JPH11302535A - Polyamide resin composition - Google Patents
Polyamide resin compositionInfo
- Publication number
- JPH11302535A JPH11302535A JP11179098A JP11179098A JPH11302535A JP H11302535 A JPH11302535 A JP H11302535A JP 11179098 A JP11179098 A JP 11179098A JP 11179098 A JP11179098 A JP 11179098A JP H11302535 A JPH11302535 A JP H11302535A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- polyamide resin
- oxide
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 45
- 239000011342 resin composition Substances 0.000 title claims abstract description 24
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 29
- -1 borate compound Chemical class 0.000 claims abstract description 23
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000003063 flame retardant Substances 0.000 claims abstract description 17
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 17
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 15
- 150000002367 halogens Chemical class 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000011256 inorganic filler Substances 0.000 claims abstract description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 12
- 229920001577 copolymer Polymers 0.000 claims description 18
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 claims description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 9
- 239000005977 Ethylene Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 9
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 9
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 8
- 150000001336 alkenes Chemical class 0.000 claims description 7
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 7
- 229920002292 Nylon 6 Polymers 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 6
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 3
- 229920000578 graft copolymer Polymers 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000005751 Copper oxide Substances 0.000 claims description 2
- 229920000577 Nylon 6/66 Polymers 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- 230000007423 decrease Effects 0.000 description 9
- 229920000098 polyolefin Polymers 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- 239000008188 pellet Substances 0.000 description 8
- 239000004677 Nylon Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 229920001778 nylon Polymers 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 229940047670 sodium acrylate Drugs 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- DGZQEAKNZXNTNL-UHFFFAOYSA-N 1-bromo-4-butan-2-ylbenzene Chemical class CCC(C)C1=CC=C(Br)C=C1 DGZQEAKNZXNTNL-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 229910052901 montmorillonite Inorganic materials 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 1
- FIAXCDIQXHJNIX-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-ethylbenzene Chemical compound CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br FIAXCDIQXHJNIX-UHFFFAOYSA-N 0.000 description 1
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 description 1
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- VFTWMPNBHNNMAV-UHFFFAOYSA-N 2-tert-butylperoxy-1,4-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=C(C(C)C)C(OOC(C)(C)C)=C1 VFTWMPNBHNNMAV-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- XDOLZJYETYVRKV-UHFFFAOYSA-N 7-Aminoheptanoic acid Chemical compound NCCCCCCC(O)=O XDOLZJYETYVRKV-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 229920003355 Novatec® Polymers 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920001007 Nylon 4 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- 229920000393 Nylon 6/6T Polymers 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- PLZVEHJLHYMBBY-UHFFFAOYSA-N Tetradecylamine Chemical compound CCCCCCCCCCCCCCN PLZVEHJLHYMBBY-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920006164 aromatic vinyl copolymer Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- VPNOHCYAOXWMAR-UHFFFAOYSA-N docosan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCCCCCN VPNOHCYAOXWMAR-UHFFFAOYSA-N 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- ZMUCVNSKULGPQG-UHFFFAOYSA-N dodecanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCCCC(O)=O ZMUCVNSKULGPQG-UHFFFAOYSA-N 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- RLAWWYSOJDYHDC-BZSNNMDCSA-N lisinopril Chemical compound C([C@H](N[C@@H](CCCCN)C(=O)N1[C@@H](CCC1)C(O)=O)C(O)=O)CC1=CC=CC=C1 RLAWWYSOJDYHDC-BZSNNMDCSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- UIERETOOQGIECD-ONEGZZNKSA-N tiglic acid Chemical compound C\C=C(/C)C(O)=O UIERETOOQGIECD-ONEGZZNKSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- NFMWFGXCDDYTEG-UHFFFAOYSA-N trimagnesium;diborate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]B([O-])[O-].[O-]B([O-])[O-] NFMWFGXCDDYTEG-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- XKMZOFXGLBYJLS-UHFFFAOYSA-L zinc;prop-2-enoate Chemical compound [Zn+2].[O-]C(=O)C=C.[O-]C(=O)C=C XKMZOFXGLBYJLS-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(57)【要約】
【課題】 難燃性と機械的性質に優れ、且つ電気的特性
に優れたポリアミド樹脂組成物を提供する。
【解決手段】 (a)ポリアミド樹脂100重量部に対
し、(b)無機充填材5〜300重量部、(c)ハロゲ
ン系難燃剤5〜125重量部、(d)金属酸化物1〜5
0重量部、(e)ほう酸金属化合物3〜100重量部、
(f)α,βー不飽和カルボン酸変性ポリオレフィン樹
脂0.1〜50重量部および(g)ポリオレフィン樹脂
0.1〜50重量部を含有してなるポリアミド樹脂組成
物PROBLEM TO BE SOLVED: To provide a polyamide resin composition having excellent flame retardancy and mechanical properties and excellent electrical properties. SOLUTION: (a) 100 parts by weight of a polyamide resin, (b) 5 to 300 parts by weight of an inorganic filler, (c) 5 to 125 parts by weight of a halogen-based flame retardant, and (d) metal oxides 1 to 5
0 parts by weight, (e) 3 to 100 parts by weight of a metal borate compound,
(F) A polyamide resin composition comprising 0.1 to 50 parts by weight of an α, β-unsaturated carboxylic acid-modified polyolefin resin and (g) 0.1 to 50 parts by weight of a polyolefin resin
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ポリアミド樹脂組
成物に関し、詳しくは、難燃性と電気的特性とに優れる
ポリアミド樹脂組成物に関する。The present invention relates to a polyamide resin composition, and more particularly, to a polyamide resin composition having excellent flame retardancy and electrical properties.
【0002】[0002]
【従来の技術】ポリアミド樹脂に無機充填材を配合した
樹脂組成物において難燃性を向上するには、ハロゲン系
難燃剤とアンチモン系等の難燃助剤を配合する方法が知
られており、また、難燃効果を高めるために、ほう酸亜
鉛と酸化アンチモンを組み合わせることが知られてい
る。他方、高電圧アークトラッキング性などの電気特性
を改良する方法としては、ポリオレフィンを添加する方
法が知られているが、電気的特性を向上させるために多
く配合すると難燃性が低下する欠点がある。従って、難
燃性、電気的特性および機械的性質に優れるポリアミド
樹脂組成物を得ることは困難であった。2. Description of the Related Art In order to improve flame retardancy in a resin composition in which an inorganic filler is blended with a polyamide resin, a method of blending a halogen-based flame retardant and an antimony-based flame retardant auxiliary is known. It is also known to combine zinc borate and antimony oxide in order to enhance the flame retardant effect. On the other hand, as a method for improving electric properties such as high-voltage arc tracking properties, a method of adding a polyolefin is known, but there is a drawback that flame retardancy is reduced when a large amount is added to improve electric properties. . Therefore, it has been difficult to obtain a polyamide resin composition having excellent flame retardancy, electrical properties, and mechanical properties.
【0003】[0003]
【発明が解決しようとする課題】本発明の目的は、難燃
性と機械的性質に優れ、且つ電気的特性に優れたポリア
ミド樹脂組成物を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a polyamide resin composition having excellent flame retardancy and mechanical properties, and also having excellent electrical properties.
【0004】[0004]
【課題を解決するための手段】本発明は、上述の問題を
解決するためになされたものであり、その要旨は、
(a)ポリアミド樹脂100重量部に対し、(b)無機
充填材5〜300重量部、(c)ハロゲン系難燃剤5〜
125重量部、(d)金属酸化物1〜50重量部、
(e)ほう酸金属化合物3〜100重量部、(f)α,
β−不飽和カルボン酸変性ポリオレフィン樹脂0.1〜
50重量部および(g)ポリオレフィン樹脂0.1〜5
0重量部を含有するポリアミド樹脂組成物に存する。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and its gist is as follows.
(A) 100 parts by weight of polyamide resin, (b) 5 to 300 parts by weight of inorganic filler, (c) 5 to 5 parts of halogen-based flame retardant
125 parts by weight, (d) 1 to 50 parts by weight of metal oxide,
(E) 3 to 100 parts by weight of a metal borate compound, (f) α,
β-unsaturated carboxylic acid-modified polyolefin resin 0.1 to
50 parts by weight and (g) polyolefin resin 0.1 to 5
It is present in a polyamide resin composition containing 0 parts by weight.
【0005】以下、本発明を詳細に説明する。本発明に
おける(a)ポリアミド樹脂としては、3員環以上のラ
クタム、重合可能なωーアミノ酸、または、二塩基酸と
ジアミンなどの重縮合によって得られるポリアミドを用
いることができる。3員環以上のラクタムおよび重合可
能なωーアミノ酸としては、εーカプロラクタム、アミ
ノカプロン酸、エナントラクタム、7ーアミノヘプタン
酸、11ーアミノウンデカン酸、9ーアミノノナン酸、
αーピロリドン、αーピペリドンなどが挙げられる。Hereinafter, the present invention will be described in detail. As the polyamide resin (a) in the present invention, a lactam having three or more rings, a polymerizable ω-amino acid, or a polyamide obtained by polycondensation of a dibasic acid and a diamine can be used. Examples of lactams having three or more ring members and polymerizable ω-amino acids include ε-caprolactam, aminocaproic acid, enantholactam, 7-aminoheptanoic acid, 11-aminoundecanoic acid, 9-aminononanoic acid,
α-pyrrolidone, α-piperidone and the like.
【0006】ジアミンとしては、ヘキサメチレンジアミ
ン、ノナメチレンジアミン、ウンデカメチレンジアミ
ン、ドデカメチレンジアミン、メタキシリレンジアミン
などが挙げられる。ジカルボン酸としては、テレフタル
酸、イソフタル酸、アジピン酸、セバシン酸、ドデカン
二塩基酸、グルタール酸などが挙げられる。Examples of the diamine include hexamethylene diamine, nonamethylene diamine, undecamethylene diamine, dodecamethylene diamine, and meta-xylylene diamine. Examples of the dicarboxylic acid include terephthalic acid, isophthalic acid, adipic acid, sebacic acid, dodecane dibasic acid, glutaric acid, and the like.
【0007】ポリアミド樹脂としては、ポリアミド重合
体およびポリアミド共重合体が挙げられ、具体例として
は、ナイロン4、ナイロン6、ナイロン7、ナイロン
8、ナイロン11、ナイロン12、ナイロン6.6、ナ
イロン6.9、ナイロン6.10、ナイロン6.11、
ナイロン6.12、ナイロン6T、共重合ナイロン6/
6.6、共重合ナイロン6/12、共重合ナイロン6/
6T、共重合ナイロン6I/6Tなどが挙げられ、好ま
しくは、ナイロン6、ナイロン66および共重合ナイロ
ン6/66などが挙げられる。複数種のポリアミド樹脂
を使用することもできる。Examples of the polyamide resin include polyamide polymers and polyamide copolymers. Specific examples include nylon 4, nylon 6, nylon 7, nylon 8, nylon 11, nylon 12, nylon 6.6, and nylon 6. .9, nylon 6.10, nylon 6.11,
Nylon 6.12, nylon 6T, copolymer nylon 6 /
6.6, copolymer nylon 6/12, copolymer nylon 6 /
6T, copolymer nylon 6I / 6T and the like, and preferably, nylon 6, nylon 66, copolymer nylon 6/66 and the like. A plurality of types of polyamide resins can be used.
【0008】ポリアミド樹脂の相対粘度は、好ましく
は、98%硫酸中濃度1%、温度25℃での測定で2.
2〜5.5であり、より好ましくは2.3〜4.5であ
る。相対粘度が低すぎると機械的性質が低下し、高すぎ
ると、成形性を損なう。[0008] The relative viscosity of the polyamide resin is preferably measured at a concentration of 1% in 98% sulfuric acid at a temperature of 25 ° C.
It is 2-5.5, More preferably, it is 2.3-4.5. If the relative viscosity is too low, the mechanical properties decrease, and if it is too high, the moldability is impaired.
【0009】ポリアミド樹脂の末端は、カルボン酸また
はアミンで封止されていてもよく、特に炭素数6〜22
のカルボン酸またはアミンで封止されたポリアミド樹脂
が好ましい。封止に用いるカルボン酸としては、カプロ
ン酸、カプリル酸、カプリン酸、ラウリン酸、ミリスチ
ン酸、パルミチン酸、ステアリン酸、ベヘニン酸などの
脂肪族モノカルボン酸が挙げられる。封止に用いるアミ
ンとしては、ヘキシルアミン、オクチルアミン、デシル
アミン、ラウリルアミン、ミリスチルアミン、パルミチ
ルアミン、ステアリルアミン、ベヘニルアミンなどの脂
肪族第一級アミンが挙げられる。封止に使用するカルボ
ン酸またはアミンの量は、30μeq/g程度がよい。The terminal of the polyamide resin may be sealed with a carboxylic acid or an amine, and particularly has 6 to 22 carbon atoms.
And a polyamide resin sealed with a carboxylic acid or an amine. Examples of the carboxylic acid used for sealing include aliphatic monocarboxylic acids such as caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, and behenic acid. Examples of the amine used for sealing include aliphatic primary amines such as hexylamine, octylamine, decylamine, laurylamine, myristylamine, palmitylamine, stearylamine, and behenylamine. The amount of the carboxylic acid or amine used for sealing is preferably about 30 μeq / g.
【0010】本発明における(b)無機充填材として
は、ポリアミド樹脂に通常用いられるものであればよ
く、平均粒子径、形状に特に制限はない。無機充填材の
具体例としては、ガラス繊維、ガラスフレーク、タル
ク、カオリン、焼成カオリン、モンモリロナイト、膨潤
化モンモリロナイト、雲母(マイカ)、膨潤性フッ素雲
母系鉱物、層状珪酸塩、粘土鉱物、シリカ、クレー、炭
酸カルシウム、硫酸マグネシウム、ウオラストナイト、
ウィスカー、アルミナ、アスベスト、カーボン繊維、お
よびこれらの変性品等が挙げられる。無機充填材は、無
処理のまま使用してもよいが、ポリアミド樹脂との界面
接着性を向上させ、又分散性を向上させる目的で、各種
シランカップリング剤、チタンカップリング剤、高級脂
肪酸、高級脂肪酸エステル、高級脂肪酸アミド、高級脂
肪酸塩類あるいは他の界面活性剤などで表面を処理した
ものを使用することができる。The inorganic filler (b) in the present invention may be any of those commonly used in polyamide resins, and there is no particular limitation on the average particle size and shape. Specific examples of the inorganic filler include glass fiber, glass flake, talc, kaolin, calcined kaolin, montmorillonite, swelled montmorillonite, mica (mica), swellable fluoromica-based mineral, layered silicate, clay mineral, silica, clay , Calcium carbonate, magnesium sulfate, wollastonite,
Examples include whiskers, alumina, asbestos, carbon fibers, and modified products thereof. The inorganic filler may be used without any treatment, but for the purpose of improving the interfacial adhesion with the polyamide resin and improving the dispersibility, various silane coupling agents, titanium coupling agents, higher fatty acids, Those whose surface has been treated with higher fatty acid esters, higher fatty acid amides, higher fatty acid salts or other surfactants can be used.
【0011】無機充填材の含有量は5〜300重量部で
ある。無機充填材の含有量が5重量部未満であると剛性
が低下しやすく、300重量部を越えると靱性が低下す
る。無機充填材の含有量は、好ましくは10〜250重
量部であり、より好ましくは20〜200重量部であ
る。[0011] The content of the inorganic filler is 5 to 300 parts by weight. If the content of the inorganic filler is less than 5 parts by weight, rigidity tends to decrease, and if it exceeds 300 parts by weight, toughness decreases. The content of the inorganic filler is preferably 10 to 250 parts by weight, more preferably 20 to 200 parts by weight.
【0012】本発明における(c)ハロゲン系難燃剤と
しては、芳香族ハロゲン化合物、ハロゲン化エポキシ樹
脂、ハロゲン化ポリカーボネート、ハロゲン化芳香族ビ
ニル系共重合体、ハロゲン化シアヌレート樹脂、ハロゲ
ン化ポリフェニレンエーテル等が挙げられ、好ましくは
デカブロモジフェニルオキサイド、1,2(ペンタブロ
モフェニル)ーエタン、ペンタブロモベンジルポリアク
リレート、テトラブロムビスフェノールA、テトラブロ
モビスフェノールAのオリゴマー、ブロム化ビスフェノ
ール系エポキシ樹脂、ブロム化ビスフェノール系フェノ
キシ樹脂、ブロム化ビスフェノール系ポリカーボネー
ト、ブロム化ポリスチレン、ブロム化架橋ポリスチレ
ン、ブロム化ポリフェニレンオキサイド、ポリジブロム
フェニレンオキサイド、デカブロムジフェニルオキサイ
ドビスフェノール縮合物およびハロゲンリン酸エステル
等が挙げられる。The halogen-based flame retardant (c) in the present invention includes aromatic halogen compounds, halogenated epoxy resins, halogenated polycarbonates, halogenated aromatic vinyl copolymers, halogenated cyanurate resins, halogenated polyphenylene ethers and the like. Preferred are decabromodiphenyl oxide, 1,2 (pentabromophenyl) -ethane, pentabromobenzyl polyacrylate, tetrabromobisphenol A, oligomers of tetrabromobisphenol A, brominated bisphenol-based epoxy resins, and brominated bisphenol-based resins. Phenoxy resin, brominated bisphenol-based polycarbonate, brominated polystyrene, brominated cross-linked polystyrene, brominated polyphenylene oxide, polydibromophenylene oxide Decabromodiphenyl diphenyl oxide bisphenol condensate and a halogen phosphates.
【0013】ハロゲン系難燃剤の含有量は、5〜125
重量部である。ハロゲン系難燃剤の含有量が5重量部未
満であると難燃性が低下しやすく、125重量部を越え
ると電気的特性が低下する。ハロゲン系難燃剤の含有量
は、好ましくは10〜100重量部であり、より好まし
くは15〜80重量部である。The content of the halogen-based flame retardant is 5 to 125.
Parts by weight. If the content of the halogen-based flame retardant is less than 5 parts by weight, the flame retardancy tends to decrease, and if it exceeds 125 parts by weight, the electrical properties deteriorate. The content of the halogen-based flame retardant is preferably from 10 to 100 parts by weight, more preferably from 15 to 80 parts by weight.
【0014】本発明における(d)金属酸化物として
は、難燃助剤として作用する金属酸化物であり、三酸化
アンチモン、五酸化アンチモン、酸化銅、酸化マグネシ
ュム、酸化亜鉛、酸化モリブデン、酸化ジルコニュム、
酸化スズ、酸化鉄、酸化チタンおよび酸化アルミニュム
等が挙げられる。金属酸化物の含有量は、1〜50重量
部である。金属酸化物の含有量が0.5重量部未満であ
ると難燃性が低下しやすく、50重量部を越えると電気
的特性が低下する。金属酸化物の含有量は、好ましくは
2〜40重量部であり、より好ましくは3〜30重量部
である。The metal oxide (d) in the present invention is a metal oxide acting as a flame-retardant aid, such as antimony trioxide, antimony pentoxide, copper oxide, magnesium oxide, zinc oxide, molybdenum oxide, zirconium oxide. ,
Examples include tin oxide, iron oxide, titanium oxide, and aluminum oxide. The content of the metal oxide is 1 to 50 parts by weight. If the content of the metal oxide is less than 0.5 part by weight, the flame retardancy tends to decrease, and if it exceeds 50 parts by weight, the electrical properties deteriorate. The content of the metal oxide is preferably 2 to 40 parts by weight, and more preferably 3 to 30 parts by weight.
【0015】本発明における(e)ほう酸金属化合物と
しては、ほう酸亜鉛、ほう酸アルミニウム、ほう酸マグ
ネシウム等が挙げられ、好ましくは、ほう酸亜鉛が挙げ
られる。ほう酸亜鉛としては、酸化亜鉛とほう酸を主成
分とするものであれば組成比率など特に制限はない。ほ
う酸金属塩の含有量は3〜100重量部である。ほう酸
亜鉛の含有量が3重量部未満であると電気的特性が低下
しやすく、100重量部を越えると靱性が低下しやす
い。ほう酸金属塩の含有量は、好ましくは4〜80重量
部であり、より好ましくは5〜60重量部である。The metal compound (e) in the present invention includes zinc borate, aluminum borate, magnesium borate, and the like, and preferably zinc borate. The composition ratio of zinc borate is not particularly limited as long as it contains zinc oxide and boric acid as main components. The content of the metal borate is 3 to 100 parts by weight. If the content of zinc borate is less than 3 parts by weight, the electrical properties tend to decrease, and if it exceeds 100 parts by weight, the toughness tends to decrease. The content of the metal borate is preferably 4 to 80 parts by weight, more preferably 5 to 60 parts by weight.
【0016】金属酸化物の含有量とほう酸金属化合物の
含有量の合計は、好ましくは、ポリアミド樹脂100重
量部に対し4〜120重量部である。金属酸化物の含有
量とほう酸金属化合物の含有量の合計が4重量部未満で
あると難燃性が低下しやすく、120重量部を越えると
靱性が低下しやすい。金属酸化物の含有量とほう酸金属
化合物の含有量の合計は、より好ましくは、ポリアミド
樹脂100重量部に対し5〜100重量部である。The total of the content of the metal oxide and the content of the metal borate compound is preferably 4 to 120 parts by weight based on 100 parts by weight of the polyamide resin. If the total of the content of the metal oxide and the content of the metal borate compound is less than 4 parts by weight, the flame retardancy tends to decrease, and if it exceeds 120 parts by weight, the toughness tends to decrease. The total of the content of the metal oxide and the content of the metal borate compound is more preferably 5 to 100 parts by weight based on 100 parts by weight of the polyamide resin.
【0017】本発明における(f)α,β−不飽和カル
ボン酸変性ポリオレフィン樹脂は、α,β−不飽和カル
ボン酸により変性されたポリオレフィン樹脂であり、好
ましくは、エチレン及び/又はプロピレンを主たる構成
成分とするオレフィンとα,β−不飽和カルボン酸若し
くはその誘導体との共重合物、並びにエチレン及び/又
はプロピレンを主たる構成成分とするオレフィンの重合
物にα,β−不飽和カルボン酸若しくはその誘導体をグ
ラフトさせたグラフト重合物等が挙げられる。The (f) α, β-unsaturated carboxylic acid-modified polyolefin resin in the present invention is a polyolefin resin modified with α, β-unsaturated carboxylic acid, and is preferably composed mainly of ethylene and / or propylene. Copolymer of an olefin as a component and an α, β-unsaturated carboxylic acid or a derivative thereof, and a polymer of an olefin mainly containing ethylene and / or propylene as an α, β-unsaturated carboxylic acid or a derivative thereof And the like.
【0018】エチレン成分及び/又はプロピレン成分を
主たる構成成分とするオレフィンとα,β−不飽和カル
ボン酸若しくはその誘導体との共重合物におけるα,β
−不飽和カルボン酸若しくはその誘導体としては、例え
ば、アクリル酸、メタクリル酸、メチルメタクリル酸、
アクリル酸ナトリウム、アクリル酸亜鉛、酢酸ビニル、
グリシジルメタクリレート等が挙げられる。エチレン成
分及び/又はプロピレン成分を主たる構成成分とするオ
レフィンとα,β−不飽和カルボン酸若しくはその誘導
体との共重合物におけるα,β−不飽和カルボン酸若し
くはその誘導体の割合は、好ましくは40モル%以下で
ある。Α, β in a copolymer of an olefin having an ethylene component and / or a propylene component as a main constituent and an α, β-unsaturated carboxylic acid or a derivative thereof.
-As unsaturated carboxylic acids or derivatives thereof, for example, acrylic acid, methacrylic acid, methyl methacrylic acid,
Sodium acrylate, zinc acrylate, vinyl acetate,
Glycidyl methacrylate and the like can be mentioned. The proportion of the α, β-unsaturated carboxylic acid or its derivative in the copolymer of an olefin having an ethylene component and / or a propylene component as a main constituent and an α, β-unsaturated carboxylic acid or its derivative is preferably 40. Mol% or less.
【0019】エチレン成分及び/又はプロピレン成分を
主たる構成成分とするオレフィンとα,β−不飽和カル
ボン酸若しくはその誘導体との共重合物の具体例として
は、例えば、エチレン−酢酸ビニル共重合体、エチレン
−アクリル酸共重合体、エチレン−エチルアクリル酸共
重合体、エチレン−アクリル酸ナトリウム共重合体等が
挙げられる。Specific examples of the copolymer of an olefin having an ethylene component and / or a propylene component as a main component and an α, β-unsaturated carboxylic acid or a derivative thereof include, for example, an ethylene-vinyl acetate copolymer, Examples include an ethylene-acrylic acid copolymer, an ethylene-ethyl acrylic acid copolymer, and an ethylene-sodium acrylate copolymer.
【0020】エチレン及び/又はプロピレンを主たる構
成成分とするオレフィンの重合物にα,β−不飽和カル
ボン酸若しくはその誘導体をグラフトさせたグラフト重
合物におけるオレフィンの重合物としては、例えば、ポ
リエチレン、ポリプロピレン、エチレン−プロピレン共
重合体、エチレン−ブテン−1共重合体、エチレン−酢
酸ビニル共重合体、エチレン−アクリル酸共重合体、エ
チレン−エチルアクリル酸共重合体、エチレン−アクリ
ル酸ナトリウム共重合体等が挙げられる。Examples of the olefin polymer in the graft polymer obtained by grafting an α, β-unsaturated carboxylic acid or a derivative thereof to an olefin polymer containing ethylene and / or propylene as a main component include, for example, polyethylene and polypropylene. , Ethylene-propylene copolymer, ethylene-butene-1 copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-ethylacrylic acid copolymer, ethylene-sodium acrylate copolymer And the like.
【0021】グラフト重合物においてグラフトされる
α,β−不飽和カルボン酸若しくはその誘導体として
は、アクリル酸、メタアクリル酸、エタクリル酸、マレ
イン酸、フマル酸、これらの酸無水物、これらの酸とテ
トラヒドロフルフリルアルコールなどとのエステル等が
挙げられ、好ましくは無水マレイン酸が挙げられる。グ
ラフト量は、好ましくは、オレフィン重合物の0.05
〜1.5重量%である。The α, β-unsaturated carboxylic acids or derivatives thereof grafted in the graft polymer include acrylic acid, methacrylic acid, ethacrylic acid, maleic acid, fumaric acid, anhydrides of these acids, and those acids. Examples thereof include esters with tetrahydrofurfuryl alcohol and the like, and preferably include maleic anhydride. The graft amount is preferably 0.05% of the olefin polymer.
~ 1.5% by weight.
【0022】グラフト重合は、常法に従って両成分を混
合し樹脂温度150〜300℃で溶融させることにより
実施される。グラフト重合に際して、α,α’−ビス−
t−ブチルパーオキシ−p−ジイソプロピルベンゼンの
ような有機過酸化物を、ポリオレフィンに対し0.00
1〜0.05重量%配合すると効率よく反応を実施する
ことができる。The graft polymerization is carried out by mixing both components and melting them at a resin temperature of 150 to 300 ° C. according to a conventional method. In the graft polymerization, α, α'-bis-
An organic peroxide such as t-butylperoxy-p-diisopropylbenzene is added to the polyolefin at 0.00
When the amount is 1 to 0.05% by weight, the reaction can be efficiently performed.
【0023】α,β−不飽和カルボン酸変性ポリオレフ
ィン樹脂の含有量は0.1〜50重量部である。変性ポ
リオレフィン樹脂の含有量が0.1重量部未満であって
も50重量部を越えても難燃性が低下する。α,β−不
飽和カルボン酸変性ポリオレフィン樹脂の含有量は、好
ましくは1〜40重量部であり、より好ましくは2〜3
0重量部である。The content of the α, β-unsaturated carboxylic acid-modified polyolefin resin is 0.1 to 50 parts by weight. If the content of the modified polyolefin resin is less than 0.1 part by weight or exceeds 50 parts by weight, the flame retardancy is reduced. The content of the α, β-unsaturated carboxylic acid-modified polyolefin resin is preferably 1 to 40 parts by weight, more preferably 2 to 3 parts by weight.
0 parts by weight.
【0024】本発明における(g)ポリオレフィン樹脂
としては、エチレン成分及び/又はプロピレン成分を主
たる構成成分とするポリオレフィンであり、例えば、ポ
リエチレン、ポリプロピレン、エチレン−プロピレン共
重合体、エチレン−ブテン−1共重合体、エチレン−酢
酸ビニル共重合体、エチレン−アクリル酸共重合体、エ
チレン−エチルアクリル酸共重合体、エチレン−アクリ
ル酸ナトリウム共重合体等の未変性ポリオレフィン樹脂
が挙げられる。The polyolefin resin (g) in the present invention is a polyolefin having an ethylene component and / or a propylene component as a main component, and examples thereof include polyethylene, polypropylene, ethylene-propylene copolymer, and ethylene-butene-1 copolymer. Unmodified polyolefin resins such as a polymer, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid copolymer, an ethylene-ethylacrylic acid copolymer, and an ethylene-sodium acrylate copolymer are exemplified.
【0025】ポリオレフィン樹脂の含有量は0.1〜5
0重量部である。ポリオレフィン樹脂の含有量が0.1
重量部未満であっても50重量部を越えても難燃性が低
下する。ポリオレフィン樹脂の含有量は、好ましくは1
〜40重量部であり、より好ましくは2〜30重量部で
ある。α,β−不飽和カルボン酸変性ポリオレフィン樹
脂の含有量とポリオレフィン樹脂の含有量の合計はポリ
アミド樹脂100重量部に対し、好ましくは1〜75重
量部であり、より好ましくは2〜60重量部である。
α,β−不飽和カルボン酸変性ポリオレフィン樹脂の含
有量とポリオレフィン樹脂の含有量の合計が1重量部未
満であっても75重量部を越えても難燃性が低下する。The content of the polyolefin resin is 0.1 to 5
0 parts by weight. The content of polyolefin resin is 0.1
If the amount is less than 50 parts by weight, the flame retardancy is reduced. The content of the polyolefin resin is preferably 1
-40 parts by weight, more preferably 2-30 parts by weight. The total of the content of the α, β-unsaturated carboxylic acid-modified polyolefin resin and the content of the polyolefin resin is preferably 1 to 75 parts by weight, more preferably 2 to 60 parts by weight, based on 100 parts by weight of the polyamide resin. is there.
If the total of the content of the α, β-unsaturated carboxylic acid-modified polyolefin resin and the content of the polyolefin resin is less than 1 part by weight or exceeds 75 parts by weight, the flame retardancy is reduced.
【0026】ポリアミド樹脂に、無機充填材、ハロゲン
系難燃剤、金属酸化物、ほう酸金属化合物、α,β−不
飽和カルボン酸変性ポリオレフィン樹脂、ポリオレフィ
ン樹脂を配合する方法としては、最終成形品を成形する
直前までの任意の段階で周知の種種の手段によって行う
ことができる。最も簡便な方法としては、ポリアミド樹
脂と上記の添加物とを単にドライブレンドする方法が挙
げられ、得られるドライブレンド物を溶融混合押出にて
ペレットにする。また、所定量より多い添加剤を練り込
んだマスターペレットを予め調整し、これを希釈用ポリ
アミド樹脂とドライブレンドすることによっても、所望
の割合の樹脂組成物を得ることができる。更に、ポリア
ミド樹脂、無機充填材、変性ポリオレフィン樹脂、ハロ
ゲン系難燃剤、金属酸化物およびほう酸金属化合物をド
ライブレンド後溶融混合押出にてペレットとし、その後
その他添加剤をドライブレンドし所望の樹脂組成物を得
ることもできる。As a method of blending an inorganic filler, a halogen-based flame retardant, a metal oxide, a metal borate compound, an α, β-unsaturated carboxylic acid-modified polyolefin resin and a polyolefin resin with a polyamide resin, a final molded article is formed. It can be carried out by any known means at any stage immediately before the step. The simplest method is a method of simply dry blending the polyamide resin and the above-mentioned additive, and the obtained dry blend is formed into pellets by melt mixing extrusion. Alternatively, a resin composition having a desired ratio can be obtained by preparing in advance a master pellet in which an additive larger than a predetermined amount is kneaded, and dry blending the master pellet with a polyamide resin for dilution. Further, the polyamide resin, the inorganic filler, the modified polyolefin resin, the halogen-based flame retardant, the metal oxide and the metal borate compound are dry-blended and then melt-mixed and extruded into pellets, and then the other additives are dry-blended to obtain a desired resin composition. You can also get
【0027】本発明のポリアミド樹脂組成物には、顔
料、染料、離型剤、核剤、安定剤、帯電防止剤その他の
周知の添加剤を配合し混練することもできる。また、本
発明のポリアミド樹脂組成物においては、ポリアミド樹
脂以外の熱可塑性樹脂を、本発明の効果を損なわない範
囲において配合することもできる。本発明のポリアミド
樹脂組成物を成形してなる成形品は、前記ドライブレン
ド物やペレットを射出成形、押出成形、ブロー成形、圧
縮成形などの各種成形機に供給して、常法に従って成形
することにより得ることができる。The polyamide resin composition of the present invention may be kneaded with a pigment, a dye, a release agent, a nucleating agent, a stabilizer, an antistatic agent and other known additives. Further, in the polyamide resin composition of the present invention, a thermoplastic resin other than the polyamide resin can be blended within a range that does not impair the effects of the present invention. The molded product obtained by molding the polyamide resin composition of the present invention is obtained by supplying the dry blend or the pellet to various molding machines such as injection molding, extrusion molding, blow molding, and compression molding, and molding the molded product according to a conventional method. Can be obtained by
【0028】[0028]
【実施例】以下、本発明を実施例により更に詳細に説明
するが、本発明はその要旨を越えない限り、以下の実施
例に限定されるものではない。以下の実施例および比較
例における各種評価は次の方法に従って行った。 (1)曲げ弾性率:ASTM−D790に準拠して行な
った。 (2)アイゾット衝撃試験:ASTM−D256に準拠
して行なった。 (3)難燃性:UL−94に準拠して行なった。 (4)HVTR(高電圧アークトラッキング性試験):
UL−746Aに準拠して行なった。この試験結果はP
LC0〜4の5段階評価で示され、PLC0が最も良い
とされている。EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist thereof. Various evaluations in the following Examples and Comparative Examples were performed according to the following methods. (1) Flexural modulus: performed in accordance with ASTM-D790. (2) Izod impact test: performed according to ASTM-D256. (3) Flame retardancy: Performed according to UL-94. (4) HVTR (high voltage arc tracking test):
Performed in accordance with UL-746A. The test result is P
It is indicated by a five-level evaluation of LC0 to 4, and PLC0 is considered to be the best.
【0029】実施例および比較例において用いた原料は
次の通りである。 (5)ポリアミド6樹脂:三菱エンジニアリングプラス
チックス社製、グレード名1010J、相対粘度2.
5。 (6)ポリアミド66樹脂:デュポン社製、グレード名
FE3218、相対粘度2.8。 (7)ガラス繊維:日本電気硝子社製、商品名T28
3。 (8)ハロゲン系難燃剤:アルベマール浅野社製、商品
名SAYTEX8010。(以下、ハロゲン系難燃剤A
と称することがある。) (9)ハロゲン系難燃剤:グレートレイクスケミカル社
製、商品名PO64P。(以下、ハロゲン系難燃剤Bと
称することがある。)The raw materials used in the examples and comparative examples are as follows. (5) Polyamide 6 resin: manufactured by Mitsubishi Engineering-Plastics Corporation, grade name 1010J, relative viscosity 2.
5. (6) Polyamide 66 resin: DuPont, grade name FE3218, relative viscosity 2.8. (7) Glass fiber: T28, manufactured by NEC Corporation
3. (8) Halogen-based flame retardant: trade name SAYTEX8010 manufactured by Albemarle Asano Co. (Hereinafter, halogen-based flame retardant A
It may be called. (9) Halogen flame retardant: PO64P, manufactured by Great Lakes Chemical Company. (Hereinafter, it may be referred to as halogen-based flame retardant B.)
【0030】(10)金属酸化物:三酸化アンチモン、
森六社製、商品名MIC−3。 (11)ほう酸金属化合物:ほう酸亜鉛、BORAX社
製、商品名ZINC BORATE2335。 (12)α,β−不飽和カルボン酸変性ポリオレフィン
樹脂:三井石油化学社製、商品名NタフマーMP061
0。(以下、変性ポリオレフィンAと称することがあ
る。) (13)ポリオレフィン樹脂:日本ポリケム社製、商品
名ノバテックHY540。(以下、ポリオレフィンAと
称することがある。) (14)ポリオレフィン樹脂:三井石油化学社製、商品
名HIWAX410P。(以下、ポリオレフィンBと称
することがある。)(10) Metal oxide: antimony trioxide,
MIC-3 manufactured by Morirokusha. (11) Metal borate compound: Zinc borate, manufactured by BORAX, trade name ZINC BORATE 2335. (12) α, β-unsaturated carboxylic acid-modified polyolefin resin: manufactured by Mitsui Petrochemical Co., Ltd., trade name N Tuffmer MP061
0. (Hereinafter, it may be referred to as modified polyolefin A.) (13) Polyolefin resin: Novatec HY540, manufactured by Nippon Polychem Co., Ltd. (Hereinafter, it may be referred to as polyolefin A.) (14) Polyolefin resin: HIWAX410P manufactured by Mitsui Petrochemical Co., Ltd. (Hereinafter, it may be referred to as polyolefin B.)
【0031】[実施例1〜4]表−1に示す各種成分を
表−1に示す配合量でブレンド後、日本製鋼社製(株)
製のTEX30C型2軸押出機を用い、275℃の設定
温度で溶融混合してポリアミド樹脂組成物のペレットを
得た。このペレットを各々の成形品に応じて射出成形し
て、曲げ弾性率、アイゾット衝撃値、燃焼性、HVTR
の評価を行なった。評価結果を表−1に示す。Examples 1-4 After blending the various components shown in Table 1 in the amounts shown in Table 1, Nippon Steel Corp.
Was melt-mixed at a set temperature of 275 ° C. using a TEX30C type twin screw extruder to obtain pellets of the polyamide resin composition. The pellets are injection-molded according to each molded article, and the flexural modulus, Izod impact value, flammability, HVTR
Was evaluated. Table 1 shows the evaluation results.
【0032】[0032]
【表1】 [Table 1]
【0033】[比較例1〜6]表−2に示す各種成分を
表−2に示す配合量でブレンド後、実施例1と同様にペ
レット化し、実施例1と同様に各種評価を行なった。評
価結果を表−2に示す。[Comparative Examples 1 to 6] After blending the various components shown in Table 2 in the amounts shown in Table 2, pellets were prepared in the same manner as in Example 1, and various evaluations were performed in the same manner as in Example 1. Table 2 shows the evaluation results.
【0034】[0034]
【表2】 [Table 2]
【0035】[0035]
【発明の効果】本発明のポリアミド樹脂組成物は、難燃
性、電気的特性及び機械的特性に優れており、電気・電
子部品、自動車部品、各種工業部品などに有用であり、
特に電磁開閉器部品等に好適である。Industrial Applicability The polyamide resin composition of the present invention has excellent flame retardancy, electrical properties and mechanical properties, and is useful for electric / electronic parts, automobile parts, various industrial parts, etc.
It is particularly suitable for electromagnetic switch parts and the like.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI C08K 5/136 C08K 5/136 //(C08L 77/00 101:04 23:26 23:00) (72)発明者 鈴木 政己 神奈川県平塚市東八幡5丁目6番2号 三 菱エンジニアリングプラスチックス株式会 社技術センター内────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. 6 Identification symbol FI C08K 5/136 C08K 5/136 // (C08L 77/00 101: 04 23:26 23:00) (72) Inventor Masami Suzuki 5-6-2 Higashi-Hachiman, Hiratsuka-shi, Kanagawa Prefecture Mitsubishi Engineering Plastics Co., Ltd. Technology Center
Claims (8)
し、(b)無機充填材5〜300重量部、(c)ハロゲ
ン系難燃剤5〜125重量部、(d)金属酸化物1〜5
0重量部、(e)ほう酸金属化合物3〜100重量部、
(f)α,β−不飽和カルボン酸変性ポリオレフィン樹
脂0.1〜50重量部および(g)ポリオレフィン樹脂
0.1〜50重量部を含有するポリアミド樹脂組成物。1. (a) 100 parts by weight of a polyamide resin, (b) 5 to 300 parts by weight of an inorganic filler, (c) 5 to 125 parts by weight of a halogen-based flame retardant, and (d) 1 to 5 parts of a metal oxide.
0 parts by weight, (e) 3 to 100 parts by weight of a metal borate compound,
(F) A polyamide resin composition containing 0.1 to 50 parts by weight of an α, β-unsaturated carboxylic acid-modified polyolefin resin and (g) 0.1 to 50 parts by weight of a polyolefin resin.
ナイロン66または共重合ナイロン6/66であること
を特徴とする請求項1に記載のポリアミド樹脂組成物。2. The method according to claim 1, wherein (a) the polyamide resin is nylon 6,
The polyamide resin composition according to claim 1, which is nylon 66 or copolymerized nylon 6/66.
8%硫酸中濃度1%、温度25℃での測定で2.2〜
5.5であることを特徴とする請求項1または2に記載
のポリアミド樹脂組成物。(3) The polyamide resin has a relative viscosity of 9
8% sulfuric acid concentration 1%, measured at a temperature of 25 ℃ 2.2-
The polyamide resin composition according to claim 1, wherein the composition is 5.5.
ン、五酸化アンチモン、酸化銅、酸化マグネシュム、酸
化亜鉛、酸化モリブデン、酸化ジルコニュム、酸化ス
ズ、酸化鉄、酸化チタン、酸化アルミニュムからなる群
から選ばれた金属酸化物であることを特徴とする請求項
1に記載のポリアミド樹脂組成物。4. The group of (d) a metal oxide comprising antimony trioxide, antimony pentoxide, copper oxide, magnesium oxide, zinc oxide, molybdenum oxide, zirconium oxide, tin oxide, iron oxide, titanium oxide, and aluminum oxide. The polyamide resin composition according to claim 1, which is a metal oxide selected from the group consisting of:
であることを特徴とする請求項1に記載のポリアミド樹
脂組成物。5. The polyamide resin composition according to claim 1, wherein (e) the metal borate compound is zinc borate.
リオレフィン樹脂が、エチレン及び/又はプロピレンを
主たる構成成分とするオレフィンとα,β−不飽和カル
ボン酸若しくはその誘導体との共重合物、または、エチ
レン及び/又はプロピレンを主たる構成成分とするオレ
フィンの重合体にα,β−不飽和カルボン酸もしくはそ
の誘導体をグラフトさせたグラフト重合物であることを
特徴とする請求項1に記載のポリアミド樹脂組成物。6. The (f) α, β-unsaturated carboxylic acid-modified polyolefin resin is a copolymer of an olefin having ethylene and / or propylene as a main constituent and an α, β-unsaturated carboxylic acid or a derivative thereof. 2. A graft polymer obtained by grafting an α, β-unsaturated carboxylic acid or a derivative thereof to a polymer of an olefin containing ethylene and / or propylene as a main component. Polyamide resin composition.
酸金属化合物の含有量の合計が、(a)ポリアミド樹脂
100重量部に対し、4〜120重量部であることを特
徴とする請求項1に記載のポリアミド樹脂組成物。7. The total of the content of the metal oxide (d) and the content of the metal borate (e) is 4 to 120 parts by weight based on 100 parts by weight of the polyamide resin (a). The polyamide resin composition according to claim 1, wherein
リオレフィン樹脂の含有量と(g)ポリオレフィン樹脂
の含有量の合計が、(a)ポリアミド樹脂100重量部
に対し1〜75重量部であることを特徴とする請求項1
に記載のポリアミド樹脂組成物。8. The sum of the content of (f) the α, β-unsaturated carboxylic acid-modified polyolefin resin and the content of (g) the polyolefin resin is 1 to 75 parts by weight based on 100 parts by weight of the polyamide resin (a). 2. The method according to claim 1, wherein
The polyamide resin composition according to the above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11179098A JPH11302535A (en) | 1998-04-22 | 1998-04-22 | Polyamide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11179098A JPH11302535A (en) | 1998-04-22 | 1998-04-22 | Polyamide resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11302535A true JPH11302535A (en) | 1999-11-02 |
Family
ID=14570230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11179098A Pending JPH11302535A (en) | 1998-04-22 | 1998-04-22 | Polyamide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11302535A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009275121A (en) * | 2008-05-15 | 2009-11-26 | Mitsubishi Engineering Plastics Corp | Flame retardant polyamide resin composition excellent in electric safety |
-
1998
- 1998-04-22 JP JP11179098A patent/JPH11302535A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009275121A (en) * | 2008-05-15 | 2009-11-26 | Mitsubishi Engineering Plastics Corp | Flame retardant polyamide resin composition excellent in electric safety |
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