JPH1165482A - Display panel electrode forming method - Google Patents
Display panel electrode forming methodInfo
- Publication number
- JPH1165482A JPH1165482A JP22407897A JP22407897A JPH1165482A JP H1165482 A JPH1165482 A JP H1165482A JP 22407897 A JP22407897 A JP 22407897A JP 22407897 A JP22407897 A JP 22407897A JP H1165482 A JPH1165482 A JP H1165482A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- metal
- transparent
- forming
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 100
- 239000002184 metal Substances 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 abstract description 46
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 238000004544 sputter deposition Methods 0.000 description 14
- 239000011651 chromium Substances 0.000 description 9
- 239000010949 copper Substances 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 102100039169 [Pyruvate dehydrogenase [acetyl-transferring]]-phosphatase 1, mitochondrial Human genes 0.000 description 4
- 101710126534 [Pyruvate dehydrogenase [acetyl-transferring]]-phosphatase 1, mitochondrial Proteins 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Gas-Filled Discharge Tubes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】
【課題】 本発明は表示パネルの電極形成方法に関し、
少なくとも表示面側のガラス基板面に埋め込み型金属電
極と透明電極からなる放電電極の形成において、該埋め
込み型金属電極上に形成した透明電極の段差切れの解消
と、平坦化を図って形成された放電電極による基板面で
の凹凸を僅少化して表示パネルの大型化、高精細化での
表示品質を向上させることを目的とする。
【解決手段】 ガラス基板11上に透明電極42a とそれよ
り幅狭の金属電極33a とを積層状に形成する際に、該基
板11表面に前記金属電極33a の形成に対応する凹部31の
形成と、該凹部31内に金属電極33a を形成した後、該金
属電極33a を含む基板11面に低粘性の透明導電塗布液を
塗布して基板面を平坦化する透明導電平坦化膜41を形成
し、該平坦化膜41上に透明導電膜42を形成した後、その
両方の膜41, 42を同時にパターニングして幅広の透明電
極42a を形成した構成とする。
(57) Abstract: The present invention relates to a method for forming an electrode of a display panel,
In the formation of a discharge electrode composed of an embedded metal electrode and a transparent electrode on at least the glass substrate surface on the display surface side, the discharge electrode was formed with the aim of eliminating the step breakage of the transparent electrode formed on the embedded metal electrode and flattening it. It is an object of the present invention to reduce unevenness on a substrate surface due to a discharge electrode and to increase the size of a display panel and improve display quality in high definition. When a transparent electrode (42a) and a narrower metal electrode (33a) are formed on a glass substrate (11) in a laminated manner, a concave portion (31) corresponding to the formation of the metal electrode (33a) is formed on the surface of the substrate (11). After forming the metal electrode 33a in the recess 31, a low-viscosity transparent conductive coating solution is applied to the surface of the substrate 11 including the metal electrode 33a to form a transparent conductive flattening film 41 for flattening the substrate surface. After the transparent conductive film 42 is formed on the flattening film 41, the two films 41 and 42 are simultaneously patterned to form a wide transparent electrode 42a.
Description
【０００１】[0001]
【発明の属する技術分野】本発明はコンピュータの表示
端末や表示装置等に用いられるガス放電表示パネル等の
表示パネルの電極形成方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming electrodes on a display panel such as a gas discharge display panel used for a display terminal or a display device of a computer.
【０００２】ガス放電を利用した表示パネルとして知ら
れる例えばプラズマディスプレイパネル（ＰＤＰ）は、
一般に表示の輝度及びコントラストの点で優れているこ
とから、ＯＡ機器の表示手段として広く用いられ、近年
ではテレビジョン表示が可能であることから、大型化が
容易な薄型のフルカラーフラットパネルディスプレイと
して注目されている。そのため、前記フラットパネルと
しては大画面、高精細でコントラストの良い鮮明な高表
示品質の画面の実現が要望されている。[0002] For example, a plasma display panel (PDP) known as a display panel using gas discharge is
In general, they are excellent in terms of display brightness and contrast, so they are widely used as display means for OA equipment. In recent years, since they can display television, they have attracted attention as thin full-color flat panel displays that can be easily enlarged. Have been. Therefore, there is a demand for the flat panel to realize a large screen, high definition, a clear, high-contrast screen with good contrast.
【０００３】[0003]
【従来の技術】従来の例えばＡＣ駆動型のガス放電表示
パネルとして、カラー表示用面放電型のプラズマディス
プレイパネル（ＰＤＰ）の基本的な構造としては、図５
の要部分解斜視図に示すようにマトリクス表示の単位発
光領域ＥＵに一対のＸ，Ｙからなる放電電極対（表示電
極）12とアドレス電極Ａとが対向する３電極構造を有し
ている。2. Description of the Related Art As a conventional gas discharge display panel of, for example, an AC drive type, the basic structure of a surface discharge type plasma display panel (PDP) for color display is shown in FIG.
As shown in an exploded perspective view of the main part of FIG. 1, a unit electrode area EU of a matrix display has a three-electrode structure in which a pair of discharge electrodes (display electrodes) 12 composed of a pair of X and Y and an address electrode A face each other.
【０００４】この表示ラインを形成する面放電のための
Ｘ，Ｙからなる放電電極対12は、放電空間24に対して表
示面Ｈ側のガラス基板11上に設けられており、表示光の
遮光を最小限にするためにネサ膜やＩＴＯ（Indium Tin
Oxide) 膜などの透明導電膜からなる透明電極12a とそ
の導電性を補う (低抵抗化) ための金属膜からなる金属
バス電極12b とを積層した構成からなっている。A discharge electrode pair 12 composed of X and Y for surface discharge forming the display line is provided on the glass substrate 11 on the display surface H side with respect to the discharge space 24, and shields display light. In order to minimize the nesa film and ITO (Indium Tin
An Oxide) film is formed by laminating a transparent electrode 12a made of a transparent conductive film such as a film and a metal bus electrode 12b made of a metal film for supplementing the conductivity (lowering resistance).
【０００５】またその放電電極対12上は壁電荷を利用し
てガス放電を維持するＡＣ駆動のための誘電体層13によ
って放電空間24に対して絶縁状態に被覆されており、該
誘電体層13の表面には更に数千Å程度の厚さのMgＯ膜か
らなる保護膜14が設けられている。The discharge electrode pair 12 is covered with a dielectric layer 13 for AC driving for maintaining a gas discharge using wall charges in an insulating state with respect to the discharge space 24. On the surface of 13, a protective film 14 made of a MgO film having a thickness of about several thousand degrees is further provided.
【０００６】一方、単位発光領域ＥＵを選択的に発光さ
せるためのアドレス電極Ａは、背面側のガラス基板21上
に、前記Ｘ，Ｙからなる放電電極対12と直交するように
一定のピッチで配列され、各アドレス電極Ａの間には所
定高さのストライプ状の隔壁22が設けられ、これによっ
て放電空間24がライン方向 (放電電極対12の長さ方向)
に単位発光領域ＥＵ毎に区画され、かつ放電空間24の間
隔寸法が規定されている。On the other hand, the address electrodes A for selectively emitting light in the unit light emitting region EU are arranged on the glass substrate 21 on the rear side at a constant pitch so as to be orthogonal to the discharge electrode pair 12 composed of X and Y. The stripe-shaped barrier ribs 22 having a predetermined height are provided between the address electrodes A so that the discharge space 24 is formed in the line direction (the length direction of the discharge electrode pair 12).
Are defined for each unit light emitting area EU, and the interval dimension of the discharge space 24 is defined.
【０００７】更に、前記ガラス基板21には、アドレス電
極Ａの上面及び隔壁22の側面を含めた背面側の内面を被
覆するように、Ｒ（赤），Ｇ（緑），Ｂ（青）の３原色
の蛍光体23が設けられている。そしてこのような構成の
ＰＤＰ１では各色の蛍光体23は面放電時に放電空間24内
のガス放電より放射される紫外線により励起されて発光
し、Ｒ，Ｇ，Ｂの組合せによるフルカラー表示が可能で
あり、その表示に際して隔壁22により単位発光領域ＥＵ
間のクロストークが防止されている。Further, the glass substrate 21 is coated with R (red), G (green), and B (blue) so as to cover the inner surface on the back side including the upper surface of the address electrode A and the side surface of the partition wall 22. A phosphor 23 of three primary colors is provided. In the PDP 1 having such a configuration, the phosphors 23 of each color are excited by ultraviolet rays radiated from the gas discharge in the discharge space 24 at the time of surface discharge to emit light, and a full-color display by a combination of R, G, and B is possible. In the display, the unit light emitting region EU is formed by the partition 22.
Crosstalk between them is prevented.
【０００８】以上の構成のＰＤＰ１は、上述のように各
ガラス基板11と21に対して個別に所定の構成要素を設け
た後、該ガラス基板11と21とを対向配置してその間隙の
周囲を気密に封止して内部を一旦真空に排気すると共
に、放電ガスを封入する一連の工程によって製造されて
いる。In the PDP 1 having the above structure, predetermined components are individually provided for each of the glass substrates 11 and 21 as described above, and then the glass substrates 11 and 21 are arranged to face each other and the periphery of the gap is provided. And hermetically sealed to evacuate the interior once and at the same time enclose a discharge gas.
【０００９】[0009]
【発明が解決しようとする課題】ところで、上記した従
来のＰＤＰ１におけるＸ，Ｙからなる放電電極対（表示
電極）12は、表示面側のガラス基板11の表面に対して透
明電極12a と、その透明電極12a 上にその導電性を補う
（低抵抗化）ための金属バス電極12b として電気的特性
とガラス基板11および誘電体層などとの密着性に優れた
クロム(Cr)−銅(Cu)−クロム(Cr)の三層構造の金属膜、
または銀(Ag)等の金属膜をスパッタリング工程、または
真空蒸着工程とフォトリソグラフィ工程等により重ねて
形成していた。The discharge electrode pair (display electrode) 12 composed of X and Y in the above-described conventional PDP 1 has a transparent electrode 12a and a transparent electrode 12a formed on the surface of the glass substrate 11 on the display surface side. Chromium (Cr) -copper (Cu) with excellent electrical properties and good adhesion to the glass substrate 11 and dielectric layers, etc. as a metal bus electrode 12b on the transparent electrode 12a to supplement its conductivity (lower resistance) -A three-layer metal film of chromium (Cr),
Alternatively, a metal film such as silver (Ag) has been formed by a sputtering process or a vacuum deposition process and a photolithography process.
【００１０】ところが、該ＰＤＰ１の大型化、高精細化
に伴って前記放電電極対（表示電極）12の電極長も長
く、電極幅も細線化されるので、そのような放電電極対
12の電気抵抗が大きくなる傾向にあり、その電気抵抗の
低抵抗化のためには積層する厚い金属バス電極が必要と
なる。However, as the size and definition of the PDP 1 increase, the electrode length of the discharge electrode pair (display electrode) 12 becomes longer and the electrode width becomes narrower.
Twelve electrical resistances tend to increase, and a thick metal bus electrode to be laminated is required to reduce the electrical resistance.
【００１１】従って、細くて長い放電電極パターンの形
成が難しく、また金属バス電極の膜厚増加により放電電
極形成後の基板面の凹凸も大きくなる。この基板面の凹
凸の大きさは１０μｍ程度の一定レベル以下であれば放
電パネルの特性上では特に問題はないが、しかし、その
後の基板面に誘電体層13や保護膜14を形成する際に該基
板面と段差の大きい放電電極対12に対する誘電体層13や
保護膜14の被覆性が悪くなり、それらの工程が煩雑にな
るという問題が生じる。Therefore, it is difficult to form a thin and long discharge electrode pattern, and the unevenness of the substrate surface after the formation of the discharge electrode becomes large due to an increase in the thickness of the metal bus electrode. If the size of the irregularities on the substrate surface is not more than a certain level of about 10 μm, there is no particular problem in the characteristics of the discharge panel. However, when forming the dielectric layer 13 and the protective film 14 on the substrate surface thereafter, The coverage of the dielectric layer 13 and the protective film 14 with respect to the discharge electrode pair 12 having a large difference in level from the substrate surface is deteriorated, resulting in a problem that those steps become complicated.
【００１２】そこで上記した問題点を解決するために、
例えば図６(a) に示すように、前記表示面側のガラス基
板11の内面にフォトエッチング工程により前記各放電電
極対の幅狭の金属バス電極のパターンと厚さに対応する
凹部31a, 31bを形成する。In order to solve the above-mentioned problems,
For example, as shown in FIG. 6A, concave portions 31a and 31b corresponding to the pattern and thickness of the narrow metal bus electrode of each of the discharge electrode pairs are formed on the inner surface of the glass substrate 11 on the display surface side by a photoetching process. To form
【００１３】次に図６(b) に示すように、該凹部31a, 3
1b内の内壁面に沿ってスパッタリング法とフォトリソグ
ラフィ工程等により外来光の反射を抑止する暗色遮光膜
32を形成し、引き続きその各凹部31a, 31b内にAg等の金
属ペーストを用いたスクリーン印刷法やレジストマスク
等を用いたスパッタリング法とリフトオフ法等によって
Cr−Cu−Crの三層構造の金属導電材を埋め込んで金属バ
ス電極33a, 33bを埋設する。Next, as shown in FIG.
Dark shielding film that suppresses the reflection of extraneous light along the inner wall inside 1b by sputtering and photolithography processes
32, and subsequently, in each of the recesses 31a and 31b, a screen printing method using a metal paste such as Ag, a sputtering method using a resist mask, a lift-off method, or the like.
The metal bus electrodes 33a and 33b are buried by burying a metal conductive material having a three-layer structure of Cr-Cu-Cr.
【００１４】次に図６(c) に示すように、その各金属バ
ス電極33a, 33bが埋め込まれた基板面に、スパッタリン
グ法等により酸化錫（SnO2）膜、またはＩＴＯ (Indium
TinOxide) 等の透明導電膜を形成し、該透明導電膜を
フォトリソグラフィ工程で前記金属バス電極33a および
33b よりも幅広いストライプ状にパターニングして平行
に隣接するＸ，Ｙからなる一対の透明電極34a および34
b を所定間隔をもって前記金属バス電極33a および33b
と積層して形成し、放電電極対 (表示電極)35を構成す
る。Next, as shown in FIG. 6C, a tin oxide (SnO 2 ) film or an ITO (Indium) film is formed on the substrate surface on which the metal bus electrodes 33a and 33b are embedded by a sputtering method or the like.
A transparent conductive film such as TinOxide) is formed.
A pair of transparent electrodes 34a and 34 composed of X and Y adjacent in parallel by patterning in a stripe shape wider than 33b.
b at predetermined intervals with the metal bus electrodes 33a and 33b
And a discharge electrode pair (display electrode) 35 is formed.
【００１５】その後、前記放電電極対35が配列されたガ
ラス基板11上に図６(d) に示すように、スクリーン印刷
法やスパッタリング法等により誘電体層36を形成し、更
に該誘電体層36の全表面にMgＯからなる保護膜37を形成
することによって、前記放電電極対35を細幅にすること
で高められる電気抵抗値を低減するための金属バス電極
33a, 33bの膜厚を厚くすることができ、しかも基板表面
の凹凸を僅少にした所望の表示面側のガラス基板11を得
る方法が提案されている。Thereafter, as shown in FIG. 6D, a dielectric layer 36 is formed on the glass substrate 11 on which the discharge electrode pairs 35 are arranged by a screen printing method, a sputtering method, or the like. By forming a protective film 37 made of MgO on the entire surface of 36, a metal bus electrode for reducing the electric resistance value which is increased by making the discharge electrode pair 35 narrower.
A method has been proposed in which the thickness of the layers 33a and 33b can be increased, and the glass substrate 11 on the desired display surface side with less irregularities on the substrate surface has been proposed.
【００１６】しかしながら、上述のような提案におい
て、例えば図７(a) に示すように前記表示面側のガラス
基板11の表面に凹部31a を形成したレジストマスク38を
介して該凹部31a 内にスパッタリング法等によって金属
導電材33を埋め込み、前記レジストマスク38上の金属導
電材33をリフトオフ法により除去して図７(b) に示すよ
うに金属バス電極33a を形成すると、凹部31a の側壁と
金属バス電極33a との間に隙間や段差ができる。However, in the above proposal, for example, as shown in FIG. 7A, sputtering is performed in the concave portion 31a through a resist mask 38 in which the concave portion 31a is formed on the surface of the glass substrate 11 on the display surface side. The metal conductive material 33 is buried by a method or the like, and the metal conductive material 33 on the resist mask 38 is removed by a lift-off method to form a metal bus electrode 33a as shown in FIG. 7 (b). A gap or a step is formed between the bus electrode 33a and the bus electrode 33a.
【００１７】従って、その金属バス電極33a を含むガラ
ス基板11上に透明導電膜34をスパッタリング法により形
成しパターニングして図７(c) に示すように透明電極34
a を形成した際に、前記凹部31a の側壁と金属バス電極
33a との間に生じる隙間とそれによって現れる該凹部31
a のエッジ部分での段差で透明電極34a が薄くなり、段
差切れができたり、また前記隙間と透明電極34a との間
に空洞ができてリークが発生するという恐れがあった。Accordingly, a transparent conductive film 34 is formed on the glass substrate 11 including the metal bus electrode 33a by a sputtering method and patterned to form the transparent electrode 34 as shown in FIG.
a, the side wall of the recess 31a and the metal bus electrode
33a and the concavity 31 caused by the gap
There is a risk that the transparent electrode 34a becomes thin due to a step at the edge portion of a and the step may be cut off, or that a cavity may be formed between the gap and the transparent electrode 34a to cause leakage.
【００１８】更に、図８(a) に示すように前記表示面側
のガラス基板11の表面に形成した凹部31a 内にスクリー
ン印刷法により金属導電材33を埋め込み、焼成して図８
(b)に示すように金属バス電極33a を形成する場合にも
該金属バス電極33a と該凹部31a のエッジ部分で段差が
生じる。Further, as shown in FIG. 8A, a metal conductive material 33 is buried in a concave portion 31a formed on the surface of the glass substrate 11 on the display surface side by a screen printing method and fired.
As shown in (b), when the metal bus electrode 33a is formed, a step is generated between the metal bus electrode 33a and the edge of the concave portion 31a.
【００１９】従って、該金属バス電極33a を含むガラス
基板11上に透明導電膜34をスパッタリング法により形成
しパターニングして図８(c) に示すように透明電極34a
を形成した際にも、前記凹部31a のエッジ部分で透明電
極34a が薄くなった段差部分ができたり、段差切れが生
じるという問題があった。Therefore, a transparent conductive film 34 is formed on the glass substrate 11 including the metal bus electrode 33a by the sputtering method and patterned to form the transparent electrode 34a as shown in FIG.
However, there is also a problem that a step portion where the transparent electrode 34a becomes thinner is formed at the edge portion of the concave portion 31a, or the step is cut off.
【００２０】本発明は上記した従来の問題点に鑑み、少
なくとも表示面側の透明な絶縁性基板の表面に対する金
属電極と透明電極とからなる放電電極（表示電極）の形
成方法を改良して、放電電極の低抵抗化のための埋め込
み型の金属電極上に形成した透明電極の段差切れを解消
し、かつ形成された放電電極による基板面での凹凸を僅
少化して表示パネルの大型化、高精細化に対して表示品
質の向上が実現できる新規な表示パネルの電極形成方法
を提供することを目的とするものである。In view of the above-mentioned conventional problems, the present invention has improved a method of forming a discharge electrode (display electrode) comprising a metal electrode and a transparent electrode on at least the surface of a transparent insulating substrate on the display surface side. Eliminates breaks in the transparent electrode formed on the buried metal electrode for lowering the resistance of the discharge electrode, and reduces unevenness on the substrate surface due to the formed discharge electrode. It is an object of the present invention to provide a novel electrode forming method for a display panel that can improve display quality with respect to definition.
【００２１】[0021]
【課題を解決するための手段】本発明は上記した目的を
達成するため、透明な絶縁性基板上に、透明電極とそれ
よりも幅狭の金属電極とを積層状に形成する表示パネル
の電極形成方法としては、前記絶縁性基板の表面に前記
金属電極の形状に対応する凹部を形成する工程と、該凹
部内に金属導電材を埋め込んで金属電極を形成する工程
と、埋設された金属電極上を含む前記絶縁性基板の表面
に、低粘性の透明導電塗布液を塗布して当該絶縁性基板
の表面を平坦化する透明導電平坦化膜を形成する工程
と、該透明導電平坦化膜上に透明導電膜を形成した後、
該透明導電膜と透明導電平坦化膜とを前記透明電極の形
状にパターニングして前記金属電極上に該金属電極より
も幅広の透明電極を形成する工程を用いる。According to the present invention, there is provided an electrode for a display panel in which a transparent electrode and a narrower metal electrode are laminated on a transparent insulating substrate. As a forming method, a step of forming a recess corresponding to the shape of the metal electrode on the surface of the insulating substrate, a step of forming a metal electrode by embedding a metal conductive material in the recess, and a step of forming the embedded metal electrode A step of applying a low-viscosity transparent conductive coating liquid on the surface of the insulating substrate including the top to form a transparent conductive flattening film for flattening the surface of the insulating substrate; After forming a transparent conductive film on
A step of patterning the transparent conductive film and the transparent conductive flattening film into the shape of the transparent electrode to form a transparent electrode wider than the metal electrode on the metal electrode is used.
【００２２】また、前記凹部内に金属導電材を埋め込む
前に、該凹部の内壁面に沿って該金属導電材よりも低反
射率の暗色遮光膜を形成する工程を用いる。上記した工
程によって表示パネルの電極、即ち、表示面側の透明な
絶縁性基板の表面に金属電極 (従来の金属バス電極) と
透明電極とを積層してなる放電電極（表示電極）を形成
する場合、例えば図３(a) に示すように前記表示面側の
透明な絶縁性基板、例えばガラス基板11に形成され、か
つ内壁面をこれから形成すべき金属電極よりも低反射率
の暗色遮光膜32で覆った凹部31内に、レジストマスクを
用いたスパッタリング法とリフトオフ法によって金属導
電材を埋め込んで金属電極33a を形成すると、該金属電
極33a と前記ガラス基板11との間に隙間や段差が生じ
る。Before embedding the metal conductive material in the recess, a step of forming a dark light-shielding film having a lower reflectance than the metal conductive material along the inner wall surface of the recess is used. Through the above-described steps, an electrode of the display panel, that is, a discharge electrode (display electrode) formed by laminating a metal electrode (conventional metal bus electrode) and a transparent electrode on the surface of the transparent insulating substrate on the display surface side is formed. In this case, as shown in FIG. 3A, for example, a dark-color light-shielding film formed on a transparent insulating substrate on the display surface side, for example, a glass substrate 11 and having an inner wall surface having a lower reflectance than a metal electrode to be formed, is used. When the metal electrode 33a is formed by embedding a metal conductive material in the concave portion 31 covered by 32 by a sputtering method using a resist mask and a lift-off method, a gap or a step is formed between the metal electrode 33a and the glass substrate 11. Occurs.
【００２３】従って、そのような隙間や段差および金属
電極33a を含むガラス基板11上に低粘性の透明導電塗布
液を塗布すると、その低粘性の透明導電塗布液は必然的
に前記ガラス基板面の窪んだ部分に流入して埋め込ま
れ、該金属電極33a とガラス基板11の表面を同一平面状
とする透明導電平坦化膜41を形成することができる。Accordingly, when a low-viscosity transparent conductive coating solution is applied to the glass substrate 11 including such gaps and steps and the metal electrode 33a, the low-viscosity transparent conductive coating solution is inevitably applied to the glass substrate surface. The transparent conductive flattening film 41 which flows into the recessed portion and is buried to make the surface of the metal electrode 33a and the surface of the glass substrate 11 coplanar can be formed.
【００２４】次に、表面が平坦化された透明導電平坦化
膜41上に透明導電膜42を形成し、該透明導電平坦化膜41
と透明導電膜42とを同時にパターニングして図３(b) に
示すように前記金属電極33a 上に、該金属電極33a より
も幅広の透明電極42a を形成することによって、従来、
金属電極33a と前記ガラス基板11との間で生じていた隙
間による空洞の発生がなく、かつ段差切れのない透明電
極42a が形成でき、金属電極33a と透明電極42a からな
る放電電極（表示電極）43を前記ガラス基板11の表面に
凹凸を小さくして歩留り良く、容易に形成することが可
能となる。Next, a transparent conductive film 42 is formed on the transparent conductive flattening film 41 whose surface is flattened, and the transparent conductive flattening film 41 is formed.
And the transparent conductive film 42 are simultaneously patterned to form a transparent electrode 42a wider than the metal electrode 33a on the metal electrode 33a as shown in FIG.
A transparent electrode 42a having no gap due to a gap formed between the metal electrode 33a and the glass substrate 11 and having no level difference can be formed, and a discharge electrode (display electrode) composed of the metal electrode 33a and the transparent electrode 42a. 43 can be easily formed with a small yield on the surface of the glass substrate 11 with good yield.
【００２５】また、前記凹部31内の金属電極33a の表示
面側が暗色遮光膜32で覆われているので、外来光の反射
が効果的に抑制され表示画面のコントラストが改善され
る。なお、図４(a) に示すように前記表示面側の透明な
ガラス基板11に形成され、かつ内壁面をこれから形成す
べき金属電極よりも低反射率の暗色遮光膜32で覆った凹
部31内に、スクリーン印刷法によって同様に金属導電材
を埋め込んで焼成することによっても、該金属導電材の
体積が埋め込み時よりも減少した金属電極33a が形成さ
れ、該金属電極33a と前記凹部31のエッジ部分との間に
段差が生じる。Further, since the display surface side of the metal electrode 33a in the concave portion 31 is covered with the dark light shielding film 32, reflection of extraneous light is effectively suppressed, and the contrast of the display screen is improved. As shown in FIG. 4A, a concave portion 31 formed on the transparent glass substrate 11 on the display surface side and having an inner wall surface covered with a dark-color light-shielding film 32 having a lower reflectance than a metal electrode to be formed. In the same manner, a metal electrode 33a in which the volume of the metal conductive material is smaller than that at the time of embedding is also formed by embedding and firing the metal conductive material by the screen printing method in the same manner, and the metal electrode 33a and the concave portion 31 are formed. There is a step between the edge and the edge.
【００２６】しかし、そのような段差および金属電極33
a を含むガラス基板11上に低粘性の透明導電塗布液を塗
布することにより、その低粘性の透明導電塗布液は必然
的に前記ガラス基板面の平らな部分では薄く、窪んだ部
分には厚く塗布されて上述したように該金属電極33a と
ガラス基板11の表面を同一平面状とする透明導電平坦化
膜41を形成することができる。However, such a step and the metal electrode 33
a, the low-viscosity transparent conductive coating solution is inevitably thin on a flat portion of the glass substrate surface and thick on a recessed portion. As described above, it is possible to form the transparent conductive flattening film 41 which makes the surface of the metal electrode 33a and the glass substrate 11 coplanar.
【００２７】従って、表面が平坦化された透明導電平坦
化膜41上に透明導電膜42を形成し、該透明導電平坦化膜
41と透明導電膜42とを同時に図４(b) に示すように該金
属電極33a よりも幅広の電極形状にパターニングするこ
とによっても、段差切れのない透明電極42a が形成で
き、金属電極33a と透明電極42a からなる放電電極（表
示電極）43を歩留り良く、かつ前記ガラス基板11の表面
に凹凸を小さくして容易に形成することが可能となる。Therefore, a transparent conductive film 42 is formed on the transparent conductive flattening film 41 having a flattened surface, and the transparent conductive flattening film 41 is formed.
By simultaneously patterning the 41 and the transparent conductive film 42 into an electrode shape wider than the metal electrode 33a as shown in FIG. 4 (b), a transparent electrode 42a with no level difference can be formed. The discharge electrode (display electrode) 43 composed of the transparent electrode 42a can be easily formed with good yield and with small irregularities on the surface of the glass substrate 11.
【００２８】[0028]
【発明の実施の形態】以下図面を用いて本発明の実施例
について詳細に説明する。図１および図２は本発明の表
示パネルの電極形成方法をガス放電表示パネルの電極形
成を対象とした場合の一実施例を工程順に示す要部断面
図であり、図６と同等の機能を有する部分には同一符号
を付している。Embodiments of the present invention will be described below in detail with reference to the drawings. FIGS. 1 and 2 are sectional views of a main part showing an embodiment in which the electrode forming method of the display panel of the present invention is applied to the formation of the electrodes of the gas discharge display panel in the order of steps. The parts having the same reference numerals are given.
【００２９】本実施例では先ず図１(a) に示すように、
表示面側のガラス基板11の表面に、例えば40％含有の弗
化水素酸(HF)：水 (H2O)＝３： 97 のエッチング液を用
いたフォトエッチング工程によって、ストライプ状の一
対のＸ放電電極とＹ放電電極からなる放電電極対を透明
電極とともに構成する該透明電極よりも幅狭の金属電極
のパターンと厚さに対応する例えば２μｍ〜１０μｍ程
度の深さを有する凹部31a および31b を形成する。In this embodiment, first, as shown in FIG.
On the surface of the glass substrate 11 on the display surface side, for example, containing 40% hydrofluoric acid (HF): water (H 2 O) = 3: by 97 photo-etching process using an etchant, striped pair Concave portions 31a and 31b having a depth of, for example, about 2 μm to 10 μm corresponding to a pattern and a thickness of a metal electrode narrower than the transparent electrode which constitutes a discharge electrode pair including an X discharge electrode and a Y discharge electrode together with the transparent electrode. To form
【００３０】次に、図１(b) に示すように、前記凹部31
a および31b の内壁面に沿って、スパッタリング法とフ
ォトリソグラフィ工程等により前記放電電極対を構成す
る金属電極よりも反射率が低く、外来光の反射を抑止す
るクロム(Cr)の酸化膜、満貫(Mn)−鉄(Fe)−銅(Cu)系の
酸化膜、またはCr−Cu系の酸化膜等を、例えば本実施例
では５００〜１０００Åの厚さの酸化クロム(CrO) 膜か
らなる暗色遮光膜32を形成する。Next, as shown in FIG.
along the inner wall surfaces of a and 31b, a chromium (Cr) oxide film that has a lower reflectance than the metal electrodes constituting the discharge electrode pair and suppresses the reflection of extraneous light by a sputtering method and a photolithography process, etc. A (Mn) -iron (Fe) -copper (Cu) -based oxide film, a Cr-Cu-based oxide film, or the like, for example, in this embodiment, a dark color formed of a 500-1000 mm thick chromium oxide (CrO) film A light shielding film 32 is formed.
【００３１】次に、図１(b) に示すように、それぞれ前
記暗色遮光膜32が内設された凹部31a および31b の内部
に、Ag, Au, Ni等の金属ペーストを用いたスクリーン印
刷法、或いはレジストマスクを用いたスパッタリング法
及び真空蒸着法とリフトオフ法等、例えば本実施例では
レジストマスクを用いたスパッタリング法とリフトオフ
法により例えば２μｍ〜１０μｍ程度の厚さのクロム(C
r)−銅(Cu)−クロム(Cr)の三層構造の金属膜を充填して
金属電極33a および33b を埋め込んだ状態に形成する。Next, as shown in FIG. 1B, a screen printing method using a metal paste such as Ag, Au, Ni or the like is performed inside the concave portions 31a and 31b in which the dark light shielding films 32 are respectively provided. Or a sputtering method using a resist mask, a vacuum evaporation method, a lift-off method, etc., for example, in this embodiment, a chromium (C) having a thickness of about 2 μm to 10 μm, for example, by a sputtering method using a resist mask and a lift-off method.
r) -Copper (Cu) -Chromium (Cr) metal film having a three-layer structure is filled and the metal electrodes 33a and 33b are buried.
【００３２】次に、図１(c) に示すように、前記金属電
極33a および33b を含むガラス基板11上に低粘性の透明
導電塗布液 (粘度：10 cp ，ＹＮ−４００、触媒化成工
業社製、または粘度：2.03 cSt/25 ℃,HＨＮＳ−１００
０、日立化成工業社製）、例えばＹＮ−４００の低粘性
の透明導電塗布液をスピンナ、またはロールコータ等で
塗布することにより、その低粘性の透明導電塗布液は必
然的に前記ガラス基板面の平らな部分では薄く、前記金
属電極33a および33b 上の窪んだ部分には厚く塗布され
ることになる。Next, as shown in FIG. 1C, a low-viscosity transparent conductive coating solution (viscosity: 10 cp, YN-400, Catalyst Chemical Industry Co., Ltd.) was placed on the glass substrate 11 containing the metal electrodes 33a and 33b. Or viscosity: 2.03 cSt / 25 ° C, HHNS-100
0, manufactured by Hitachi Chemical Co., Ltd.), for example, by applying a low-viscosity transparent conductive coating solution of YN-400 using a spinner or a roll coater, the low-viscosity transparent conductive coating solution is inevitably applied to the surface of the glass substrate. The flat portions are thin and the concave portions on the metal electrodes 33a and 33b are thick.
【００３３】次に、上記塗布膜を80〜150 ℃で10分間程
度乾燥した後、500 〜550 ℃で30〜60分間程度焼成する
ことによって、前記凹部31a および31b 内に埋設された
金属電極33a および33b と該凹部31a および31b のエッ
ジ部分との間に生じる段差や隙間が埋められて図示のよ
うに該金属電極33a および33b とガラス基板11の表面を
同一平面状とする０．２〜０．５μｍの厚さの透明導電
平坦化膜41を形成することができる。Next, the coated film is dried at 80 to 150 ° C. for about 10 minutes, and then baked at 500 to 550 ° C. for about 30 to 60 minutes, so that the metal electrodes 33a embedded in the recesses 31a and 31b are formed. Steps and gaps formed between the metal electrodes 33a and 33b and the edge portions of the concave portions 31a and 31b are filled to make the surfaces of the metal electrodes 33a and 33b and the glass substrate 11 coplanar as shown in FIG. A transparent conductive flattening film 41 having a thickness of 0.5 μm can be formed.
【００３４】引き続き前記透明導電平坦化膜41上にスパ
ッタリング法、真空蒸着法、またはスクリーン印刷法等
により２０００〜３０００Åの膜厚の酸化錫（SnO2）
膜、またはＩＴＯ (Indium Tin Oxide) 等の透明導電膜
42を形成する。Subsequently, tin oxide (SnO 2 ) having a thickness of 2000 to 3000 ° is formed on the transparent conductive flattening film 41 by a sputtering method, a vacuum deposition method, a screen printing method or the like.
Film or transparent conductive film such as ITO (Indium Tin Oxide)
Form 42.
【００３５】次に、該透明導電膜42と透明導電平坦化膜
41とをフォトエッチング工程等によって前記金属電極33
a および33b よりも幅広の電極形状に同時にパターニン
グして図２(a) に示すように前記金属電極33a および33
b 上に、該金属電極33a および33b よりも幅広の透明電
極42a および42b を形成することによって、従来、金属
電極33a および33b と前記凹部31a および31b のエッジ
部分との間で生じていた隙間による空洞の発生がなく、
かつ段差切れのない透明電極42a および42b が形成で
き、金属電極33a および33b と透明電極42a および42b
が積層された一対のＸとＹの放電電極からなる放電電極
対（表示電極）44を前記ガラス基板11の表面に凹凸を小
さくして歩留り良く、容易に形成することが可能とな
る。Next, the transparent conductive film 42 and the transparent conductive planarizing film
41 and the metal electrode 33 by a photo etching process or the like.
a and 33b are simultaneously patterned into electrode shapes wider than those of the metal electrodes 33a and 33b as shown in FIG.
By forming the transparent electrodes 42a and 42b wider on the b than the metal electrodes 33a and 33b, the gap formed between the metal electrodes 33a and 33b and the edge portions of the recesses 31a and 31b conventionally occurs. No cavitation,
In addition, transparent electrodes 42a and 42b with no level difference can be formed, and metal electrodes 33a and 33b and transparent electrodes 42a and 42b are formed.
It is possible to easily form a discharge electrode pair (display electrode) 44 composed of a pair of X and Y discharge electrodes on which the unevenness is reduced on the surface of the glass substrate 11 with good yield.
【００３６】従って、前記一対のＸ放電電極とＹ放電電
極からなる放電電極対43を設けた表示面側のガラス基板
11上に、図２(b) に示すように低融点ガラス等の絶縁ペ
ーストをスクリーン印刷法等によって一様に塗布し、１
００〜１５０℃程度の温度で乾燥させた後、その低融点
ガラス等からなる絶縁ペースト層を５００〜６００℃程
度の温度で焼成処理を行って、１０〜２０μｍ程度の厚
さの絶縁膜からなる誘電体層36を形成する。Accordingly, the glass substrate on the display surface side on which the discharge electrode pair 43 comprising the pair of X discharge electrodes and Y discharge electrodes is provided.
2, an insulating paste such as a low melting glass is applied uniformly by a screen printing method or the like as shown in FIG.
After drying at a temperature of about 00 to 150 ° C., the insulating paste layer made of the low-melting glass or the like is subjected to a baking treatment at a temperature of about 500 to 600 ° C. to form an insulating film having a thickness of about 10 to 20 μm. The dielectric layer 36 is formed.
【００３７】また、その誘電体層36の全表面に更に数千
Å程度の厚さのMgＯからなる保護膜37をスパッタリング
法、真空蒸着法等により形成することにより基板表面の
凹凸を僅少にした所望の表示面側のガラス基板11を得る
ことができる。Further, a protective film 37 made of MgO having a thickness of about several thousand m is further formed on the entire surface of the dielectric layer 36 by a sputtering method, a vacuum evaporation method, or the like to reduce irregularities on the substrate surface. The desired glass substrate 11 on the display surface side can be obtained.
【００３８】従って、このような構成の表示面側のガラ
ス基板11をガス放電表示パネルに用いることにより放電
表示特性が良好で、前記凹部31a および31b 内の金属電
極33a および33b の表示面側が暗色遮光膜32で覆われて
いるので、外来光の反射が効果的に抑制され表示画面の
コントラストが改善される。Therefore, by using the glass substrate 11 on the display surface side having such a structure for a gas discharge display panel, the discharge display characteristics are good, and the display surface side of the metal electrodes 33a and 33b in the concave portions 31a and 31b is dark. Since it is covered with the light shielding film 32, reflection of extraneous light is effectively suppressed, and the contrast of the display screen is improved.
【００３９】なお、前記表示面側のガラス基板11の表面
への凹部31a および31b の形成および透明導電膜のパタ
ーニング等に用いるエッチング法としては必要に応じて
ウエットエッチングとドライエッチングのどちらかを選
択して適宜用いることができる。前記ガラス基板11の表
面への凹部31a および31b の形成には、この他にレーザ
光の選択的な照射により直接形成することもできる。As an etching method used for forming the concave portions 31a and 31b on the surface of the glass substrate 11 on the display surface side and for patterning the transparent conductive film, either wet etching or dry etching is selected as necessary. And can be used as appropriate. The recesses 31a and 31b can be formed directly on the surface of the glass substrate 11 by selective irradiation with laser light.
【００４０】また、本実施例ではガス放電表示パネルの
表示面側のガラス基板に対する電極形成について説明し
ているが、本発明はその例に限らず、例えば背面側のガ
ラス基板等に対する電極形成にも同様に用いることがで
きる。Although the present embodiment describes the formation of electrodes on the glass substrate on the display surface side of the gas discharge display panel, the present invention is not limited to this example. Can also be used.
【００４１】更に、本実施例ではカラー表示用の面放電
型のプラズマディスプレイを対象としたガス放電表示パ
ネルに適用した場合の例について説明しているが、本発
明はそのようなカラー表示用の面放電型のガス放電表示
パネルに限定されるものではなく、例えばモノクロ表示
用の面放電型のガス放電表示パネルや金属バス電極と透
明電極とを積層した二層構造の放電電極 (表示電極) を
採用している各種の表示パネル等にも適用することがで
きる。Further, in this embodiment, an example is described in which the present invention is applied to a gas discharge display panel intended for a surface discharge type plasma display for color display, but the present invention relates to such a color display. It is not limited to the surface discharge type gas discharge display panel, for example, a surface discharge type gas discharge display panel for monochrome display or a discharge electrode (display electrode) having a two-layer structure in which a metal bus electrode and a transparent electrode are laminated. The present invention can be applied to various display panels and the like that adopt the above.
【００４２】[0042]
【発明の効果】以上の説明から明らかなように、本発明
の表示パネルの電極形成方法によれば、透明な絶縁性基
板 (ガラス基板) の表面に金属電極のパターンと厚さに
対応する凹部を形成し、その凹部の内に金属導電材を埋
め込んで金属電極を形成した後、その金属電極上を含む
前記絶縁性基板 (ガラス基板) 上に低粘性の透明導電塗
布液を塗布して透明導電平坦化膜を形成することによ
り、前記凹部内に金属電極を形成した際に生じる該凹部
のエッジ部分の露呈が被覆され、該エッジ部分と金属電
極との間に生じる段差の解消や隙間も埋め込まれるの
で、前記金属電極上を含む前記絶縁性基板 (ガラス基
板) 上を平坦化することができる。As is apparent from the above description, according to the electrode forming method for a display panel of the present invention, the concave portions corresponding to the pattern and thickness of the metal electrode are formed on the surface of the transparent insulating substrate (glass substrate). After forming a metal electrode by embedding a metal conductive material in the recess, a low-viscosity transparent conductive coating liquid is applied on the insulating substrate (glass substrate) including the metal electrode to form a transparent electrode. By forming the conductive flattening film, the exposure of the edge portion of the concave portion that occurs when the metal electrode is formed in the concave portion is covered, and the elimination of the step and the gap between the edge portion and the metal electrode are also reduced. Since it is embedded, the surface of the insulating substrate (glass substrate) including the surface of the metal electrode can be planarized.
【００４３】従って、その透明導電平坦化膜上に透明導
電膜を被着した後、該透明導電膜と透明導電平坦化膜と
を同時にパターニングして前記金属電極上に該金属電極
よりも幅広の透明電極を形成することにより、前記凹部
のエッジ部分での段差切れのない透明電極が簡便に形成
でき、金属電極と透明電極とからなる放電電極を歩留り
良く、また前記絶縁性基板 (ガラス基板) 上に凹凸を僅
少化して容易に形成することが可能となる。Therefore, after a transparent conductive film is deposited on the transparent conductive flattening film, the transparent conductive film and the transparent conductive flattening film are simultaneously patterned to have a wider area on the metal electrode than the metal electrode. By forming a transparent electrode, it is possible to easily form a transparent electrode without a step at the edge portion of the concave portion, a good yield of a discharge electrode composed of a metal electrode and a transparent electrode, and the insulating substrate (glass substrate) It is possible to easily form the upper surface with less irregularities.
【００４４】更に、凹部内に埋設している金属電極の表
示面側を暗色遮光層により覆っておくことにより、この
ような構成の前記絶縁性基板 (ガラス基板) を表示パネ
ルの表示面側の基板として用いた場合に、外来光の反射
が防止され、表示画面のコントラストが全面にわたって
改善されて見やすくなり、表示パネルの大型化、高精細
化に対して表示品質の良好なガス放電表示パネルを容易
に得ることが可能となり、実用上優れた効果を奏する。Further, by covering the display surface side of the metal electrode buried in the concave portion with a dark-color light-shielding layer, the insulating substrate (glass substrate) having such a configuration can be placed on the display surface side of the display panel. When used as a substrate, the reflection of extraneous light is prevented, the contrast of the display screen is improved over the entire surface, making it easier to see, and a gas discharge display panel with good display quality for a large and high definition display panel. It can be easily obtained, and has a practically excellent effect.
【図１】 本発明の表示パネルの電極形成方法をガス放
電表示パネルの電極形成を対象とした場合の一実施例を
工程順に示す要部断面図である。FIG. 1 is a fragmentary cross-sectional view showing an example of a method of forming an electrode of a display panel according to the present invention in the case of forming an electrode of a gas discharge display panel in the order of steps.
【図２】 本発明の表示パネルの電極形成方法をガス放
電表示パネルの電極形成を対象とした場合の一実施例を
図１に引き続いて工程順に示す要部断面図である。FIG. 2 is a cross-sectional view of a main part showing an embodiment in the case where the method of forming electrodes of a display panel of the present invention is applied to the formation of electrodes of a gas discharge display panel, in the order of steps following FIG.
【図３】 本発明の表示パネルの電極形成方法の原理を
説明する要部断面図である。FIG. 3 is a cross-sectional view of a main part explaining the principle of a method for forming an electrode of a display panel of the present invention.
【図４】 本発明の表示パネルの電極形成方法の他の原
理を説明する要部断面図である。FIG. 4 is a cross-sectional view of a principal part explaining another principle of the method for forming electrodes of a display panel of the present invention.
【図５】 ガス放電表示パネルの一例を示す要部分解斜
視図である。FIG. 5 is an exploded perspective view of an essential part showing an example of a gas discharge display panel.
【図６】 従来の表示パネルの電極形成方法を工程順に
説明する要部断面図である。FIG. 6 is a cross-sectional view of a main part explaining a conventional method for forming an electrode of a display panel in the order of steps.
【図７】 従来の表示パネルの電極形成方法における問
題点を説明する要部断面図である。FIG. 7 is a cross-sectional view of a main part for describing a problem in a conventional method for forming an electrode of a display panel.
【図８】 従来の表示パネルの電極形成方法における他
の問題点を説明する要部断面図である。FIG. 8 is a cross-sectional view of a main part for explaining another problem in a conventional method for forming an electrode of a display panel.
１１ ガラス基板 ３１ａ，３１ｂ 凹部 ３２ 暗色遮光膜 ３３ａ，３３ｂ 金属電極 ３６ 誘電体層 ３７ 保護膜 ４１ 透明導電平坦化膜 ４２ 透明導電膜 ４２ａ 透明電極 ４３，Ｘ，Ｙ 放電電極 ４４ 放電電極対 DESCRIPTION OF SYMBOLS 11 Glass substrate 31a, 31b Depression 32 Dark color light shielding film 33a, 33b Metal electrode 36 Dielectric layer 37 Protective film 41 Transparent conductive flattening film 42 Transparent conductive film 42a Transparent electrode 43, X, Y discharge electrode 44 Discharge electrode pair
Claims (2)
よりも幅狭の金属電極とを積層状に形成する表示パネル
の電極形成方法であって、 前記絶縁性基板の表面に前記金属電極の形状に対応する
凹部を形成する工程と、 該凹部内に金属導電材を埋め込んで金属電極を形成する
工程と、 埋設された金属電極上を含む前記絶縁性基板の表面に、
低粘性の透明導電塗布液を塗布して当該絶縁性基板の表
面を平坦化する透明導電平坦化膜を形成する工程と、 該透明導電平坦化膜上に透明導電膜を形成した後、該透
明導電膜と透明導電平坦化膜とを前記透明電極の形状に
パターニングして前記金属電極上に該金属電極よりも幅
広の透明電極を形成する工程とを含むことを特徴とする
表示パネルの電極形成方法。1. A method for forming an electrode on a display panel, comprising: forming a transparent electrode and a metal electrode having a smaller width than the transparent electrode on a transparent insulating substrate, wherein the metal is formed on a surface of the insulating substrate. Forming a concave portion corresponding to the shape of the electrode, forming a metal electrode by embedding a metal conductive material in the concave portion, and forming a metal electrode on the surface of the insulating substrate including on the embedded metal electrode.
Forming a transparent conductive flattening film for flattening the surface of the insulating substrate by applying a low-viscosity transparent conductive coating solution; and forming a transparent conductive film on the transparent conductive flattening film, Patterning a conductive film and a transparent conductive flattening film into the shape of the transparent electrode to form a transparent electrode wider than the metal electrode on the metal electrode. Method.
に、該凹部の内壁面に沿って該金属導電材よりも低反射
率の暗色遮光膜を形成する工程を含むことを特徴とする
請求項１に記載の表示パネルの電極形成方法。2. The method according to claim 1, further comprising, before embedding a metal conductive material in the recess, forming a dark light-shielding film having a lower reflectance than the metal conductive material along an inner wall surface of the recess. Item 2. The method for forming an electrode of a display panel according to Item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22407897A JP3979450B2 (en) | 1997-08-20 | 1997-08-20 | Display panel electrode forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22407897A JP3979450B2 (en) | 1997-08-20 | 1997-08-20 | Display panel electrode forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1165482A true JPH1165482A (en) | 1999-03-05 |
| JP3979450B2 JP3979450B2 (en) | 2007-09-19 |
Family
ID=16808222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22407897A Expired - Fee Related JP3979450B2 (en) | 1997-08-20 | 1997-08-20 | Display panel electrode forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3979450B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8154699B2 (en) | 2008-05-29 | 2012-04-10 | Hitachi Displays, Ltd. | Liquid crystal display device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220009216A (en) * | 2020-07-15 | 2022-01-24 | 삼성전자주식회사 | Light emitting device, method of manufacturing the light emitting device, and display apparatus including the light emitting device |
-
1997
- 1997-08-20 JP JP22407897A patent/JP3979450B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8154699B2 (en) | 2008-05-29 | 2012-04-10 | Hitachi Displays, Ltd. | Liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3979450B2 (en) | 2007-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3582248B2 (en) | Gas discharge display panel and method of manufacturing the same | |
| KR100716697B1 (en) | Panel assembly for pdp and manufacturing method thereof | |
| JPH11306994A (en) | Plasma display panel and its manufacture | |
| JPH0950767A (en) | Thin flat panel display | |
| JP2001052622A (en) | Flat plasma discharge display device | |
| EP1391907A1 (en) | Plasma display | |
| JPH08212918A (en) | Method for manufacturing plasma display panel | |
| JPH10283940A (en) | Plasma display panel | |
| JP3979450B2 (en) | Display panel electrode forming method | |
| JP3966372B2 (en) | Display panel electrode structure | |
| JPH117893A (en) | Gas discharge display panel | |
| JP3757334B2 (en) | Manufacturing method of surface discharge type plasma display panel | |
| JP3718095B2 (en) | Plasma display panel and manufacturing method thereof | |
| JPH11329256A (en) | Back substrate for ac-type color plasma display panel | |
| JP2000348606A (en) | Method of manufacturing gas discharge display panel | |
| JP3757333B2 (en) | Manufacturing method of surface discharge type plasma display panel | |
| JP3554301B2 (en) | Plasma display panel and method of manufacturing the same | |
| JPH10241576A (en) | Color plasma display panel | |
| JPH0817337A (en) | Method for manufacturing gas discharge display panel | |
| KR100502908B1 (en) | Plasma display panel and manufacturing method thereof | |
| KR20050052248A (en) | Plasma display panel and manufacturing method thereof | |
| KR100681037B1 (en) | Plasma display panel | |
| JPH11329255A (en) | Front surface substrate for ac-type color plasma display panel, and its manufacture | |
| KR100560484B1 (en) | Plasma display panel | |
| KR100560511B1 (en) | Manufacturing Method Of Plasma Display Panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040722 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20050428 |
|
| A711 | Notification of change in applicant |
Effective date: 20050720 Free format text: JAPANESE INTERMEDIATE CODE: A711 |
|
| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20050720 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20050914 |
|
| A521 | Written amendment |
Effective date: 20051206 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20051207 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Effective date: 20070619 Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Effective date: 20070619 Free format text: JAPANESE INTERMEDIATE CODE: A61 |
|
| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100706 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 4 Free format text: PAYMENT UNTIL: 20110706 |
|
| LAPS | Cancellation because of no payment of annual fees |