JPH11352446A - Substrate combination instruction apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a yield and to shorten a production lead time by instructing a superposition apparatus in such a manner that the second substrate winning the highest point among the superposition scores determined by an arithmetic function is superposed on a prescribed first substrate. SOLUTION: The arithmetic function imparts the scores to the points where the position of the TFT substrate 11a of a non-defective article of the prescribed TFT substrates 11 and the position of a CF panel 12a of a non-defective article of the CF substrates 12 face each when the substrates are superposed for each of the respective combinations of the prescribed TFT substrates 11 and the plural CF substrates 12 in accordance with the position data stored in a data base apparatus 2. The total sum of these scores is determined as the superposition scores of the CF substrate 12 in this combination. The superposition apparatus 5 is so instructed as to execute the combination with the combination of the prescribed TFT substrate 11 and the CF substrate 12 winning the highest point among the superposition scores determined by this arithmetic function. Then, the superposition in the optimum combination is surely executed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate combination indicating device used in an overlapping step of overlapping substrates, and is used, for example, in an overlapping step of a transistor substrate and a color filter substrate in a process of assembling a liquid crystal display panel. The present invention relates to a board combination indicating device.

[0002]

2. Description of the Related Art Conventionally, a liquid crystal display panel (hereinafter, referred to as LCD) has a TFT in which a plurality of thin film transistor (hereinafter, referred to as TFT) panels are arranged and formed on a single glass substrate.
A substrate and a CF substrate in which a plurality of color filter (hereinafter referred to as CF) panels are arranged and formed on a single glass substrate in the same manner as a TFT panel are overlapped with the TFT panel and the CF panel facing each other. It is made by laminating. Therefore, as shown in FIG. 7, when the TFT substrate 11 and the CF substrate 12
If either the FT panel 11a or the CF panel 12a is defective, the LCD
10 always becomes defective.

A defective TFT panel or CF panel which is unavoidably formed in the manufacturing process cannot be removed in a unit of one panel because there is a possibility that the defective panel is formed on a single glass substrate simultaneously with a non-defective product. Therefore, the yield of the LCD greatly changes depending on the combination of the positions of defective products of the TFT panel and the CF panel and the superposition.

That is, as shown in FIG. 8, for example, a TFT substrate 11 having a yield of 50%, in which four TFT panels 11a are formed in an array and two of them are defective,
Like the panel 11a, four CF panels 12a are arrayed and formed, and two of them are defective.
% Of the first CF substrate 121 and the second CF substrate 122 are combined. TFT substrate 11
In the combination of the first CF substrate 12 and the first CF substrate 12, there is only one case where the position of the defective TFT panel 11a of the TFT substrate 11 and the position of the defective CF panel 12a of the first CF substrate 121 face each other when they are superposed. .

On the other hand, in the combination of the TFT substrate 11 and the second CF substrate 122, the TFT
Position of defective TFT panel 11a on substrate 11 and first CF
There are two cases where the position of the defective CF panel 12a of the substrate 121 is opposed. As a result, the TFT substrate 11 and the first
In superposition by combination with the CF substrate 121, L
Although the CD yield is 25%, the TFT substrate 11 and the second
In the superposition by the combination with the CF substrate 122, L
The yield of CD becomes 50%.

Therefore, the TFT panels and CF panels of non-defective products should be opposed to each other as much as possible, and the TFT panels of defective products should be
By combining a TFT substrate and a CF substrate so that the panel and the CF panel can be opposed to each other, the yield can be greatly improved.

[0007]

However, in the prior art, since the combination of the TFT substrate and the CF substrate in the overlaying step is often determined by the judgment of the operator, human error tends to occur. There is a problem that they are not always overlapped in an optimal combination. In addition, even if the superimposition is performed in the optimal combination, it takes time to reach the superimposition due to the work by humans, which causes a problem that the production lead time is extended. .

[0008]

In order to solve the above-mentioned problems, a first aspect of the present invention is directed to a first substrate having a plurality of panels arranged on one surface and a plurality of panels disposed on one surface.
An inspection device for inspecting whether each panel of the second substrate arranged and formed in the same manner as the panel is a non-defective product or a defective product, and superimposing the first substrate and the second substrate inspected by the inspection device on each panel. Is a board combination instructing device connected to a superposing device in which the first and second substrates are opposed to each other, based on inspection results sent from the inspection device. Storage means for storing position data with respect to the panel position, and, based on the position data stored in the storage means, for each combination of a predetermined first substrate and a plurality of second substrates, A calculation function for giving a score to a position where the non-defective panel position on the predetermined first substrate and the non-defective panel position on the second substrate oppose each other, and calculating the sum of the points as the superimposition score of the second substrate; Indicating means for instructing the superposing apparatus to superimpose the second substrate having the highest score among the superimposition points obtained by the function on the predetermined first substrate. It has a configuration.

In the above invention, first, when the inspection result is sent from the inspection device, the storage means stores, based on the inspection result, the position data of the non-defective panel position and the defective panel position for each of the first and second substrates. Is stored. Then, the arithmetic function of the instruction means is based on the position data stored in the storage means, and for each combination of the predetermined first substrate and each of the plurality of second substrates, a predetermined first A score is given to a position where the non-defective panel position on the substrate and the non-defective panel position on the second substrate oppose each other, and the sum of the scores is determined as the superimposition score of the second substrate. For this reason,
In a plurality of combinations of the predetermined first substrate and the second substrate, the higher the rate at which non-defective panels face each other, the higher the number of overlapping points is obtained, and the optimum combination is scored. .

The instruction function of the instruction means instructs the superposition apparatus to superimpose the second substrate having the highest score on the predetermined first substrate by comparing the superimposition points obtained by the arithmetic function. Therefore, the optimum second substrate is always objectively searched for and instructed. Therefore, in the superposing apparatus, the superimposition in the optimum combination in which the non-defective panels face each other with the highest ratio is reliably performed.

According to a third aspect of the present invention, there is provided a board combination indicating apparatus connected to an inspection apparatus and a superposing apparatus, similarly to the first aspect of the present invention. A plurality of the first substrates are defined as one unit, and based on the position data stored in the storage means, the combination of each first substrate and each of the plurality of second substrates in the unit, A score is given to a location where the non-defective panel position on one substrate and the non-defective panel position on the second substrate oppose each other, the sum of the scores is obtained as a superimposed score, and each of the first and second substrates in the unit is determined. Calculation function for summing the superimposition points of the second substrate in each combination in the combination pattern for each combination pattern, and obtaining the highest score among the total superimposition points obtained by the calculation function And the second substrate in each combination of the combination in the pattern has a configuration which includes an instruction unit having an instruction function for instructing the superimposition unit to superimpose the first substrate in combination therewith.

In the above invention, the operation function of the instruction means is
For each combination of each first substrate and each of the plurality of second substrates in the unit, the number of points given by the non-defective panel position on the first substrate and the non-defective panel position on the second substrate when superimposed on each other Since the sum is obtained as the number of superimposition points of the second substrate, in a plurality of combinations of the first substrate and the second substrate in the unit, the higher the ratio of non-defective panels facing each other, the higher the number of superimposition points. Will be obtained.

Further, since the arithmetic function sums the number of superimposed points of the second substrate in each combination in the combination pattern for each combination pattern of the first substrate and the second substrate in the unit, The higher the combination pattern in which non-defective panels face each other, the higher the total number of overlapping points is obtained,
The optimal combination pattern is scored.

The instruction function compares the total number of superimposition points obtained by the calculation function with each other, and compares the second substrate in each combination in the combination pattern with the highest score with the first substrate combined therewith. Since the superposition apparatus is instructed to superimpose, the second substrate in each combination within the optimal combination pattern is always objectively searched for and instructed. Therefore,
In the superposing apparatus, the first substrate and the second substrate in the unit are reliably superimposed with an optimal combination pattern in which non-defective panels face each other with the highest ratio.

According to a fifth aspect of the present invention, in addition to the inspection device and the overlaying device similar to the first aspect of the present invention, the second substrate is sequentially arranged from the inspection device to the first substrate disposed in the overlaying device. A board combination instructing device connected to an assembly system including a flowing line, wherein a predetermined first board is provided based on storage means similar to the invention of claim 1 and position data stored in the storage means. Score given only when the non-defective panel position on the predetermined first substrate and the non-defective panel position on the second substrate oppose each other when superimposed on each combination of the second substrate and the plurality of second substrates on the line Is determined as the number of superimposition points of the second substrate, and the weighting points that increase in order from the upstream side to the downstream side of the line are determined according to the position of the second substrate on the line in the combination. And the second substrate having the highest score among the new superimposition points obtained by the operation function is determined by multiplying each of the superimposed points by a predetermined number of times. And an instructing means having an instructing function for instructing the superimposing apparatus to superimpose on one substrate.

In the above invention, the operation function of the instruction means is:
For each combination of the predetermined first substrate and each of the plurality of second substrates on the line, when superimposed, the non-defective panel position on the predetermined first substrate and the non-defective panel position on the second substrate face each other. The total sum of the points given only when the superimposition is performed is obtained as the superimposed points of the second substrate. For this reason, in the combination of the predetermined first substrate and each of the plurality of second substrates on the line, the higher the rate at which non-defective panels face each other, the higher the number of overlapping points is obtained, and the optimal combination is obtained. Will be scored.

Further, the arithmetic function multiplies each of the obtained superimposition points by a weighting point that increases in order from the upstream side to the downstream side of the line according to the position on the line of the second substrate in the combination, and newly obtains a new value. In order to obtain a high number of superimposition points, the higher the rate at which non-defective panels face each other, and the higher the new number of superimposition points is obtained on the downstream side of the line, that is, the earlier the second board is put into the assembly system. become.

The instruction function instructs the superposing apparatus to superimpose the second substrate having the highest score on the predetermined first substrate by comparing the new number of superimposition points. The optimum second substrate is objectively searched for and instructed in consideration of the use of the second substrate, which is input earlier. Therefore, in the superposing apparatus, taking into account the use of the second substrate, which has been put into the assembling system earlier, the superimposition can be reliably performed in a high combination in which the non-defective panels face each other at an optimal ratio. Will be

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a board combination instruction apparatus according to the present invention will be described with reference to the drawings. FIG.
FIGS. 2A and 2B are diagrams for explaining the board combination instruction device according to the first embodiment, in which FIG. 1A is a block diagram of a schematic configuration in a state of being connected to an LCD assembly system, and FIG. FIG. 4 is a view showing a state of the substrate.

As shown in FIG. 1, a substrate combination instructing apparatus 1 according to the first embodiment includes a TF for forming an LCD 10.
A device 5 for superimposing a T substrate 11 and a CF substrate 12;
Each TFT panel 1 arranged and formed on the upper surface of the FT substrate 11
1a and a CF panel 12a arrayed on the upper surface of the CF substrate 12 are used in an assembling system including an inspection device 4 for inspecting whether they are non-defective products or defective products, and a display device 6, respectively. The superposing device 5, the inspection device 4, and the display device 6 are connected to each other via a network 7.

Here, in the assembling system, a line (not shown) is provided between the inspection device 4 and the overlaying device 5, and the TFT that has undergone the inspection process in the inspection device 4 is provided.
The substrate 11 and the CF substrate 12 flow toward the superposing apparatus 5 while being subjected to a predetermined processing. That is, the inspection device 4 is arranged on the upstream side of the line, and the overlay device 5 is arranged on the downstream side. In the overlay device 5, the TFT substrate 11 and the CF substrate 12 inspected by the inspection device 4 are overlaid. Has been done.

In the present embodiment, the space between the inspection device 4 and the overlay device 5 is referred to as a line including various processing devices for performing the predetermined processing. Also T
The FT substrate 11 is a first substrate of the present invention, and the CF substrate 12 is a second substrate of the present invention. Each CF panel 12a of the CF substrate 12 is
They are arranged and formed in the same manner as the FT panel 11a. In FIG. 2, for example, both the TFT substrate 11 and the CF substrate 12 have four TFT panels 11a,
Indicates a state in which an array is formed.

The board combination instructing device 1 connected to each of the superposing device 5, the inspection device 4, and the display device 6 includes a database device 2 serving as storage means,
Instructing means 3 is provided.

The database device 2 stores the inspection results (hereinafter referred to as inspection data) obtained by the inspection device 4 and the TFT substrates 11 and the CF substrates 12 based on the inspection data.
Each good TFT panel 11a position, CF panel 12a
The position data and the position data of the defective TFT panel 11a position and the CF panel 12a position are stored. Further, it stores the number of superimposed points of the CF substrate 12 for each combination of the TFT substrate 11 and the CF substrate 12, which will be described later. Such a database device 2 is, for example, a RAM (Randam Access Memor
y) and a storage medium such as a floppy disk, a porcelain disk, or an optical disk.

As shown in FIG. 2, the instruction means 3 is provided with an arithmetic function 3a and an instruction function 3b, and the combination of the TFT substrate 11 and the CF substrate 12 is optimized in terms of yield. In this way, calculations and instructions are performed. For example, it is composed of a personal computer, a workstation, or the like.

The arithmetic function 3a is based on the position data stored in the database device 2, and for each combination of the predetermined TFT substrate 11 and the plurality of CF substrates 12, the predetermined TFT substrate 11 This is a function of giving a point to a position where the position of the non-defective TFT panel 11a in 11 and the position of the non-defective CF panel 12a in the CF substrate 12 are opposed, and calculating the sum of the points as the number of superimposed points of the CF substrate 12 in this combination.

The indicating function 3b is provided by a superposition apparatus for performing superposition using a combination of a predetermined TFT substrate 11 and a CF substrate 12 having the highest score among the superposition points obtained by the arithmetic function 3a. 5 is provided. As described above, the board combination instructing apparatus 1 configured as described above is connected to the inspection apparatus 4, the overlaying apparatus 5, and the display apparatus 6 via the network 7, and exchanges data with them. Is available.

Next, the operation of the board combination apparatus 1 will be described. First, when inspection data of the TFT panel 11a of the TFT substrate 11 and the inspection data of the CF panel 12a of the CF substrate 12 are sent from the inspection device 4 to the database device 2 via the network 7, the database device 2 is sent. Stores inspection data. At the same time, based on the received inspection data, position data indicating which positions of the TFT panel 11a and the CF panel 12a are non-defective or defective are stored for each TFT substrate 11 and each CF substrate 12.

Next, when processing proceeds on the line and the TFT substrate 11 arrives at the overlay device 5, the indicating means 3 removes all of the CF substrates 12 on the line from the inspection device 4 to the overlay device 5. In other words, all of the CF substrates 12 in process from the inspection process to the overlaying process are CFs which are optimally combined with the TFT substrate 11 reaching the overlaying device 5 as an object to be overlayed.
The substrate 12 is searched, and an instruction is issued to the superposing apparatus 5.

That is, the arithmetic means 3a of the instruction means 3
As shown in the flowchart of FIG. 3, first, in step (hereinafter, referred to as ST) 1, the TF to be superimposed is
The T substrate 11 (hereinafter, referred to as a predetermined TFT substrate 11) is determined. Then, the position data of the non-defective product and the defective product of the TFT panel 11 a on the TFT substrate 11 is extracted from the database device 2.

Next, the arithmetic means 3a checks the in-process of the CF substrate 12 which can be combined with the predetermined TFT substrate 11 (ST2). In-process CF substrate 12
If there is no, go to ST5. If there is a CF substrate 12 in progress, the process proceeds to ST3, and for all the CF substrates 12 in progress, it is determined whether or not the number of overlapping points of the CF substrate 12 assuming a combination with a predetermined TFT substrate 11 has been determined. To check.

In the state where the number of superimposition points is not determined at all in the first stage, the arithmetic function 3a must determine the number of superposition points when all the CF substrates 12 in process are combined with the predetermined TFT substrate 11. Then, the process proceeds to ST4 to perform an operation for obtaining the number of superimposition points.

Specifically, in ST4, the arithmetic function 3a
First, the position data of the non-defective product and the non-defective product of the CF panel 12a for obtaining the number of superposition points when combined with the predetermined TFT substrate 11 are taken out from the database device 2.

Next, as shown in FIG.
Non-defective TFT panel 11a on a given TFT substrate 11 based on position data indicating the actual state of the TFT substrate 11 and the CF substrate 12.
Non-defective CF panel 12 in position and CF substrate 12
The same number of points, one point in this case, is given to the position a. On the other hand, the position of the defective TFT panel 12 a on the predetermined TFT substrate 11 and the position of the defective CF
The position of the panel 12b is set to 0 point. By this scoring, 1 or O is added to all positions of each TFT panel 11a of the TFT substrate 11 and positions of each CF panel 12a of the CF substrate 12.

Next, the TFs facing each other when superposed
The points at the T panel 11a position and the CF panel 12a position are integrated, that is, the points at the same position of the TFT panel 11a and the CF panel 12a are integrated, and the sum of the integrated results is compared with the predetermined TFT substrate 11. The number of superimposed points of the combined CF substrate 12 is obtained.

In other words, when superposed TFTs are good
A point is given to a position where the position of the panel 11a and the position of the non-defective CF panel 12a face each other, and the total of the points is obtained as the number of superimposed points of the CF substrate 12 combined with the predetermined TFT substrate 11. Therefore, in a plurality of combinations of the predetermined TFT substrate 11 and the CF substrate 12, the higher the ratio of the non-defective TFT panel 11a and the non-defective CF panel 12 facing each other, the higher the number of overlapping points can be obtained. . Then, the arithmetic means 3a records information on the obtained score of the superimposition in the database device 2.

Then, the operation function 3a returns to ST3, and checks whether or not the number of superimposition points when all the CF substrates 12 being processed are combined with a predetermined TFT substrate 11 has been obtained. If it is determined that the number of superimposition points has not been obtained for all CF substrates 12 being processed, the process proceeds to ST4, and the calculation for obtaining the number of superimposition points and recording of the obtained number of superimposition points are performed as described above. In this way, for all the CF substrates 12, the number of superimposition points is determined for each combination with the predetermined TFT substrate 11, and the number of superimposition points is recorded for each CF substrate 12.

On the other hand, if it is determined in ST3 that the superimposition points have been obtained for all the CF substrates 12 in process, the arithmetic function 3a proceeds to ST5. Then, the number of superimposition points recorded for each CF substrate 12 is read out from the database device 2, and the CF substrate 12 having the highest number of superimposition points is combined with a predetermined TFT substrate 11 to be an optimal substrate in terms of yield. Then, the controller 5 instructs the superposing device 5 to superpose the CF substrate 12 on a predetermined TFT substrate 11. The instruction function 3b also causes the display device 6 (see FIG. 1) to display the optimal CF substrate 12, and indicates the CF substrate 12 to an on-site staff such as an operator.

If it is determined in ST2 that there is no CF substrate 12 in process and the process proceeds to ST5, it is determined that there is no CF substrate 12 having the highest number of superimposition points, and an instruction to that effect is given by the superposition device 5. Will be sent to

As described above, in the board combination instructing apparatus 1 of the first embodiment, the arithmetic function 3a of the instructing means 3 is a combination of a predetermined TFT substrate 11 and a certain limited number of CF substrates 12 in combination with each CF substrate 12. For each time, the higher the rate at which the non-defective TFT panel 11a and the non-defective CF panel 12 face each other, the higher the number of superimposed points that can be obtained is higher. It will be scored.

The indicating function 3b of the indicating means 3 finds the optimum CF substrate 12 having the highest score by comparing the number of overlapping points, and instructs the overlapping device 5 to overlap with the predetermined TFT substrate 11. Therefore, the optimum CF substrate 12 is always objectively searched for and instructed. Therefore, it is possible to reliably perform the superimposition in the optimal combination in which the ratio of the non-defective TFT panel 11a and the CF panel 12a facing each other is the highest in the superposition apparatus 5. Therefore, the production yield of the LCD 10 as a final product can be reliably improved. In addition, since the CF substrate 12 to be the optimum combination can be determined in a very short time without human intervention, the production lead time can be reduced.

Next, a board combination instructing apparatus according to a second embodiment of the present invention will be described. The difference between the substrate combination instructing device of the second embodiment and the substrate combination instructing device 1 of the first embodiment is that a plurality (for example, 20) of the TFT substrates 11 is one unit (one lot), and This is to instruct the superposition device 5 to search for each combination in the optimum combination pattern and to superimpose each combination.

Such a board combination instructing apparatus 1 comprises:
Since the operation function 3a and the instruction function 3b in the instruction device 3 of the first embodiment are slightly different from each other except for the functions slightly different from those of the first embodiment, the schematic configuration is shown in FIG. Will be described.

That is, the calculation function 3a of the instruction function 3 in the second embodiment is based on the position data stored in the database device 2 and each TFT substrate 11 in the unit.
And each of the plurality of CF substrates 12,
Good TF on TFT substrate 11 when superimposed
Good CF in T panel 11a position and CF substrate 12
A function is provided in which a point is given to a position facing the position of the panel 12a, and the sum of the points is obtained as a superimposed point. Further, the calculation function 3a of the second embodiment is a function of performing, for each combination pattern of the TFT substrate 11 and the CF substrate 12 in the unit, the calculation of summing the number of superimposed points of the CF substrate 12 in each combination in the combination pattern. It has what has.

For example, as shown in the explanatory diagram of FIG.
If one unit is constituted by three TFT substrates 11 of T2 and T3, and the CF substrates 12 mounted on the line of the combination system are three substrates of C1, C2 and C3, the calculating means 3a First, a combination pattern of each of the TFT substrates 11 of T1, T2, and T3 in the unit and each of the CF substrates 12 of C1, C2, and C3 (-in FIG. 5).
For each combination in ()), the number of superimposition points is determined in the same manner as in the first embodiment. Then, the calculating means 3a
Information on the obtained superimposition score is temporarily recorded in the database device 2.

In addition, as shown in FIGS. 5A to 5C, in the combination pattern, the CF substrate 12 combined with one TFT substrate 11 cannot be combined with the other two TFT substrates 11, and the remaining CF substrate 12 is not combined. The other two T
It will be combined with the FT substrate 11.

Next, the arithmetic function 3a reads the number of superimposition points of the CF substrate 12 in each combination in the combination pattern from the database device 2 for each of the combination patterns of and obtains the total number of superimposition points. Information on the sum of the obtained overlay scores is
Are recorded in the database device 2 for each combination pattern of.

The indicating function 3b in the second embodiment
Reads out the total number of superimposition points recorded in combination pattern units from the database device 2 and sets the combination pattern having the highest score among the total superimposition points as the optimal combination pattern. CF substrate 12 in each combination
Is superposed on the TFT substrate 11 combined therewith. In the combination patterns (1) to (5) in FIG. 5, since the and are the combination patterns having the highest score among the total number of superimposition points, the superimposition device 5 is instructed to perform the superimposition using any one of the combination patterns. I do.

The instruction function 3b also causes the display device 6 (see FIG. 1) to display the optimum combination pattern and the CF substrate 12 in each combination in the optimum combination pattern, etc., and show them to the on-site staff such as an operator. .

As described above, in the board combination instructing apparatus 1 of the second embodiment, the arithmetic function 3a of the instructing means 3 is executed by each TFT substrate 11 in the unit and each of the CF substrates 12 of a limited group of CF substrates 12. For each combination in the combination pattern (〜 in FIG. 5), the higher the score at which the non-defective TFT panel 11a and the non-defective CF panel 12 face each other, the higher the score is obtained. Therefore, the optimal combination is scored as the number of superimposed points.

Furthermore, the arithmetic function 3a sums the superimposition points of each combination in the combination pattern for each combination pattern to obtain the total superimposition points.
The higher the combination pattern in which the 1a and the CF panel 12a face each other, the higher the total number of overlapping points is obtained, and the optimum combination pattern is scored.

The indicating function 3b of the indicating means 3 is used to compare the total number of superimposed points with each other to determine the CF substrate 12 in each combination of the combination patterns having the highest score.
Is instructed to overlap the TFT substrate 11 combined therewith, so that the CF substrate 1 in each combination of the optimal combination pattern is always
2 will be objectively searched and directed.

Therefore, in the superposition device 5, the T
The FT panel 11a and the CF panel 12a have the highest rate of facing each other, and can be reliably overlapped in an optimal combination pattern. Therefore,
The production yield of the LCD 10 as the final product can be reliably improved. In addition, it is possible to perform superposition in an optimal combination pattern without intervention of human judgment.
Since the F substrate 12 can be determined in a very short time, the production lead time can be shortened.

Incidentally, in the board combination instructing device 1 of the first and second embodiments, the inspection device 4, the overlay device 5, the display device 6, and the inspection device 4 are provided between the overlay device 5 and the overlay device 5. In an assembly system equipped with a line, etc., the T
The optimum combination with the FT substrate 11 is selected. Normally, in an assembly line, the CF substrates 12 mounted on the downstream side of the line are arranged in order from the CF substrate 12 toward the upstream side.
Is preferably used. Therefore, it is necessary to use the CF substrate 12 that has been put into the assembly system earlier as much as possible.

Therefore, a description will be given below of a board combination instructing apparatus according to a third embodiment of the present invention, which also takes into account the preferential use of the CF board 12 which is put into the assembly system earlier.

Substrate combination instruction device 1 of the third embodiment
The configuration of the pointing device 3 of the first embodiment is the same as that of the first embodiment except that the functions of the calculation function 3a and the pointing function 3b are slightly different. That is,
As in the first embodiment, the arithmetic function 3a according to this embodiment performs, for each combination of a predetermined TFT substrate 11 and a plurality of CF substrates 12, based on the position data stored in the database device 2, A point is given to a position where the position of the non-defective TFT panel 11a on the TFT substrate 11 and the position of the non-defective CF panel 12a on the CF substrate 12 are opposed to each other, and the sum of the points is obtained as the superimposed point. ing.

Further, the arithmetic function 3a of this embodiment calculates a weighting point which increases in order from the upstream side to the downstream side of the line according to the position on the line of the CF substrate 12 in the combination, and calculates the weighting point number of the overlapping point number previously obtained. This has a function of obtaining a new superimposition point by multiplying each of them.

For example, the arithmetic function 3a calculates the number of superimposed points of the CF substrate 12 in each combination as in the first embodiment, and temporarily records the number in the database device 2. Next, as shown in the explanatory diagram of FIG. 6, the CF substrate 12 located on the most upstream side of the line among the CF substrates 12 mounted on the line after the inspection process and before entering the overlapping process.
The number of superimposition points on the substrate 12 is read from the database device 2, and the number of superimposition points is multiplied by the smallest weighting point (1) to obtain a new number of superimposition points. Then, the new superimposition point is recorded in the database device 2.

Similarly, a new superimposition point is obtained by multiplying the superimposition point number of the CF substrate 12 located secondly upstream of the line by a weighting point number (2) greater than 1 and recording it. Third, a new superimposition point is obtained by multiplying the superimposition point of the CF substrate 12 located on the upstream side of the line by an even larger weighting point (3) and recording it. Then, a new superimposition point is obtained by multiplying the superimposition point of the CF substrate 12 located on the most downstream side of the line by the largest weighting point (4), and then recording.

Therefore, as shown in FIG. 6, regardless of which CF substrate 12 has the same weighting score, the higher the CF substrate 12 on the downstream side of the line, the earlier the new system is put into the assembly system. The matching score will be obtained.

The instruction function 3b in the third embodiment
Reads a new number of superimposition points recorded in units of CF substrates 12 from the database device 2 and superimposes the CF substrate 12 with the highest score among the superimposition points on a predetermined TFT substrate 11 as an optimal substrate. To the superposition device 5. 4 on the line in Fig. 6
In the two CF substrates 12, the most downstream CF substrate 12 of the line that is put into the assembly system at the earliest is the substrate with the highest point. It instructs the superposition device 5 to perform the superposition. The instruction function 3b also causes the display device 6 (see FIG. 1) to display an optimal CF substrate 12 or the like, and indicates the same to a site staff such as an operator.

As described above, in the board combination apparatus 1 according to the third embodiment, the arithmetic function 3 a
A non-defective TFT panel is obtained by multiplying each of the obtained superimposition points by a weighting point that increases in order from the upstream side to the downstream side of the line depending on the position on the line of the substrate 12 to obtain a new superimposition point. The ratio of the 11a and the CF panel 12a facing each other is high, and the timing at which the CF panel 12a is introduced into the assembly system is reflected, and a higher number of new overlapping points can be obtained for the CF substrate 12 on the downstream side of the earlier line. become.

The pointing function 3b compares the new number of superimposition points with the CF substrate 12 having the highest score.
And instructs the superposition device 5 to superimpose it on the predetermined TFT substrate 11, so that the optimal CF substrate 12 is always considered in consideration of the use of the CF substrate 12 which is put into the assembly system earlier. They will be searched objectively and directed. Therefore, in the superposition apparatus 5, a non-defective TFT is used in consideration of the use from the CF substrate 12 which is put into the assembly system earlier.
It is possible to ensure that the panel 11a and the panel plate face each other with the highest ratio, that is, in an optimal combination.

In this embodiment, the case where the device of the present invention is used for the step of superposing the TFT substrate and the CF substrate in the LCD manufacturing process has been described. It goes without saying that the device of the present invention can also be applied.

[0065]

As described above, according to the board combination instructing device of the present invention, the optimal function of the combination is superimposed for each predetermined combination of the first board and the second board by the calculating function of the indicating means. The number of matching points is converted into a score, and the second board having the highest number of superimposed points is found and indicated by the indicating function of the indicating means, so that the optimum second board is always objectively searched for. Therefore, it is possible to surely perform the superposition in the optimum combination by the superposition device. Therefore, the production yield of the stacked products can be reliably improved. In addition, since the second substrate to be the optimum combination can be determined in a very short time without human intervention, the production lead time can be reduced.

Further, the plurality of first substrates are regarded as one unit, and the arithmetic function is used to determine the total number of superimposed points of the second substrate for each combination pattern of the first substrate and the second substrate in one unit. In the configuration in which the total number of superimposition points of the highest points is obtained by the instruction function, the superposition is instructed for each combination in the combination pattern, so that the superposition in the optimal combination pattern is always performed reliably. Can be.

Further, the arithmetic function multiplies the number of superimposition points of the second substrate for each combination by the weighting point according to the position on the line of the second substrate to obtain a new number of superposition points. In the configuration in which the superimposition is instructed by the combination in which the new number of superimposition points is obtained, the superposition in the optimal combination is performed in consideration of the use of the second substrate, which is introduced into the assembly system earlier. Can be performed reliably.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams for explaining a board combination instruction apparatus according to a first embodiment of the present invention, wherein FIG. 1A is a block diagram of a schematic configuration in a state where the apparatus is connected to an LCD assembly system; FIG. 3 is a diagram showing a state of a substrate in each device in the assembly system.

FIG. 2 is an explanatory diagram illustrating a schematic configuration of a main part of the first embodiment.

FIG. 3 is a flowchart illustrating an operation of an instruction unit according to the first embodiment.

FIG. 4 is a diagram illustrating a calculation function of an instruction unit according to the first embodiment.

FIG. 5 is a diagram illustrating a calculation function of an instruction unit according to a second embodiment.

FIG. 6 is a diagram illustrating a calculation function of an instruction unit according to a third embodiment.

FIG. 7 is a diagram illustrating a process of superposing a TFT substrate and a CF substrate in a conventional LCD manufacturing process.

FIG. 8 is a diagram showing an example in which the combination of a TFT substrate and a CF substrate affects the yield.

[Explanation of symbols]

1 ... board combination indicating device, 2 ... database device,
3 ... instruction means, 3a ... calculation function, 3b ... instruction function, 4 ...
Inspection device, 5: Overlay device, 10: LCD, 11 ...
TFT substrate, 11a ... TFT panel, 12 ... CF substrate,
12a ... CF panel

Claims (6)

[Claims] A first substrate having a plurality of panels arranged on one surface and a second substrate having a plurality of panels arranged on the same surface as the first panel are non-defective or defective. A substrate combination detection device connected to an inspection device that inspects the first substrate and a superposition device that superposes the first substrate and the second substrate inspected by the inspection device with the panels facing each other. A storage unit configured to store position data of a non-defective panel position and a defective panel position for each of the first substrate and the second substrate based on the inspection result sent from the inspection device; For each combination of the predetermined first substrate and each of the plurality of second substrates based on the position data, the non-defective panel position on the predetermined first substrate and the non-defective panel position on the second substrate when they are superimposed. But A calculation function of giving a score to a position to be performed and calculating the sum of the scores as a superimposition score of the second substrate; and a second substrate having the highest score among the superimposition scores obtained by the calculation function. An instruction means for instructing the superimposing device to superimpose on a predetermined first substrate. 2. The non-defective panel position on the predetermined first substrate and the second substrate on the basis of the position data for each combination of the predetermined first substrate and the plurality of second substrates based on the position data. The same points are given to the non-defective panel positions in the above, and the defective panel position on the predetermined first substrate and the defective panel panel position on the second substrate are each set to 0 point. 3. The board combination instructing apparatus according to claim 2, wherein the number of points is integrated, and a total sum of the integrated results is obtained as the number of superimposed points. 3. A non-defective or defective product including a first substrate having a plurality of panels arranged on one surface and a second substrate having a plurality of panels arranged on the same surface as the first panel. A board combination instructing device connected to an inspection device for inspecting the first substrate and a superposition device for superimposing the first substrate and the second substrate inspected by the inspection device with the panels facing each other. A storage unit configured to store position data of a non-defective panel position and a defective panel position for each first substrate and each second substrate based on the inspection result sent from the inspection device; One unit, based on the position data stored in the storage unit, each first unit in the unit
For each combination of the substrate and each of the plurality of second substrates,
A point is given to a position where the non-defective panel position on the first substrate and the non-defective panel position on the second substrate oppose each other, and the sum of the points is determined as the superimposition point of the second substrate. Each of the first substrate and the second
An arithmetic function for summing the number of superimposition points of the second substrate in each combination in the combination pattern for each combination pattern with the substrate, and the highest score among the sum of the superimposition points obtained by the arithmetic function was obtained. Instruction means for instructing the superimposing device to superimpose the second substrate in each combination in the combination pattern on the first substrate in each combination, the substrate combination instruction being provided. apparatus. 4. The non-defective panel position on the first substrate and the second substrate for each combination of each first substrate and each of the plurality of second substrates in the unit based on the position data. The same point is given to each non-defective panel position, and the panel position of the defective panel on the first substrate and the panel position of the defective panel on the second substrate are each set to 0 point. 4. The board combination instruction apparatus according to claim 3, wherein the sum of the integration results is obtained as the number of superimposition points. 5. A non-defective or defective panel including a first substrate having a plurality of panels arranged on one surface and a second substrate having a plurality of panels arranged on the same surface as the first panel. An inspection apparatus for inspecting the first substrate and the second substrate inspected by the inspection apparatus in a state where the panels are opposed to each other; A board combination instruction device connected between the inspection device and an assembly system including a line for sequentially flowing a second substrate from the inspection device to the first substrate disposed in the overlaying device; A storage unit for storing position data of a non-defective panel position and a defective panel position for each of the first substrate and the second substrate based on the inspection result sent from the inspection unit; Based ,
For each combination of the predetermined first substrate and each of the plurality of second substrates on the line, when superimposed, the non-defective panel position on the predetermined first substrate and the non-defective panel position on the second substrate are determined. Scores are given to the opposing portions, and the sum of the scores is obtained as the superimposition score of the second substrate,
Furthermore, a calculation is performed by multiplying each of the obtained superimposition points by a weighting point that increases in order from the upstream side to the downstream side of the line according to the position of the second substrate on the line to obtain a new superimposition point number. Function, and an instruction function for instructing the superimposing device to superimpose the second substrate having the highest score among the new superimposition points obtained by the arithmetic function with the predetermined first substrate. And a pointing means having the same. 6. The arithmetic function according to the position data, for each combination of a predetermined first substrate and each of a plurality of second substrates between the line and the overlaying device, The same point is given to the non-defective panel position on the first substrate and the non-defective panel position on the second substrate, and the defective panel position on the predetermined first substrate and the defective panel position on the second substrate are set to 0, respectively. 6. The board combination instruction apparatus according to claim 5, wherein the points are set, and the points of the panel positions facing each other when they are overlapped are integrated, and the sum of the integrated results is obtained as the overlap points.