efficiency is low.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and enables a thin film to be reliably peeled off, and has a small moving range of a device for pulling and peeling the leading end of the film which has started peeling. It is another object of the present invention to provide a method and an apparatus for peeling a film, which need not carry out the peeled film from the side of the substrate transport surface and have a short film peeling time.

[0015]

According to the present invention, a lower film peeling area, an upper film peeling area, and a substrate unloading area are sequentially set adjacent to each other in a straight line in the horizontal direction, and conveyed in the lower film peeling area. Along the horizontal substrate transfer surface formed by the apparatus, the step of transferring and stopping the substrate on which the film is attached on both the upper and lower surfaces to a predetermined position, and substantially the entire upper surface of the stopped substrate, by the horizontal upper suction plate The step of sucking and fixing, and peeling the leading end of the lower film attached to the lower surface of the substrate sucked and fixed by the upper sucking plate from the substrate in the substrate transfer direction, and the peeling tip to the outside of the leading end of the transfer device. A step of flipping from the lower surface of the substrate at a position, a step of capturing the rolled-down lower film tip, and moving the captured lower film tip to the tip of the transfer device. While pulling down through between the film peeling area, the substrate was conveyed to the upper film peeling area direction while being attracted by the upper suction cup,
A step of releasing the entire lower film from the substrate, a step of releasing the tip of the lower film peeled from the substrate and dropping and discharging the film downward, and the substrate is adsorbed by the upper suction plate, Transporting the film to the upper film peeling area while peeling the side film, and stopping horizontally after peeling the lower film; and a substrate sucked on the lower surface of the upper suction disk in the upper film peeling area. A step of transferring the substrate from the upper suction disk to the lower suction disk by sucking substantially the entire lower surface of the lower suction disk with the horizontal lower suction disk, and after the transfer, the upper suction disk is moved to the lower film peeling region. Returning step, the top surface of the upper film of the fixed substrate is peeled off by suction on the upper surface of the lower suction plate,
The step of flipping the peeling tip, the step of capturing the flipped upper film tip, and the step of pulling the captured upper film tip in the inward direction of the upper film peeling area while adsorbing by the lower suction disc. Moving the substrate in the direction of the substrate unloading area to release the entire upper film from the substrate; and releasing the upper film tip peeled from the substrate to release the lower suction disk from the substrate unloading area. Through the space created by moving in the direction, the step of dropping and discharging the upper film downward, and loading the substrate from which the upper film has been peeled into the substrate unloading area while adsorbing the substrate with the lower suction disk. Stopping the substrate horizontally, transferring the substrate from the lower suction disk in the stopped state to the substrate carrying-out means, and returning the lower suction disk to the upper film peeling area. And extent, by a film peeling method comprising a, is to achieve the above object.

Further, according to the present invention, a lower film peeling area, an upper film peeling area, and a substrate carry-out area are sequentially arranged in the horizontal direction from the substrate carry-in side to the carry-out side. A substrate transport device provided in the lower film peeling region and transporting a substrate having films adhered on both upper and lower surfaces along a horizontal substrate transport surface; and a position above the substrate transport device and the upper film peeling device. An upper suction disk capable of reciprocating substantially horizontally between the areas and adsorbing substantially the entire upper surface of the substrate to be able to hold the substrate horizontally; The lower peeling device that peels off the discharge-side tip of the lower film attached to the lower surface of the substrate in the state, and turns over, is disposed near the discharge-side end of the substrate transport device, and is disposed by the lower release device. A lower tensile peeling device that captures the leading end of the lower film that has been lowered, and passes between the substrate transport device and the upper film peeling region, and pulls the leading end of the captured lower film downward. Is disposed at a lower position of the upper suction plate when the upper suction plate has moved into the upper film peeling region, and can reciprocate horizontally between the lower position and the substrate unloading region, and A lower suction disc capable of holding the substrate horizontally by adsorbing substantially the entire upper surface, and an unloading end of an upper film attached to an upper surface of the substrate in a state of being adsorbed by the lower suction disc. The upper peeling device, which peels off, and flips up, captures the tip of the flipped up film and pulls it to the substrate loading side, and has an upper tensile peeling device. , Said lower pull When the lower film is pulled by the peeling device, the substrate moves to the upper film peeling region while adsorbing the substrate, and returns to the lower film peeling region before peeling the upper film by the upper peeling device. When the upper suction device pulls the upper film by the upper pulling device, the suction device moves into the substrate unloading area while holding the substrate, the upper film is separated from the substrate, and the lower suction disk is pulled into the substrate unloading area. When the blank is generated in the downward direction of the upper tensile peeling device by moving in the direction, the upper tensile peeling device releases the captured upper film by the film peeling device, characterized in that: The purpose is achieved.

According to a third aspect of the present invention, the substrate transfer device comprises:
It comprises a plurality of transport rollers arranged in parallel along the substrate transport surface, and comprises one to three transport rollers on the upper film peeling region side end portion of the plurality of transport rollers, constituting the substrate transport surface. Transport position and below this,
The lower film peeled by the lower peeling device and may be vertically movable between a turned-down lower film and a standby position pulled down until it does not interfere.

Further, the lower pull-off device is disposed substantially vertically downward from near the lower side of the substrate transfer surface at a position near the leading end of the substrate transfer side of the substrate transfer device. A guide plate for guiding the leading end of the lower film, a film capturing device provided near the lower end of the guide plate, and capable of capturing the leading end of the lower film protruding downward from the guide plate; and A swing arm that is swingable between a position near the guide plate and a release position below the guide plate with the capture device supported at the free end side and centered on the base end side; Is also good.

Further, as described in claim 5, the substrate on the substrate transfer device is pushed up below the substrate transfer device, and is vertically movable so as to be pressed from below onto the upper suction plate which is waiting above. A device may be provided, and the base of the swing arm may be swingably supported by the push-up device.

According to the present invention, when the film stuck on the lower surface of the substrate is peeled off, the upper surface of the substrate is sucked and held, and the film is conveyed in the direction of the front end of the substrate. By pulling the lower film, the lower film can be pulled downward under the transfer device while the substrate is being transferred, and the separation time can be shortened, and the separated film can be released and discharged as it is.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings.

As shown in FIG. 1, a film peeling device 10 according to the present invention comprises a lower film peeling region 12 and an upper The film peeling area 14, and the substrate carry-out area 16 are sequentially arranged adjacently, and are fed from the substrate carry-in side to the lower film peeling area 12,
The upper film 18 is on the upper surface, and the lower film 2 is on the lower surface.
The lower and upper films 20 and 18 are peeled in this order from the substrate 22 (see FIG. 2) to which the “0” is attached, respectively, and the substrate 22 after the film peeling is carried out from the substrate carrying-out area 16. Things.

The lower film peeling area 12 is provided with a substrate transfer device 26 in which a plurality of transfer rollers 24 are horizontally arranged in parallel, and along a substrate transfer surface 26A formed by the upper end of the transfer rollers 24. In FIG. 1, the substrate 22 can be conveyed until the entire substrate 22 loaded from the left substrate input end enters the lower film peeling region 12.

Of the transport rollers constituting the substrate transport device 26, two transport rollers 25 at the forefront of the substrate transport direction
Is a transfer position configuring the substrate transfer surface 26A by the cylinder device 28, and as shown by a solid line in FIG.
It is movable up and down between a transfer position and a standby position which is greatly lowered.

At the lower position of the substrate transfer device 26, there are provided a plurality of push-up and down members 30 which push up the substrate 22 on the substrate transfer surface 26A by projecting upward from the gap between the transfer rollers 24. A lifting device 32 is disposed.

As shown in FIG. 1, the push-up device 32 is normally in a standby position in which the tip of the push-up member 30 is located below the substrate transfer surface 26A, and pushes up the substrate 22 by the cylinder device 34. It can be driven into position. Reference numeral 34A in FIG. 1 indicates a guide shaft for guiding the lifting member 30 in the vertical direction.

At an upper position of the lower film peeling area 12 and the upper film peeling area 14, an upper suction disk 36 which is horizontally reciprocable between them is disposed.

A plurality of suction holes (not shown) to which a negative pressure is applied are uniformly provided in the lower surface of the upper suction plate 36 in the surface direction, and the upper surface of the substrate 22 pressed from below is entirely covered with the suction surface. To be able to be adsorbed.

The upper suction plate 36 is disposed horizontally and in the transport direction along a guide bar 38 disposed in the substrate transport direction over the lower and upper film peeling regions 12 and 14 via a guide shoe 38A. Slidably guided
In addition, it can be reciprocated along the guide bar 38 by the feed screw mechanism 40.

The feed screw mechanism 40 has a motor 40A, a screw feed screw 40B driven by the motor 40A, and a nut portion 40C screwed into the feed screw 40B and advanced and retracted by the rotation thereof. The portion 40C supports the upper suction plate 36. The moving range of the upper suction plate 36 by the feed screw mechanism 40 is, as shown in FIG. 1, in the lower film peeling region 12, at a position directly above the substrate transfer device 26 and in the upper film peeling region 14. It is between the entry position.

The height of the upper suction plate 36, that is, the distance from the substrate transfer surface 26A, is such that when the substrate 22 is pushed up by the pushing member 30, the upper surface of the substrate 22 is in contact with the lower surface of the upper suction plate 36. It is set to almost match.

When the upper suction disk 36 enters the upper film peeling area 14, the upper suction disk 36
A lower suction plate 42 is horizontally arranged at a position facing the lower surface of the storage device.

The lower suction plate 42 is provided with a large number of suction holes (not shown) for applying a negative pressure on the horizontal upper surface thereof in a plane direction. Can be adsorbed over its entire surface.

The lower suction plate 42 includes a lifting cylinder 42
A is vertically movably supported by A
2A can be reciprocated by a rodless cylinder 46 horizontally along the guide bar 38 and between the upper film peeling area 14 and the substrate unloading area 16.

In the lower film peeling area 12, a lower peeling device for peeling off and turning over the leading end of the lower film 20 at the leading end in the transport direction with the substrate 22 being sucked by the upper sucking plate 36. 48, an upper peeling device 50 is provided in the upper film peeling region 14 for peeling off and turning up the tip of the upper film 18 on the upper surface of the substrate 22 which is sucked by the lower sucking plate 42. I have.

As shown in FIG. 2, the upper film 18 and the lower film 20 are respectively located on the upper surface and the lower surface of the substrate 22 at positions slightly behind the leading end of the substrate 22 in the transport direction. It is stuck so that there is a tip.

As shown in an enlarged view in FIG. 3, the lower peeling device 48 is capable of moving up and down with respect to the front end of the lower film 20 of the substrate 22 adsorbed on the upper adsorbing disk 36 so as to be able to contact and detach. , And the width direction of the substrate (in FIG. 1, the direction perpendicular to the paper surface)
Roll (48mm) that can reciprocate slightly (about 30mm)
A, the peeling roll 48A is slightly reciprocated in the width direction of the substrate while pressing the peeling roll 48A against the distal end of the lower film 20, so that the distal end of the lower film 20 floats from the lower surface of the substrate 22.

The lower peeling device 48 blows compressed air between the front end of the lower film 20 lifted from the lower surface of the substrate 22 by the peeling roll 48A and the lower surface of the substrate 22, and And a peeling nozzle 48B for peeling off and turning over.

The peeling roll 48A is pressed by the linear guide 48D onto the lower surface of the substrate 22 that is being sucked by the lower suction board 42, as shown by the solid line in FIG. It can be moved up and down between the substrate transfer surface 26A and a standby position below. Reference numeral 48E in FIGS. 1 and 3 denotes a slide table for slightly reciprocating the peeling roll 48A in the substrate width direction.
An air cylinder for reciprocating the peeling roll 48A is not shown. The transport roller 25, slide table 48E, and peeling nozzle 48B can be slightly moved up and down as a whole by an air cylinder 48C.

As shown in FIG. 3 in an enlarged manner, a guide plate 52 having a function as a push-up member is provided in parallel with the push-up member 30 in the push-up device 32 so as to be movable up and down. Roller 25
Are arranged in a vertical direction at a position adjacent to.

In the lower film peeling area 12, below the push-up member 30 of the substrate transfer device 26 and the push-up device 32, the leading end of the lower film 20 protruding from the guide plate 52 and hanging is captured. A lower tension peeling device 54 is provided for peeling the lower film 20 from the substrate 22 by pulling the lower film 20 downward.

The lower pull-off device 54 is pivotally supported by the push-up device 32 at the base end thereof by means of a pin 56A (a rocking drive source is not shown). As shown in FIG. A swing arm 56 which is swingable clockwise in a range of about 100 ° from the state, and the swing arm 5
6 and a catching device 58 that can catch and release the tip of the lower film 20 protruding from the lower end of the guide plate 52 and hanging therefrom.

The catching device 58 has a receiving plate 58A continuously and vertically arranged at the lower end of the guide plate 52, and a free end disposed at a lower position and an outer position of the receiving plate 58A. The air cylinder 58D includes a catch lever 58C swingably supported by a pin 58B and an air cylinder 58D.
The lower end of the lower film 20 is released by swinging the lower end of the lower film 20 in the counterclockwise direction in FIG. 2 so that the lower end is sandwiched between the receiving plate 58A and the catching lever 58C in the retracted state. It is made to let.

As shown in the enlarged view of FIG. 4, the upper peeling device 50 includes a peeling roll 50A, a peeling nozzle 50B, an air cylinder 50C, a linear guide 50D, and the like, as in the lower peeling device 48. It is provided with a slide table 50E.

In the upper film peeling area 14, an upper tensile peeling device that captures the tip of the upper film 18 that has been peeled off from the upper surface of the substrate 22 by the upper peeling device 50 and that has been turned up, and pulls in the peeling direction. 60 are provided.

The upper pull-off device 60 includes a catching device 62 similar to the catching device 58 in the lower pull-off device 54, an elevating cylinder 64 for vertically moving the catching device 62 up and down in FIG. Lifting cylinder 64
And a moving device 66 for horizontally supporting the substrate in a substrate reciprocating direction.

As in the case of the catching device 58, the catching device 62 includes a vertical receiving plate 62A and a receiving plate 62A.
The upper end of the upper film 18 flipped up along the upper end of the receiving plate 62A is sandwiched between the upper end and the upper end of the receiving plate 62A.
And a pin 6 for swingably supporting the capture lever 62C.
2B and an air cylinder 62D that swings the capture lever 62C forward of the pin 62B.

The moving device 66 includes the lifting cylinder 6
Guide bar 66 for slidably supporting substrate 4 in the substrate transport direction
A, and a rodless cylinder 66B for reciprocating the lifting cylinder 64 along the guide bar 66A.

When the lower suction plate 42 moves into the substrate transfer region 16, the lower suction plate 42 is lowered from above to the position above the lower suction plate 42, and There is provided a substrate unloading device 68 for sucking and lifting, and unloading from the substrate unloading area 16 to the right side in FIG.

The substrate unloading device 68 includes a plurality of bellows-containing adsorbents 68A for applying a negative pressure to approach and adsorb the substrate 22 from above, and for raising and lowering the adsorbent 68A. The air cylinder 68B and the substrate 2 on which the air cylinder 68B and the adsorbent 68A are adsorbed.
Moving device 68C for moving out of the line together with 2
And

Reference numeral 70 in FIG. 1 indicates a control panel. The control panel 70 includes the substrate transfer device 26 and the cylinder device 2.
8. Cylinder device 34 of lifting device 32, motor 40
A, ON / OFF of negative pressure to upper and lower suction disks 36, 42, lifting cylinder 42A, rodless cylinders 46, 6
6B, a control device 72 for controlling the lower and upper peeling devices 48 and 50, the lower and upper tensile peeling devices 54 and 60, and the substrate unloading device 68 is provided (see FIG. 5).

Next, a process of peeling the upper film 18 and the lower film 20 from the substrate 22 by the film peeling device 10 will be described.

First, a substrate 2 having films on its upper and lower surfaces
2 is horizontally loaded from the entry side (the left side in FIG. 1) of the substrate transport device 26, and is transported by the substrate transport device 26 until the substrate 22 enters the lower film peeling region 12, and the lower film When the leading end of the roller 20 reaches the position of the peeling roll 48A of the lower peeling device 48, the conveyance is stopped.

At this time, the transport roller 25, which can be raised and lowered, is pushed up to the position of the substrate transport surface 26A by the cylinder device 34 as shown by a two-dot chain line in FIG. Prevent sagging.

Next, the substrate 22 stopped at a predetermined position is pushed up by the pushing device 32 and the transport roller 25 until it comes into contact with an upper suction plate 36 set at a position directly above the substrate 22.

If a negative pressure is applied to the upper suction disk 36 in advance, when the substrate 22 approaches the lower surface of the upper suction disk 36, the substrate 22 is sucked up by the negative pressure and suction-held. become.

Next, the lifting device 32 is lowered to the position shown in FIG. The transport roller 25 keeps pressing the substrate 22 as it is. Next, the peeling roll 48A of the lower peeling device 48 is raised to a position where the peeling roll 48A is pressed against the lower film 20 adhered to the lower surface of the substrate 22, and then reciprocated in the substrate width direction. At this time, the substrate 2
2 does not rattle.

Accordingly, the leading end of the lower film 20 is slightly peeled off from the substrate 22 by the peeling roll 48A, and compressed air is blown from the peeling nozzle 48B,
When the compressed air enters the gap between the lower film 20 and the substrate 22, the lower film 20 is turned down.

After the peeling operation of the leading end of the lower film 20 is completed, the peeling roll 48A and the transport roller 25 are
It retreats below the substrate transfer surface 26A.

The peeling nozzle 48B descends slightly,
The compressed air is blown out again, and the part that could not be turned down by the first blow is completely turned down.

The lower film 20 peeled off from the substrate 22
Is vertically suspended along the guide plate 52. At this time, when the guide plate 52 is made of metal, the lower film 20 is caused by static electricity of itself.
It adheres closely to the guide plate 52.

The leading end of the lower film 20 hanging down from the lower end of the guide plate 52 reaches a receiving plate 58A that is vertically continuous below the guide plate 52.

In this state, as shown in FIG.
When the capture lever 58C that has been rocked clockwise is rocked counterclockwise by the air cylinder 58D, the tip of the hanging lower film 20 is captured (captured) between the capture lever 58C and the receiving plate 58A. Is done.

Next, as shown in FIG. 7, while holding the leading end of the lower film 20, the swing arm 56
Is pivoted clockwise in FIG. 1, and at the same time, the upper suction plate 36 is horizontally moved in the direction of the upper film peeling region 14 by the feed screw mechanism 40.

Therefore, by adjusting the moving speed of the upper suction plate 36 and the pulling speed of the lower film 20 by the swing arm 56, the peeling point of the lower film 20 is positioned above the guide plate 52. The lower film 20 can be peeled off from the substrate 22 smoothly.

At this time, the moving speed of the upper suction plate 36 is
If the speed at which the lower film 20 is pulled downward by the lower pull-off device 54 is slightly higher, the peeling point of the lower film 20 is always shifted to the upper film peeling region 14 side of the guide plate 52. In addition, the lower film 20 does not rub against the upper end of the guide plate 52 during peeling.

In this way, the lower film 20 is pulled downward while peeling off while moving the upper suction plate 36, and after the peeling is completed, the catch lever 58 C is released below the lower tensile peeling device 54. By operating the lower film 20, the lower film 20 can be dropped and disposed.

That is, the lower film 20 is peeled and discharged while being pulled downward through the gap at the end of the substrate transfer device 26 on the upper film peeling region 14 side.

The substrate 22 is further moved by the upper suction disk 36, and is stopped when it comes to a position just above the lower suction disk 42 in the upper film peeling area 14.

Next, the lower suction disk 42 is raised by the lifting cylinder 42A while applying a negative pressure. on the other hand,
The lower pressure of the upper suction disk 36 is released when the lower suction disk 42 approaches, and the substrate 22 is transferred from the upper suction disk 36 to the lower suction disk 42.

After the transfer, the upper suction plate 36 is returned to the lower film peeling area 12 as shown in FIG.

The lower suction plate 42 having sucked the substrate 22 is lowered by the lifting cylinder 42A to the position shown in FIG. 1 and stopped.

In this state, the peeling roll 50A of the upper peeling device 50 is lowered to reciprocate in the substrate width direction while pressing the tip of the upper film 18 stretched on the upper surface of the substrate 22. Thus, as described above, the upper film 18 is peeled off from the substrate 22 and turned up by blowing compressed air from the peeling nozzle 50B, so as to be in a state along the receiving plate 62A of the upper tensioning device 60.

In this state, since the leading end of the upper film 18 is located outside the upper end of the receiving plate 62A, the catch lever 62C which has been swung counterclockwise in advance by the air cylinder 62D as shown in FIG. By swinging in the clockwise direction, the tip of the catch lever 62C and the receiving plate 62
A turned upside film 18 between the upper end of A
Capture (capture) the tip of

Next, in a state where the upper film 18 is captured, the capturing device 62 is raised by the elevating cylinder 64, and the lower film peeling region 1 is moved by the moving device 66.
Move horizontally in two directions.

At this time, the lower suction plate 42 is also moved horizontally by the rodless cylinder 46 in the direction of the substrate carrying-out area 16. Thereby, the upper film 18 is forcibly peeled off from the upper surface of the substrate 22.

When the substrate 22 is moved to the substrate carrying-out area 16 by the lower suction plate 42 while peeling off the upper film 18, the capturing device 62 is moved to the position shown by the two-dot chain line in FIG. , Its capture lever 62C
Between the upper film 1 and the receiving plate 62A.
8 are held.

On the other hand, as described above, since the lower suction plate 42 has been moved to the substrate unloading area 16,
When the capture lever 62C is swung counterclockwise, the captured upper film 18 is released, falls freely, and is discharged from the lower end of the upper film peeling area 14 when the capture lever 62C is swung counterclockwise. become.

The substrate suction area 16 is moved by the lower suction plate 42.
The substrate 22 moved inside is transferred from the lower suction plate 42 to the adsorbent 68A of the substrate unloading device 68 descending from above, and is unloaded outside the line.

By repeating the above steps, the upper and lower films 18, 2
0 is peeled off.

In the film peeling device 10, the substrate 22 carried on the substrate transport device 26 is
The push-up device 32 pushes the upper suction plate 36 up to the position of the upper suction plate 36, but the present invention is not limited to this.
May be lowered and adsorbed without damaging the device.

The lower and upper peeling devices 48, 50
Is to peel off the leading end of the film by a peeling roll and a peeling nozzle, and turn the film up or down.However, the present invention is not limited to this. It is also possible to have it make it.

The transfer roller 25 on the tip side of the substrate transfer device is movable up and down by a cylinder device 28. This is necessary when the substrate 22 is thin and easily hangs down. Is thick enough so that the tip does not hang down, the transport roller 25 is unnecessary.

The upper film 18 and the lower film 2
As shown in FIG. 2, 0 is attached to the upper surface and the lower surface of the substrate 22, respectively, so that the leading end is located at a position slightly backward from the leading end in the transport direction of the substrate 22. You may make it correspond with the front-end | tip of the board | substrate 22.

The upper suction disk 36 is moved by the feed screw mechanism 40, which is used because of its high positioning accuracy. Therefore, other moving means such as a rodless cylinder may be used as long as positioning accuracy can be ensured.

[0086]

As described above, the present invention has an excellent effect that the area of the film peeling device can be greatly reduced and the film can be peeled efficiently in a short time. .

[Brief description of the drawings]

FIG. 1 is a sectional view showing a film peeling device according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view showing a substrate on which a film to be peeled is stretched;

FIG. 3 is an enlarged side view showing the vicinity of a lower tension peeling device in the film peeling device.

FIG. 4 is an enlarged side view showing the vicinity of the upper tension peeling device;

FIG. 5 is a block diagram showing a control system of the film peeling device.

FIG. 6 is an enlarged side view showing a process of capturing the lower film by the lower pull-off device.

FIG. 7 is an enlarged side view showing a process of pulling a lower film by the lower pull-off device.

FIG. 8 is an enlarged side view showing a process of capturing the upper film by the upper tension peeling device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Film peeling apparatus 12 ... Lower film peeling area 14 ... Upper film peeling area 16 ... Substrate carry-out area 18 ... Upper film 20 ... Lower film 22 ... Substrate 24, 25 ... Transport roller 26 ... Substrate transport apparatus 26A ... Substrate transport Surface 36 Upper suction plate 42 Lower suction plate 48 Lower peeling device 50 Upper peeling device 52 Guide plate 54 Lower tensile peeling device 58, 62 Capture device 58A, 62A Receiving plate 58C, 62C Capture lever 60 Upper pull-off device 66 Moving device 68 Substrate unloading device 70 Control panel

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[Procedure amendment]

[Submission date] September 11, 1997

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[Document name to be amended] Drawing

[Correction target item name] Fig. 6

[Correction method] Change

[Correction contents]

FIG. 6

[Procedure amendment 6]

[Document name to be amended] Drawing

[Correction target item name] Fig. 7

[Correction method] Change

[Correction contents]

FIG. 7

[Procedure amendment 6]

[Document name to be amended] Drawing

[Correction target item name] Fig. 8

[Correction method] Change

[Correction contents]

FIG. 8

Claims (5)

[Claims] 1. A horizontal substrate transfer formed by a transfer device in a horizontal straight line with a lower film peeling area, an upper film peeling area, and a substrate unloading area sequentially set adjacent to each other. Along the surface, the board with the film attached to the upper and lower surfaces is transported to a predetermined position,
A step of stopping, a step of adsorbing and fixing substantially the entire upper surface of the stopped substrate by a horizontal upper suction disk, and a substrate of a lower film attached to a lower surface of the substrate sucked and fixed by the upper suction disk. A step of peeling the leading end in the transport direction from the substrate, a step of flipping the peeling distal end from the lower surface of the substrate at a position outside the distal end of the transport device, a step of capturing the rolled-down lower film distal end, and a step of capturing the captured lower side. While pulling the film tip downward between the tip of the transfer device and the upper film peeling area, the substrate,
Transporting the upper film in the direction of the upper film peeling area while being suctioned by the upper suction disk, and peeling the entire lower film from the substrate; And the step, while the substrate is being sucked by the upper suction disk, while peeling the lower film, transporting the film to the upper film peeling area, and stopping horizontally after peeling the lower film, In the film peeling area, the substrate is transferred from the upper suction disk to the lower suction disk by suctioning substantially the entire lower surface of the substrate that is sucked to the lower surface of the upper suction disk by the horizontal lower suction disk. Step and after the delivery, the step of returning the upper suction disk to the lower film peeling area, and suctioning the upper surface of the lower suction disk, peeling off the tip of the upper film of the fixed substrate. The step of flipping the peeling tip, the step of capturing the flipped upper film tip, and the step of pulling the captured upper film tip in the inward direction of the upper film peeling area while adsorbing by the lower suction disc. Moving the substrate in the direction of the substrate unloading area to release the entire upper film from the substrate; and releasing the upper film tip peeled from the substrate to release the lower suction disk from the substrate unloading area. Through the space created by moving in the direction, the step of dropping and discharging the upper film downward, the substrate from which the upper film has been peeled,
Transporting the substrate to the substrate unloading area while being suctioned by the lower suction disk, and stopping horizontally, transferring the substrate from the lower suction disk to the substrate unloading means in the stopped state; and Returning the film to the upper film peeling region. 2. A lower film peeling area, an upper film peeling area, and a substrate carry-out area are horizontally arranged from a substrate loading side to a loading side in a horizontal direction, and are provided in the lower film peeling area. , A substrate transfer device that transfers a substrate with a film attached to both upper and lower surfaces along a horizontal substrate transfer surface, and is capable of reciprocating substantially horizontally between an upper position of the substrate transfer device and the upper film peeling area. And an upper suction plate capable of holding the substrate horizontally by sucking substantially the entire upper surface of the substrate, and a lower surface attached to a lower side surface of the substrate in a state of being sucked by the upper suction plate. A lower peeling device that peels off the leading end of the film on the carry-out side and turns down, and is disposed near the carry-out side end of the substrate transfer device, and removes the leading end of the lower film turned down by the lower peeling device. Capturing, and passing between the substrate transfer device and the upper film peeling region, a lower tensile peeling device that pulls the tip of the captured lower film downward, and the upper film peeling region in the upper film peeling region. The suction disk is disposed at a lower position when moved, horizontally reciprocally reciprocable between the lower position and the inside of the substrate unloading area, and sucks substantially the entire upper surface of the substrate. A lower suction disk capable of holding the substrate horizontally, and an upper peeling-off operation in which the upper end of the upper film affixed to the upper surface of the substrate sucked by the lower suction disk is peeled off and turned up. Device, and an upper tension peeling device that captures the turned-up upper film tip and pulls it to the substrate loading side, and the upper suction cup is lower by the lower tension peeling device. Pull the film Moving to the upper film peeling region while holding the substrate, and returning to the lower film peeling region before peeling the upper film by the upper peeling device, wherein the lower suction device is provided with the upper pulling device. When the upper film is pulled, the substrate is moved into the substrate unloading area while holding the substrate, the upper film is peeled off from the substrate, and the lower suction disk is moved in the direction of the substrate unloading area, and the upper tension is pulled. The film peeling device according to claim 1, wherein the upper tension peeling device releases the captured upper film when a gap occurs in a downward direction of the peeling device. 3. The apparatus according to claim 2, wherein the substrate transfer device comprises:
It comprises a plurality of transport rollers arranged in parallel along the substrate transport surface, and comprises one to three transport rollers on the upper film peeling region side end portion of the plurality of transport rollers, constituting the substrate transport surface. Transport position and below this,
A film peeling device, wherein the film can be vertically moved between a lower film that has been peeled off and turned up by the lower peeling device and a standby position that has been pulled down until it does not interfere. 4. The lower pull-off device according to claim 2, wherein the lower pull-off device is disposed substantially vertically downward from near a lower side of the substrate transfer surface at a position near a tip end of the substrate transfer side of the substrate transfer device. A guide plate for guiding the leading end of the lower film, a film capturing device provided near the lower end of the guide plate, and capable of capturing the leading end of the lower film protruding downward from the guide plate; and A swing arm that is capable of swinging between a position near the guide plate and a release position below the guide plate with the capture device supported at the free end side and centered on the base end side. Characteristic film peeling device. 5. The lifting device according to claim 4, wherein a lifting device is provided below said substrate transfer device, said lifting device being capable of moving up and down so as to push up the substrate on said substrate transfer device and press it from below onto an upper suction plate waiting above. A film peeling device, wherein a base end of the swing arm is swingably supported by the push-up device.