JPH11314480A - Method and device for manufacture of electronic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To save a member for a surface which covers electronic parts on a member for a substrate. SOLUTION: An electronic card manufacturing device is provided with a rear sheet supplying unit 6, supplying a continuous sheet type rear sheet 1, a chip sheet supplying unit 8, supplying an electronic parts receiving porous chip receiving sheet 3 onto the rear sheet 1 supplied by the rear sheet supplying unit 6, a front sheet supplying unit 9, supplying a front sheet 5 for covering the chip receiving sheet (receiving member) 3 onto the rear sheet 1, a slitter 25, cutting the front sheet 5, supplied by the front sheet supplying unit 9, into a leaflet type sheet having a size capable of covering the chip receiving sheet 3, and a vacuum hot press device 17, bonding the leaflet type front sheet 5A cut by the slitter 25, the chip receiving sheet 3 and the rear sheet 1 while interposing adhesive members 10A, 10B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention is applicable to non-contact type IC cards such as cash cards, employee ID cards, employee ID cards, employee ID cards, student ID cards, alien registration IDs and various driver's licenses. And a method for manufacturing the electronic card.

More specifically, a plurality of electronic components for a card are arranged on a long sheet-like substrate member, and a single sheet-like surface member is arranged on the electronic component. Then, the electronic component and the surface member are bonded together with an adhesive member interposed therebetween, so that the surface member can be saved.

[0003]

2. Description of the Related Art In recent years, an IC card in which an IC chip or an antenna is sealed in a resin card has been proposed. Since this type of IC card is a non-contact type, it has no information input / output terminals. Therefore, the information is used by converting it into a specific modulated radio wave, receiving it with an antenna, demodulating it with an IC chip, writing it into a memory or the like, or reading it out.

[0004] The non-contact type IC card is disclosed in, for example, Japanese Patent Application Laid-Open No. 9-275184, which is a technical document, as "Information Carrier and its Manufacturing Method".
According to this technical document, an electronic component such as an IC chip or an antenna is housed in a woven reinforcing member (hereinafter also referred to as a housing member), and is bonded with an upper and lower cover sheet via an adhesive member. An IC card is formed. Thereby, the IC card itself can be formed thin.

[0005] In this type of IC card, a printed member is used as a surface member, and for example, "XXX employee ID", "name", "issue date", etc. are used for the field of use of the card. Such image display information is often printed. The printing member is provided with an image receiving layer for forming a photograph of the face of the user of the card, and a material such as a sublimation dye or a diffusion dye is used for the image receiving layer. A face photograph or the like is formed on the image receiving layer using a thermal head or an ink jet means. The back sheet serving as a member for the substrate of the IC card may be provided with a writing layer or the like that can be written with a pen.

Accordingly, when mass-producing cash cards, employee cards, employee cards, membership cards, student cards, alien registration cards, various driver's licenses, and the like, a member for the surface on which image display information is printed. In many cases, a storage member for storing electronic components and a substrate member having a writing layer are used in the form of a long sheet.

[0007] The surface member formed into a long sheet shape,
The accommodating member and the member for the substrate are heated and bonded by a vacuum hot press or the like with an adhesive member interposed therebetween. The long sheet-shaped card aggregate after the heat bonding is cut into one unit of card aggregate. Thereafter, when the card assembly is completely cured, IC cards are punched out one by one from the card assembly by a punching device or the like.

[0008]

Therefore, in response to a demand for mass production of cash cards, employee cards, employee cards, membership cards, student cards, alien registration cards and various driver's licenses,
When a storage member storing electronic components is bonded to a long sheet-shaped (web-shaped) surface member and a long sheet-shaped substrate member, and then cut, one sheet is obtained. The surface member between the electronic card and another electronic card is often wasted. Thereby, non-contact type IC
There is a problem that the cost of the card increases.

When the surface member is in the form of a web, it is also very difficult to adjust the tension with the long sheet-like substrate member, so that the card assembly is not conveyed to the cutting device. In some cases, the transport system may cause a control error such as canceling the transport operation.

[0010] Incidentally, even if the material for the long sheet-shaped surface member and the long sheet-shaped substrate member are the same, the difference in the thickness, surface processing, surface printing, and the like. Storage conditions, production conditions, elapsed time after production, and differences in production lots. In particular, since these members are wound and handled in a roll shape, there is a difference in the degree of expansion and contraction depending on whether the member is wound around an outer peripheral portion or a portion near a core.

For this reason, it is very difficult to align the two. If the transport speed of these transport systems increases, for example, it becomes difficult to adjust the timing of the drive roller and the like, so it is difficult to maintain the tension of the upper and lower members uniformly, and the image display information of the surface member and the substrate There is a possibility that a large number of defective cards may be produced due to a deviation from the writing layer of the member for use.

In view of the above, the present invention has been made to solve the above-mentioned problems, and provides an electronic card manufacturing apparatus and an electronic card manufacturing method capable of saving a surface member for covering an electronic component on a substrate member. The purpose is to do.

[0013]

In order to solve the above-mentioned problems, an electronic card manufacturing apparatus according to the present invention comprises a first supply means for supplying a member for a long sheet-like substrate, and a first supply means for supplying a member for a long sheet-like substrate. A second supply unit for supplying an electronic component for a card onto a member for a substrate by the supply unit, and a second supply unit for supplying a member for a sheet-like surface for covering the electronic component on the substrate member. 3 supply means, a sheet-like surface member,
A bonding means for bonding the electronic component and a member for a substrate with an adhesive member interposed therebetween is provided.

According to the electronic card manufacturing apparatus of the present invention, when the long sheet-like member is supplied from the first supply means, the electronic parts are supplied from the second supply means onto the member for the substrate. Then, for example, it is held by an adhesive member such as a reactive hot melt resin.

On the other hand, when a sheet-like surface member is supplied from the third supply means, the sheet-like surface member provided by the third supply means and the electronic member provided by the second supply means. The component and the member for the substrate provided by the first supply unit are bonded by the bonding unit with the bonding member interposed therebetween.

Therefore, it is possible to bond the sheet-like surface member covering one storage member and the sheet-sheet surface member covering the other storage member with a gap therebetween. Therefore, the surface member at that portion can be omitted, and the positioning of the surface substrate with respect to the substrate member can be easily performed.

According to a first method of manufacturing an electronic card of the present invention, a plurality of electronic components for a card are arranged on a long sheet-shaped substrate member, and the electronic components arranged on the substrate member are separated from each other. A step of supplying a member for a sheet-shaped surface having a size to cover, and a step of bonding the member for a sheet-shaped surface and the member for an electronic component and a substrate with an adhesive member interposed therebetween. It is characterized by having.

According to the first method of manufacturing an electronic card of the present invention, after supplying a sheet-like surface member onto an electronic component disposed on a long sheet-like substrate member, The surface member, the electronic component, and the substrate member are bonded together with an adhesive member interposed therebetween.

With this configuration, a gap can be formed between the sheet-like surface member covering one electronic component and the sheet-like surface member covering the other electronic component. The members for the surface can be omitted. Thereby, the surface member can be saved as compared with a case where the surface member is formed into a long sheet shape and bonded on the electronic component.

According to a second method of manufacturing an electronic card of the present invention, the electronic component for a card is stored in a storage member having a predetermined shape, and the electronic component stored in the storage member is used for a long sheet-like substrate. A plurality of members, and a step of supplying a single-sheet surface member having a size to cover the storage member arranged on the substrate member; and a single-sheet surface member. And a step of bonding the housing member and the substrate member with an adhesive member interposed therebetween.

According to the second method of manufacturing an electronic card of the present invention, for example, a plurality of long sheet-shaped storage members storing electronic components are arranged side by side on a long sheet-shaped substrate member. A sheet-like surface member is supplied onto a storage member, and the surface member, the storage member, and the substrate member are bonded to each other with an adhesive member interposed therebetween.

With this configuration, a gap can be formed between the single-sheet surface member covering the one storage member and the single-sheet surface member covering the other storage member. The members for the surface can be omitted. Thereby, the member for a surface can be saved compared with the case where the member for a surface is made into a long sheet shape and stuck on a storage member.

Also, the first and second electronic cards of the present invention
In common with the production method, the difference between the thickness and surface processing of the surface member and the substrate member, the difference in surface printing, as well as the respective storage conditions, production conditions, elapsed time after production, production lot Due to the difference, even when the finished state of the surface member is different, a degree of freedom (margin) is generated in the alignment of the sheet-like surface member with respect to the long sheet-like substrate member. , And the alignment becomes very easy. Therefore,
Even if the transport speed of the card transport system increases, the tension between the substrate member and the surface member can be maintained uniform. Therefore, the image display information of the member for the surface can be matched with the writing layer of the member for the substrate, and the production yield is remarkably improved.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic card manufacturing apparatus and an electronic card manufacturing method according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing a configuration example of an electronic card manufacturing apparatus 100 as an embodiment of the present invention.
FIG. 2 is a perspective view showing a configuration example of the slitter 25.
In this embodiment, a plurality of storage members accommodating electronic components are arranged and fixed on a long sheet-shaped substrate member, and the front surface member is cut in advance to a size that covers the storage member. In the form of a sheet, the member for the sheet-like surface, the storage member, and the member for the long sheet-like substrate are bonded together with an adhesive member interposed therebetween, so that the This is to save members.

The electronic card manufacturing apparatus 100 of the present invention
The electronic card 50 is manufactured by a bonding method in which a roll sheet and a single sheet are combined. In FIG. 1, a back sheet supply unit 6 is provided as a first supply unit for forming an electronic card 50 in an electronic card manufacturing apparatus 100.
The back sheet 1 is wound around the feeding shaft 6A as a long sheet (web-shaped) substrate member, and further, for example, a frame member supply unit 7 that winds the long sheet frame member 2 is provided. Provided.

Here, in the long sheet form, at least one or more electronic cards can be punched out, for example, image display information such as "XXX employee ID", "name", "issue date" is formed continuously. Means something. As the long sheet-like form, it is assumed that image display information is arranged in n rows in the width direction and m pieces in the longitudinal direction. The sheet-like sheet shape is several steps shorter than the long sheet shape, and at least the image display information thereof is one.
One that includes In this example, it is assumed that the image display information includes about 6 to 9 pieces. Of course, it is not limited to this.

As the second supply means, a chip sheet supply section 8 is provided, and a chip storage sheet 3 as a porous storage member for storing electronic components is wound around a delivery shaft 8A. A top sheet supply unit 9 is provided as a third supply unit, and a top sheet 5 serving as a front member for covering the chip storage sheet 3 on the back sheet 1 is wound around the delivery shaft 9A. The top sheet 5 is transported by the drive roller 19A.

On the top sheet 5, image display information such as "employee's card", "name" and "issue date" are arranged in three rows in the width direction, and the image display information is continuously arranged in the transport direction. Is printed. A slitter 25 as a cutting means is provided on the downstream side of the top sheet supply unit 9, and the driving roller 1
The top sheet 5 conveyed by 9 </ b> A is cut into a single-sheet size covering the chip storage sheet 3. For example, the top sheet 5 is cut such that six (3 rows × 2) sheets constitute one sheet of the electronic card 50. Hereinafter, the top sheet 5 cut by the slitter 25 is referred to as a single sheet top sheet 5A. In addition to the slitter 25, a rotary cutter or a push-cut type (vertical type) cutting device can be used as the cutting means.

The slitter 25 has, for example, an L-shaped main body 81 shown in FIG. The width of the main body 81 is slightly longer than the width of the topsheet 5 in the width direction.

An L-shaped groove 82 is provided in the main body 81, and a movable portion 84 having a blade 83 is slidably movable, for example, right and left. With respect to the L-shaped groove portion 82, the wall surface of the main body portion 81 forms a reference surface, and when the movable portion 84 is moved along the reference surface, the blade 83 can be moved in a direction perpendicular to the transport direction. . This movable part 84
Is engaged with a motor 86 through an opening 85, and the movable portion 84 is driven by the motor 86. The main body portion 81 is provided with a sheet entry restricting portion 87, which restricts the end of the top sheet 5 to enter in a direction parallel to the movement locus of the blade 83.

The function of the slitter 25 is, for example, that when the slitter control signal S11 is input to the motor 86, the motor 86 rotates based on the slitter control signal S11, and the rotation causes the movable portion 84 to move in the width direction. . Thereby, the top sheet 5 can be cut linearly in a direction perpendicular to the transport direction.

Returning to FIG. 1, driven rollers 19B to 19D and the like are provided downstream of the supply units 6 to 9, respectively.
The transport direction of the back sheet 1, the frame member 2, and the like can be changed. In this example, the chip sheet supply unit 8
An adhesive supply device 14 is provided on the downstream side, and the surface of the chip storage sheet 3 is impregnated with a thermosetting epoxy resin as an adhesive member 10A. An adhesive supply device 15 is provided downstream of the frame member supply unit 7, and a thermosetting reactive hot melt resin is applied as an adhesive member 10B to the surface of the sheet-shaped frame member 2. Both resins are extruded and applied to the sheet-like frame member 2, the chip storage sheet 3, and the like by using a die called an extrusion and pumping out by a pump.

The adhesive supply device 14 may also serve as the adhesive supply device 15 for the frame member. Further, an adhesive supply device 14 for a chip sheet may be provided near the adhesive supply device 15. This is because applying the adhesive members 10A and 10B while the chip storage sheet 3 is in the opening of the frame member 2 eliminates the risk of sagging of the adhesive members 10A and 10B.

A drive roller 16 for guiding and positioning is provided downstream of these four back sheet supply units 6, frame member supply unit 7, chip sheet supply unit 8, and front sheet supply unit 9.
The back sheet 1, the sheet-like frame member 2, the chip storage sheet 3, and the sheet-like top sheet 5A are aligned based on the pre-printed alignment mark p0, and the vacuum heat is applied. It is guided in the direction of the press device 17.

On the downstream side of the drive roller 16, a vacuum heat press device 17 as a bonding means is provided.
Sheet-shaped top sheet 5A cut by the sheet 5
And the chip storage sheet 3 by the chip sheet supply unit 8
And the back sheet 1 by the back sheet supply unit 6 are bonded together with an adhesive member interposed therebetween.

This vacuum heat press device 17 is a flat type upper and lower press portion 17 which is disposed to face the upper and lower sides of the transport path.
A, 17B, and a sheet-like surface sheet 5
A predetermined pressure is applied from above A and below the long sheet-shaped back sheet 5. For this purpose, the upper and lower press sections 17A and 17B can be moved in a direction in which they are separated from each other. In this example, the adhesive members 10A, 10B are provided between the back sheet 1 and the sheet-like top sheet 5A.
The chip housing sheet 3 sealed inside the frame member 2 with B interposed therebetween is hereinafter referred to as a card assembly 20.

The upper and lower press sections 17A, 17B
An electric heater (not shown) 18 is provided therein to heat the card assembly 20 to a predetermined temperature (see FIG. 3 for the electric heater 18). In this example, depending on the type of the adhesive member 10, the heating temperature is 60 ° C to 120 ° C.
C., and the heating time is about 10 seconds to 60 seconds.

The device for heating and bonding the card assembly 20 is not limited to the vacuum heat press device 17, but may be a heat roller device. The card assembly 20 discharged from the vacuum heat press device 17 is not completely cured,
This is a so-called semi-dry state.

The vacuum heat press 17 of this embodiment is provided with, for example, an endless release sheet 28. The release sheet 28 is provided so as to be interposed between the upper press portion 17A of the vacuum heat press device 17 and the card assembly 20 at the time of heat bonding. The function of the release sheet 28 is to wipe off (adsorb) the adhesive member when the adhesive member is exposed between the sheet-like surface sheet 5A and another adjacent sheet-like surface sheet 5A. It is.
The adhesion of the adhesive member by the release sheet 28 prevents the card sheet transport belt 30 from being stained. In this case, the release sheet 28 may be a porous sheet or a resin sheet with very little air flow. Specifically, a member such as cellophane paper or Saran wrap is suitable.

A card sheet transport belt 30 is provided downstream of the vacuum hot press device 17, and the card assembly 20 heated and bonded by the vacuum hot press device 17 is transferred in a predetermined transport direction, in this example, a cutting device. It is conveyed to 40.
At this time, the moving distance of the card sheet conveying belt 30 is equal to the length L1 of the vacuum heat press device 17 in the conveying direction. A cutting device 40 is provided downstream of the card sheet transport belt 30.
Is provided, and the card assembly 20 is cut for each unit (for example, 3 rows × 2). As the cutting device 40, a vertical push-type cutter or a rotary cutter is used.

Next, a control method of the electronic card manufacturing apparatus 100 will be described with reference to FIG. FIG. 3 is a block diagram illustrating an outline of a control system example of the electronic card manufacturing apparatus 100.

In this example, a control device 70 for controlling the entire electronic card manufacturing apparatus 100 is provided, and a slitter control signal S for cutting the top sheet 5 at a predetermined timing.
11 is output to the slitter 25. The control device 70
Detects an alignment mark p0 (shown in FIG. 14) formed in advance on the card assembly 20, and controls the card sheet transport belt 30 based on the detection. In this control system, the delivery detection sensor 71 is connected to the vacuum heat press device 17.
And the card assembly 20 at the card sending position p1.
Is detected. This sensor 71
Outputs a card sending position detection signal S1. An arrival detection sensor 72 is provided on the cutting device 40 side, and the alignment mark p0 of the card assembly 20 is detected at the card arrival position p2. The sensor 72 outputs a card arrival detection signal S2.

The output stages of these sensors 71 and 72 include:
The control device 70 is connected, and the card sheet transport belt 30 is controlled based on the two detection signals S1 and S2. For example, the control device 70 controls the card sheet transport belt 30 to operate intermittently between the card delivery position p1 and the card arrival position p2. If the topsheet 5 is long and non-stretchable, only one of the sensors 71 and 72 can be used.

In this example, in order to form the electronic card 50, on the other hand, the driven roller 19
D, the back sheet 1 is fed out to the drive roller 16, the chip sheet supply unit 8 feeds out the chip storage sheet 3 to the drive roller 16 via 19 B and 19 C, and the sheet is fed from the frame member supply unit 7 to the drive roller 16. Frame member 2
Pay out. Thereafter, the controller 70 sends the drive roller 16
When the drive control signal S3 is output, the drive roller 16 rotates. Before or after this, an adhesive control signal S4A is output from the control device 70 to the adhesive supply device 14, and the surface of the chip housing sheet 3 is impregnated with a thermosetting epoxy resin as the adhesive member 10A. Similarly, an adhesive control signal S4B is output from the control device 70 to the adhesive supply device 15, and a thermosetting reactive hot melt resin is applied to the surface of the sheet-like frame member 2 as the adhesive member 10B.

On the other hand, after the adhesive members 10A and 10B are impregnated, the drive control signal S10 is output from the control device 70 to the drive roller 19A, and the drive roller 19A is rotated based on the signal S10. The top sheet 5 is fed from the section 9 to the slitter 25. Immediately thereafter, the slitter control signal S11 is output from the control device 70 to the slitter 25, so that the top sheet 5 is cut into a single sheet. Single sheet-like top sheet 5A after cutting
Are positioned by a guide member or the like (not shown) while descending onto the chip storage sheet 3, and are arranged on the chip storage sheet 3.

The card assembly 20 impregnated with these resins and having the sheet-like top sheet 5A is guided to the vacuum hot press device 17 by the drive roller 16 and heated by the control device 70 to the vacuum hot press device 17. Lamination control signal S5
Is output. In the vacuum heat press device 17, the temperature and the press pressure of the upper press portion 17A and the lower press portion 17B are controlled to be constant. The leading end of the first card assembly 20 is made to protrude from the vacuum heat press device 17. When the first heat bonding is completed, an end signal S6 is output from the vacuum heat press device 17 to the control device 70. This tip is detected by the sensor 71. The card sending position detection signal S1 by the sensor 71 is obtained by detecting the alignment mark p1.

A belt transport control signal S7 is output to the card sheet transport belt 30 from the controller 70 which has received the card sending position detection signal S1. The card sheet transport belt 30 starts to move by placing the card assembly 20 on the basis of the belt transport control signal S7, and the card assembly 20 after the first heat bonding is transported from the vacuum heat press device 17 to the cutting device 40. You. At this time, the drive rollers 16 also cooperate to move the card assembly 20 downstream. At this stage, the card assembly 20 has not been cut.

When the first card assembly 20 is conveyed from the vacuum hot press device 17 to the cutting device 40, the sensor 72
Thus, the arrival of the card assembly 20 is detected. The sensor 72 outputs a card delivery arrival detection signal S2 to the control device 70. Card delivery arrival detection signal S
2, the control device 70 inputs the card sheet transport belt 3
Since the belt transport control signal S7 is output to 0, the card sheet transport belt 30 stops. Although not shown, a fan is provided on the downstream side of the vacuum hot press device 17, and is cooled to, for example, about 50 ° C. by wind from the fan until the card assembly 20 discharged from the vacuum hot press device 17 is cut. It is.

On the other hand, in the vacuum hot press device 17, the second heat bonding is performed. When the second heat bonding is completed, the vacuum heat press device 17 outputs an end signal S6 to the control device 70. After that, a belt transport control signal S7 is output to the card sheet transport belt 30 from the control device 70 which has received the card sending position detection signal S1 from the sensor 71. The card sheet transport belt 30 starts moving the card assembly 20 by the belt transport control signal S7, and the card assembly 20 after the second heating and bonding is transported from the vacuum heat press device 17 to the cutting device 40.

At this time, the drive rollers 16 also cooperate to move the card assembly 20 downstream. At this stage, the card assembly 20 can be cut. Therefore, when the second card assembly 20 is transported from the vacuum heat press device 17 to the cutting device 40, the sensor 72 detects that the card assembly 20 has arrived. A card arrival detection signal S2 is output from the sensor 72 to the control device 70.
The control device 70 that has received the card arrival detection signal S2 outputs the belt conveyance control signal S7 to the card sheet conveyance belt 30, so that the card sheet conveyance belt 30 stops.

At the same time, a cutting control signal S8 is output to the cutting device 40. In the cutting device 40 that has received the cutting control signal S8, the card assembly 20 is cut into one unit of electronic card sheet. Similar operations are repeated for the third and subsequent times. Thereby, a plurality of sheet-like electronic card sheets can be obtained from the card assembly 20.

As described above, according to the electronic card manufacturing apparatus 100 of the present embodiment, a sheet-like top sheet 5A covering one chip storage sheet 3 and a sheet sheet covering the other chip storage sheet 3 Since a gap can be formed between the top sheet 5A and the top sheet 5A, the top sheet 5A at that portion can be omitted.

Accordingly, it is possible to continuously print the image display information such as “employee's card”, “name”, and “date of issue” in the transport direction without leaving a gap in the top sheet 5. Thereby, more electronic cards can be manufactured from the topsheet 5 per unit length than in the conventional method.

The case where the slitter 25 is provided in the electronic card manufacturing apparatus 100 has been described. However, the present invention is not limited to this. For example, the top sheet 5 cut into a single sheet is obtained from the beginning, The electronic components 4 may be supplied one by one on the long sheet-shaped electronic component 4 or the chip storage sheet 3 storing the electronic component.

Next, the electronic card 50 manufactured by the electronic card manufacturing apparatus 100 will be described with reference to FIGS. The electronic card 50 shown in FIG.
cm, horizontal length is about 9cm, thickness is 0.5 ~
It has a thickness of about 1.0 mm, and has a three-layer structure when roughly divided except for the adhesive member.

The lowermost layer of the electronic card 50 is provided with a back sheet 1 having a thickness of about 100 μm as a substrate. The back sheet 1 further has a writing layer (not shown) that can be written with a pen. A frame member 2 is provided in an outer peripheral area on the back sheet 1 to prevent intrusion of water or chemicals from the outside.

Inside the frame member 2, a chip storage sheet 3 is provided as a porous storage member, and an electronic component 4 is stored in advance. Generally, IC chip 4A is 200-30
It is formed as thin as about 0 μm. The antenna 4B has the same thickness. In this example, at least the frame member 2 is made of a water-resistant and chemical-resistant resin material that is substantially equal to the thickness of the electronic component 4.

Further, the porous chip storage sheet 3 includes
A woven or nonwoven resin sheet is used. A woven or nonwoven resin sheet is used for the porous storage member. For example, when the thickness of the frame member 2 is set to 500 μm and the electronic component 4 having a thickness of about 300 μm is protected above and below by a porous material having cushioning properties or an adhesive member, the durability is further improved.

The reason why a porous resin sheet is used for the chip storage sheet 3 is that the impregnating property of the adhesive member is improved and the adhesive property between the members becomes superior. The electronic components 4 are an IC chip 4A for electrically recording information relating to the user of the electronic card 50, and a coil-shaped antenna 4B connected to the IC chip 4A. IC chip 4A
Is a memory only, or a microcomputer in addition to the memory. May include capacitors.

Since the electronic card 50 is of a non-contact type, it does not have any information input / output terminals. The information is converted into a specific modulated radio wave, received by the antenna 4B, demodulated by an IC chip, written into a memory or the like, or read therefrom. In a method used for a normal non-contact type IC card, the driving power source can take in external electromagnetic energy into the antenna 4B. For example, a DC power supply is obtained by rectifying an electromotive force generated by electromagnetic induction. Of course, in addition to this, it is conceivable to take in electricity from external high-frequency electromagnetic energy into the antenna or other objects.

In this example, the electronic component 4 is previously covered with a porous resin sheet, and the electronic component 4 is protected. On the entire surface of the back sheet 1 including the frame member 2 surrounding the electronic component 4, an adhesive member is interposed so as to enclose the chip storage sheet 3 so as to have a thickness of 100 μm as the top sheet 5 A.
About m top sheets 5 are bonded. The topsheet 5 is formed, for example, on a film support 51 shown in FIG.
2. An anchor layer 53, an image receiving layer 54 and an upper layer 55 are laminated. The adhesive member 10 is applied to the film support 51 side.

The film support 51 is preferably formed of a resin such as polyethylene terephthalate (PET) or polypropylene (PP). In particular, when a biaxially stretched resin is used, a thin topsheet 5 having excellent strength can be formed. The film thickness of the film support 51 is, for example, 12 μm or more (particularly 25 μm) when a biaxially stretched polyethylene terephthalate resin is used.
It is preferably 300 μm or less (particularly 250 μm).

The cushion layer 52 is provided to alleviate the influence of the unevenness of the IC chip 4A when the film support 51 has a structure containing bubbles or is formed of a flexible material. In addition, the cushion layer 52 has a function of improving the contact of the thermal head during the image display processing.

[0065] Preferably the tensile modulus is as a cushion layer 52 (ASTM D790) is 20 kgf / mm ² or more, and is preferably 200 kgf / mm ² or less. The thickness of the cushion layer 52 is preferably 2 μm or more (particularly 5 μm) from the viewpoint of the cushion effect, and is preferably 200 μm or less (particularly 50 μm) from the viewpoint of the overall thickness and curl suppression.

As a member forming the cushion layer 52, for example, polyethylene resin, polypropylene resin,
Polybutadiene resin, ethylene-vinyl acetate copolymer resin, ethylene-ethyl acrylate copolymer resin, styrene-butadiene-styrene block copolymer resin, styrene-isoprene-styrene block copolymer resin, styrene-ethylene-butadiene- Polyolefin resins such as a styrene block copolymer resin and a styrene-hydrogenated isoprene-styrene block copolymer resin are preferred because of their flexibility.

The top sheet 5 is a printing member, and image display information is printed in a predetermined area on the front surface in advance. The image display information is a field in which the electronic card 50 is used, for example, “XXX employee ID”, “name”, “issue date”, and the like. The printing member is provided with an image receiving layer 54 for forming a photograph of the face of the user of the card 50. The image receiving layer 54 is made of a material such as a sublimation dye or a diffusion dye. A face photograph or the like is formed by fixing the image receiving layer 54 by trapping these dyes by applying heat by a thermal head.

As a material of the image receiving layer 54, a polymer material such as a polyester resin, a polyvinyl chloride resin, a polyvinyl acetal resin, a polyvinyl butyral resin, an epoxy resin, and an acrylic resin can be used. Among them, the use of a polyester-based resin is preferable from the viewpoint of the environment. The image receiving layer 54 is formed by powdering these resins, dissolving them in a solvent such as isocyanate, coating them with a gravure coater or the like, drying them, and then volatilizing the solvents.

The layer adjacent to the image receiving layer 54, for example, the film support 51 or the cushion layer 52 is preferably a resin mixed (containing) with a white pigment in order to enhance the image formed on the image receiving layer 54. The present invention is not limited to this. In order to increase the whiteness, a layer provided with voids may be used. The voids provide cushioning. Preferred examples of the white pigment include, but are not limited to, titanium oxide, barium sulfate, and calcium carbonate.

FIG. 6 is a cross-sectional view showing the laminated structure of the back sheet 1. The back sheet 1 of this example has a film support 11
It has a writing layer 12 below. The writing layer 12 is obtained by diffusing calcium carbonate and silica fine particles into a polyester emulsion. Similarly to the image receiving layer 54 of the topsheet 5, the writing layer 12 is formed by dissolving the above-described material with a solvent, applying the solution with a gravure coater or the like, and then drying and evaporating the solvent. The adhesive member 10 is applied on a support.

In this example, a thermosetting resin or a reactive hot melt resin is used for the adhesive member 10. As the thermosetting resin, a gel epoxy resin generally called a B-stage epoxy is used.

Examples of the reactive hot melt resin include Hen.
Polyamide-based reactive hot-melt resins such as macromelt series manufactured by Kel, Calflex TR and Quinton series manufactured by Shell Chemical Co., Ltd., Tufprene manufactured by Asahi Kasei Corporation, and Firestone Synthetic Ru.
Ber and Latex, Tuffden, Phi
SOLPLEN 40 manufactured by lips Petroleum
Thermoreversible elastomer type reactive hot melt resin such as No. 0 series is preferable. Sumitomo, Sumitomo Chemical Co., Ltd., Vistax, Chisso Petrochemical Co., Ltd., Mitsubishi Yuka Yucatak, Henkel Macro Melt Series Preferred are polyolefin-based reactive hot melt resins such as Tuffmer manufactured by Mitsui Petrochemical Co., APAO manufactured by Ube Lexen, Eastman Bond manufactured by Eastman Chemical, and A-FAX manufactured by Hercules. Further, Sumitomo 3M TE030 and TE100 manufactured by Hitachi Chemical Co., Ltd., Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bondmaster 170 series manufactured by Kanebo NSC, Henkel
A reactive hot-melt resin such as Macroplast QR3460 manufactured by Co., Ltd. is preferable, and a reactive hot-melt resin of an ethylene / vinyl acetate copolymer system or a polyester-based reactive hot-melt resin is preferable. The reactive hot melt resin has a property of being cured by absorbing moisture after bonding. Compared with a normal hot melt resin, the reactive hot melt resin has an advantage that the stability is high at a high temperature of 80 ° C. or 90 ° C.

In this example, the frame member 2 has an IC chip 4
For example, a frame member 2 having an opening having substantially the same size as the outer peripheral region of the electronic component 4 is formed on the back sheet 1 and then formed on the back sheet 1. Inside the frame member 2, the chip storage sheet 3 in the form of a single sheet storing the electronic component 4 is arranged. Thereafter, when the top sheet 5 is formed on the entire surface of the back sheet 1 on which the chip storage sheet 3 is arranged, the electronic card 1 shown in FIG.
00 is obtained. Of course, a water-resistant and chemical-resistant resin material is used for the frame member 2.

As described above, according to the electronic card 50 of the present embodiment, the outer peripheral area of the porous chip storage sheet 3 in which the electronic components 4 such as the IC chip 4A and the antenna 4B shown in FIG. , The thickness t of the IC chip 4A
A frame member 2 which is slightly thicker and made of a water-resistant and chemical-resistant resin material is provided.

Accordingly, since the peripheral edge of the chip storage sheet 3 containing the electronic components 4 shown in FIG. 8 can be strengthened by the frame member 2, the chip storage sheet 3 is excellent in water absorption and corrosion resistance, resistant to peeling, and has a reduced card thickness. An extremely thin electronic card 50 can be provided.

Next, three manufacturing methods of the electronic card 50 according to the present embodiment will be described with reference to FIGS.

(1) First Embodiment FIGS. 9A to 9C show an electronic card 5 according to a first embodiment.
FIG. 11 is a cross-sectional view of an example of a forming step showing a manufacturing method of No. 0 FIG.
FIG. 14 to FIG. 14 are top views showing the sheet-like members that complement it. In this example, the chip storage sheet 3 arranged inside the sheet-shaped frame member 2 is selectively bonded between the back sheet 1 and the sheet-like top sheet 5A with the adhesive member 10A.
The case where the card assembly 20 bonded with the intermediary of the card assembly 10B is formed will be described.

In this example, the back sheet 1 is wound around the delivery shaft 6A of the back sheet supply section 6 shown in FIG. An electronic component 4 having a predetermined size is stored in advance in a long sheet-shaped chip storage sheet 3 made of a porous storage member, and the chip storage sheet 3 is stored in a chip sheet supply unit 8 shown in FIG.
Is wound around the delivery shaft 8A. Further, a sheet-like frame member 2 in which an opening 13 having substantially the same size as the outer peripheral region of the electronic component 4 is formed in advance is wound around the delivery shaft 7A of the frame member supply unit 7. The topsheet 5 is wound around a delivery shaft 9A of the topsheet supply unit 9 shown in FIG. It is assumed that these members are prepared.

First, in FIG. 9A, the chip storage sheet 3 fed from the chip sheet supply unit 8 is bonded to the back sheet 1 fed from the back sheet supply unit 6. The surface of the chip storage sheet 3 is impregnated with a thermosetting epoxy resin as an adhesive member 10A. The back sheet 1 has a writing layer 12 shown in FIG. 10 that can be written with a pen. An alignment mark p0 is also printed on the end of the back sheet 1 in advance. This alignment mark p0
Are formed for each card area. The alignment mark p0 may be a black line or block having a low reflectance that can be detected by the optical sensor, but may be a magnetic mark, a slit, or a hole.

The chip storage sheet 3 is made of a woven or non-woven resin sheet. The chip storage sheet 3 shown in FIG.
And other electronic components 4 are stored. The electronic component 4 includes a chip capacitor and the like. The thickness of the frame member 2 is 45
It is about 0 μm. The thickness of the IC chip 4A is 300 μm
And the thickness of the antenna 4B is about 300 μm. For example, a urethane wire having a diameter of about 0.1 mm is about 50 mm thick.
It is wound about times.

In this example, the reason why the chip storage sheet 3 is first formed on the back sheet 1 is to make the top sheet 5A in the form of a single sheet as flat as possible. That is, when the frame member 2 is formed on the back sheet 1 first, since the chip storage sheet 3 is formed in a long sheet shape, an excess portion of the chip storage sheet 3 covers the frame member 2. . Therefore, although slightly, the chip storage sheet 3 remains in the pressed frame member 2 in a thickness together with the adhesive member 10A. This uneven thickness prevents flattening of the topsheet 5A. By bringing this to the back side of the frame member 2, the topsheet 5A can be flattened.

The chip storage sheet 3 is placed on the back sheet 1.
9B, the frame member 2 is bonded from above the chip storage sheet 3 in FIG. 9B. The sheet-shaped frame member 2 and the chip storage sheet 3 are coated with a thermosetting reactive hot melt resin as an adhesive member 10B. FIG. 1 shows a frame member 2 having a size capable of storing electronic components 4 one by one.
An opening 13 shown in FIG. 2 is continuously opened in the transport direction, for example. The size of the opening 13 is equal to the size of the outer peripheral region of the electric component 4, and its thickness is substantially equal to the thickness of the electronic component 4. Moreover, the sheet-like frame member 2 is formed using a water-resistant and chemical-resistant resin material. The frame member 3 is made of, for example, a thermosetting resin of a reactive hot melt type or an acrylic type, which is formed into a sheet in advance, and is formed by punching an opening 3 in the resin sheet.

Thereafter, in FIG. 9C, a sheet-like top sheet 5A is formed on the entire surface of the sheet-like frame member 2 and the chip storage sheet 3 disposed inside the frame member 2. As the top sheet 5A in the form of a single sheet, the top sheet 5A cut in real time by the slitter 25 based on the cutting control signal S11 as described in FIG. 1 may be used. Is cut into a single-sheet sheet and stored in a specific storage case or the like, and the single-sheet surface sheet 5 is sequentially arranged from the storage case.
A may be pulled out and used.

Image display information for the user of the electronic card 50 is printed on the front sheet 5 in a predetermined print area shown in FIG. This print area is hereinafter referred to as an image display area A. In this example, the topsheet 5 is shown in FIG.
3 has a long sheet shape in which the image display information shown in FIG. 3 is continuously printed in the transport direction. An alignment mark p0 is printed on the end of the topsheet 5 in advance. In this example, image display information such as “employee's card”, “name”, and “date of issue” are arranged in three columns in the width direction on the long sheet-shaped top sheet 5, and the image display is performed. Information is printed continuously in the transport direction. Dummy areas called "ears" are provided on both sides of the image display area A, and marks to be cut p3 and the like are printed. The cut mark p3 is printed, for example, at the boundary of the image display area A.
In this example, the cutting may be performed at the cutting position of the cut mark p3 of the card assembly 20 so as to include the six image display areas A. Six electronic cards can be taken from one unit of electronic card sheet.

When forming the single-sheet top sheet 5 on the frame member 2 and the chip storage sheet 3, a foamable urethane sheet (not shown) is placed inside the frame member 2, that is, the electronic component 4. It may be formed between the storage area and the topsheet 5. The urethane sheet can further protect the top sheet 1 and the like made of the electronic component 4.

Thereafter, when a heating and pressing treatment is performed in the same manner as in the conventional method, the sheet-shaped card assembly 20 shown in FIG. 14 is completed. The card assembly 20 discharged from the vacuum heat press device 17 is not completely cured, that is, is in a so-called semi-dry state. In this example, the card assembly 20 is cut from the frame member 2 to form one unit of an electronic card sheet.
For example, the card assembly 2 based on the alignment mark p0 formed outside the image display area A of the card assembly 20
0 is cut into two or more.

Thereafter, the electronic card sheet is completely cured and then punched out by a punching device or the like, so that one electronic card 50 is obtained. The hatched portion shown in FIG. 14 is the frame member 2 formed to protect the electronic component 4.
When the card assembly 20 is punched into one electronic card 50, the frame member 2 becomes a harder part than the central part of the electronic card 50. When cutting is performed with the above-described frame member 2 as a target, the card assembly 20 can be cut without deformation. Even if the adhesive member 10 is not completely cured, if the frame member 2 is cut, the card is hardly distorted.

As described above, according to the method of manufacturing the electronic card 50 according to the present embodiment, a plurality of the chip storage sheets 3 storing the electronic components 4 are arranged and fixed on the long sheet-like back sheet 1 and the front side is fixed. The sheet 5 is cut in advance into a single-sheet shape so as to cover the chip storage sheet 3, and the single-sheet top surface sheet 5A, the chip storage sheet 3, and the back sheet 1 are bonded to each other with an adhesive member. It is intended to be interposed and bonded.

With this configuration, a gap can be formed between the sheet-like top sheet 5A that covers one chip storage sheet 3 and the sheet-like top sheet 5A that covers the other chip storage sheet 3. Therefore, the topsheet 5A between them can be omitted. Thereby, the surface sheet 5 can be largely saved as compared with the case where the surface sheet 5 is used in the form of a long sheet and bonded onto the chip storage sheet 3. In this example, the used amount of the topsheet 5 could be reduced by 10% to 18%.

Further, although alignment is difficult in the conventional method, in this embodiment, since the back sheet 1 is a long sheet or a large-size sheet and the top sheet 5 is a cut sheet, the thickness of the top sheet 5 and the back sheet 1 is large. Even if the difference is caused by the difference in pod surface processing, surface printing, and even the respective storage condition, manufacturing conditions, elapsed time after manufacturing, and manufacturing lot, sheet-to-sheet processing for the long sheet-shaped back sheet 1 A degree of freedom (margin) is generated in the positioning of the sheet-like top sheet 5A, and not only is the positioning very easy,
Very resistant to that displacement. In particular, when format printing of image display information or the like has already been performed on the top sheet 5A, positioning with the chip storage sheet 3 is easy.

Therefore, even if the conveying speed of the card sheet conveying belt 30 increases, the back sheet 1 and the top sheet 5A
Can be maintained uniformly. Thereby, the image display information of the top sheet 5A and the back sheet 1
And the writing layer 12 can be matched with high accuracy, and the production yield is remarkably improved.

The excess adhesive member protrudes from the back sheet 1 onto the back sheet 1 in the form of a long sheet. Therefore, the protruding adhesive member is wiped off with the release sheet 28,
Alternatively, since the sheet is confined on the frame member 2 between the single sheets, the card sheet transport belt 30 is not stained.

In this example, a case has been described in which the chip storage sheet 3 in which the chip storage sheet 3 of the electric component 4 is formed in a sheet shape in advance is used, but the present invention is not limited to this.
For example, a porous first resin sheet 21 is formed on the frame member 2 of the back sheet 1 shown in FIG.
The electric component 4 is arranged on the first resin sheet 21 shown in FIG. At this time, the electric components 4 may be arranged by dropping the electronic components 4 onto the first resin sheet 21 using a pallet-like gripper or the like. At this time, each member is fixed to the back sheet 1 with an adhesive member 10A or the like. Thereafter, in FIG. 15C, a porous second resin sheet 22 is formed on the electric component 4. According to this forming method, the chip storage sheet 3 ′ can be formed on the back sheet 1 in real time.

Although the case where the chip storage sheet 3 is formed first on the back sheet 1 has been described, the present invention is not limited to this, and the frame member 2 is formed first on the back sheet 1 shown in FIG. 16A. Thereafter, the chip storage sheet 3 may be formed on the frame member 2 shown in FIG. 16B, and the sheet-like top sheet 5A may be formed on the frame member 2 and the chip storage sheet 3 shown in FIG. 16C. Also in this forming method, since the peripheral portion of the chip storage sheet 3 can be strengthened by the frame member 2, it is possible to manufacture the electronic card 50 which is excellent in water absorption and corrosion resistance, resistant to peeling and extremely thin in card thickness. it can.

In this embodiment, the case where the reactive hot-melt resin is used for the frame member 2 has been described. However, the present invention is not limited to this. It may be bonded using a reactive hot melt resin. According to the data obtained by experiments by the present inventors, the reactive hot melt resin as the adhesive member 10 is suitable for thinning the card, including maintaining flatness.

Also, as in the present embodiment, the electronic component 4
The electronic card 50 having a sandwich structure in which the frame member 2 surrounding the frame is bonded to the back sheet 1 and the top sheet 5 using a reactive hot melt resin, the influence of the permeation of moisture from the end face of the card is extremely reduced. There are advantages too.

(2) Second Embodiment FIGS. 17A to 17C are cross-sectional views of a forming process example showing a method of manufacturing an electronic card 50 according to a second embodiment. FIG. 18 is a top view showing an example of applying the adhesive member of the chip storage sheet 3 to supplement the example of the forming process. In this example, the frame member 2 is simultaneously formed in real time in the step of enclosing the chip storage sheet 3 by utilizing the difference in the chemical and physical characteristics of the adhesive member.

For example, in FIG.
The chip storage sheet 3 is formed thereon. Then, FIG. 17B
Then, two types of adhesive members having different chemical and physical properties are selectively impregnated on the area of the chip storage sheet 3.
In this example, a thermosetting adhesive member 10B having different chemical and physical characteristics is attached to the outer periphery of the chip storage sheet 3 with respect to the adhesive member 10A in the storage area of the electric component 4 inside the wavy line shown in FIG. Impregnate the part. The outer peripheral portion of the chip storage sheet 3 is a region to function as a frame, and a water-resistant and chemical-resistant resin material is formed in this region. As this resin material, a thermosetting resin such as a hot-melt resin is used.

Then, after bonding the sheet-like top sheet 5 shown in FIG. 17C onto the chip storage sheet 3, the resin material is cured by heat treatment. This heat treatment is performed at the same time as the pressing by the vacuum hot pressing device 17. By this heat bonding process, the adhesive member at the peripheral portion of the card becomes harder like the frame 10C than at the central portion of the card.

As described above, according to the present embodiment, unlike the first embodiment, the peripheral portion of the chip housing sheet 3 housing the electronic components 4 can be heat-cured without using the frame member 2. Since it can be strengthened by the frame 10C made of an adhesive member,
Excellent water absorption and corrosion resistance, strong peeling, and
An electronic card 50 having an extremely thin card thickness as compared with the first embodiment can be manufactured.

(3) Third Embodiment FIGS. 19A to 19C are cross-sectional views of a forming process example showing a method of manufacturing an electronic card 50 according to a third embodiment. In this example, the frame member 2 is formed on the back sheet 1 in real time using a resin that is cured by ultraviolet rays.

For example, in FIG.
The chip storage sheet 3 is formed thereon. Then, FIG. 19B
Then, the chip storage sheet 3 is impregnated with the resin 10D which is cured by ultraviolet rays. A water-resistant and chemical-resistant resin material is used for the resin 10D. An epoxy or acrylic resin is used as the resin material.

Thereafter, in FIG. 19C, the resin 10
The frame member 2 is formed by irradiating D with ultraviolet rays. Then, the resin 10D is cured by heat treatment. In this heat treatment, the back sheet 1, the chip storage sheet 3, and the sheet-like top sheet 5 are heated and bonded by the vacuum heat press device 17. By this heat bonding process, the peripheral portion of the card becomes harder like a frame than the central portion of the card.

As described above, according to the present embodiment, similarly to the second embodiment, even if the frame member 2 is not used, the peripheral portion of the chip storage sheet 3 in which the electronic components 4 are stored is heat-cured. Can be strengthened with the passage of time by the adhesive member, so that it is possible to manufacture the electronic card 50 which is excellent in water absorption and corrosion resistance, resistant to peeling, and extremely thin in card thickness as compared with the first embodiment.

In each of the embodiments, the case where six electronic cards 50 are punched out from one sheet-like top sheet 5A has been described. However, the present invention is not limited to this. A case in which the top sheet 5 is cut into a single-sheet sheet in a size of 50 sheets may be used.

In each embodiment, the case where the electronic component 4 is stored in the chip storage sheet 3 in the form of a long sheet or a single sheet has been described. However, the present invention is not limited to this. Electronic card 50 sandwiched between a back sheet 1 in the form of a long sheet and a top sheet 5A in the form of a single sheet
May be formed.

Further, in each embodiment, the case where the outer periphery of the electronic component 4 or the chip storage sheet 3 containing the electronic component 4 is surrounded by the frame member 2 has been described. However, the present invention is not limited to this. The electronic card 50 in which the chip storage sheet 4 or the chip storage sheet 3 is directly sandwiched between the long sheet-shaped back sheet 1 and the single sheet-shaped top sheet 5A may be formed. In any case, the sheet-like top sheet 5A can be saved.

[0108]

As described above, according to the electronic card manufacturing apparatus of the present invention, a sheet-like surface member, an electronic component and a substrate member are pasted together with an adhesive member interposed therebetween. And bonding means for bonding.

According to this configuration, a gap can be formed between the sheet-like surface member covering one electronic component and the sheet-like surface member covering the other electronic component. The surface member for that portion can be omitted.

According to the first method of manufacturing an electronic card of the present invention, after arranging a plurality of electronic components side by side on a long sheet-like substrate member, the sheet-like surface member is placed on the electronic component. And a member for the surface, an electronic component,
A member for a substrate is bonded with an adhesive member interposed therebetween.

With this configuration, a gap can be formed between the sheet-like surface member covering one electronic component and the sheet-like surface member covering the other electronic component. The members for the surface can be omitted. Thereby, the surface member can be saved as compared with a case where the surface member is formed into a long sheet shape and bonded on the electronic component.

According to the second method of manufacturing an electronic card of the present invention, after a plurality of long sheet-like storage members storing electronic components are arranged side by side on a long sheet-like substrate member, a single sheet The surface member is supplied onto the storage member, and the surface member, the storage member, and the substrate member are bonded to each other with an adhesive member interposed therebetween.

With this configuration, a gap can be formed between the sheet-like surface member that covers one storage member and the sheet-like surface member that covers the other storage member. The members for the surface can be omitted. Thus, compared to a case where the front surface member is formed into a long sheet shape and bonded on the storage member, the front surface member can be saved, and the cost of a non-contact IC card or the like can be reduced.

The present invention is applied to a non-contact type IC card such as a cash card, an employee ID card with a face photograph, an employee ID card, a member ID card, a student ID card, an alien registration ID and various driver's licenses, and a method of manufacturing the same. It is very suitable.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration example of an electronic card manufacturing apparatus 100.

FIG. 2 is a perspective view showing a configuration example of the slitter 25.

FIG. 3 is a block diagram illustrating an example of a control system of the electronic card manufacturing apparatus 100.

FIG. 4 is a perspective view showing a laminated structure example of an electronic card 50 according to each embodiment.

FIG. 5 is a cross-sectional view showing an example of a laminated structure of the top sheet 5 of the electronic card 50.

FIG. 6 is a cross-sectional view showing an example of a laminated structure of the back sheet 1.

FIG. 7 is a cross-sectional view illustrating an example of the relationship between the thickness of the frame member 2 of the electronic card 50 and the IC chip 4A.

8 is a frame member 2 surrounding the electronic component 4 of the electronic card 50. FIG.
It is a top view of the partial cross section which shows the example of a state.

FIGS. 9A to 9C are cross-sectional views illustrating an example of a forming process of the method of manufacturing the electronic card 50 according to the first embodiment.

FIG. 10 is a top view showing a printing example of the back sheet 1;

FIG. 11 is a top view showing a configuration example of the chip storage sheet 3.

FIG. 12 is a top view illustrating a configuration example of a sheet-shaped frame member 2.

FIG. 13 is a top view showing a cutting example for forming the top sheet 5 into a single-sheet sheet.

FIG. 14 is a top view showing an example of cutting the card assembly 20 after heat bonding.

FIGS. 15A to 15C are cross-sectional views illustrating an example of a process of forming another chip storage sheet 3 of the electronic card 50. FIGS.

FIGS. 16A to 16C are cross-sectional views illustrating another example of a forming process of the electronic card 50 according to the first embodiment.

17A to 17C are cross-sectional views illustrating an example of a forming process of a method for manufacturing the electronic card 50 according to the second embodiment.

FIG. 18 is a top view showing an example of applying a thermosetting resin to the chip storage sheet 3.

19A to 19C are cross-sectional views illustrating an example of a forming process of a method for manufacturing an electronic card 50 according to a third embodiment.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 back sheet (substrate member) 2 frame member 3 chip storage sheet (storage member) 4 electronic component 4A IC chip 4B antenna body 5 top sheet (top member) 5A sheet-like top sheet 6 back sheet supply Unit (first supply unit) 7 Frame member supply unit 8 Chip sheet supply unit (second supply unit) 9 Top sheet supply unit (third supply unit) 10, 10A, 10B Adhesive member 13 Opening 16, 19A Driving roller 17 Vacuum heat press (bonding means) 20 Card assembly 25 Slit 30 Card sheet transport belt 40 Cutting device 70 Control device 50 Electronic card 100 Electronic card manufacturing device

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshio Kato 1 Sakuracho, Hino-shi, Tokyo Konica Corporation

Claims (25)

[Claims] A first supply unit for supplying a long sheet-shaped substrate member; and a second supply unit for supplying an electronic component for a card onto the substrate member by the first supply unit. A third supply means for supplying a sheet-like surface member for covering an electronic component on the substrate member, the sheet-like surface member, and the electronic component. A bonding means for bonding the substrate member with an adhesive member interposed therebetween. 2. A cutting device according to claim 1, further comprising cutting means for cutting the long sheet-shaped surface member into a single sheet having a size covering at least one of the electronic components. Electronic card manufacturing equipment. 3. The electronic card manufacturing apparatus according to claim 1, wherein a reactive hot melt resin is used for the adhesive member. 4. A step of arranging a plurality of electronic components for a card on a substrate member in the form of a long sheet, and a sheet-like sheet sized to cover the electronic components arranged on the substrate member. A step of supplying a surface member, the sheet-like surface member, and the electronic component;
A method of manufacturing an electronic card, comprising a step of bonding the member for a substrate with an adhesive member interposed therebetween. 5. The method for manufacturing an electronic card according to claim 4, wherein the surface member, the substrate member, and the electronic component are joined with a thermosetting adhesive member. 6. The method for manufacturing an electronic card according to claim 4, wherein the surface member, the substrate member, and the electronic component are joined with a reactive hot melt resin. 7. A step of storing electronic components for a card in a storage member having a predetermined shape; a step of arranging a plurality of electronic components stored in the storage member in a member for a long sheet-like substrate; Supplying a member for a sheet-like surface having a size sufficient to cover the storage member disposed on the member for; a member for the sheet-like surface, and the storage member;
A method of manufacturing an electronic card, comprising a step of bonding the member for a substrate with an adhesive member interposed therebetween. 8. The method for manufacturing an electronic card according to claim 7, wherein a woven, non-woven, or porous resin sheet is used for the storage member. 9. The method for manufacturing an electronic card according to claim 7, wherein said electronic component is stored in a single sheet-like storage member. 10. The method for manufacturing an electronic card according to claim 7, wherein said electronic component is stored in a long sheet-shaped storage member. 11. The method for manufacturing an electronic card according to claim 7, wherein the member for the front surface, the member for the substrate, and the housing member are joined by a thermosetting adhesive member. 12. The method for manufacturing an electronic card according to claim 7, wherein the surface member, the substrate member, and the housing member are joined with a reactive hot melt resin. 13. The electronic card according to claim 4, wherein the long sheet-shaped surface member is cut into a single-sheet sheet large enough to cover one or more of the electronic components. Production method. 14. The method for manufacturing an electronic card according to claim 4, wherein the front surface member is a resin sheet having a size substantially equal to that of an electronic card. 15. The method for manufacturing an electronic card according to claim 4, wherein the surface member is a resin sheet having a size for obtaining a plurality of electronic cards. 16. The electronic component according to claim 4, wherein the electronic component is an IC chip for electrically storing information of the card user, and a coil-shaped antenna connected to the IC chip. Electronic card manufacturing method. 17. The method for manufacturing an electronic card according to claim 4, wherein the surface member is a printing member on which image display information is printed in a predetermined area in advance. 18. The method according to claim 17, wherein the printing member has an image receiving layer for forming a photograph of the face of the card user. 19. A long sheet-like frame member having an opening that is substantially the same as the outer peripheral region of the electronic component or slightly larger than the outer peripheral region of the electronic component is formed on the substrate member. The method for manufacturing an electronic card according to claim 4 or 7, wherein 20. The frame member according to claim 19, wherein the frame member is formed using a thermosetting adhesive member having different chemical and physical characteristics from the adhesive member of the storage member. Electronic card manufacturing method. 21. The method according to claim 19, wherein the housing member is impregnated with an epoxy resin, and the frame member is coated with a reactive hot melt resin. 22. The frame member according to claim 19, wherein a water-resistant and chemical-resistant resin material is used which is substantially equal to or thicker than the electronic component. Electronic card manufacturing method. 23. The method according to claim 19, wherein a reactive hot melt resin or an epoxy resin is used for the frame member. 24. The frame member, wherein a water-resistant and chemical-resistant resin material is formed on an outer peripheral region of the electronic component or the housing member, and then the resin material is cured by heat treatment. 20. The method for manufacturing an electronic card according to claim 19. 25. The frame member is formed of a resin cured by ultraviolet light or a member coated with the resin.
20. The method according to claim 19, wherein the resin is irradiated with ultraviolet rays.