JPH11301153A - Ic module and ic card using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module for widening an adhesive area in the case of charging it in an IC card base plate and an IC card using the module. SOLUTION: In the IC module, when a difference between a y direction central position of the IC module base plate and a y direction terminal central position of an ISO standard is L in the case that a side direction parallel to a long side (A) of a card of an IC module base plate formed on a terminal board made of one layer is an x direction a side direction parallel to a short side (B) of the card is a y direction, and a punched size of the IC module base plate is (A×B mm), the y direction central position of the IC module is deviated to a y direction positive side in a range of the L of a formula [0<L<(B/2)-4.66] mm from the u direction terminal central position of the ISO standard. In the IC card, such an IC module is charged in a recess formed on the IC card body base plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module and an IC card using the same, and more particularly, to a method of improving a mold position and a mold size with respect to a terminal board for an IC card to improve a mold formed in an IC card body substrate. The object of the present invention is to increase the area of adhesion to the IC card body substrate to prevent the IC module from falling off or being damaged.

[0002]

2. Description of the Related Art The position of external terminals on an IC card is I
Since it is specified in SO7816-2, the IC chip mounted on the substrate of the conventional IC module and the external terminals electrically connected to the IC chip are both configured such that the center is located at the center of the module substrate. Have been. In addition, since it is necessary to connect the IC chip to the external terminals with wires to establish electrical continuity and then perform resin molding, the molding area on the back surface of the substrate increases, and the bonding area between the recess of the IC card body substrate and the IC module substrate increases. Was difficult to do.

FIG. 5 shows an IC card terminal position standard according to ISO. According to ISO 7816-2, it is necessary to secure external terminals within a range indicated by numerical values in the figure as shown in FIG. Of the external terminals C1 to C8, those actually used at present are C1, C2, C3, C5, C6, and C7, and C4 and C8 are reserved for future use and are currently used. Not used on cards. Also, C
Reference numeral 5 denotes a terminal for a ground function. The terminal position indicates the position where the pin of the reader / writer comes in contact, and max, mi
Although shown as an allowable range by n display, when the range of each terminal is expanded, the actual degree of freedom is small because there are adjacent terminals. When the center position of the ISO standard terminal is calculated using the numerical values shown in FIG. 5 as they are, 23.89 mm from the upper end of the card and 15.06 from the left end of the card.
mm. This is C on the terminal board
2 and C3, or C6 and C7,
This corresponds to a position intersecting the center line of the terminal rows 1 to C4 and the terminal rows C5 to C8. This position is fixed regardless of the shape of the terminal board.

[0004] On the other hand, there is no special standard for the size (Amm x Bmm) of the module substrate itself.
The size is such that each terminal position specified by the O standard can be included with a margin. However, it is common to unify the punch size regardless of the product type. 10 in the y direction (B)
１３13 mm, the x direction (A) is often slightly larger than the y direction (B). The die cutting is performed after the IC chip is mounted on the terminal substrate, the IC chip and the substrate are bonded with wires, and resin molding is performed.

FIG. 6 is an enlarged view showing an example of an IC card module substrate conforming to the ISO standard. In FIG. 6, A indicates the length of the module substrate in the x direction, and B indicates the length of the module substrate in the y direction. The upper part on the drawing is the positive side in the y direction. In this state, the ISO standard terminal center position C
The distance between (x) and the lowermost end of the C8 terminal in the y direction is 4.66 m
m, y between the lowermost edge of the C8 terminal and the edge of the IC module substrate
The directional distance is [(B / 2) -4.66] mm.

FIG. 7 shows an IC module substrate conforming to the ISO standard. FIG. 7 shows a state where the external terminals are seen through from the card surface side in order to clarify the relationship between the terminal positions and the mold positions. As shown in FIG.
And the external terminal C1 are connected by a bonding wire 22 through a bonding hole 33. The terminals other than C1 are the same, but the terminals of C4 and C8 are often not connected with the current IC card for future use as described above.

After the connection between the IC chip and the terminal by the bonding wire, the whole is molded with a sealing resin (grain hatched portion in the figure) to make a module. FIG.
In such a molded state, the terminal center position C (x) of the ISO standard and the center of the mold are usually made to coincide with each other. When the module is mounted on the IC card body substrate, a conventional method is to apply an adhesive to the portion outside the mold area or attach an adhesive sheet to adhere to the IC card body substrate.

FIG. 8 is a diagram showing a cross section of the IC module portion of the IC card. 8 shows a state in which the IC module of FIG. 7 is cut along any one of the bonding wires 22. The IC card body substrate 11 is
A concave portion 12 for loading the C module is provided, and the IC module is loaded in the concave portion via an adhesive or an adhesive sheet 24. IC chip is IC module substrate 3
After the die bonding, the die pad and the terminal substrate copper foil 32 are
2 connected. A terminal pattern separating portion 34 is formed in the terminal copper foil. As a terminal board, there is a method in which copper foil is provided on both sides of the board, a printed circuit is provided on the IC chip side, and conduction with external terminals is established through through holes. Using a single-layer substrate provided with a copper foil 32
3 and the bonding wire 2 directly to the IC chip 21
The method of connecting with two is becoming mainstream. The substrate composed of one layer means the substrate.

[0009]

However, FIG. 6 and FIG.
As is clear from FIG.
4, since C8 is also molded, there is a problem that the mold area becomes large and a sufficient bonding area cannot be secured. When the bonding area is small, there is a problem that the IC module is easily peeled off from the main substrate due to the bending stress of the card. Therefore, the present invention conforms to the ISO standard,
In addition, it has been studied to reduce the mold area while maintaining the principle that the center of the mold region is the center of the IC module substrate.

[0010]

An IC module according to the present invention for solving the above-mentioned problems has an IC module substrate formed on a single-layered terminal substrate in a direction parallel to a long side (A) of a card. Direction, the side direction parallel to the card short side (B) is defined as the y direction, and the extraction size of the IC module substrate is defined as (Amm × Bmm). ISO
When the difference from the standard y-direction terminal center position is L,
The center position of the C module in the y direction is shifted from the center position of the ISO standard y direction terminal to the positive side in the y direction within the range of L in the following equation [0 <L <(B / 2) -4.66] mm. An IC module for an IC card. With such an IC module, an IC card with high strength can be manufactured.

The IC card according to the present invention for solving the above-mentioned problems has an IC module substrate formed on a single-layered terminal substrate, in which the direction parallel to the long side (A) of the card is the x direction and the short side of the card ( Let the side direction parallel to B) be the y direction,
If the difference between the center position in the y-direction of the eight-terminal IC module substrate and the center position in the y-direction terminal of the ISO standard is L when the size of the C-module substrate is (Amm × Bmm), An IC module in which the center position in the y direction is shifted to the positive side in the y direction from the center position in the y direction of the ISO standard within the range of L of the following equation [0 <L <(B / 2) -4.66] mm An IC card characterized in that an adhesive is applied or stuck to a portion other than the mold portion of the IC module, and is fixed and loaded in the recess of the IC card main body substrate with the adhesive. Since such an IC card is used, an IC card from which the IC module is hard to fall off is obtained.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be specifically described, but the present invention is not limited to the following embodiments. FIG. 1 shows an IC card I of the present invention.
It is a figure showing an example of C module. Although shown in the same state as FIG. 7, the IC chip, the bonding wires and the like are omitted. FIG. 1 shows that the difference (L1) between the center position P (○) in the y direction of the IC module substrate and the center position C (x) in the y direction of the ISO module substrate is 0 when the size of the IC module substrate is set to 13 mm × 11.8 mm. It shows the case of 0.5 mm. In this state, the mold area (grain portion) is reduced by about 13% as compared with the case of FIG. Since the adhesive application or the adhesive sheet attaching portion avoids the mold area, the adhesive area increases by the reduced area.

The principle that the center of the mold area is the center of the IC module substrate is that if the center position is displaced in the process of loading the IC module into the IC card or the like, the imbalance of the center of gravity causes the IC module to be out of position. This is because there is often a problem in the handling of the material. This is likely to occur as a phenomenon that the IC module is hardly parallel to the plane of the card when the IC module is dropped off from the machine when picked up or when the IC module is loaded into the counterbore with an adhesive.

FIG. 2 is a diagram showing another example of an IC module for an IC card according to the present invention. Although FIG. 2 shows the same state as FIG. 1, FIG. 2 shows a case where the cutout size of the IC module substrate is 13 mm × 11.8 mm and the center position P (○) of the IC module substrate in the y direction and the center of the ISO standard y direction terminal The case where the difference (L2) from the position C (x) is 1.24 mm is shown. In this state, the position where the lower end is pulled out is C
4, C8, so that it is in contact with the lower end of the terminal,
It is almost at the limit. In the case of FIG. 2, the mold area (grain portion) is reduced by about 33% as compared with the case of FIG. In both cases of FIG. 1 and FIG. 2, the terminals C4 and C8 of the external terminals are secured at predetermined positions of the ISO standard on the surface of the card, so that they conform to the standard.

FIG. 3 is a diagram showing an example of the terminal pattern shape of the card surface side of the IC module of the present invention. The inside of the range surrounded by the dotted line indicates the region of the mold resin 23 on the back surface of the substrate. FIG. 3 (A), (B), (C), (D)
In either case, the center position of the IC module in the y direction (（)
Is shifted to the upper edge side (positive side in the y direction) of the card with respect to the center position (x) of the ISO standard y direction terminal.
In each case, the center position (○) of the IC module substrate in the y direction is the center of the mold resin region. In order to form such an IC module, the extended portion 35 is provided at the C1 and C5 terminals on the outer edge side of the card of the front side terminal board to form a wide width (FIGS. 3B and 3D) or C1 ,
In addition to the C5 terminal, it is necessary to form a metal plate portion 36 having no terminal function on the outer edge side of the card (FIG. 3A,
(C)).

Next, a method of manufacturing such an IC module will be described. Although the IC module of the present invention can use a conventional double-sided board, a case where a single-layer board is used will be described from the viewpoint of providing flexibility and economy. First, the glass with adhesive
A base material such as an epoxy resin is prepared, and a bonding hole for wire bonding is formed. For this purpose, a mechanical drilling method or a laser drilling method is used. As the base material, a printed wiring board base material can be used, and a base material such as a glass / epoxy base material, a heat-resistant epoxy resin, an imide-modified epoxy resin, a polyimide resin, a bismaleimide / triazine resin (BT resin), or the like may be used. Subsequently, a copper foil is laminated on the adhesive side of the substrate. The copper foil preferably has a thickness of about 0.018 mm. Next, a terminal pattern separating portion 34 for separating the terminals into a terminal pattern shape is formed. This is based on a photo-etching method in which a photosensitive material is applied on a copper foil or a photosensitive film is attached and a photomask having a predetermined pattern is used.
After the terminal shape is formed, nickel plating and soft gold plating are performed on the copper foil to enhance the conductivity and durability of the terminal.

The module fabrication starts with a die bonding step of mounting an IC chip on a substrate. After the IC chip on the carrier tape is mounted on the substrate, the wire is bonded to the plated copper foil surface through the bonding hole of the base material that has been previously drilled from the die pad of the IC chip.
Finally, resin sealing for covering the IC chip and the wire is performed. This resin-sealed portion becomes a mold resin region.

An adhesive sheet having a mold portion cut out in a donut shape is attached to a module substrate in a reel state in advance. Alternatively, a method in which a normal liquid adhesive is applied to the periphery of the mold resin may be used. Next, the terminal board is punched into a predetermined shape, and is attached to a card body substrate having a concave portion. This means that after the IC module is inserted, only the terminal layer surface is locally hot-pressed by a hot stamper (for example, 100 to 170 ° C., 5 to 15 kg / cm ² ,
5 seconds) to fix the IC module in the recess of the card body. Thereby, the IC card of the present invention is completed.

[0019]

[Example] Glass epoxy resin base material (0.12 mm
(Thickness), a bonding hole (hole diameter φ0.8 mm) for wire bonding was drilled, and then a copper foil (0.018 mm thick) was attached. Subsequently, FIG.
Was formed by a photoetching method, and predetermined nickel plating (5 μm) and soft gold plating (1 μm) were performed on the terminal pattern. next,
After mounting the IC chip, C1, C2, C3, C5, C
6 and C7 were wire-bonded to the IC chip. The whole including the IC chip and the bonding wire portion was sealed with a sealing resin (epoxy resin) into the shape of the mold resin shown in FIG. A doughnut-shaped adhesive sheet was stuck around the mold resin. Next, the terminal substrate was punched into a predetermined shape (13.0 mm × 11.8 mm, R at the corner = 2.2 mm).

The IC module is inserted in advance into a recess having a counterbore in the IC card body substrate,
The substrate was fixed to the card substrate by applying a heat pressure of 10 ° C., 10 kg / cm ² and 5 seconds. Thus, the prototype IC card (T1) was completed. For comparison, a conventional product (T2) based on FIG.
And two comparative products with a smaller adhesive area (T
3, T4) was also prototyped under the same conditions.

After making a hole in the card base material on the back surface of the IC module part of each of the obtained IC cards, the mold part was pushed using a jig, and the load when the module was peeled off from the card base material was measured. The measured values and the area of the adhesive were as follows.

FIG. 4 is a graph showing the relationship between the adhesive area and the load at the time of peeling. As shown in FIG. 4, it was confirmed that the adhesive strength was higher than that of the conventional product.

[0023]

According to the IC card IC module of the present invention, the mold size can be reduced. Therefore, the bonding area around the mold part increases, the bonding strength of the IC module to the IC card body substrate increases, and the strength of the IC card increases. Further, since the amount of the mold resin used can be reduced, the cost of the resin material can be reduced, and the cost of the IC card can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of an IC card IC module of the present invention.

FIG. 2 is a diagram showing another example of the IC module for an IC card of the present invention.

FIG. 3 is a diagram illustrating an example of a card surface side terminal pattern shape of the IC module of the present invention.

FIG. 4 is a graph showing a relationship between an adhesive area and a load at the time of peeling.

FIG. 5 shows an IC card terminal position standard according to ISO.

FIG. 6 is an enlarged view showing an example of an IC card module substrate conforming to the ISO standard.

FIG. 7 shows an IC module for an IC card conforming to the ISO standard.

FIG. 8 is a diagram showing a cross section of an IC module part of the IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 IC card main body board 12 Depression 21 IC chip 22 Bonding wire 23 Mold resin 24 Adhesive or adhesive sheet 31 IC module board 32 Terminal copper foil 33 Bonding hole 34 Terminal pattern separation part

Claims (6)

[Claims] 1. A semiconductor device comprising: an I-terminal formed on a terminal substrate comprising a single layer;
The direction of the side parallel to the card long side (A) of the C module substrate is defined as the x direction, the direction of the side parallel to the card short side (B) is defined as the y direction, and the size of the IC module substrate cut out is (Amm × Bm).
m), when the difference between the center position in the y-direction of the IC module substrate having eight terminals and the center position in the y-direction terminal of the ISO standard is L, the center position of the IC module in the y-direction is defined as y in the ISO standard. An IC module for an IC card, which is shifted from a center position of a direction terminal to a positive side in a y direction within a range of L represented by the following equation: [0 <L <(B / 2) -4.66] mm. 2. The IC module for an IC card according to claim 1, wherein the terminal on the outer edge side of the IC card is formed wider than the other terminals in the surface terminal pattern shape of the terminal board. 3. The I terminal according to claim 1, wherein a metal plate portion having no terminal function is formed on the outer edge side of the IC card in the surface terminal pattern shape of the terminal substrate.
IC module for C card. 4. An I-terminal formed on a single-layer terminal substrate.
The direction of the side parallel to the card long side (A) of the C module substrate is defined as the x direction, the direction of the side parallel to the card short side (B) is defined as the y direction, and the size of the IC module substrate cut out is (Amm × Bm).
m), when the difference between the center position in the y-direction of the IC module substrate having eight terminals and the center position in the y-direction terminal of the ISO standard is L, the center position of the IC module in the y-direction is defined as y in the ISO standard. The IC module shifted to the positive side in the y direction within the range of L of the following equation [0 <L <(B / 2) -4.66] mm from the center position of the directional terminal is placed on a part other than the mold part of the IC module. An IC card, characterized in that an adhesive is applied or stuck thereon, and is fixed and loaded into the recess of the IC card main body substrate by the adhesive. 5. The IC card according to claim 4, wherein the terminal on the outer edge side of the IC card is formed wider than the other terminals in the surface terminal pattern shape of the terminal board. 6. The I terminal according to claim 4, wherein a metal plate portion having no terminal function is formed on the outer edge side of the IC card in the surface terminal pattern shape of the terminal substrate.
C card.