JPH1154049A - Plasma display substrate and manufacture of plasma display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress warp or crack of a substrate caused in the formation of a dielectric layer, and to enhance the yield by setting the total content of alkali metals in the dielectric layer consisting of an insulator which is provided on an electrode layer formed on a glass base to a specified wt.% or less. SOLUTION: When a dielectric layer consisting of an insulator is formed on a glass base having an electrode layer formed thereon, the total content of alkali metals contained in the dielectric layer is set to 5 wt.% or less. More preferably, the total content of Na, K and Li is set to 0.01-3 wt.%. A photosensitive glass paste consisting of glass powder and a photosensitive organic component is applied onto the glass base having a dielectric paste with such an alkali metal total content consisting of glass powder or ceramic powder and an organic component applied thereto, exposed, and developed. After a bulkhead pattern is formed, the dielectric paste layer and the bulkhead pattern are simultaneously baked to form the dielectric layer and a bulkhead.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a plasma display panel (hereinafter abbreviated as PDP). A PDP can be made large and thin, and is a display suitable for a home television, a computer monitor, and the like. More specifically, when fabricating a substrate for a PDP,
P for producing PDP with reduced cracking and high yield
The present invention relates to a DP substrate and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, plasma displays have attracted attention as large displays. 2. Description of the Related Art Plasma display panels (PDPs) can permeate at higher speeds than liquid crystal panels and can be easily increased in size, and thus have permeated fields such as OA equipment and public information display devices. Also, progress in the field of high-definition television is highly expected. With the expansion of such applications, attention has been paid to color PDPs having a large number of fine display cells.

[0003] A PDP is constructed by laminating a front plate and a back plate. In the front plate, a transparent electrode made of ITO or tin oxide is formed on the back surface of the glass substrate. A plurality of transparent electrodes are formed in a strip shape. Usually, a pulsed AC voltage of 10 kHz to several tens of kHz is applied between the adjacent transparent electrodes to obtain a discharge for display. However, since the sheet resistance of the transparent electrode is as high as several tens of Ω / cm ² , the electrode resistance is reduced to about several tens of kΩ. As a result, the driving becomes difficult because the imprint voltage pulse does not sufficiently rise. Therefore, a metal bus electrode is usually formed on the transparent electrode to reduce the resistance value.

Next, these electrodes are covered with a transparent dielectric layer. The transparent dielectric layer uses low melting point glass. Thereafter, MgO is formed as a protective layer by an electron beam evaporation method. The dielectric formed on the front plate has a role as a capacitor for accumulating charges for discharging.

On the other hand, in the rear panel, a data electrode for writing display data on a glass substrate is formed using a photosensitive silver paste, and is covered with a dielectric layer. A partition is formed thereon, and a phosphor that emits red, green, and blue light is applied by screen printing, and then dried and fired to form a phosphor layer. (Y, Gd) BO ₃ as a red phosphor powder:
Eu, green phosphor powder (Zn, Mn) ₂ Si
O, (Ba, Eu) MgAl ₁₀ as blue phosphor powder
O _{7 and the} like are generally used.

[0006] After sealing the front plate and the rear plate so as to enable matrix driving, exhaust, He, Ne,
A mixed gas of Xe is sealed, and a drive circuit is mounted to manufacture a PDP.

When a pulsed AC voltage is applied between adjacent transparent electrodes, gas discharge occurs, and plasma is formed. The ultraviolet light generated here excites the phosphor to emit visible light and obtain display light emission through the front plate. The transparent electrode that generates a discharge is composed of a scan electrode and a sustain electrode. In an actual panel drive, a sustain discharge pulse is applied to the transparent electrode serving as a discharge electrode.
A voltage is applied between the data electrodes on the back plate to generate a counter discharge, and this discharge is maintained between the discharge electrodes by a sustain pulse. When manufacturing the above PDP, there is a problem that the yield is reduced due to warpage or cracking of the substrate during processing. In particular, substrate warpage or substrate cracking due to a dielectric formed on substantially the entire surface of the substrate is likely to occur.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to provide a PDP substrate with a high yield by suppressing warping or cracking of the substrate when a dielectric layer is formed on a glass substrate. The method of the present invention is effective when forming a dielectric layer of a PDP rear substrate provided with electrodes, dielectrics, partitions, and phosphors on a glass substrate. In particular, it is effective when a partition is formed by a photosensitive paste method to obtain a high-definition PDP substrate.

[0009]

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display substrate in which a dielectric layer made of an insulator is provided on an electrode layer formed on a glass substrate, the substrate being included in the dielectric layer. This is achieved by a plasma display substrate characterized in that the total content of alkali metals is 5% by weight or less.

[0010] It is another object of the present invention to provide a method in which a glass powder having a total content of alkali metals of 5% by weight or less and a dielectric paste comprising an organic component and a glass substrate are coated with a glass powder and a photosensitive organic compound. After forming a partition pattern through the steps of applying a photosensitive glass paste composed of components, exposing and developing, a dielectric paste layer and a partition pattern are simultaneously fired to form a dielectric layer and a partition. Achieved.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION As a glass substrate used for the PDP substrate of the present invention, a soda glass substrate or an Asahi Glass
A heat-resistant glass substrate for PDP such as PD-200 "can be used. When an electrode is formed on this glass substrate, silver is used as an electrode material in an amount of 50% by weight or more, more preferably 90 to 99%. It is preferable to use a material containing 1% by weight in terms of resistance value and adhesion to a glass substrate, and an electrode layer having excellent adhesion to a substrate glass by containing a glass component of 1 to 10% by weight in an electrode. As a method for forming this electrode, a screen printing method or a photosensitive paste method is used, in which a silver powder having an average particle diameter of 1 to 4 microns and an average particle diameter of 0.1 to 4 are used. To form a photosensitive silver paste obtained by kneading a 2 micron glass frit with a photosensitive organic component on a glass substrate, drying, exposing, developing, and firing It can be.

A dielectric layer made of an insulator is formed on the glass substrate on which the electrode layer has been formed. By forming a dielectric layer on the electrode layer, peeling or falling down hardly occurs when a partition is formed. In particular, when the partition is formed by a photosensitive paste method, peeling due to a difference in polymerization curing between the upper part and the lower part of the partition is likely to occur, and forming a dielectric layer under the partition layer improves yield. It is effective for.

The thickness of the dielectric layer is preferably 3 to 20 μm, more preferably 6 to 15 μm, in order to form a uniform dielectric layer. If the thickness exceeds 20 μm, during baking, it is difficult to remove the solvent and cracks are likely to occur, and the stress applied to the glass substrate is large, causing problems such as warping of the substrate. If the thickness is less than 3 μm, it is difficult to maintain uniformity of the thickness. The dielectric constant of the dielectric material can be 7 to 13, but is preferably 7 to 10. A material having a dielectric constant of 7 or less is difficult to print on a glass substrate, and a material having a dielectric constant of 13 or more is not preferable because a discharge voltage increases when displaying a PDP.

The dielectric layer has a coefficient of thermal expansion α ₅₀ to ₄₀₀ in the range of ₅₀ to ₄₀₀ ° C., 70 to 85 × 10 ⁻⁷ / ° K,
It is more preferable to use a glass having a temperature of 72 to 80 × 10 ⁻⁷ / ° K. This is because it matches the thermal expansion coefficient of the substrate glass and reduces the stress applied to the glass substrate during firing. If it exceeds 85 × 10 ⁻⁷ / ° K., a stress such that the substrate is warped is applied to the surface on which the dielectric layer is formed, and 70 × 10 ⁻⁷ / ° K.
If it is less than K, a stress is applied to the surface without the dielectric layer such that the substrate warps. Therefore, the substrate may be cracked when the substrate is repeatedly heated and cooled. Also, when sealing with the front substrate,
In some cases, both substrates may not be parallel and cannot be sealed due to the warpage of the substrates.

When the substrate is warped, a gap is formed between the head of the partition and the surface of the front plate when the front plate and the rear plate are sealed, causing erroneous discharge between the cells, The substrate may be damaged during sealing. In order to avoid these problems, the absolute value of the amount of warpage needs to be 3 × 10 ⁻³ m ⁻¹ or less. That is, the amount of warpage of the substrate needs to be within the range of the following equation. -3 × 10 ⁻³ m ⁻¹ ≦ 1 / R ≦ 3 × 10 ⁻³ m ⁻¹ (R represents the radius of curvature of the substrate)

By controlling the total content of alkali metals contained in the dielectric layer to 5% by weight or less, more preferably 3% by weight or less, warpage and cracking of the substrate during firing can be suppressed. Even if the coefficient of thermal expansion matches that of the substrate glass, when the alkali metal, specifically, sodium, lithium, and potassium is contained in more than 5% by weight in total,
Since ion exchange occurs with the glass components in the glass substrate and the electrodes during firing, the properties of the surface portion of the substrate glass and the dielectric glass change, and the thermal properties do not match the thermal characteristics of the substrate glass, resulting in thermal deformation.

In particular, this is likely to occur when lithium is contained, and it is preferable that the total content of lithium contained in the dielectric layer be 3% by weight or less. In the dielectric layer, at least one of bismuth oxide, lead oxide, and zinc oxide is used for 10 times.
The use of glass containing 60% by weight facilitates control of the thermal softening temperature and the coefficient of thermal expansion. In particular, the use of glass containing 10 to 60% by weight of bismuth oxide has advantages such as stability of the paste. If the added amount of bismuth oxide, lead oxide, or zinc oxide exceeds 60% by weight, the heat resistance temperature of the glass becomes too low, and it becomes difficult to bake the glass substrate. Specific examples of the glass composition include the following in terms of oxides, but the present invention is not limited to this glass composition.

Bismuth oxide 10 to 40 parts by weight Silicon oxide 3 to 50 parts by weight Boron oxide 10 to 40 parts by weight Barium oxide 5 to 20 parts by weight Zinc oxide 10 to 20 parts by weight The dielectric layer comprises an inorganic powder and an organic binder. It can be formed by applying a dielectric paste on a glass substrate and firing it. The amount of the glass powder used for the dielectric layer paste is 50 to 90 with respect to the sum of the glass powder and the organic component.
Preferably, it is weight%. If the amount is less than 50% by weight, the denseness of the dielectric layer and the flatness of the surface are lacking. If the amount exceeds 90% by weight, the paste viscosity increases, and the thickness unevenness during coating increases. In this case, in order to suppress deformation of the glass substrate, it is necessary to bake at 500 to 600 ° C. For this reason, as an inorganic powder used for the dielectric paste, a glass powder having a glass transition temperature (Tg) of 430 to 500 ° C. and a heat-softening temperature under load (Ts) of 470 to 580 ° C. is 30% by weight or more, and further 60% by weight. % Is preferable. When the glass transition temperature (Tg) is lower than 430 ° C. or when the heat-softening temperature under load (Ts) is lower than 470 ° C., the glass is melted in a later process, and the thickness uniformity and characteristics of the dielectric are reduced. descend. Further, when the glass transition temperature (Tg) is lower than 500 ° C. or when the heat softening temperature under load (Ts) is 5
When the temperature is higher than 80 ° C., the firing on the glass substrate becomes insufficient, and the dielectric layer is liable to be peeled or missing.

Further, after applying the dielectric paste, a partition pattern is formed using the partition paste, and the dielectric layer and the partition pattern are simultaneously fired to form a uniform partition layer without peeling or falling. Can be. Forming the partition using a photosensitive paste composed of an inorganic powder and a photosensitive organic component is effective in increasing the definition of the PDP and reducing the number of manufacturing steps.

In the photosensitive paste method, a photosensitive paste mainly composed of an inorganic component composed of glass powder and an organic component having photosensitivity is applied onto a glass substrate, a photomask pattern is baked by exposure, and a partition pattern is developed by development. Is formed and then fired to obtain partition walls. As a method of applying, a method of transferring a photosensitive sheet (green tape) in which a photosensitive paste is applied on a film onto a glass substrate can also be used. Since the partition wall pattern formed by the photosensitive paste method is liable to generate strain stress due to uneven photocuring in the thickness direction, the partition pattern is likely to be peeled off during firing. When the partition is peeled off, color mixing occurs at the place where the partition is peeled off, and the peeled partition crushes the remaining pixels on the panel, lowering the yield. In order to suppress this, a partition pattern is formed on the unfired dielectric layer, and the partition pattern and the dielectric layer are fired simultaneously, whereby peeling is suppressed and the yield is improved.

When used for a partition, a pattern is formed on a glass substrate having a low glass transition point and thermal softening point. Therefore, the partition wall material has a glass transition point of 430 to 500 ° C. and a thermal softening temperature of 470 to 580 ° C. It is preferable to use a glass material. Further, by using glass having an average refractive index of 1.5 to 1.7, the refractive index of the glass powder in the paste is made close to the refractive index of the organic component, light scattering in the paste is suppressed, and the number of coating / exposure times is reduced. Can be reduced. In order to obtain a glass having a heat softening temperature that can be baked on a glass substrate and having an average refractive index of 1.5 to 1.7, at least one of lithium oxide, sodium oxide, and potassium oxide is required.
It is a simple method to use glass fine particles containing 3 to 20% by weight of the kind. A total of 2 to 20 alkali metal oxides such as sodium oxide, lithium oxide and potassium oxide
By using the glass containing by weight, not only the control of the thermal softening temperature and the coefficient of thermal expansion becomes easy, but also the average refractive index of the glass can be lowered,
It becomes easy to reduce the difference in the refractive index from the organic substance. 2
%, It becomes difficult to control the thermal softening temperature. 2
If it is more than 0%, the stability of the paste will decrease.
However, when the partition wall material contains an alkali metal and the dielectric layer contains an alkali metal or an oxide thereof, an ion exchange reaction occurs between the three layers of the partition wall layer / dielectric layer / glass substrate, thereby causing warpage of the substrate. Cracking and yellowing of the substrate due to reaction with the silver electrode occur. However, by setting the total content of alkali metals contained in the dielectric layer to 5% by weight or less, preferably 0.5% by weight or less, yellowing, warping and cracking of the substrate can be suppressed.

As the composition of the material of the partition walls, silicon oxide is preferably incorporated in the glass in the range of 3 to 60% by weight, and if less than 3% by weight, the denseness, strength and stability of the glass layer are reduced. In addition, the coefficient of thermal expansion deviates from a desired value, and a mismatch with a glass substrate is likely to occur. Further, when the content is set to 60% by weight or less, there is an advantage that the heat softening point is lowered and baking on a glass substrate becomes possible.

Boron oxide is 5 to 50% by weight in the glass.
The electrical, mechanical and thermal properties such as electrical insulation, strength, coefficient of thermal expansion, and denseness of the insulating layer can be improved by blending in the range. If it exceeds 50% by weight, the stability of the glass will decrease.

The hardness and workability can be improved by adding aluminum oxide, barium oxide, calcium oxide, magnesium oxide, zinc oxide, zirconium oxide, etc., particularly aluminum oxide, barium oxide and zinc oxide to the glass fine particles. However, from the viewpoint of controlling the thermal softening point, the coefficient of thermal expansion, and the refractive index, the content is preferably 40% by weight or less, more preferably 25% by weight or less.

As the glass composition containing lithium oxide,
In terms of oxide, lithium oxide 2 to 15 parts by weight Silicon oxide 15 to 50 parts by weight Boron oxide 15 to 40 parts by weight Barium oxide 2 to 15 parts by weight Aluminum oxide 6 to 25 parts by weight 50% or more by weight It is preferred to contain.

In the above composition, sodium oxide or potassium oxide may be used instead of lithium oxide.
Lithium oxide is preferred from the viewpoint of paste stability.

The amount of the glass powder used in the photosensitive paste method is preferably 65 to 85% by weight based on the sum of the glass powder and the organic component. If it is less than 65% by weight, the shrinkage ratio during firing becomes large, which causes disconnection and peeling of the partition walls, which is not preferable. In addition, the pattern tends to be thick and a residual film is likely to be generated during development. If it is greater than 85% by weight,
When the amount of the photosensitive component is small, pattern formability is deteriorated.

The partition wall material of the present invention has a glass softening point of 650.
A filler having a temperature of ８850 ° C. may be contained in an amount of 10５０50% by weight. Thereby, in the photosensitive paste method, the shrinkage ratio at the time of baking after pattern formation becomes small, and pattern formation becomes easy. As the filler, the heat softening temperature is 60
High melting point glass or ceramics of 0 ° C. or higher can be used.

As the high melting point glass powder, a glass powder containing 15% by weight or more of silicon oxide and aluminum oxide is preferable, and the total content of these should be 50% by weight or more in the glass powder. It is effective to have. As an example, it is preferable to use a glass powder containing the following composition.

Silicon oxide: 15 to 50% by weight Boron oxide: 5 to 20% by weight Aluminum oxide: 15 to 50% by weight Barium oxide: 2 to 10% by weight The organic components used for the dielectric layer paste and the partition wall paste include: General organic binders, plasticizers, solvents and the like can be added. Specific examples of the organic binder include polyvinyl alcohol, cellulosic polymer, silicon polymer, polyethylene, polyvinylpyrrolidone, polystyrene, polyamide, high molecular weight polyether, polyvinyl butyral, methacrylate polymer, acrylate polymer, and acrylic. Acid ester-methacrylic acid ester copolymer, α-methylstyrene polymer, butyl methacrylate resin, and the like. When adjusting the viscosity of the paste, as a solvent, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone,
Contains cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, and one or more of these. An organic solvent mixture is used.

The paste may contain a plasticizer. Specific examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, polyethylene glycol,
Glycerin and the like.

By imparting photosensitivity to the dielectric paste and the partition paste, there are advantages that pattern processing becomes easy and solubility in a solvent or a developing solution can be controlled. The paste contains a photosensitive component selected from at least one of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer, and further includes a photopolymerization initiator, an ultraviolet absorber, a sensitizer, Photosensitivity is imparted by adding additive components such as a sensitizer and a polymerization inhibitor. In this case, after the paste is applied on the glass substrate, the paste is dried, exposed to light, and cured. After pattern exposure, unnecessary portions can be developed and removed to form a pattern.

The photosensitive component includes a photo-insolubilizing type and a photo-solubilizing type. The photo-insolubilizing type includes: (A) a functional monomer having at least one unsaturated group or the like in the molecule. (B) those containing photosensitive compounds such as aromatic diazo compounds, aromatic azide compounds, and organic halogen compounds. (C) So-called diazo resins such as condensates of diazo amines and formaldehyde. And others.

Examples of the photo-soluble type include: (D) a complex of a diazo compound with an inorganic salt or an organic acid, and a compound containing a quinone diazo compound; and (E) a quinone diazo compound combined with an appropriate polymer binder. For example, phenol, naphthoquinone-1,2-diazide-5-sulfonic acid ester of a novolak resin, and the like.

As the photosensitive component used in the present invention, all of the above can be used. As the photosensitive component which can be easily used as a photosensitive paste by being mixed with inorganic fine particles, (A) is preferred.

The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, and sec-butyl. Acrylate, isobutyl acrylate, tert-butyl acrylate, n-
Pentyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxytriethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, heptadecafluorodecyl acrylate, 2-
Hydroxyethyl acrylate, isobonyl acrylate, 2-hydroxypropyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxydiethylene glycol acrylate, octafluoropentyl acrylate, phenoxyethyl acrylate, Stearyl acrylate, trifluoroethyl acrylate, allylated cyclohexyl diacrylate, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate Acrylate, dipen Erythritol hexaacrylate, dipentaerythritol monohydroxypentaacrylate, ditrimethylolpropane tetraacrylate, glycerol diacrylate, methoxylated cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate, triglycerol diacrylate, triglycol Methylolpropane triacrylate, acrylamide, aminoethyl acrylate,
Phenyl acrylate, phenoxyethyl acrylate, benzyl acrylate, 1-naphthyl acrylate, 2-naphthyl acrylate, bisphenol A diacrylate, diacrylate of bisphenol A-ethylene oxide adduct, diacrylate of bisphenol A-propylene oxide adduct, thiophenol acrylate , Acrylates such as benzyl mercaptan acrylate, and among the hydrogen atoms of these aromatic rings,
A monomer in which 1 to 5 are substituted with chlorine or bromine atoms, or styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene, chlorinated styrene, brominated styrene, α-methylstyrene, chlorinated α- Methyl styrene, brominated α-methyl styrene, chloromethyl styrene, hydroxymethyl styrene, carboxymethyl styrene, vinyl naphthalene, vinyl anthracene, vinyl carbazole, and some or all acrylates in the molecules of the above compounds were changed to methacrylates , Γ-methacryloxypropyltrimethoxysilane,
1-vinyl-2-pyrrolidone and the like. In the present invention, one or more of these can be used.

In addition, by adding an unsaturated acid such as an unsaturated carboxylic acid, the developability after pattern exposure can be imparted. Specific examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid,
Examples thereof include crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.

The content of these monomers is preferably 5 to 30% by weight based on the sum of the glass powder and the photosensitive component.
Outside of this range, the pattern formability deteriorates and the hardness becomes insufficient after curing.

As the binder, polyvinyl alcohol, polyvinyl butyral, methacrylate polymer, acrylate polymer, acrylate ester
Examples include methacrylate copolymers, α-methylstyrene polymers, and butyl methacrylate resins.

An oligomer or polymer obtained by polymerizing at least one of the compounds having a carbon-carbon double bond described above can be used. During the polymerization, the copolymer may be copolymerized with another photosensitive monomer so that the content of the photoreactive monomer is 10% by weight or more, more preferably 35% by weight or more.

As a monomer to be copolymerized, an unsaturated acid such as an unsaturated carboxylic acid can be copolymerized to improve developability in forming a partition pattern. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof. The acid value (AV) of the polymer or oligomer having an acidic group such as a carboxyl group in the side chain thus obtained is preferably in the range of 50 to 180, more preferably 70 to 140. When the acid value is less than 50, the allowable development width becomes narrow. On the other hand, if the acid value exceeds 180, the solubility of the unexposed portion in the developing solution decreases, so that if the developing solution concentration is increased, peeling occurs up to the exposed portion, making it difficult to obtain a high-definition pattern.

By adding a photoreactive group to a side chain or a molecular end of the polymer or oligomer described above, it can be used as a photosensitive polymer or a photosensitive oligomer having photosensitivity. Preferred photoreactive groups are those having an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acryl group, and a methacryl group.

A method for adding such a side chain to an oligomer or a polymer is to use an ethylenically unsaturated compound having a glycidyl group or an isocyanate group or an acrylic acid for a mercapto group, an amino group, a hydroxyl group or a carboxyl group in the polymer. There is a method in which chloride, methacrylic chloride or allyl chloride is added to make an addition reaction.

Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, glycidyl ether crotonic acid, glycidyl ether isocrotonic acid, and the like. .

Examples of the ethylenically unsaturated compound having an isocyanate group include (meth) acryloyl isocyanate and (meth) acryloylethyl isocyanate.

The ethylenically unsaturated compound having a glycidyl group or an isocyanate group, acrylic acid chloride, methacrylic acid chloride or allyl chloride is used in an amount of from 0.05 to 0.05 to the mercapto group, amino group, hydroxyl group and carboxyl group in the polymer. It is preferable to add one molar equivalent.

The amount of the polymer component consisting of the photosensitive polymer, the photosensitive oligomer and the binder in the photosensitive paste is excellent in terms of pattern formability and shrinkage after baking. Is preferably 5 to 30% by weight based on the sum of Outside this range, it is not preferable because pattern formation is impossible or the pattern becomes thick.

Specific examples of the photopolymerization initiator include benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, and 4,4-dichlorobenzophenone. , 4-benzoyl-4-methyldiphenyl ketone, dibenzyl ketone, fluorenone, 2,2-
Diethoxyacetophenone, 2,2-dimethoxy-2-
Phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyldimethylketanol Benzylmethoxyethyl acetal, benzoin, benzoin methyl ether, benzoin butyl ether, anthraquinone, 2-t-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthrone, dibenzosuberone, methyleneanthrone, 4-azidoben Zalacetophenone, 2,6-bis (p-azidobenzylidene) cyclohexanone, 2,6-bis (p-azidobenzylidene)- - methylcyclohexanone, 2-phenyl-1,2-butadione-2-(o-methoxycarbonyl) oxime, 1-phenyl - propane dione -2
-(O-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxy-propanetrione-2- (o-benzoyl) oxime, Michler's ketone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propanone, naphthalenesulfonyl chloride, quinoline sulfonyl chloride, N-phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, Photoreducing dyes such as benzothiazole disulfide, triphenylphosphine, camphorquinone, carbon tetrabromide, tribromophenylsulfone, benzoin peroxide and eosin, and methylene blue, and reduction of ascorbic acid and triethanolamine Such as a combination of the like. In the present invention, one or more of these can be used.

The photopolymerization initiator is added to the photosensitive component in an amount of 0.1%.
In the range of 0.5 to 20% by weight, more preferably
0.1 to 15% by weight. If the amount of the polymerization initiator is too small, the photosensitivity becomes poor, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion may be too small.

It is also effective to add an ultraviolet absorber. By adding a compound having a high ultraviolet absorption effect, a high aspect ratio, high definition, and high resolution can be obtained. UV absorbers composed of organic dyes, especially 35
Organic dyes having a high UV absorption coefficient in the wavelength range of 0 to 450 nm are preferably used. Specifically, azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, aminoketone dyes, anthraquinones, benzophenones, diphenylcyanoacrylates, triazines, p-aminobenzoic acid dyes and the like can be used. . Even when the organic dye is added as a light absorbing agent, it is preferable because deterioration of the insulating film characteristics due to the light absorbing agent can be reduced without remaining in the insulating film after firing. Among these, azo dyes and benzophenone dyes are preferred.

The addition amount of the organic dye is preferably 0.05 to 1 part by weight based on the glass powder. When the content is less than 0.05% by weight, the effect of adding the ultraviolet absorbent is reduced, and when it exceeds 1% by weight, the properties of the insulating film after firing are deteriorated, which is not preferable. More preferably, it is 0.1 to 0.18% by weight.

An example of the method of adding the ultraviolet light absorber composed of an organic dye is as follows. In addition to the method of preparing a solution in which the organic dye is dissolved in an organic solvent in advance and kneading the solution at the time of preparing the paste, a method of adding a glass in the organic solvent is also used. After mixing the fine particles, a method of drying the fine particles can be used. By this method, so-called capsule-like fine particles in which the surface of each glass fine particle is coated with an organic film can be produced.

A sensitizer is added to improve the sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone,
2,6-bis (4-dimethylaminobenzal) cyclohexanone, 2,6-bis (4-dimethylaminobenzal) -4-methylcyclohexanone, Michler's ketone,
4,4-bis (diethylamino) -benzophenone,
4,4-bis (dimethylamino) chalcone, 4,4-bis (diethylamino) chalcone, p-dimethylaminocinnamylideneindanone, p-dimethylaminobenzylideneindanone, 2- (p-dimethylaminophenylvinylene)- Isonaphthothiazole, 1,3-bis (4-
Dimethylaminobenzal) acetone, 1,3-carbonyl-bis (4-diethylaminobenzal) acetone,
3,3-carbonyl-bis (7-diethylaminocoumarin), N-phenyl-N-ethylethanolamine, N
-Phenylethanolamine, N-tolyldiethanolamine, N-phenylethanolamine, isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 3-phenyl-5-benzoylthiotetrazole, 1-phenyl-5-ethoxycarbonylthiotetrazole and the like. Can be In the present invention, one or more of these can be used. Some sensitizers can also be used as photopolymerization initiators. When a sensitizer is added to the photosensitive paste of the present invention, the amount is usually 0.05 to 10% by weight, more preferably 0.1 to 10% by weight, based on the photosensitive component. If the amount of the sensitizer is too small, the effect of improving the photosensitivity is not exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion may be too small.

The polymerization inhibitor is added to improve the thermal stability during storage. Specific examples of the polymerization inhibitor include hydroquinone, monoesterified hydroquinone,
N-nitrosodiphenylamine, phenothiazine, p-
t-butylcatechol, N-phenylnaphthylamine,
2,6-di-t-butyl-p-methylphenol, chloranil, pyrogallol and the like. When adding a polymerization inhibitor, the amount added, in the photosensitive paste,
Usually, it is 0.001 to 1% by weight.

Specific examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, polyethylene glycol, glycerin and the like.

To adjust the viscosity of the photosensitive paste,
An organic solvent may be added. The organic solvent used at this time includes methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, Chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, and the like, and an organic solvent mixture containing at least one of these are used.

By adding a radical polymerizable monomer and a radical polymerization initiator to the dielectric layer paste, a thermopolymerizable paste can be obtained. The crosslinked structure can be obtained by heating after applying the paste. In this case, specific examples of the radical polymerizable monomer include ethylene, styrene, butadiene, vinyl chloride, vinyl acetate, acrylic acid, methyl acrylate, methyl vinyl ketone, acrylamide, and acrylonitrile. Benzoyl peroxide, as a radical initiator,
Examples include lauroyl peroxide, potassium persulfate, azobisisobutyronitrile, benzoyl peroxide-dimethylaniline and the like.

Further, by adding an ultraviolet absorber such as an organic dye to the dielectric paste, it is possible to suppress a pattern defect due to reflection and scattering from the dielectric surface when the partition is exposed during pattern processing. . That is, T1 <T between the total light transmittance T1 of the dielectric paste at the g-line and the total light transmittance T2 of the photosensitive paste for the partition wall.
When the relationship of 2 is satisfied, the partition pattern can be favorably formed. The compounds described above can be used as the ultraviolet absorber to be used.

After mixing the above components, the mixture is kneaded with a planetary mixer, a three-roller, or the like to prepare a dielectric and a paste for a partition.

Next, an example of a manufacturing process of the PDP substrate of the present invention will be described. However, the present invention is not limited to this.

The paste used for the PDP substrate of the present invention is prepared by mixing the above-mentioned various inorganic and organic components so as to have a predetermined composition, and then uniformly mixing and dispersing the mixture with a three-roller or kneader.

The viscosity of the paste is appropriately adjusted by the addition ratio of inorganic fine particles, a thickener, an organic solvent, a plasticizer, a suspending agent, etc., but the range is from 2000 to 200,000 cp.
s (centipoise). For example, when applying to a glass substrate by a spin coating method other than the screen printing method, 200 to 5000 cps is preferable. To obtain a film thickness of 10 to 20 μm by applying once by the screen printing method,
2,000 to 200,000 cps is preferable.

A paste for a dielectric layer is applied to a thickness of 5 to 40 μm on the glass substrate on which the electrodes are formed.

Here, when applying the paste on the substrate,
Surface treatment of the substrate can be performed to enhance the adhesion between the substrate and the coating film. Examples of the surface treatment liquid include silane coupling agents such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, and tris-silane.
(2-methoxyethoxy) vinylsilane, γ-glycidoxypropyltrimethoxysilane, γ- (methacryloxypropyl) trimethoxysilane, γ (2-aminoethyl) aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane and the like, or organic metals such as organic titanium, organic aluminum and organic zirconium. The silane coupling agent or the organic metal is dissolved in an organic solvent, for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl alcohol, ethyl alcohol, propyl alcohol, butyl alcohol or the like.
Use the one diluted to a concentration of 1 to 5%. Next, after applying this surface treatment liquid uniformly on the substrate with a spinner or the like, 8
Surface treatment can be performed by drying at 0 to 140 ° C. for 10 to 60 minutes.

After the application of the dielectric layer paste, drying is performed to remove the solvent in the paste. Next, when the dielectric layer paste contains a photo- or thermo-polymerizable component, the paste is cured by light or heat to prevent erosion by a developing solution when forming the partition wall pattern.

A partition pattern is applied on the formed dielectric layer. In this case, there are a method in which the photosensitive paste is directly applied over the entire surface or a partial application, followed by patterning, and a method in which the photosensitive paste is applied on a polymer film and patterned, and then transferred onto the dielectric layer. As a coating method, a method such as screen printing, a bar coater, a roll coater, a die coater, and a blade coater can be used. The coating thickness can be adjusted by selecting the number of coatings and the viscosity of the paste.

After application, exposure is performed using an exposure apparatus. The exposure is generally performed by a mask exposure using a photomask, as is performed by ordinary photolithography. As the mask to be used, either a negative type or a positive type is selected depending on the type of the photosensitive organic component. Alternatively, a method of directly drawing with a red or blue laser beam without using a photomask may be used.

As an exposure device, a stepper exposure device, a proximity exposure device, or the like can be used. In the case of performing a large-area exposure, after applying a photosensitive paste on a substrate such as a glass substrate, and performing the exposure while transporting, it is possible to expose a large area with an exposure machine having a small exposure area. it can.

The active light source used at this time is, for example,
Visible light, near-ultraviolet light, ultraviolet light, electron beam, X-ray, laser light, etc. are preferable. Among them, ultraviolet light is preferable. Etc. can be used. Among these, an ultra-high pressure mercury lamp is preferred.
Exposure conditions vary depending on the coating thickness, but 1 to 100 mW
Exposure is performed for 0.5 to 30 minutes using an ultra-high pressure mercury lamp having an output of / cm ² .

By providing an oxygen shielding film on the surface of the applied photosensitive paste, the pattern shape can be improved. As an example of the oxygen shielding film, a film of polyvinyl alcohol (PVA) or cellulose, or a film of polyester or the like can be given.

The PVA film is formed by uniformly applying an aqueous solution having a concentration of 0.5 to 5% by weight on a substrate by a method such as a spinner, and then drying at 70 to 90 ° C. for 10 to 60 minutes to evaporate water. Let me do it. Further, it is preferable to add a small amount of alcohol to the aqueous solution, since the wettability with the insulating film is improved and the evaporation is facilitated. A more preferred solution concentration of PVA is 1 to 3% by weight. Within this range, the sensitivity is further improved. The reason why the sensitivity is improved by the PVA application is presumed as follows. That is, when the photosensitive component undergoes a photoreaction, the presence of oxygen in the air is considered to hinder the photocuring sensitivity, but the presence of a PVA film is considered to improve the sensitivity during exposure because excess oxygen can be blocked. .

When a transparent film of polyester, polypropylene, polyethylene, or the like is used, there is a method in which the film is attached to the photosensitive paste after application.

After the exposure, development is performed utilizing the difference in solubility between the photosensitive portion and the non-photosensitive portion in the developing solution.
The immersion method, the shower method, the spray method, and the brush method are used.

As the developer to be used, an organic solvent in which the organic components in the photosensitive paste can be dissolved can be used. Water may be added to the organic solvent as long as the solvent does not lose its solubility. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, development can be performed with an aqueous alkali solution. As the alkaline aqueous solution, a metallic alkaline aqueous solution such as sodium hydroxide, sodium carbonate, calcium hydroxide aqueous solution, etc. can be used, but it is preferable to use an organic alkaline aqueous solution since the alkaline component can be easily removed during firing.

As the organic alkali, an amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, diethanolamine and the like. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the soluble portion is not removed, and if the alkali concentration is too high, the pattern portion may be peeled off and the non-soluble portion may be corroded, which is not preferable. The development temperature during development is preferably from 20 to 50 ° C. from the viewpoint of process control.

Next, firing is performed in a firing furnace. The firing atmosphere and temperature vary depending on the type of the paste and the substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch type firing furnace or a belt type or roller hearth type continuous firing furnace can be used. When patterning is performed on a glass substrate, baking is performed at a temperature of 540 to 610 ° C. for 10 to 60 minutes.

A heating step at 50 to 300 ° C. may be introduced for the purpose of drying and preliminary reaction during each of the coating, exposure, development and baking steps.

Next, a phosphor paste that emits red, blue, and green light is pattern-printed by screen printing, whereby a back substrate for a PDP capable of full-color display can be manufactured.

In the present invention, the measurement of the light transmittance and the refractive index of the glass material is accurate at the wavelength of light to be exposed by the photosensitive paste method in order to confirm the effect. In particular, it is preferable to measure with light having a wavelength in the range of 350 to 650 nm. Further, it is preferable to measure the refractive index at the i-line (365 nm) or the g-line (436 nm). The light transmittance can be measured by a spectrophotometer and a refractive index measuring method such as an ellipso method, a V-block method, or a Becke method.

[0080]

The present invention will be specifically described below with reference to examples. However, the present invention is not limited to this. The concentrations (%) in Examples and Comparative Examples are% by weight unless otherwise specified. In the evaluation method, the yellowness was measured by a reflection method using a color computer manufactured by Suga Test Instruments Co., Ltd. The warpage of the substrate was measured using a surface roughness meter manufactured by Tokyo Seimitsu Co., Ltd. Regarding the cracking of the substrate, the evaluation was made as x when the front substrate and the rear substrate were broken at the time of sealing, and as o when the substrate was not broken.

The warpage of the substrate glass was defined as follows. The amount of warpage can be defined by the reciprocal of the radius of curvature of the glass substrate, that is, the amount of warpage is inversely proportional to the radius of curvature. Positive and negative values of the amount of warpage indicate the direction in which the substrate warps.

Although the radius of curvature of the glass substrate can be measured by various methods, the simplest method is to measure the undulation of the glass substrate surface using a surface roughness meter. The following relationship is established between the measurement length (L) and the maximum deviation (H) of the curve when L is a sufficiently large value with respect to H. R = L2 / 8H

Example 1 The following solvents and polymer 1 were mixed to form a 40% solution and heated to 60 ° C. with stirring to dissolve all the polymers homogeneously.

Polymer 1: 40% methacrylic acid (M
AA), a weight average molecular weight obtained by subjecting a copolymer consisting of 30% methyl methacrylate (MMA) and 30% styrene (St) to an addition reaction of 0.4 equivalent of glycidyl methacrylate (GMA) to a carboxyl group. 43
000, a photosensitive polymer having an acid value of 95.

Then, the solution was cooled to room temperature, and the components constituting the following organic components were added in the proportions shown below and dissolved to obtain organic components. Thereafter, this solution was filtered using a 400-mesh filter to produce an organic vehicle.

Organic dye: Sudan: Azo-based organic dye (C ₂₄ H ₂₀ N ₄ O) 0.5 g Monomer: TMPTA (trimethylolpropane triacrylate) 150 g Polymer: Polymer 1 150 g Initiator: 30 g of Irgacure 369 manufactured by Ciba Geigy Sensitizer: 2,4-diethylthioxanthone 30 g Sensitizing aid: p-dimethylaminobenzoic acid ethyl ester 20 g Plasticizer: dibutyl phthalate (DBP) 50 g Solvent: γ-BL: gamma butyrolactone 300 g To 40 g of the obtained organic vehicle Glass powder A shown below
60 g was added and kneaded with a kneader to produce a dielectric layer paste. The glass powder used was finely divided by an attractor in advance.

Glass powder B6 was added to 40 g of the above organic vehicle.
0 g was added and kneaded with a kneader to produce a photosensitive paste for partition walls. The glass powder used was finely divided by an attractor in advance.

Glass powder A: composition Bi ₂ O ₃ 38%,
_{SiO 2 7%, B 2 O} 3 19%, BaO 12%, A
l ₂ O ₃ 3%, ZnO 21%. Non-spherical powder having an average particle size of 3.4 μm. Tg 476 ° C, Ts 525 ° C. Thermal expansion coefficient 77 × 10 ^-7 / ° K. Refractive index at g-line (436 nm) 1.75.

Glass powder B: composition Li ₂ O 9%, Si
O ₂ 20%, B ₂ O ₃ 31%, BaO 4%, Al ₂ O
₃ 24%, ZnO 2%, MgO 6%, CaO 4
%. Non-spherical powder having an average particle size of 2.6 μm. Tg (glass transition point) 480 ° C, Ts (softening point) 520 ° C. Thermal expansion coefficient 79 × 10 ^-7 / ° K. The refractive index at g-line (436 nm) is 1.58.

Using a photosensitive silver paste, a pitch of 150
300 in which a striped electrode having a line width of 40 μm was formed.
On a mm square glass substrate (PD-200 manufactured by Asahi Glass Co., Ltd.)
30 μm of the above dielectric paste by screen printing
And dried at 80 ° C. for 30 minutes, and then irradiated with light at an exposure of 1 J / cm ^{2 using} an ultra-high pressure mercury lamp.

Next, the above-mentioned partition wall paste was applied to a thickness of 350 μm (thickness after drying: 180 μm), dried at 80 ° C. for 40 minutes, and then pitch 150 μm, line width 2
Through a 0 μm stripe-shaped negative mask, the mask was exposed to ultraviolet light from an upper surface using a super-high pressure mercury lamp of 50 mW / cm ² output. The exposure amount was 1.5 J / cm ² .

Next, a 0.3% by weight aqueous solution of monoethanolamine kept at 35 ° C. was developed by showering for 85 seconds (only 70 seconds in Example 3), and then washed with water using a shower spray. A space portion that was not photocured was removed to form a stripe-shaped partition pattern. The glass substrate on which the dielectric layer and the partition walls are formed is fired in air at 570 ° C. for 30 minutes,
A partition was prepared.

Next, a phosphor paste using each of the RGB phosphors was pattern-printed by screen printing to produce a plasma display rear substrate. In addition, a transparent electrode, a bus electrode, a dielectric layer, a protective film (M
Sealing was performed using the front substrate formed with gO) and sealing glass. The temperature at the time of sealing is 450 ° C. The fabricated PD
Table 1 shows the evaluation results of the rear substrate for P.

Example 2 A substrate was produced in the same manner as in Example 1 except that the following glass powder C was used as a dielectric paste glass. Table 1 shows the evaluation results of the manufactured rear substrate for PDP.

Glass powder C: composition Bi ₂ O ₃ 27%,
_{SiO 2 14%, B 2 O} 3 18%, BaO 14%,
Al ₂ O ₃ 4%, ZnO 21%, Na ₂ O 2%. Non-spherical powder having an average particle size of 3.4 μm. Tg 486 ° C, Ts
531 ° C. Thermal expansion coefficient 74 × 10 ^-7 / ° K. Refractive index at g-line (436 nm) 1.75.

Comparative Example 1 A substrate was produced in the same manner as in Example 1, except that glass powder B was used as the glass for the dielectric paste.
Table 1 shows the evaluation results of the manufactured rear substrate for PDP.

Comparative Example 2 A substrate was produced in the same manner as in Example 1 except that glass powder D shown below was used as the glass for the dielectric paste. Table 1 shows the evaluation results of the manufactured rear substrate for PDP.

Glass powder D: composition Li ₂ O 3%, K ₂
O 6%, SiO ₂ 21%, B ₂ O ₃ 33%, BaO
4%, Al ₂ O ₃ 20%, ZnO 13%. Non-spherical powder having an average particle size of 2.6 μm. Tg (glass transition point) 473
° C, Ts (softening point) 520 ° C. Thermal expansion coefficient 79 × 10
^-7 / ° K. Refractive index at g-line (436 nm) 1.60.

[0099]

[Table 1]

[0100]

According to the method for manufacturing a plasma display panel of the present invention, since the partition walls do not peel off during firing,
High-definition PDP can be manufactured with high yield.
Thus, a high-definition plasma display can be provided.

Claims (12)

[Claims] 1. A plasma display substrate comprising a dielectric layer comprising an insulator provided on an electrode layer formed on a glass substrate, wherein the total content of alkali metals contained in the dielectric layer is 5% by weight. A plasma display substrate characterized by the following. 2. The plasma display substrate according to claim 1, wherein the plasma display substrate comprises a glass substrate provided with respective layers of electrodes, dielectrics, partition walls and phosphors. 3. The plasma display substrate according to claim 1, wherein the total content of Na, Li, and K elements contained in the dielectric layer is 0.01 to 3% by weight. 4. The method according to claim 1, wherein the content of lithium in the dielectric layer is 3
2. The substrate for a plasma display according to claim 1, wherein the content is not more than% by weight. 5. The plasma display substrate according to claim 1, wherein the dielectric layer is made of glass having a thermal expansion coefficient of 50 to 400 ° C. and a thermal expansion coefficient of 70 to 85 × 10 ⁻⁷ / ° K. 6. The method according to claim 1, wherein the dielectric layer has a glass transition temperature (Tg) of 43.
0-500 ° C, heat-softening temperature under load (Ts) 470-580
2. The substrate for a plasma display according to claim 1, wherein the substrate is made of glass having a temperature of ℃. 7. The plasma display substrate according to claim 1, wherein the dielectric layer is made of glass containing 10 to 60% by weight of bismuth oxide. 8. The plasma display substrate according to claim 1, wherein silver is contained in the electrode layer in an amount of 50% by weight or more. 9. The plasma display substrate according to claim 2, wherein the partition layer is made of glass having a total content of Na, Li and K elements of 2 to 20% by weight. 10. The plasma display substrate according to claim 2, wherein the partition layer is made of glass having a refractive index of 1.5 to 1.7. 11. A photosensitive composition comprising a glass powder and a photosensitive organic component on a glass substrate coated with a dielectric paste comprising a glass powder or a ceramic powder and an organic component having a total content of alkali metals of 5% by weight or less. A method for manufacturing a plasma display, wherein a dielectric paste layer and a partition pattern are simultaneously fired to form a dielectric layer and a partition after forming a partition pattern through steps of coating, exposing, and developing a glass paste. 12. The method according to claim 11, wherein the glass powder used for the photosensitive glass paste is made of glass having a refractive index at g-line of 1.5 to 1.7.