JPH11298049A - Light emitting display - Google Patents

Abstract

(57) [Problem] To provide a light emitting display device in which leakage of molding resin and generation of resin burrs 17 during transfer molding are prevented. SOLUTION: Separation part 14 between electrode wiring layers on the substrate surface side
A region including a part of the adjacent electrode wiring layers 15 and 16 between which is covered by resin resist layers 18a and 18b formed by a coating means such as a screen printing method. By forming the mold resin package 9 such that the mold is sealed under pressure, a package using transfer resin mold can be formed without causing resin leakage.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting display device, and more particularly, to a light-emitting display device having a structure in which two or more solid-state light-emitting elements are directly mounted on an electrode wiring layer of an insulating substrate and sealed with a mold resin package. The present invention relates to a light-emitting display device.

[0002]

2. Description of the Related Art With the miniaturization of electric equipment, light emitting display devices used as light sources for various display devices are required to be further reduced in size and thickness.

[0003] A typical example of a light-emitting display device is a light-emitting diode (hereinafter, simply referred to as an LED) as a light-emitting element. In recent years, this LED also includes a small and thin chip including a two-color light-emitting type. Part type is used.

[0004] A conventional two-color light-emitting chip component type light-emitting display device has an LED mounted on an electrode wiring layer of an insulating substrate as disclosed in Japanese Patent Publication No. 7-93338, for example. A pair of through-holes for electrically connecting the electrode wiring layer to the back surface electrode of the insulating substrate are provided for each of the anode and the cathode, and the direction along the row of the through-holes is sealed. It is used in a structure in which a cutting process is performed in two directions, that is, a direction perpendicular to the resin, and the chip component type light emitting display device is separated and divided.

In place of the arrangement of through holes formed for electrical conduction of the insulating substrate, a slit-shaped opening is provided in advance on the insulating substrate, and a metal layer formed on the side surface of the insulating substrate is provided. , And electrical separation can be performed to separate the individual devices at a slit electrode dividing portion provided at a predetermined position on the side surface of the insulating substrate. A two-color light-emitting chip component type light-emitting display device having the above structure is shown in a perspective view of FIG. In this figure, the internal structure is transparently shown assuming that the package portion is formed of a transparent body. In FIG. 4, 1 is an insulating substrate, 2 is an LED chip, 3 is a conductive adhesive (conductive paste), 4 is an electrode wiring layer called a pad on the LED mounting side, 5 is an electrode wiring layer on the thin metal wire connection side, 6
Is a thin metal wire, 9 is a molded resin package, 10 is LE
D is an anode electrode, 11 is an anode-side slit electrode wiring layer, 12 is a cathode-side slit electrode wiring layer, 13 is a separation part between the slit electrode wiring layers, 14 is a separation part between the electrode wiring layers on the substrate surface side, and 15 and 16 are 2 shows each electrode wiring layer on the substrate surface.

According to this structure, one direction is slit-shaped and divided in advance, so that the cutting axis can be a single direction only in a direction perpendicular to the sealing resin, so that the number of cutting steps is reduced. In addition, since many through holes are not required, there is an excellent economical effect that the substrate price is reduced.

[0007]

However, in the case of the two-color light emitting chip component type light emitting display device shown in FIG. 4, the substrate surface where the electrode wiring layers 15 and 16 are separated from the electrodes on the substrate surface, that is, the substrate surface. Since there is a step between the insulating resin and the insulating pattern portion, when the mold resin package 9 is formed by transfer molding, leakage of the mold resin occurs,
In some cases, resin burrs 17 may be formed, in which case a step of removing resin burrs is required.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to form a stable molded resin package without resin burrs.

[0009]

A light emitting display device according to the present invention comprises at least two pairs of electrode wiring layers made of metal on a surface of an insulating substrate, and a conductive layer is formed on one surface of each of the pair of electrode wiring layers. A structure in which one electrode surface of a solid-state light-emitting element is bonded with an adhesive, and the other electrode surface of the solid-state light-emitting element is connected to the other surface of the electrode wiring layer with a thin metal wire, and these are sealed with a mold resin package. In the light-emitting display device, a resin resist layer is disposed on the surface of the insulating substrate, at an edge portion of the mold resin package in a region including a space between each one of the two pairs of electrode wiring layers adjacent to each other. is there.

The resin resist layer is formed by screen printing on a surface of the insulating substrate, including a region including one of the two pairs of electrode wiring layers adjacent to each other, by screen printing. The structure may be such that the steps are filled with this resin resist layer, and the material may be a material having good sealing properties with any of the insulating substrate, the electrode wiring layer and the mold resin package, and having moisture resistance. For example, it is optimal to use the same material as the mold resin.

According to this, when forming the mold resin package by the transfer molding method, since the upper mold for molding presses and shields the resin resist layer, the molding resin is formed between the electrode wiring layer and the substrate surface. Can be prevented from leaking from the gap.

[0012]

Next, the present invention will be described in more detail with reference to embodiments.

FIG. 1 is a perspective view of a light emitting display device according to one embodiment of the present invention. Reference numerals 1 to 16 in the figure are the same as those in FIG. As shown in FIG. 1, adjacent electrode wiring layers 1 with an isolation portion 14 between the electrode wiring layers on the substrate surface side interposed therebetween.
A region including a part of each of 5 and 16 is covered with resin resist layers 18a and 18b formed by a coating means such as a screen printing method, and an upper mold (not shown) of a transfer mold is formed on the coated surface. Are formed under pressure to form a molded resin package 9, whereby a package using a transfer resin mold can be formed without causing resin leakage.

The method for forming the mold resin package 9 is not limited to the transfer molding method, but any other means, such as a casting method using a liquid resin, may be used as long as it is a mold structure for forming a package portion. However, a similar effect can be obtained. Further, the resin resist layer is divided into an anode side 18a and a cathode side 18b.
By changing the length, the polarity display of the light emitting display device is also possible.

FIG. 2 is a perspective view showing a two-color light emitting chip component type light emitting display device according to another embodiment of the present invention. In this embodiment, the coloring of the resin resist layer 18a on the anode side and the resin resist layer 18b on the cathode side are changed.
For example, a complementary color such as 18a is red and 18b is blue, or resin resist layers 18a and 1
If one of the colors 8b is inconspicuous (a color similar to that of the insulating substrate 1), the other resin resist layer is made to be conspicuous.
Except for this point, the configuration is similar to that of the above-described embodiment. According to this embodiment, without changing the length of the anode side 18a and the cathode side 18b of the resin resist layer,
Different colors allow recognition of the polarity.

FIG. 3 is a conceptual plan view showing the electrode structure on the back side of the two-color light emitting chip component type light emitting display device applied to each of the above embodiments and the shape of the protective coating with the resin resist layer. In the figure, reference numeral 19 denotes each back electrode which is electrically connected from the electrode wiring layer on the front surface of the insulating substrate via the conductor layer on the side surface of the substrate, 20 denotes a pattern of a resin resist layer for protecting the conductor on the back surface, 21 Indicates a wiring pattern of a conductor. As shown in FIG. 3, a resin resist layer for protecting the conductor on the back surface is provided on almost the entire surface except for the electrode surface.
Alternatively, the resin resist layers 18a and 18b in FIG. 2 can function to prevent warping of the substrate due to pressurization of the mold during transfer molding in order to improve the effect of preventing resin leakage during transfer molding.

[0017]

As described above, according to the present invention,
By covering the edge of the mold resin package with the resin resist layer in the area including the part of the two pairs of electrodes and the adjacent electrodes on the surface of the insulating substrate, transfer resin molding without causing resin leakage The excellent effect that it can be obtained is obtained.

Further, by changing the length of the resin resist film, it is possible to display the polarity of the light emitting display device.

[Brief description of the drawings]

FIG. 1 is a perspective view of a light emitting display device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a light emitting display device according to another embodiment of the present invention.

FIG. 3 is a schematic plan view of a back-side electrode structure of the light-emitting display device according to the embodiment of the present invention.

FIG. 4 is a perspective view of a conventional light emitting display device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Insulating substrate 2 LED chip 3 Conductive adhesive 4 Electrode wiring layer (pad for mounting LED) 5 Electrode wiring layer (pad for mounting fine metal wire) 6 Fine metal wire 9 Mold resin package 10 Anode electrode of LED 11 Anode slit electrode wiring Layer 12 Cathode side slit electrode wiring layer 13 Slit electrode separation part 14 Substrate surface insulating pattern part (electrode separation part) 15 Electrode wiring layer on substrate surface 16 Electrode wiring layer on substrate surface 17 Resin burr 18a Resin layer 18b on anode side 18b Cathode Side resin resist layer 19 back electrode layer 20 back resin resist layer 21 back conductor

Continuation of front page (72) Inventor Kazuhiro Ishibashi 1-1, Kochicho, Takatsuki-shi, Osaka Matsushita Electronics Corporation

Claims (3)

[Claims] At least two pairs of electrode wiring layers made of metal are provided on a surface of an insulating substrate, and one electrode surface of a solid-state light emitting element is bonded to one surface of each of the pair of electrode wiring layers with a conductive adhesive. The other electrode surface of the solid-state light-emitting element and the other surface of the electrode wiring layer are connected by a thin metal wire, and the structure is sealed with a mold resin package. A light emitting display device, wherein a resin resist layer is provided at an edge portion of the mold resin package in a region including a space between each one of the two pairs of electrode wiring layers adjacent to each other. 2. The light-emitting display device according to claim 1, wherein the resin resist layer has different dimensions in a region including a region where one of the two pairs of electrode wiring layers is adjacent to each other. 3. The light emitting display device according to claim 1, wherein the resin resist layer is formed by coating.