JPH1140920A - Composite component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid mutual induction between inductors for preventing interferences between elements when the same kind of inductors are closely contacted by placing them, so that fluxes from the adjacent inductors are approximately perpendicular. SOLUTION: Green sheets having printed wiring patterns are laminated and the patterns are connected to form oblong inductors 12A, 12B. They are adhered with adhesives to form a composite component 11, so that the laminating directions of the green sheets of the inductors are perpendicular and one side of the inductor 12A, 12B approximately forms a flat face. Thus, they are formed and held so that the fluxes from the inductors 12A, 12B are approximately perpendicular and will not cross each other. This reduces the mutual inductance between the inductors of the component 11 and avoids interference between closely contacting disposed elements.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a composite part,
For example, the present invention can be applied to a filter in which a chip capacitor and a chip inductor are integrated. According to the present invention, the inductor is arranged such that a magnetic flux generated by another inductor is substantially orthogonal to the coil, and the capacitor is arranged such that a virtual plane parallel to a counter electrode of the capacitor is substantially orthogonal. In addition, by arranging a magnetic shield member and an electrostatic shield member in place of them, even if the same kind of elements are closely arranged,
Interference between these elements can be effectively avoided.

[0002]

2. Description of the Related Art Conventionally, in an LC filter which is one of composite components in which a chip capacitor, a chip inductor and the like are integrated, interference between inductors and capacitors is achieved by integrating different types of electronic components side by side. Is to be reduced.

That is, this kind of composite component is formed by printing, for example, a wiring pattern and an electrode pattern on a green sheet, drying, laminating, and pressing, then removing and firing to form an external electrode. At this time, the inductor is formed by printing a wiring pattern using a green sheet made of a ferrite material so as to form a coil.
In addition, a capacitor is formed by printing an electrode pattern using a green sheet of a capacitor material so as to form a counter electrode. The LC filter is created by integrating the respective elements in such a manufacturing process, or is integrated after the respective elements are created.

At this time, when the inductors L are arranged adjacent to each other as shown in FIGS. 14 and 15, the magnetic flux generated by one inductor L interlinks with the coils of the other inductors L. Interference occurs due to mutual guidance. 14 and 15, the sign of the inductor indicates the direction of the coil in each inductor L.

In the same manner, as shown in FIG.
, Interference occurs between these capacitors C due to electrostatic induction between the opposing electrodes forming. In FIG. 16, the counter electrodes of the stacked capacitors are indicated by lines, and the directions of these counter electrodes are indicated. Therefore, in FIG. 16, each counter electrode is formed so as to extend perpendicularly to the plane of the paper and vertically.

For this reason, as shown in FIGS. 17 and 18,
A conventional LC filter is formed by arranging inductors and capacitors with different types of elements interposed therebetween. FIG. 17 shows, for example, a T-type high-pass filter 1 in which input / output capacitors 3A and 3B are arranged on both sides of an inductor 2. In this case, the capacitors 3A and 3B are spaced apart from each other with the inductor 2 interposed therebetween, thereby preventing electrostatic induction. FIG. 18 shows a T-type low-pass filter 5, for example, in which input / output inductors 7A and 7B are arranged on both sides of a ground capacitor 6. Again,
The inductors 7A and 7B are spaced apart with the capacitor 6 interposed therebetween, thereby preventing mutual induction.
Thus, in the conventional composite component, interference between elements is prevented.

[0007]

By arranging the same type of elements at a distance in this way to prevent interference between the elements, the layout of each element is limited. On the other hand, if interference of these elements can be prevented even if elements of the same kind are arranged closely, it is necessary to lay out desired elements in various ways and make a composite component having desired characteristics in a small size. It is thought that it is possible.

By the way, to prevent interference between elements,
A method of separately arranging the elements constituting the composite component on the wiring board is also conceivable. However, such a method increases the size of the wiring board.

The present invention has been made in view of the above points, and it is an object of the present invention to propose a composite part which can prevent interference between the same kind of elements even if they are closely arranged. Things.

[0010]

According to the present invention, in order to solve such a problem, in a composite component in which a plurality of inductors are integrated, the inductors are arranged such that magnetic fluxes generated by adjacent inductors are substantially orthogonal.

At this time, predetermined members on which the wiring patterns are printed are laminated, and an inductor formed by sequentially connecting the respective wiring patterns is applied.

Alternatively, in a composite component in which a plurality of capacitors are integrated, the capacitors are arranged such that a virtual plane parallel to a counter electrode of an adjacent capacitor is substantially orthogonal.

At this time, a capacitor formed by laminating predetermined members on which the counter electrodes are printed and selectively connecting the respective counter electrodes is applied.

[0014] Alternatively, in a composite part in which a plurality of inductors are integrated, between adjacent inductors,
A magnetic shield member is arranged.

At this time, predetermined members on which the wiring patterns are printed are laminated, and an inductor formed by sequentially connecting the wiring patterns is applied.

Alternatively, in a composite component in which a plurality of capacitors are integrated, an electrostatic shield member is arranged between adjacent capacitors.

At this time, a capacitor formed by laminating predetermined members on which counter electrodes are printed and selectively connecting the respective counter electrodes is applied.

In the composite component, if the inductors are arranged so that the magnetic fluxes generated by adjacent inductors are substantially orthogonal, even if the inductors are closely arranged, the magnetic flux generated by the adjacent inductor is linked to the coil of another inductor. These inductors can be arranged so that they do not cross.
Thereby, mutual induction between inductors can be prevented, and interference between inductances can be effectively avoided.

At this time, a predetermined component on which the wiring patterns are printed is laminated, and an inductor formed by sequentially connecting the respective wiring patterns is applied, whereby a composite component in which the inductors are integrated at a high density can be produced. .

Alternatively, in the composite component, if the capacitors are arranged so that the virtual planes parallel to the opposing electrodes of the adjacent capacitors are substantially orthogonal, even if the capacitors are closely arranged, the opposing surfaces of the capacitors may be arranged. Electrostatic induction between the electrodes can be reduced.

At this time, a predetermined component on which the counter electrodes are printed is laminated, and a capacitor formed by selectively connecting the respective counter electrodes is applied to produce a composite component in which the capacitors are integrated at a high density. be able to.

Alternatively, in a composite component, if a magnetic shield member is arranged between adjacent inductors,
Even if the inductors are closely arranged in various directions, the magnetic flux by the adjacent inductor can be shielded so that the magnetic flux does not interlink with the coils of other inductors. Thereby, interference between the inductors can be effectively avoided.

At this time, a predetermined component on which the wiring patterns are printed is laminated, and an inductor formed by sequentially connecting the wiring patterns is applied, whereby a composite component in which the inductors are integrated at a high density can be produced. .

Alternatively, in a composite component, if an electrostatic shield member is arranged between adjacent capacitors, even if the capacitors are closely arranged in various directions, the electrostatic shield between the opposing electrodes of the adjacent capacitors can be obtained. Induction can be reduced, so that interference between capacitors can be effectively avoided.

At this time, a predetermined component on which the opposing electrodes are printed is laminated, and a capacitor formed by selectively connecting the opposing electrodes is applied to produce a composite component in which the capacitors are integrated at a high density. be able to.

[0026]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(1) First Embodiment FIG. 1 is a plan view showing a composite component according to a first embodiment of the present invention, and FIG. 2 is a plan view of an inductor constituting the composite component 11. It is a figure and a side view.

That is, the inductors 12A and 12B
It is made of a chip inductor, and is formed in a rectangular shape by laminating green sheets on which wiring patterns are printed and sequentially connecting the wiring patterns. Inductors 12A and 1
2B indicates that the direction in which the central axis of the coil corresponding to the laminating direction of the green sheets extends is the direction of the inductors 12A and 12A.
External electrodes 13 are formed so as to be substantially parallel to the mounting surface of the wiring board on which 2B is mounted.

The composite component 11 includes inductors 12A and 12A.
The inductors 12A and 12B are bonded by a predetermined adhesive so that the lamination directions of the green sheets in 2B are orthogonal to each other and one side surface of the inductors 12A and 12B forms a substantially flat surface. Thereby, the composite component 11 causes the inductors 12A and 12B so that the magnetic fluxes generated by the inductors 12A and 12B are substantially orthogonal.
B are closely arranged.

According to the above configuration, the inductors 12A and 12B are arranged so that the lamination directions of the green sheets are orthogonal, and the inductors 12A and 12B are arranged so that the magnetic fluxes generated by the inductors 12A and 12B are substantially orthogonal. Thereby, in each inductor, the magnetic flux by the other inductors is held so as not to link the coils. As a result, in the composite component 11, mutual induction between inductors can be reduced, and the components can be closely arranged to effectively avoid interference between elements.

(2) Second Embodiment FIG. 3 is a plan view showing a composite component according to a second embodiment, and FIG. 4 is a plan view and a side view of a capacitor constituting the composite component 21. FIG.

That is, the capacitors 22A and 22B are
It is formed of a chip capacitor, and is formed in a rectangular shape by laminating green sheets on which counter electrodes are printed and selectively connecting the respective counter electrodes. Capacitors 22A and 22B
Are formed such that an imaginary plane parallel to the counter electrode printed on each green sheet is substantially orthogonal to the mounting surface of the wiring board on which the capacitors 22A and 22B are mounted.

The composite component 21 is arranged such that an imaginary plane parallel to the counter electrode of each of the capacitors 22A and 22B is orthogonal.
Also, the capacitors 2A and 22B are formed with a predetermined adhesive so that one side surface of the capacitors 22A and 22B forms a substantially flat surface.
It is formed by bonding 2A and 22B.

According to the configuration of FIG. 3, the capacitors 22A and 22B are arranged so that the virtual planes parallel to the opposing electrodes of the capacitors 22A and 22B are substantially orthogonal to each other, so that the static electricity between the opposing electrodes of the capacitors 22A and 22B can be obtained. Electric induction can be reduced. This makes it possible to reduce the interference between elements by closely disposing the elements.

(3) Third Embodiment FIG. 5 is a plan view showing a composite part according to a third embodiment. The composite component 31 is a filter having a predetermined frequency characteristic, and is formed by integrating capacitors and inductors according to a predetermined layout.

Here, as the capacitors 31A and 31B, those having the same shape as the capacitors described in the second embodiment are applied. In contrast, inductors 32A-
32D has first inductors 32B and 32C having the same configuration as the inductor described in the first embodiment, and a second inductor 32B and 32C having external electrodes formed on different side surfaces. Inductor 32A, 3
2D applies.

FIG. 6 shows these second inductors 32A,
It is the top view and side view which show 32D. In the second inductors 32A and 32D, the wiring patterns of the stacked green sheets are sequentially connected to form a coil, and the wiring patterns corresponding to both ends of the coil are drawn out to the side surfaces through through holes. The external electrodes 33 are formed on the side surfaces of the second inductors 32A and 32D, so that the center axis of the coil corresponding to the stacking direction of the green sheets is orthogonal to the mounting surface of the wiring board on which the inductors 32A and 32B are mounted. It is formed as follows.

FIG. 7A shows these second inductors 3.
It is a perspective view which shows 2A, 32D, and FIG.7 (B) is sectional drawing which cut | disconnects this perspective view by the AA line.
In FIG. 7, the cross section of the green sheet is represented by a broken line, and the lamination direction of the green sheet is shown. Actually, these second inductors 32A and 32D are formed such that the electrodes formed on the end faces of the laminated green sheets are exposed, for example, in a circular shape, and external electrodes formed by bumps are formed on these electrodes. Thus, the second inductors 32A and 32D are formed such that the center axis of the coil is orthogonal to the mounting surface of the wiring board.

FIG. 8A is a perspective view showing the first inductors 32B and 32C in comparison with FIG. 7, and FIG. It is sectional drawing cut and shown by the B line. This first inductor 3
2B and 32C are eventually connected to the second inductors 32A and 32C.
The second inductors 32A and 32D are formed such that the central axis of the coil is parallel to the mounting surface of the wiring board by changing the wiring pattern to the external electrodes with respect to the second inductors 32A and 32D. You.

The composite component 31 is made up of an adjacent inductor 32
For A and 32B, 32C and 32D, the first and second inductors are applied, respectively, so that adjacent inductors 32A and 32B, 32C and 32D
D so that the magnetic flux is substantially orthogonal at D.
~ 32D are placed closely together.

The capacitors 31A and 31B are arranged apart from each other.

According to the configuration shown in FIG. 5, even when the capacitor and the inductor are integrated, the elements of the inductor are closely arranged so that the magnetic flux generated by the other inductor is substantially orthogonal to the coil. Interference between the elements can be effectively avoided.

(4) Fourth Embodiment FIG. 9 is a plan view showing a composite part according to a fourth embodiment. The composite component 41 has a configuration in which the capacitor and the inductor are replaced in the right half portion from the center in the drawing of the composite component according to the third embodiment.

The composite component 41 is formed by the first and second inductors described in the third embodiment so that the magnetic fluxes are substantially orthogonal to the adjacent inductors 32A and 32B, 32B and 42A, and the adjacent capacitors are used. 31A and 41B, 41A and 41B are arranged such that a virtual plane parallel to the counter electrode is orthogonal.

As shown in FIG. 9, even when the capacitor and the inductor are integrated, the inductor has a virtual plane parallel to the counter electrode of the capacitor so that the magnetic flux generated by the other inductor is substantially orthogonal to the coil. Are arranged so as to be substantially orthogonal to each other, the same effect as in the third embodiment can be obtained.

(5) Fifth Embodiment FIG. 10 is a perspective view showing a shield case applied to a composite part according to a fifth embodiment. The shield case 50 is a magnetic shield member having a high magnetic permeability and a small coercive force, and is formed into a frame shape by processing a conductive electrostatic shield member such as a permalloy or a silicon steel plate. Inside each chip inductor,
A small room for partitioning and storing chip capacitors and chip resistors is formed.

As shown in FIG. 11, in the manufacturing process according to this embodiment, for example, a thermosetting adhesive 51 is dropped into each small room of the shield case 50 by a dispenser, and then sequentially according to a predetermined layout. A chip component 52 such as an inductor, a capacitor, and a resistor is housed therein.
Further, as shown in FIG. 12, in this manufacturing process, after the adhesive is cured, the chip component 52 and the shield case 50 are integrated, and before and after this thermosetting process, solder bumps are formed on each chip component. I do.

Thus, in this embodiment, the inductor is magnetically shielded with permalloy or the like, and the capacitor is similarly electrostatically shielded with permalloy or the like. It is made to effectively avoid interference. Thus, in the shield case 50, a projection is formed on the side surface on which the bump is formed in order to ensure the function of the electrostatic shield, and a lead wire or the like is connected through the projection or to the outer periphery of the shield case 50. Then, the wiring board is grounded to a fixed potential (for example, ground).

According to the configuration shown in FIGS. 10 to 12, a shield case is formed by a magnetic shield member and an electrostatic shield member, and an inductor,
By integrating the capacitors, even if the inductors are closely arranged in various orientations, the magnetic flux by the adjacent inductors is shielded so that this magnetic flux does not interlink with the coils of other inductors. be able to. Further, even if the capacitors are closely arranged in various directions, it is possible to effectively avoid the coupling between the opposed electrodes of the adjacent capacitors. Thereby, interference between these elements can be effectively avoided.

Further, when it is arranged on the wiring board, mutual induction and electrostatic induction with other electronic components can be reduced, and thereby, it can be arranged close to other electronic components.

(6) Other Embodiments In the above-described embodiment, a case has been described in which a capacitor is used in which the stacking direction of the green sheets is parallel to the mounting surface of the wiring board, but the present invention is not limited to this. Figure 1
As shown in FIG. 3, a capacitor in which the stacking direction of the green sheets is set perpendicular to the mounting surface of the wiring board may be applied.

In the above-described fifth embodiment,
In the case of integrating capacitors and inductors, a case is described in which a shield case is formed of permalloy or the like which is a magnetic shield member, an electrostatic shield member, and a capacitor, an inductor, and the like are integrated with this shield case. However, the present invention is not limited to this. For example, when various elements are integrated except for the capacitor, or when the capacitor can be arranged separately, a shield case may be formed by a magnetic shield member. On the contrary, when various elements are integrated except for the inductor, and when the inductor can be arranged at a distance,
The shield case may be formed by an electrostatic shield member.

In the above-described fifth embodiment,
Although the case where the electrostatic shield and the magnetic shield are performed by the shield case has been described, the present invention is not limited to this. For example, instead of the shield case, a simple plate-shaped electrostatic shield member or a magnetic shield member may be appropriately arranged. Also, each chip component may be adhered with a conductive adhesive to form an electrostatic shield. Further, when green sheets are laminated to form each chip component, an electrode or the like for an electrostatic shield is created. Thus, a shield member and a magnetic shield member may be built in each chip component. In addition, as the electrostatic shield member, in addition to a conductive adhesive, a conductive member such as an aluminum plate or a brass plate can be used. As the magnetic shield member, a ferrite sheet or the like can be used.

[0054]

As described above, according to the present invention, an imaginary plane parallel to a counter electrode of a capacitor is substantially orthogonal to a capacitor so that a magnetic flux generated by another inductor is substantially orthogonal to a coil for an inductor. By arranging them in such a way, and by arranging them instead of magnetic shield members and electrostatic shield members,
Even if elements of the same type are closely arranged, it is possible to effectively avoid interference between these elements of the same type.

[Brief description of the drawings]

FIG. 1 is a plan view showing a composite component according to a first embodiment of the present invention.

FIG. 2 is a plan view and a side view showing an inductor applied to the composite component of FIG.

FIG. 3 is a plan view showing a composite component according to a second embodiment of the present invention.

4 is a plan view and a side view showing a capacitor applied to the composite component of FIG.

FIG. 5 is a plan view showing a composite component according to a third embodiment of the present invention.

6A and 6B are a plan view and a side view showing an inductor applied to the composite component of FIG.

FIG. 9 is a plan view showing a composite part according to a fourth embodiment of the present invention.

FIG. 10 is a perspective view showing a shield case applied to a composite component according to a fifth embodiment of the present invention.

11 is a perspective view for explaining mounting of a chip component on the shield case of FIG. 10;

FIG. 12 is a perspective view showing a composite part to which the shield case of FIG. 10 is applied.

FIG. 13 is a plan view and a side view showing a capacitor applied to a composite component according to another embodiment.

FIG. 14 is a plan view for describing interference between inductors.

FIG. 15 is a plan view for explaining interference between inductors when the arrangement of inductors is changed from that of FIG. 14;

FIG. 16 is a plan view for describing interference between capacitors.

FIG. 17 is a plan view showing a conventional composite part.

FIG. 18 is a plan view showing a conventional composite component in addition to FIG.

[Explanation of symbols]

2, 7A, 7B, 12A, 12B, 32A to 32D, 4
2A, L ... Inductor, 3A, 3B, 6, 22A, 2
2B, 31A, 31B, 41A, 41B, 62, C ...
Capacitors, 11, 21, 31, 41 ... composite parts, 5
0: Shield case, 52: Chip parts

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[Procedure amendment]

[Submission date] October 3, 1997

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 is a plan view showing a composite component according to a first embodiment of the present invention.

FIG. 2 is a plan view and a side view showing an inductor applied to the composite component of FIG.

FIG. 3 is a plan view showing a composite component according to a second embodiment of the present invention.

4 is a plan view and a side view showing a capacitor applied to the composite component of FIG.

FIG. 5 is a plan view showing a composite component according to a third embodiment of the present invention.

6A and 6B are a plan view and a side view showing an inductor applied to the composite component of FIG.

FIG. 7 is a perspective view and a sectional view showing a second inductor applied to the composite component of FIG. 5;

8 is a perspective view and a sectional view showing a first inductor applied to the composite component of FIG.

FIG. 9 is a plan view showing a composite part according to a fourth embodiment of the present invention.

FIG. 10 is a perspective view showing a shield case applied to a composite component according to a fifth embodiment of the present invention.

11 is a perspective view for explaining mounting of a chip component on the shield case of FIG. 10;

FIG. 12 is a perspective view showing a composite part to which the shield case of FIG. 10 is applied.

FIG. 13 is a plan view and a side view showing a capacitor applied to a composite component according to another embodiment.

FIG. 14 is a plan view for describing interference between inductors.

FIG. 15 is a plan view for explaining interference between inductors when the arrangement of inductors is changed from that of FIG. 14;

FIG. 16 is a plan view for describing interference between capacitors.

FIG. 17 is a plan view showing a conventional composite part.

FIG. 18 is a plan view showing a conventional composite component in addition to FIG.

[Description of Signs] 2, 7A, 7B, 12A, 12B, 32A to 32D, 4
2A, L ... Inductor, 3A, 3B, 6, 22A, 2
2B, 31A, 31B, 41A, 41B, 62, C ...
Capacitors, 11, 21, 31, 41 ... composite parts, 5
0: Shield case, 52: Chip parts

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Mitsuhiro Takayama 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Mutsushi Nakazawa 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Hitoshi Ebihara 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Kazuyuki Shibuya 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Co., Ltd.

Claims (8)

[Claims] 1. A composite component in which a plurality of inductors are integrated, wherein said inductors are arranged such that magnetic fluxes generated by adjacent inductors are substantially orthogonal to each other. 2. The composite part according to claim 1, wherein the inductor is formed by laminating predetermined members on which wiring patterns are printed, and sequentially connecting the wiring patterns. 3. A composite component in which a plurality of capacitors are integrated, wherein the capacitors are arranged such that a virtual plane parallel to a counter electrode of an adjacent capacitor is substantially orthogonal. 4. The capacitor according to claim 3, wherein a predetermined member on which a counter electrode is printed is laminated, and the respective counter electrodes are selectively connected.
A composite part according to item 1. 5. A composite component in which a plurality of inductors are integrated, wherein a magnetic shield member is disposed between adjacent inductors. 6. The composite component according to claim 5, wherein said inductor is formed by laminating predetermined members on which wiring patterns are printed, and sequentially connecting each wiring pattern. 7. A composite part in which a plurality of capacitors are integrated, wherein an electrostatic shield member is arranged between adjacent capacitors. 8. The capacitor according to claim 7, wherein a predetermined member on which a counter electrode is printed is laminated, and the respective counter electrodes are selectively connected.
A composite part according to item 1.