JPH1134557A - Production of ic module, and apparatus for producing ic module assembly used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce an IC module of prescribed structure equipped with a protective member for protecting an IC chip efficiently and appropriately by simple equipment and to reduce its production costs. SOLUTION: A method for producing an IC module has the first process for producing an IC module assembly A' in which IC modules are connected and the second process in which the IC module assembly A' is divided into individual IC modules. The first process includes a process in which the first hoop members 1' as a hoop-shaped substrate on which IC chips 2 are mounted at prescribed intervals are transferred through a prescribed transfer route, a process in which the second hoop members 40' in which through holes 5' are formed at prescribed intervals are supplied to the transfer route of the first hoop members 1', the second hoop members 40' are laid continuously on a hoop-shaped substrate to overlap each other to arrange each IC chip 2 in each through hole 5', and the second hoop members 40' are glued together, and a process in which the third hoop members 41' are arranged continuously to overlap with the second hoop members to close the one end opening each through hole 5' of the second hoop members.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for efficiently manufacturing an IC module suitable for use in an IC card.

[0002]

2. Description of the Related Art As is well known, in recent years, IC cards in which an IC chip is incorporated in a card body made of a synthetic resin are becoming widespread. Compared with a magnetic card in which data is stored in a magnetic stripe, the IC card can have a significantly larger memory capacity and can have an advanced information processing function. Furthermore, by incorporating an antenna coil in the card body, I
The present invention is also suitable for a so-called non-contact type information storage card which can supply a driving current for the C chip and transmit and receive data wirelessly.

When such an IC card is manufactured, the protection of the IC chip is lacking if the IC chip is incorporated alone as it is in a synthetic resin card body. That is, the card body of the IC card is generally made of a thin synthetic resin, and furthermore, it is required that the thickness be further reduced in the future. Therefore, the card body of the IC card is easily bent and deformed when handled by the user, and stress is easily concentrated on the IC chip during the bent deformation. When such a situation occurs, there is a possibility that the IC chip may be peeled off from the predetermined wiring portion or the IC chip itself may be damaged. In particular, when the IC chip itself is damaged, data stored in the IC chip is lost, and it becomes difficult to recover the data. Therefore, such a situation needs to be avoided as much as possible. .

Therefore, the inventors of the present application have proposed a new structure of an IC module suitable for being incorporated in an IC card body prior to the present invention (Japanese Patent Application No. 9-166321). As shown in FIG. 15 of the present application, the structure of this IC module is such that a protection member 4e covering the IC chip 2e is adhered to a substrate 1e on which the IC chip 2e is mounted, and a recess 5 formed in the protection member 4e.
e is a structure in which the IC chip 2e is housed. In addition, the substrate 1e is provided with an antenna coil 3e that conducts with the IC chip 2e as necessary.

According to the IC module having the above-described structure, since the components of the IC module are integrated, they can be used as they are by incorporating them into the IC card. The strength of the peripheral portion is increased by the protection member 4e, and the IC chip 2e can be protected. Further, if a gap Se is formed between the IC chip 2e and the protection member 4e so that the IC chip 2e and the protection member 4e do not directly contact each other,
Even if the protective member 4e bends along with the card body of the IC card, the bending deformation force is applied to the IC chip 2e.
The IC chip 2e can be protected also by making the gap Se function as a stress relaxation portion. Therefore, according to the structure of the IC module, due to the bending deformation of the IC card,
The IC chip 2e is peeled off from the substrate 1e, or
It is possible to appropriately prevent or suppress the C chip 2e itself from being greatly damaged.

Incidentally, the IC module having the above structure is
Naturally, it is strongly demanded that it be provided at a low price. Therefore, for that purpose, it is necessary to manufacture the IC module in large quantities and efficiently, without using large-scale and expensive equipment. As a method for manufacturing the IC module, as shown in FIG. 16, a protective member 4e having a concave portion 5e and having a predetermined shape is resin-molded using a mold, and then the resin-molded protective member 4e is mounted on the substrate 1e. Means such as bonding to the surface are considered. However, such means requires a large-scale and expensive resin molding apparatus using a mold. In addition, the work of bonding a large number of resin-molded protective members individually to each of the substrates 1e manufactured in large numbers is very complicated, and the productivity is poor. Therefore, with the above-mentioned means, the manufacturing cost of the IC module becomes relatively expensive.

The present invention was conceived in view of the above circumstances, and is intended to provide an IC module having a predetermined structure provided with a protection member for protecting an IC chip by using a large-scale resin using a mold. Efficient and appropriate manufacturing with simple equipment without using molding equipment, etc.,
The challenge is to reduce the manufacturing cost.

[0008]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

According to a first aspect of the present invention, there is provided a method of manufacturing an IC module. According to the method of manufacturing an IC module, a protection member for covering the IC chip is bonded to a substrate on which the IC chip is mounted, and the IC module is accommodated in a recess formed in the protection member. For manufacturing an IC module assembly in which a plurality of the IC modules are connected, and a second process for cutting and separating the IC module assembly manufactured in the first process into individual IC modules And the first step includes a step of transferring a first hoop member as a hoop-shaped substrate on which a plurality of IC chips are mounted at predetermined intervals along a predetermined transfer path, and a plurality of through-holes at predetermined intervals. The second hoop member thus formed is supplied to the transfer path of the first hoop member, and the second hoop member is accommodated and arranged in each of the through holes. A step of continuously overlapping the hoop member on the first hoop member and bonding them, and a step of attaching a third hoop member to the second hoop member so as to close one end opening of each through hole of the second hoop member. And continuously bonding them together.

In the first step of the method for manufacturing an IC module according to the present invention, a hoop-shaped laminated member in which the first hoop member, the second hoop member, and the third hoop member are overlapped and bonded is manufactured. That is, the first hoop member is a first hoop member on which a plurality of IC chips are mounted at predetermined intervals. On the other hand, each of the plurality of through holes provided in the second hoop member is closed at one end by a third hoop member, and is mounted inside the first hoop member. The second hoop member and the third hoop member have the same configuration as a protection member for protecting the IC chip is formed in a hoop shape. I have. Therefore, according to the operation step of sequentially stacking the three predetermined hoop members in the first step, each of the plurality of IC chips mounted on the hoop-shaped substrate is protected by the hoop-shaped protection member. An IC module assembly will be manufactured. Further, in the second step of the method of manufacturing an IC module according to the present invention, the IC module assembly manufactured in the first step is cut and separated, so that individual IC modules can be manufactured sequentially and continuously. Becomes The IC module manufactured through the second step corresponds to a protection member for protecting an IC chip in which a member obtained by cutting the second hoop member and the third hoop member to a predetermined size is mounted on a substrate having a predetermined size. Yes,
The IC module has the structure intended by the present invention.

As described above, according to the method of manufacturing an IC module according to the present invention, an IC module assembly having a predetermined structure is manufactured by successively overlapping and bonding three types of hoop members, and then these are individually assembled. Of the IC module mounted on the substrate
An IC module having a structure capable of appropriately protecting a C chip by a protective member can be mass-produced efficiently. Therefore, the present invention does not use a large-scale and expensive apparatus such as a resin molding apparatus using a mold, but uses a simpler and cheaper apparatus.
The C module can be mass-produced relatively easily, and a special effect that the productivity of the IC module can be increased and the manufacturing cost thereof can be reduced is obtained.

In a preferred embodiment of the present invention, the first hoop member is connected to the first hoop member at a position upstream of a position where the second hoop member overlaps the first hoop member in the transfer path of the first hoop member. A configuration including a step of sequentially mounting a plurality of IC chips can be adopted.

According to such a configuration, in the process of transferring the first hoop member as the hoop-shaped substrate, the operation of mounting the IC chip on the first hoop member and the second hoop on the first hoop member Each work such as the work of overlapping the members and the third hoop member is performed continuously. Therefore, a plurality of predetermined operation steps required for manufacturing the IC module are integrated, and the efficiency of the IC module manufacturing operation can be further improved.

In another preferred embodiment of the present invention,
After the second hoop member is overlaid on the first hoop member, a filler having a smaller elastic modulus than the second hoop member and the third hoop member is filled in the through-hole of the second hoop member, and thereafter, A configuration in which the third hoop member is overlapped with the second hoop member can be adopted.

According to such a configuration, the structure of the IC module manufactured by the manufacturing method of the present invention is reduced by using a filler in which the IC chip housed in the recess of the protection member has a smaller elastic modulus than the protection member. The structure can be covered. In such a structure of the IC module, the IC chip can be protected by the filler, and for example, the metal wiring portion of the IC chip can be hardly oxidized. In addition, the filler,
Since the elastic member has a smaller elastic modulus and is softer than the protective member, even if the protective member undergoes, for example, bending deformation, the deformation force of the protective member is absorbed and relaxed by the elastic deformation action of the filler, so that the protective member is softened. Therefore, the effect of preventing an unreasonable force from directly acting on the IC chip can be expected. Therefore, it is possible to manufacture an IC module having an excellent protection function of the IC chip.

In another preferred embodiment of the present invention,
Inside the through hole of the second hoop member, a reinforcing ring harder than the second hoop member and the third hoop member is mounted, and when the second hoop member is overlaid on the first hoop member, The above IC inside the reinforcing ring
A configuration for accommodating a chip can be adopted.

According to such a configuration, the structure of the IC module manufactured by the manufacturing method of the present invention can be modified such that a reinforcing ring harder than the protective member is mounted in the concave portion of the reinforcing member, IC by ring
A structure in which the periphery of the chip is surrounded can be employed.
In such a structure of the IC module, even if a bending force is applied to the protective member, the portion where the reinforcing ring is provided can be prevented from being easily bent and deformed. On the other hand, it is possible to make it difficult for a large bending force to act directly. Therefore, an IC module having an excellent IC chip protection function can be manufactured.

According to a second aspect of the present invention, there is provided an apparatus for manufacturing an IC module assembly. This IC module assembly manufacturing apparatus includes a first hoop member transfer means for transferring a first hoop member as a hoop-shaped substrate having a plurality of IC chips mounted at predetermined intervals along a predetermined transfer path, and a plurality of through holes. Supplies the second hoop member formed at a predetermined interval to the transfer path of the first hoop member, and moves the second hoop member to the first hoop so that the IC chips are accommodated and arranged in the through holes. A second hoop member transfer / supply means for continuously superimposing the second hoop member on the second hoop member and allowing the second hoop member to adhere to the second hoop member; And a third hoop member transferring / supplying means for continuously overlapping the hoop members so that they can be adhered to each other.

In the manufacturing apparatus for an IC module assembly according to the present invention, the predetermined second hoop member is transferred using the transfer and supply means of the second hoop member while the first hoop member is transferred along a predetermined transfer path. The first hoop member can be continuously superimposed and adhered, and at the time of the superposition, the first hoop member is mounted inside the plurality of through holes of the second hoop member. A plurality of IC chips can be sequentially accommodated. Then, the third hoop member is overlapped and adhered to the second hoop member by using the transfer and supply means of the third hoop member, and one end openings of the plurality of through-holes of the second hoop member are closed. It can be closed by the third hoop member. Therefore, by using the IC module assembly manufacturing apparatus according to the present invention, the first method of manufacturing an IC module provided by the first aspect of the present invention is provided.
The process can be performed appropriately, and the IC module assembly can be efficiently manufactured.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing an example of an apparatus for manufacturing an IC module assembly according to the present invention. FIG.
FIG. 2 is a schematic cross-sectional view showing an example of an IC module assembly cutting / separating device provided at a subsequent stage of the IC module assembly manufacturing device shown in FIG. 1.

The IC module assembly manufacturing apparatus E shown in FIG. 1 includes a first hoop member 1 ', a second hoop member 40', and a plurality of winding rolls Ra, Rb, and Rc set at predetermined positions. Each of the third hoop members 41 'is configured to be able to be extended and transported along a predetermined path. Specifically, the manufacturing apparatus E includes a feed rotatable feed roller 80 and a guide roller 81 for transferring the first hoop member 1 ′ along a predetermined transfer path D. In addition, a guide roller 82 for guiding the second hoop member 40 'onto the first hoop member 1' and a third hoop member 41 'on the first hoop member 1' and the second hoop member 40 '. It also has a guide roller 83 for guiding. Further, the manufacturing apparatus E is also provided with a filler discharge nozzle K3 and various device devices to be described later for mounting a predetermined IC chip 2 on the first hoop member 1 '.

The first hoop member 1 'corresponds to a substrate on which a plurality of IC chips 2 are mounted. For example, the first hoop member 1' is made of a flexible resin film made of a synthetic resin such as polyimide. It is a hoop-shaped sheet material with a width.
The thickness of the first hoop member 1 'is, for example, 0.1 mm.
It is about. As shown in FIG. 3, the first hoop member 1 'has a number of feed holes 19 provided at both sides in the longitudinal direction at a constant pitch. On the other hand, the feed roller 80 shown in FIG. 1 is formed as a roller having a large number of engaging projections 80a which can be sequentially engaged with the large number of feed holes 19 of the first hoop member 1 '. Therefore, the first hoop member 1 ′ can be reliably pulled in a predetermined direction by the engagement between the engagement projection 80 a and the feed hole 19, and the first hoop member 1 ′ can be removed from the winding roll Ra. The intermittent transfer or the continuous transfer can be performed on the transfer path D at a predetermined accurate pitch or speed while sequentially feeding out.

When the first hoop member 1 'is wound on the winding roll Ra, no IC chip is mounted on the surface thereof. However, many antenna coils 3 are provided on the surface. In the arrangement of these many antenna coils 3, two rows in which the antenna coils 3 are arranged at regular intervals in the longitudinal direction of the first hoop member 1 'are provided in total in the width direction of the first hoop member 1'. It is an array. However, the present invention is not limited to this, and the rows of the antenna coils 3 may be provided in only one row or in three or more rows. Each of the antenna coils 3 functions as a device that transmits and receives radio waves (electromagnetic waves) to and from a predetermined transceiver. Specifically, each of the antenna coils 3 is formed by forming a conductive film such as a copper foil on the surface of the first hoop member 1 ′ and then etching the conductive film into a predetermined pattern. As shown in FIG. 4, a spiral wiring portion 35 formed in a spiral shape or a plurality of concentric spiral shapes close to concentric circles, and an extending portion 36 extending from the spiral wiring portion 35 radially inward is provided. . This extension portion 36
Are arranged at the center of the inside of the spiral wiring portion 35 so that the wires of the antenna coil 3 are not short-circuited to each other.
Between the lands 10, 10. Extension part 3
6 has both ends of the wiring of the antenna coil 3, and both ends are connected to the lands 10, 10. The electrodes of the IC chip 2 mounted on the first hoop member 1 'are electrically connected to the lands 10, 10 as described later.

Referring to FIG. 1, the second hoop member 40 '
Is a hoop-shaped sheet material having a constant width made of, for example, polyethylene terephthalate (hereinafter, abbreviated to PET) or acrylonitrile-butadiene-styrene resin (hereinafter, abbreviated to ABS resin) having a thickness of about 0.35 mm. It is. The second hoop member 40 'has a large number of through holes 5' provided at predetermined pitch intervals. The arrangement of these many through holes 5 'is the same as the arrangement of the antenna coils 3 of the first hoop member 1'. Further, each through-hole 5 ′ is positioned at a distance from the IC chip 2 such that when the IC chip 2 is accommodated therein, an appropriate gap is formed between the IC chip 2 and the inner peripheral wall of the through-hole 5 ′. It is a large size around. On one side of the second hoop member 40 ', the second hoop member 40' is
An adhesive layer for bonding to the hoop member 1 'is provided in advance as needed. In this case, the second hoop member 40 'is wound up as a winding roll Rb with its adhesive layer covered with release paper as necessary. The release paper is peeled off from the second hoop member 40 'at a time before being unrolled on the first hoop member 1' after being unwound from the winding roll Rb.

The third hoop member 41 'is, for example, a hoop-shaped sheet material having a constant width made of PET or ABS resin having a thickness of about 0.1 mm. This third hoop member 41 'is different from the second hoop member 40',
No through-holes or the like are formed, but are simply in the form of a tape. However, the third hoop member 41 'is provided on one side of the third hoop member 41' with the second hoop member 4 '.
An adhesive layer for bonding to 0 'is provided as needed. Also for this adhesive layer, the second hoop member 4
Similarly to the case of 0 ′, the release paper is appropriately covered with release paper, and the release paper is peeled off from the third hoop member 41 ′ before the third hoop member 41 ′ is overlapped with the second hoop member 40 ′.

Next, an example of a method of manufacturing an IC module having a predetermined structure using the manufacturing apparatus E and the cutting / separating apparatus shown in FIG. 2 will be described.

First, in FIG. 1, a large number of IC chips 2 are sequentially mounted on the upper surface of the first hoop member 1 'which has been unwound from the winding roll Ra while being transported along a predetermined transport path D. This operation is performed by the following steps. That is, first, the land 1 described above of the first hoop member 1 ′
An anisotropic conductive film 11 is provided on the locations where 0 and 10 are formed, and then the IC chip 2 is mounted on the anisotropic conductive film 11 using a chip mounter K1. Next, the IC chip 2 is pressed using a heating press K2. As a result, as shown in FIG. 5, the IC chip 2 can be mounted substantially at the center of each of the plurality of antenna coils 3 provided on the first hoop member 1 '. As shown in FIG. 6, in each of the IC chips 2, the electrodes 20, 20 provided on the main surface thereof are connected to the land 1 via the anisotropic conductive film 11.
0 and 10 are electrically connected. The anisotropic conductive film 11
A conductive material is dispersed and blended in an insulating material, and plays a role of conducting only between the electrodes 20 and 20 and the lands 10 and 10 to which a pressure equal to or more than a predetermined value is applied by a pressing operation. .

Next, as shown in FIG. 1, at a position subsequent to the mounting operation position of the IC chip 2, the second hoop member 40 'unwound from the winding roll Rb is transferred along a predetermined transfer path. It is superimposed on the first hoop member 1 '. However, in this case, the position where the two hoop members 1 'and 40' overlap each other is adjusted, and the IC chip on the first hoop member 1 'is inserted into each through hole 5' of the second hoop member 40 '. 2 is set to be accommodated.
At the same time as the second hoop member 40 'is superimposed on the upper surface of the first hoop member 1', the two hoop members 1 'and 40' are adhered to each other. As described above, this can be easily performed by adopting, for example, a unit using an adhesive layer provided in advance as the second hoop member 40 '.

When using the second hoop member 40 'in which the adhesive layer is not provided in advance, an adhesive application device is provided near the transfer path of the second hoop member 40'. The second hoop member 40 'is a take-up roll Rb.
A means for applying an adhesive to one surface of the second hoop member 40 'in the transfer path extending from the first hoop member 1' to the transfer path of the first hoop member 1 'may be employed. this is,
A third hoop member 41 'is attached to a second hoop member 40' described later.
The same applies to the operation step of bonding the. Also, the second
If the hoop member 40 'is adhered to the first hoop member 1', the second hoop member 40 'can be transferred along with the first hoop member 1'. Further, the second hoop member 40 'can be paid out from the winding roll Rb using the transfer force of the first hoop member 1'. Therefore, a dedicated feeding roller for feeding the second hoop member 40 ′ from the winding roll Rb, a winding roll Rb
A dedicated feed roller for transferring the second hoop member 40 'fed out of the apparatus can be unnecessary. In the present embodiment, the feed roller 80 for transferring the first hoop member 1 'also serves as a roller for transferring the second hoop member 40'. This is the third hoop member 41 ′
The same applies to the case where is fed out from the winding roll Rc and transferred.

At a later stage of the work position where the first hoop member 1 'and the second hoop member 40' are overlapped with each other, each through-hole 5 of the second hoop member 40 'is formed by using a filler discharge nozzle K3. 'Filler 6 is filled sequentially.
As the filler 6, a material having an elastic modulus after curing smaller than that of the second hoop member 40 'or the third hoop member 41' is used. As an example, a silicone resin is used.

In the latter stage of the filling operation position of the filler 6, the third hoop member 41 'unwound from the take-up roll Rc is overlaid on the second hoop member 40' transferred together with the first hoop member 1 '. Glue them together. By this operation, the upper end opening of each through-hole 5 'can be closed by the third hoop member 41', and the first hoop member 1 ', the second hoop member 40', and the third hoop member 41 'are closed. An IC module assembly A 'which is superimposed and bonded is obtained.

After manufacturing the IC module assembly A ', as shown in FIG. 2, the IC module assembly A' is transported in a predetermined direction by using a feed roller 84 or the like, for example, along a transport path thereof. The punching blade 90 provided above is moved up and down to sequentially punch out predetermined positions of the IC module assembly A '. As the punching blade 90, for example, one having a circular shape in a bottom view can be used, and the peripheral portion of the antenna coil 3 can be punched substantially concentrically with the spiral wiring portion 35 of the antenna coil 3. By such work, the above IC
A large number of individual IC modules A formed in a thin disk shape can be continuously obtained from the module assembly A ′.
IC module assembly A 'subjected to the punching operation
Of the remaining portion A "remains hoop-shaped, so that the remaining portion A"
, And can be further transferred to a later stage to wind them as a predetermined winding roll.

The I manufactured by the above series of manufacturing steps
The C module A has a structure as shown in FIG. That is, the basic configuration of this IC module A is common to the above-described IC module shown in FIG. 15, and the IC module A is mounted on the substrate 1 on which the IC chip 2 electrically connected to the antenna coil 3 is mounted. A protection member 4 covering the chip 2 is adhered, and the IC chip 2 is accommodated in a recess 5 formed in the protection member 4. The protection member 4 is formed by sheet materials 40 and 41 obtained by cutting the second hoop member 40 'and the third hoop member 41'. Further, a gap S between the IC chip 2 and the inner wall surface of the concave portion 5 is filled with a filler 6 having a low elastic modulus such as a silicone resin.

The IC module A is used as a component of an IC card B, for example, as shown in FIG. The external shape of the IC card B in plan view is a long rectangular shape, and the overall thickness is, for example, about 0.76 mm. As shown in FIG. 10, this IC card B
In addition to the IC module A, the card bodies 7 and 2
The cover sheet 70 and 71 are provided. That is, the card body 7 has a thickness of, for example, about 0.45 mm, which is substantially the same as that of the IC module A, and is provided with a through-hole-shaped accommodation section 72. This storage section 72
The IC module A is housed therein, and two cover sheets 70 and 71 are adhered to both side surfaces of the card main body 7, so that both end openings of the housing section 72 are closed, and the IC module A is housed. A has a structure sealed in the accommodation section 72. As another configuration of the IC card, as shown in FIG. 11, a receiving portion 72a of the card body 7a for receiving the IC module A is formed in a concave shape with a bottom, and an opening of the receiving portion 72a is formed. It may be configured to be closed by one cover sheet 70.

The above-mentioned IC card B is entirely or partially bent during handling, and even if a bending force M acts on the periphery of the IC module A as shown in FIG. The vicinity of the IC chip 2 is reinforced, so that the IC chip 2 can be protected against the bending force M. Even if the bending force M causes bending deformation of the protection member 4, the protection member 4 and the IC chip 2
Is merely indirectly contacted via the soft filler 6 having a small elastic modulus, so that the force of the bending deformation of the protection member 4 is not transmitted to the IC chip 2 as it is. Therefore, the IC module A is preferable for forming an IC card B having an excellent protection function for the IC chip 2. Further, the antenna coil 3 of the IC module A is a so-called non-contact type IC card for the IC card B. When a predetermined radio wave is received, an induced electromotive force is generated by an electromagnetic induction effect to generate an IC.
While this power is supplied to the chip 2, when a predetermined signal is output from the IC chip 2, a radio wave corresponding to the signal is generated.

According to the above-described method for manufacturing an IC module, the IC module A having an excellent protection function for the IC chip 2 is provided.
Can be efficiently mass-produced without using a complicated and large-scale apparatus such as a resin molding apparatus. Therefore, the manufacturing cost of the IC module A can be reduced. In particular, since the protection member 4 is manufactured by laminating and bonding two types of hoop members, the raw material cost and processing cost can be reduced.

In the above embodiment, the case where the IC module A having the structure in which the filler 6 is filled in the concave portion 5 of the protection member 4 is described as an example, but the present invention is not limited to this.

According to the present invention, as shown in FIG. 12, for example, the gap S between the IC chip 2 and the inner wall surface of the concave portion 5 is merely a space portion without filling the concave portion 5 of the protective member 4 with a filler. May be manufactured. In the case of manufacturing such an IC module Aa, it is not necessary to perform a filling operation of the filler, and therefore, for example, as shown in FIG. The third hoop member 41 'may be overlapped at the same time.

In the present invention, as shown in FIG. 14, for example, a reinforcing ring 8 harder than the protective member 4 is accommodated in the concave portion 5 of the protective member 4, and the reinforcing ring 8 An IC module Ab having a structure surrounding the periphery may be manufactured. According to such a structure,
By the reinforcing effect of the reinforcing ring 8, the protection of the IC chip 2 can be enhanced. In order to manufacture such an IC module Ab, the second hoop member 40 'is connected to the first hoop member 1'.
At an appropriate time before overlapping, the work of accommodating the reinforcing ring 8 in the through hole 5 'may be performed. Of course, when the second hoop member 40 'is fed out from a predetermined winding roll, the reinforcing ring 8 may be already attached to the second hoop member 40'.

In addition, the specific configuration of each working step of the method of manufacturing an IC module according to the present invention can be variously changed. As the first hoop member of the present invention, a member on which an IC chip is mounted from the beginning is used, and the step of mounting the IC chip on the first hoop member is not performed. Alternatively, the step of overlapping the second hoop member and the third hoop member may be performed. Further, the specific configuration and usage of the IC module manufactured by the present invention are not limited, and it is needless to say that the present invention can be applied to the case of manufacturing an IC module having no antenna coil. Furthermore, the specific configuration of the IC module assembly manufacturing apparatus according to the present invention can be variously changed in design. This IC
Whether or not a device for cutting and separating the IC module assembly into individual IC modules is connected and provided at the subsequent stage of the module assembly manufacturing apparatus can be arbitrarily selected.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an example of an IC module assembly manufacturing apparatus according to the present invention.

FIG. 2 is a schematic sectional view showing an example of an IC module assembly cutting / separating apparatus provided at a subsequent stage of the IC module assembly manufacturing apparatus shown in FIG.

FIG. 3 is a perspective view of a main part showing an example of a first hoop member used in the present invention.

FIG. 4 is an enlarged plan view of a main part of an antenna coil provided on a first hoop member shown in FIG. 3;

FIG. 5 is a perspective view of an essential part showing an example of a state in which an IC chip is mounted on a first hoop member.

FIG. 6 is an enlarged sectional view of a main part showing a structure of a mounting part of the IC chip.

FIG. 7 is a cross-sectional view showing an example of an IC module manufactured by the method for manufacturing an IC module according to the present invention.

8 is a perspective view showing an example of an IC card configured using the IC module shown in FIG.

9 is an enlarged cross-sectional view taken along line IX-IX of FIG.

FIG. 10 is an exploded sectional view of the IC card shown in FIG.

FIG. 11 is an exploded sectional view showing another example of an IC card.

FIG. 12 is a sectional view showing another example of the IC module.

FIG. 13 is a fragmentary cross-sectional view showing another example of the method for manufacturing an IC module according to the present invention;

FIG. 14 is a cross-sectional view showing another example of an IC module.

FIG. 15 is a sectional view showing an example of an IC module proposed prior to the present invention.

16 is a sectional view illustrating an example of a method for manufacturing the IC module illustrated in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 1 '1st hoop member 2 IC chip 3 Antenna coil 4 Protective member 5 Depression 5' Through hole 6 Filler 8 Reinforcement ring 40 Sheet material 40 '2nd hoop member 41 Sheet material 41' 3rd hoop member A, Aa , Ab IC module A 'IC module assembly E IC module assembly manufacturing apparatus

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tomoharu Horio 21 Ryozaki-cho, Saiin, Ukyo-ku, Kyoto City Inside ROHM Co., Ltd.

Claims (5)

[Claims] An IC in which a protection member for covering the IC chip is adhered to a substrate on which the IC chip is mounted, and wherein the IC chip is accommodated in a recess formed in the protection member.
A method for manufacturing a module, comprising: a first step of manufacturing an IC module assembly in which a plurality of the IC modules are connected; and cutting and separating the IC module assembly manufactured in the first step into individual IC modules. A first step of transferring a first hoop member as a hoop-shaped substrate having a plurality of IC chips mounted thereon at a predetermined interval along a predetermined transfer path; A second hoop member having holes formed at predetermined intervals is supplied to the transfer path of the first hoop member, and the second hoop member is moved to the second hoop member so that the IC chips are accommodated in the through holes. A step of continuously superimposing the first hoop member and bonding them, and a third hoop member being attached to the second hoop member so as to close one end opening of each through hole of the second hoop member. Characterized in that it and a step of adhering the so continue to superimpose, manufacturing method of the IC module. 2. The transfer path of the first hoop member,
2. The IC module according to claim 1, further comprising a step of sequentially mounting the plurality of IC chips on the first hoop member at a position upstream of a position where the second hoop member is overlapped with the first hoop member. Manufacturing method. 3. After the second hoop member is overlaid on the first hoop member, a filler having a smaller elastic modulus than the second hoop member and the third hoop member is filled in a through hole of the second hoop member. The method for manufacturing an IC module according to claim 1, wherein the filling is performed, and then the third hoop member is overlapped with the second hoop member. 4. A reinforcing ring that is harder than the second hoop member and the third hoop member is mounted inside the through hole of the second hoop member, and the second hoop member is connected to the first hoop member. 3. The method of manufacturing an IC module according to claim 1, wherein the IC chip is accommodated inside the reinforcing ring when the IC module is overlapped on a member. 5. A first hoop member transfer means for transferring a first hoop member as a hoop-shaped substrate having a plurality of IC chips mounted at predetermined intervals along a predetermined transfer path, and a plurality of through holes formed at predetermined intervals. The second hoop member is supplied to the transfer path of the first hoop member, and the second hoop member is connected to the first hoop member so as to receive and arrange the IC chips in the through holes. Transfer and supply means for a second hoop member, which is capable of adhering the second hoop member so that they can be adhered to each other, and a third hoop member connected to the second hoop member so as to close one end opening of each through hole of the second hoop member. A third hoop member transferring / supplying means for superimposing the third hoop member and adhering them to each other.