JPH1140221A - Connecting terminal for printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connecting terminal for a printed circuit board which can secure the sufficient strength of soldering, and improve the fixed connection state of the connecting terminal. SOLUTION: A connecting terminal 11 for a printed circuit board has soldering parts 12 which extend along the printed circuit board, and facingly connected and fixed on the surface of a land 6, as well as have a rectangular section. The soldering parts 12 are provided with solder pooling parts 16, which locally increase the soldering paste amount in the direction perpendicular to both sides 13 of the soldering part 12 or a plane 14 facing opposite the land. The solder pooling parts 16 are vertical grooves 16 that notch both sides 13 and cross the land 6. Also, the plural vertical grooves 16 are formed alternately on both sides 13 of the soldering part 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection terminal soldered on a printed circuit board.

[0002]

2. Description of the Related Art FIG. 11 shows a female connector provided with a printed circuit board connection terminal disclosed in Japanese Utility Model Laid-Open No. 1-164673. The connector 1 includes a plurality of male connection terminals for printed circuit boards (hereinafter simply referred to as connection terminals) 2.
And a concave connector housing 3 for accommodating the connection terminals 2. The connector housing 3 accommodates a plurality of connection terminals 2 in two rows so as to correspond to a mating male connector (not shown). ing.

Each connection terminal 2 has a soldered portion 4 whose end is led out from the bottom surface of the connector housing 3 and extends laterally.

The connector 1 is soldered on a printed circuit board 5 having a plurality of desired circuit patterns (not shown). Each circuit pattern (not shown) is formed by printing or the like. A plurality of lands 6 for connector connection are formed in a part of each circuit pattern, and a soldered portion 4 of each connection terminal 2 led out from the connector housing 3.
Is fixedly connected.

[0005] As shown in FIG.
A lower portion (land 6 side) is formed in a wedge shape narrower than both side surfaces 7, and has a tapered surface 8.

In connecting the connector 1 to the printed circuit board 5, as shown in FIG. 13, each soldered portion 4 is placed on a land 6 of the printed circuit board 5 after being positioned. Then, soldering is performed between the tapered surface 8 of the soldered portion 4 and the land 6 (see FIG. 14).

On the other hand, FIG. 15 shows another example of the above-mentioned soldered portion 4, and the soldered portion 4 'is formed in a U-shaped cross section so that the contact with the land 6 is in linear contact. ing.

[0008]

In the above-mentioned prior art, the shape of the soldering portions 4, 4 'is formed so as to be tapered with respect to the land 6, so that the soldering of the solder with the land 6 can be performed. The amount of glue is increased to improve the soldering strength.

However, if the width of the connection terminal 2 is reduced with the downsizing of the connector 1, it becomes very difficult to form the tapered surface 8 of the soldered portion 4. However, there is a problem that almost no taper is formed, or a portion of the soldered portion 4 which comes into contact with the land 6 becomes an edge to form a line contact, so that the fixed connection state of the soldered portion 4 becomes unstable. .

An object of the present invention is to provide a printed circuit board connection terminal capable of improving the connection fixed state of the connection terminal while securing sufficient soldering strength in order to solve the above problems. I do.

[0011]

According to a first aspect of the present invention, there is provided a printed circuit board connecting terminal extending along a printed circuit board and provided on the printed circuit board. In a connection terminal for a printed circuit board having a soldering portion having a rectangular cross-sectional shape which is connected and fixed to an upper surface of a land, the soldering portion is orthogonal to both side surfaces of the soldering portion or a land-facing surface. In this case, a solder reservoir for locally increasing the amount of solder applied is provided.

It is preferable that a longitudinal groove intersecting the land is formed by cutting out both side surfaces of the soldered portion as the solder reservoir.

Preferably, a plurality of the vertical grooves are formed alternately on both side surfaces of the soldered portion.

[0014] It is preferable that the solder reservoir is cut out so as to cross the land-facing surface of the soldered portion to form a transverse groove along the land.

[0015] It is preferable that a concave groove is formed along the land by cutting out a land facing surface of the soldered portion as the solder reservoir.

It is preferable that a slit-shaped long hole penetrating the land facing surface of the soldered portion and crossing the land is formed as the solder reservoir (claim 6).

According to a seventh aspect of the present invention, there is provided a printed circuit board connecting terminal extending along a printed circuit board and facing an upper surface of a land on the printed circuit board. A connection terminal for a printed circuit board having a soldered portion having a rectangular cross-sectional shape that is connected and fixed by the soldering portion, while holding the land-facing surface of the soldered portion on both sides of the soldered portion. Is formed to form a bent solder reservoir for locally increasing the amount of solder paste.

It is preferable that the bent solder reservoir is formed by bending the front and rear of the soldered portion into an L-shape, respectively.

It is preferable that the soldered portion is bent in an S-shape to form the bent solder reservoir (claim 9).

[0020]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view showing an embodiment of a connector having a printed circuit board connection terminal of the present invention, FIG. 2 is an enlarged perspective view of a soldered portion of the printed circuit board connection terminal of FIG. Is a sectional view taken along line AA of FIG.
FIG. 4 is an explanatory view of a state where the lands and the soldered portions on the printed circuit board of FIG. 3 are soldered. The same components as those of the conventional example are denoted by the same reference numerals, and detailed description is omitted.

In FIG. 1, reference numeral 11 denotes a female connector.
The connector 11 includes a plurality of male connection terminals (hereinafter simply referred to as connection terminals) 2 for a printed board made of a conductive metal, and a concave connector housing 3 made of synthetic resin for accommodating the connection terminals 2. Have. The end of each of the connection terminals 2 housed in the connector housing 3 in two rows has a rectangular cross-sectional shape that extends outward from the bottom surface of the connector housing 3 and extends along the printed circuit board 5. Is provided with a soldered portion 12 formed at the bottom.

The connector 11 is connected and fixed on a printed circuit board 5 having a plurality of desired circuit patterns (not shown). Part of each circuit pattern has a connector 1
Lands 6 for connection to 1 are formed corresponding to the number of connection terminals 2.

The above configuration is the same as that of the conventional example, but in the present invention, as shown in FIGS. 1 and 2, both sides 13 of the soldered portion 12 are formed by a press or soldering portion as a solder reservoir. A plurality of longitudinal grooves 16 are formed in a direction perpendicular to the both side surfaces 13 by cutting or the like, that is, cut in a bay shape from the land facing surface 14 to the upper surface 15. Flute 16
Are cut out in a U-shape in the present embodiment, and are provided alternately on the left and right sides on both side surfaces 13.

The connection of the connector 11 to the printed circuit board 5 will be described. As shown in FIG.
The soldered portions 12 of the connection terminals 2 are placed on the lands 6 of FIG. Next, soldering is performed along both side surfaces 13 (see FIG. 2) of the soldering portion 12 (see FIG. 4).

The plurality of vertical grooves 16 increase the surface area of the side surface 13 and the land 6 for soldering, and locally increase the amount of solder applied, so that sufficient soldering strength can be ensured. Further, since the soldered portion 12 has a rectangular cross-sectional shape, the land facing surface 1
4 comes into contact with the land 6 in a stable state.

The number of the vertical grooves 16 may be appropriately set in consideration of the length of the soldered portion 12 and the strength of soldering to the connector 11, and is not limited to the above number. On the other hand, the vertical groove 16 may be formed in a rectangular shape, a V shape, a tenon shape, or the like in addition to the U-shaped cutout. Also, the vertical groove 16 is notched deeper on the upper surface 15 side,
The groove may be slightly inclined.

FIG. 5 shows another embodiment of the soldered portion 12 shown in FIG. The soldered portion 17 is formed as a solder storage portion on the land facing surface 14 by pressing or cutting or the like so as to cross the land facing surface 14.
An inverted U-shaped transverse groove 18 projected toward 5 is formed along the land 6.

In connecting the connector 11 to the printed circuit board 5, the soldered portions 17 of the connection terminals 2 are mounted on the corresponding lands 6 of the printed circuit board 5. Then, when soldering is performed along the side surface 13 of the soldering portion 17, as shown in FIG. 6, the transverse groove 18 is filled with solder, and the amount of solder locally increases and the soldering amount increases. The strength is sufficiently secured. The number of the transverse grooves 18 may be set appropriately as in the case of the above-described vertical grooves 16, and the transverse grooves 18 may be formed in a rectangular or V-shape in addition to being punched or cut out in an inverted U shape. It may be formed. Further, since the soldered portion 17 has a rectangular cross-sectional shape, it comes into contact with the land 6 in a stable state as described above.

The soldered portion 19 of still another form shown in FIG. 7 has a slot-like elongated hole 20 which penetrates the land facing surface 14 and the upper surface 15 vertically and intersects the land 6 as a solder reservoir. Is formed. With this long hole 20,
As the surface area for soldering increases, the amount of solder applied can be locally increased, and the strength of soldering is sufficiently ensured. The soldering portion 19 is brought into contact with the land 6 in a stable state and soldered in the same manner as described above. Note that a plurality of through holes can be provided instead of the long holes 20.

FIG. 8 is a view showing another form of the soldered portion. In the soldered portion 21 of the present embodiment, a notched groove 22 is formed in the land facing surface 14 by punching, cutting, or the like as a solder reservoir. In this embodiment, the groove 22 is formed by stamping, and the groove 22 is filled with solder in advance, and the soldered portion 2 is formed.
At the time of soldering the land 1 and the land 6, the protrusion 23 of the upper surface 15 protruded and formed by punching the groove 22 is heated with a soldering iron (not shown) and soldered together with the both side surfaces 13 (FIG. 9). Land 6 with concave groove 22
Therefore, the connection of the connector 11 to the printed circuit board 5 can provide the same effect as that of the case of the above-described elongated hole 20 (see FIG. 7).

A soldering portion 24 of still another form shown in FIG. 10 is provided on both side surfaces 1 while holding the land facing surface 14.
3 are bent to form bent solder reservoirs 25, 25 where the amount of solder applied locally increases. In the figure, the middle of both side surfaces 13 is bent at a right angle twice, and the front and rear of the soldered portion 24 are formed in L-shape, respectively.
Bent solder reservoirs 25, 25 are provided. Since the land facing surface 14 is held by the soldering portion 24, the soldering portion 24 is stably contacted and fixed to the land 6, and the soldering strength can be sufficiently secured. In addition, separately from the above, the soldered part is bent and formed into an S-shape or a C-shape,
The same effect can be obtained by providing a bent solder reservoir.

[0032]

As described above, according to the first aspect of the present invention, the soldered portion of the folded terminal for a printed circuit board is formed in a direction perpendicular to both side surfaces of the soldered portion or the land-facing surface. By providing the solder reservoir for locally increasing the amount of solder, the soldered portion can be connected and fixed on the printed circuit board in a stable state, and sufficient soldering strength can be ensured.

According to the second aspect of the present invention, by forming a vertical groove intersecting the land by cutting out both side surfaces of the soldered portion as the solder storage portion, the land facing surface of the soldered portion is formed on each land. In this case, the soldering is performed in a stable state, and the amount of the solder is locally increased, so that the soldering strength can be sufficiently secured.

According to the third aspect of the present invention, the plurality of the vertical grooves of the second aspect are alternately formed on both side surfaces of the soldered portion, so that the land-facing surface is extremely narrow and comes into contact with the land. This has the effect of preventing a more stable connection.

According to the fourth aspect of the present invention, as the solder reservoir, a transverse groove is formed along the land by cutting out across the land-facing surface of the soldered portion. The effect is that the land-facing surface of the soldering portion contacts each land in a stable state and is soldered, and the amount of solder applied locally increases to ensure sufficient soldering strength. To play.

According to the fifth aspect of the present invention, each of the lands is formed as the solder reservoir by cutting out the land facing surface of the soldered portion and forming a concave groove along the land. There is an effect that soldering is performed while the land-facing surfaces of the soldering portions are in contact with each other in a stable state, and the amount of solder paste is locally increased to sufficiently secure the soldering strength.

According to the sixth aspect of the present invention, a slot having a slit shape penetrating the land facing surface of the soldered portion and intersecting the land is formed as the solder reservoir. In addition, the land-facing surface of the soldering portion contacts each land in a stable state and is soldered, and the amount of solder paste is locally increased to ensure sufficient soldering strength. It works.

According to the seventh aspect of the present invention, the soldered portion of the folded terminal for a printed circuit board is bent on both sides of the soldered portion while holding the land-facing surface of the soldered portion, and the amount of solder paste Is formed locally so that the soldered portion is connected and fixed on the printed circuit board in a stable state, and sufficient soldering strength can be secured.

According to the eighth aspect of the present invention, since the bent solder reservoir is formed by bending the front and rear of the soldered portion into an L shape, the land-facing surface of the soldered portion is stable on each land. In this state, the soldering is performed by contacting in a state where the soldering is performed, and the amount of the applied solder is locally increased, so that the effect of sufficiently securing the soldering can be obtained.

According to the ninth aspect of the present invention, the soldered portion is made of S
Since the bent solder reservoir is formed by bending in the shape of a letter, similarly to the invention of claim 8, soldering is performed by contacting the land-facing surface of the soldering portion on each land in a stable state. At the same time, there is an effect that the amount of solder paste is locally increased and sufficient soldering strength can be secured.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing an embodiment of a connector having a printed circuit board connection terminal of the present invention.

FIG. 2 is an enlarged perspective view of a soldered portion of the printed circuit board connection terminal of FIG. 1;

FIG. 3 is a sectional view taken along line AA of FIG. 1;

FIG. 4 is an explanatory view of a state where a land and a soldered portion on the printed circuit board of FIG. 3 are soldered.

FIG. 5 is an enlarged perspective view showing another embodiment of the soldered portion shown in FIG. 2;

FIG. 6 is an explanatory view of a state where a soldering portion and a land of FIG. 5 are soldered.

FIG. 7 is an enlarged perspective view showing still another embodiment of the soldered portion shown in FIG.

FIG. 8 is an enlarged perspective view showing another form of the soldered portion shown in FIG.

FIG. 9 is an explanatory view of a state where the soldering portion and the land of FIG. 8 are soldered.

FIG. 10 is an enlarged perspective view showing still another form of the soldered portion shown in FIG.

FIG. 11 is an external perspective view of a conventional connector having a printed circuit board connection terminal.

FIG. 12 is an enlarged perspective view of a soldered portion of the printed circuit board connection terminal of FIG. 11;

FIG. 13 is a sectional view taken along the line BB showing a state where the soldered portion of FIG. 11 is mounted on a printed circuit board.

FIG. 14 is an explanatory view of a state where the soldered portion and the land of FIG. 11 are soldered.

FIG. 15 is an enlarged perspective view showing another example of the soldered portion in FIG. 11;

[Explanation of symbols]

2 Connection terminal 3 Connector housing 5 Printed circuit board 6 Land 11 Connector 12, 17, 19, 21, 24 Soldering part 13 Side surface 14 Land facing surface 16 Vertical groove (Solder storage part) 18 Crossing groove (Solder storage part) 20 Slot (Solder reservoir) 22 Groove (Solder reservoir) 25 Bent solder reservoir

Claims (9)

[Claims] 1. A printed circuit board connection terminal having a soldered portion having a rectangular cross-sectional shape extending along a printed circuit board and connected and fixed to an upper surface of a land on the printed circuit board, wherein the solder is provided. A connection terminal for a printed circuit board, wherein a solder reservoir for locally increasing the amount of solder applied is provided in the attachment portion in a direction orthogonal to both side surfaces of the solder attachment portion or a land-facing surface. 2. A connection terminal for a printed circuit board according to claim 1, wherein a vertical groove intersecting with said land is formed by cutting out both side surfaces of said soldered portion as said solder reservoir. 3. The printed circuit board connection terminal according to claim 2, wherein a plurality of said vertical grooves are alternately formed on both side surfaces of said soldered portion. 4. The connection terminal for a printed circuit board according to claim 1, wherein the solder reservoir has a transverse groove formed along the land by cutting out across the land facing surface of the soldered portion. . 5. The printed circuit board connection terminal according to claim 1, wherein the solder reservoir has a groove formed along the land by notching a land-facing surface of the soldered portion. 6. The connection for a printed circuit board according to claim 1, wherein a slit-shaped long hole penetrating the land facing surface of the soldered portion and crossing the land is formed as the solder reservoir. Terminal. 7. A connection terminal for a printed circuit board having a soldered portion having a rectangular cross-sectional shape extending along the printed circuit board and connected and fixed to an upper surface of a land on the printed circuit board, wherein the solder is provided. The soldering portion is characterized in that a bent solder reservoir is formed which bends both side surfaces of the soldering portion while holding the land facing surface of the soldering portion and locally increases the amount of solder paste. Printed circuit board connection terminal. 8. The connection terminal for a printed circuit board according to claim 7, wherein the bent solder reservoir is formed by bending each of the front and rear of the soldered portion into an L shape. 9. The printed circuit board connection terminal according to claim 7, wherein the soldered portion is bent in an S-shape to form the bent solder reservoir.