JPH11306980A - Assembling method for image forming device and manufacture of the device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image forming device of good performance by conducting nigh precision assembly in the heating process of frit glass for adhesion. SOLUTION: In an image forming device to be assembled and a manufacturing method, the device comprises a rear plate where a plurality of electron emitting elements and wirings are formed, a face plate where a phosphor member arrangerd confronting the rear plate and an accelerating electrode are formed, and a support member 103 to sustain the atmospheric pressure (called spacer hereinafter) arranged between the face plate and rear plate, wherein a jig is used having a smaller coefficient of thermal expansion than glass boards to form the face plate and rear plate in the temp. range in which the spacer 103 is heated when the face plate or rear plate are adhered to the spacer 103 by glass softening with heat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an assembling method and a manufacturing method of a flat type image forming apparatus having an atmospheric pressure resistant support member (spacer).

[0002]

2. Description of the Related Art When a large-sized display panel is formed in a flat type image forming apparatus (flat panel display) using electron-emitting devices, it is necessary to maintain the inside of the panel at a vacuum, so that the atmospheric pressure is supported. for,
An anti-atmospheric pressure support member (hereinafter, referred to as a spacer) is provided inside the panel, and the weight of the substrate is reduced without increasing the thickness of the face plate.

When a spacer is formed on a display panel, the spacer is placed on a black stripe that does not contribute to light emission on the face plate side where the fluorescent member and the acceleration electrode are formed so as not to hinder image display. On the rear plate side where a plurality of electron-emitting devices and wirings are formed, they are installed on matrix wirings other than the electron emission positions.

[0004] The spacer and the face plate or the rear plate are bonded by glass which performs positioning and softens at a low temperature.

As a conventional method for performing this positioning, Japanese Patent Application Laid-Open No. 58-214245 and Japanese Patent Application Laid-Open No. 59-9434 are disclosed.
There is No. 3 publication.

[0006]

However, when bonding with glass that softens at a low temperature (hereinafter referred to as frit glass), each substrate is heated to 400 to 450 ° C., so that expansion of the substrate glass due to heating is as follows. Significantly affects assembly accuracy.

The above conventional example has the following drawbacks.

(1) In JP-A-59-94343, alignment is performed at room temperature using a microscope or the like, and thereafter, bonding is performed by heating. However, during heating, a positional shift occurs due to thermal expansion of the glass substrate. This makes it difficult to obtain a high-precision panel.

(2) In Japanese Patent Application Laid-Open No. 58-214245, alignment is performed using holes in the substrate and positioning pins. However, there is a disadvantage that the accuracy of alignment is deteriorated due to the accuracy of the holes and pins of the plate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a high quality image forming apparatus by performing high-precision assembly in a heating step of a frit glass for bonding.

[0011]

SUMMARY OF THE INVENTION The present invention achieves the above object and includes a rear plate on which a plurality of electron-emitting devices and wirings are formed, a fluorescent member disposed opposite to the rear plate, and an acceleration member. In an image forming apparatus having a face plate on which electrodes are formed, and a spacer disposed between the face plate and the rear plate, the face plate or the rear plate;
When bonding the spacer and the glass with heat, a jig having a thermal expansion coefficient smaller than that of a glass substrate forming the face plate and the rear plate in a heating temperature range of the spacer is used. It is characterized by doing.

Further, the present invention provides a rear plate on which a plurality of electron-emitting devices and wirings are formed, a face plate on which a fluorescent member and an accelerating electrode are arranged opposite to the rear plate, and the face plate. And a spacer disposed between the rear plate and the rear plate, wherein when the face plate or the rear plate and the spacer are bonded with an adhesive, a heating temperature range of the spacer is used. And a jig having a smaller coefficient of thermal expansion than a glass substrate forming the face plate or the rear plate.

[0013]

Embodiments of the present invention will be described in detail with reference to the drawings.

An outline of a method of assembling a flat type image forming apparatus (flat panel display) using electron-emitting devices will be described with reference to FIG. In FIG. 1, a conductive black stripe 111 is provided between phosphors of a face plate 112, and this black stripe 111
A spacer spacing jig 110 for attaching and fixing a spacer 103 to a portion is shown. The spacer spacing jig 110 is provided with a spacer spacing hole 115, into which the spacer 103 is inserted.
A frit is applied to the corresponding portion of No. 03 and fixed to the face plate 112.

The spacer spacing jig 110 uses a material having a smaller coefficient of thermal expansion than the glass substrates used for the face plate 112 and the rear plate. In this connection, the high temperature at the time of fixing with the frit glass prevents the misalignment of the positioning, and the spacer 103 and the black stripe 111 on the face plate 112 can be accurately provided.

FIG. 2 is an exploded view of a flat type image forming apparatus (flat panel display) using an electron-emitting device. In the figure, reference numeral 101 denotes a face plate on which a fluorescent member and an accelerating electrode are formed. An accelerating electrode is vapor-deposited on the inside of the face plate 101, and a phosphor is applied. A black stripe is formed on the boundary between the phosphor and the adjacent phosphor. Is provided. Reference numeral 102 denotes a rear plate on which a plurality of electron-emitting devices and wirings are formed, and has electrodes and electron-emitting portions arranged in a matrix. Reference numeral 103 denotes a spacer disposed between the face plate 101 and the rear plate 102, and reference numeral 104 denotes an outer space for maintaining a height between the face plate 101 and the rear plate 102 to form a vacuum envelope. It is a frame. This image forming apparatus includes a face plate 101, an outer frame 104, and a rear plate 102 as an envelope, each of which is fixed with frit glass, and thereafter the inside is maintained in a vacuum state. Then, a minute current is applied to the electrodes sandwiching the electron emission portion to emit electrons from the electron emission portion, and the electrons are attracted to the high voltage side applied to the acceleration electrode of the face plate 101, and the electrons are emitted to the phosphor. By hitting, an image is formed.

Hereinafter, the method for assembling the image forming apparatus according to the present embodiment will be described. A slurry of frit glass is applied to a portion of the surface of the face plate 101 or the rear plate 102 where the spacer 103 is connected. The part connecting this spacer 103 is a face plate 101
In the case of the above, it is arranged on the black stripe, and in the case of the rear plate, it is arranged on the wiring.

FIG. 3 is a schematic view showing a pattern of an assembling process of the image forming apparatus. FIG. 3 shows an example of the structure between the rear plate 102 and the face plate 101. Reference numeral 105 denotes a matrix X.
A spacer 10 on the matrix X wiring 105
3 is formed. A spacer 103 is arranged on a matrix X wiring 105 for controlling and supplying a current to an electron emitting portion on the rear plate 102, and the spacer is fixed to a black stripe portion of the face plate 101.

Next, after the frit glass slurry applied on the spacer 103 inserted into the spacer spacing hole 115 of the spacer spacing jig 110 is dried and calcined, the face plate 101 is moved upward as shown in FIG. It is fixed to an assembly jig plate 107 provided on the heater 106. On the other hand, the spacer spacing jig 110 is attached to the assembly jig plate 109 provided on the lower heater 108, and the step of providing the spacer 103 on the face plate 101 corresponds to the position of the black stripe 111 coated with frit. Next, the spacer 103 is arranged.

Each member is heated by the upper heater 106 and the lower heater 108, and when the frit glass reaches a temperature (400-450 ° C.) at which the frit glass is softened and can be bonded, the upper heater 106 is lowered. Frit glass is fused and bonded between the face plate 101 and the spacer 103.

Next, the whole is cooled to around room temperature to obtain a face plate 112 to which the spacer 103 is adhered.
This state diagram is shown in FIG. FIG. 5 shows a flat spacer 10 on the black stripe of the face plate 112.
3 is a configuration diagram in which 3 are arranged in 3 rows and 15 rows in a matrix.

Next, as shown in FIG. 6, a face plate 112 to which the spacers 103 are bonded, a rear plate 113 to which frit glass is applied, and frit glass are applied by using the same heating device as in the previous step. Outer frame 114
Adhesion is performed.

In FIG. 6, the face plate 112
Is provided with an upper heater 106, which is a large flat plate heater, in contact with an assembly jig plate 107, and includes a face plate 112, an accelerating electrode and a phosphor, a black stripe, and a spacer 103 fixed on the black stripe. And warm to the softening temperature of the frit glass. On the other hand, on the rear plate 113, the wiring 105 adhered to the spacer 113 together with the electron-emitting portion is arranged.
A slit of frit glass is applied on the wiring 105,
The rear plate 113 is heated to a high temperature by the lower heater 108 disposed below the assembly jig plate 107, so that the frit glass is softened and adhered to the upper and lower sides together with the outer frame 114.

Through the steps described above, a flat image forming apparatus (flat panel display) as shown in FIG. 2 is obtained.

In the above embodiment, the case where the spacer is bonded to the face plate has been particularly described. However, the spacer is inserted into the spacer spacing jig for the rear plate and bonded to the wiring portion, and then the black of the face plate is bonded. Of course, it may be adhered to the stripe region.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic diagram that best illustrates the features of the present invention. In FIG. 1, spacers 103 are spacer spacing holes 115 provided in a spacer spacing jig 110.
Fixed inside.

The spacer spacing jig 110 is a face
Gala used for plate 112 and rear plate 113
Substrate (soda lime glass, coefficient of thermal expansion: 87.6 ×
10 ^-7/ ° C [25 to 400 ° C])
Zerodur, a small, glass ceramic
(Co., Ltd.) (Coefficient of thermal expansion: 0.5 × 10^-7/ ° C [20
３００300 ° C.]).

The spacer spacing jig 110 corresponds to the position of the black stripes 111 between the frit-coated phosphors on which the spacers 103 are to be provided on the face plate 112 when the glass substrate is heated to the frit bonding temperature. Further, a spacer spacing hole 115 was provided, and positioning was performed by combining a plurality of spacer spacing jigs 110. The plurality of spacer spacing jigs 110 are obtained by forming and stacking slit-shaped slit-shaped cutouts for the spacer spacing holes 115 in each slit, thereby simplifying the manufacturing process. Further, since the coefficient of thermal expansion of the spacer spacing jig 110 is smaller than the coefficient of thermal expansion of the face plate 112 and the rear plate 113, the bonding position of the spacer 105 can be accurately pressed and bonded, and assembly can be performed with high precision.

Next, a frit of frit glass is applied to the other end of the spacer adhered to the face plate, and a frit is also applied to the outer frame so that the face plate and the rear plate are softened by the frit glass. Then, the face plate and the spacer and the outer frame and the rear plate are integrally bonded. Thereafter, the inside of the envelope is evacuated and evacuated, and the image forming apparatus is assembled. The call image forming apparatus supplies a current to an electron emission portion arranged on the rear plate side to emit electrons, and irradiates the phosphors arranged on the face plate side with electrons, thereby forming a high-density image. Can be formed. In this embodiment,
Spacers can be precisely placed and bonded at desired positions,
The effect of the spacer on the image can be reduced.

In the above embodiment, the thermal expansion coefficient of the spacer spacing jig is particularly described when the spacer is fixed to the face plate. However, the same applies to the jig for bonding the spacer to the rear plate. A similar effect can be obtained by using a jig having a smaller coefficient of thermal expansion.

[0031]

As described above, according to the present invention, by using a jig having a thermal expansion coefficient smaller than that of the glass substrate forming the face plate and the rear plate, the size of the glass substrate due to the thermal expansion can be reduced. High-precision assembly and positioning that are not affected by changes are now possible.

Further, even when the size of the glass spacer is increased due to heating of the glass spacer, the size of the spacer spacing hole of the jig does not change.

When metal or glass is used for the jig, poor slidability at high temperatures occurs due to an increase in the coefficient of friction between members, in addition to dimensional changes due to thermal expansion. Such a defect did not occur because the elongation by heating was almost zero.

[Brief description of the drawings]

FIG. 1 is a perspective view for explaining an embodiment of the present invention.

FIG. 2 is a schematic view for explaining a panel assembling process according to an embodiment of the present invention.

FIG. 3 is a schematic view for explaining a panel assembling process according to the embodiment of the present invention.

FIG. 4 is a schematic view for explaining a panel assembling process according to the embodiment of the present invention.

FIG. 5 is a schematic diagram for explaining a panel assembling process according to the embodiment of the present invention.

FIG. 6 is a schematic view for explaining a panel assembling process according to the embodiment of the present invention.

[Explanation of symbols]

Reference Signs List 101 Face plate formed with fluorescent member and acceleration electrode 102 Rear plate formed with a plurality of electron-emitting devices and wiring 103 Anti-atmospheric pressure support member (spacer) 104 Outer frame 105 Matrix X wiring 106 Upper heater 107 Assembly jig Plate 108 Lower heater 109 Assembly jig plate 110 Spacer spacing jig 111 Black stripe coated with frit 112 Face plate bonded with spacer 103 113 Rear plate coated with frit glass 114 Outer frame coated with frit glass 115 Spacer spacing hole

Claims (3)

[Claims] 1. A rear plate on which a plurality of electron-emitting devices and wirings are formed, a face plate on which a fluorescent member and an acceleration electrode are arranged facing the rear plate, and the face plate and the rear plate In the method for assembling an image forming apparatus having a spacer disposed between the face plate and the rear plate, when bonding the spacer and the glass with heat softening glass,
An assembling method of an image forming apparatus, comprising using a jig having a thermal expansion coefficient smaller than a thermal expansion coefficient of a glass substrate forming the face plate or the rear plate in a heating temperature range of the spacer. 2. The method according to claim 1, wherein the jig has a coefficient of thermal expansion of 10% or less of a coefficient of thermal expansion of a glass substrate forming the face plate or the rear plate. A method for assembling an image forming apparatus. 3. A rear plate on which a plurality of electron-emitting devices and wirings are formed, a face plate on which a fluorescent member and an acceleration electrode are arranged facing the rear plate, and the face plate and the rear plate A method of manufacturing an image forming apparatus having an anti-atmospheric pressure supporting member (hereinafter, referred to as a spacer) disposed between the spacer and the face plate or the rear plate. A method of manufacturing the image forming apparatus, wherein the jig is manufactured using a jig having a smaller coefficient of thermal expansion than a glass substrate forming the face plate or the rear plate in a heating temperature range of the spacer. .