JPH11297589A - Substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus that can accurately set the discharge quantity of a treatment solution. SOLUTION: A discharge pump 6 is driven by a pump drive motor 7 for supplying a resist solution to a resist nozzle 4 and has it discharge the solution. The pump drive motor 7 is driven by a motor controller 10 based on the control by a control unit 13. The control unit 13 has recipe data and a supply library. Driving patterns for the pump drive motor 7, acceleration and deceleration times, discharge speed and quantity of the resist solution from the resist nozzle 4 are input in the supply library. Control information, such as discharge time of the resist nozzle 4, etc., is input from the input unit 12 and stored in the recipe data. Control information in the recipe data and the supply library can be changed from the input unit 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus provided with a nozzle for discharging a processing liquid.

[0002]

2. Description of the Related Art A substrate processing apparatus is used to perform predetermined processing on a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a substrate for an optical disk. In such a substrate processing apparatus, the surface of the substrate is processed by supplying a processing liquid such as a resist liquid, a developing liquid, or a cleaning liquid from a processing liquid nozzle to the surface thereof while rotating the substrate in a horizontal posture.

FIG. 7 is a schematic diagram showing the configuration of a rotary coating apparatus as an example of a substrate processing apparatus. 7, the rotary coating apparatus includes a substrate holding unit 2 that holds a substrate W, and a spin motor 1 that drives the substrate holding unit 2 to rotate. Further, the rotary coating apparatus is provided with a resist liquid supply system 30 for supplying a resist liquid to the surface of the substrate W. The resist liquid supply system 30 includes a resist container 25 for storing the resist liquid 26, a resist supply pipe 5 for guiding the resist liquid 26 in the resist container 25, and a resist nozzle 4 for discharging the resist liquid. A bellows 20 for sending the resist solution 26 in the resist container 25 to the nozzle 4 and a cylinder 21 for driving the bellows 20 to expand and contract are arranged in the resist supply pipe 5. Two introduction pipes 28 and 29 for introducing compressed air are connected to the cylinder 21. On-off valves 22 and 23 are provided in the introduction lines 28 and 29, respectively.
Is attached. Further, the switching valve 24 connected to the introduction pipes 28 and 29 transfers the compressed air 27 to one of the introduction pipes 2 and 29.
8 and the other supply line 29.

When a resist solution is supplied to the substrate W, compressed air 27 is supplied to the cylinder 21 through an introduction pipe 28 by a switching valve 24. Then, the bellows 20 is extended to suck the resist solution 26 from the resist container 25 into the bellows 20. Thereafter, the switching valve 24 is switched to supply the compressed air 27 to the cylinder 21 from the introduction pipe 29. Thereby, the bellows 20 is compressed, and the resist liquid 26 in the bellows 20 is discharged from the resist nozzle 4 to the surface of the substrate W through the resist supply pipe 5. The resist liquid discharged onto the surface of the substrate W is uniformly spread over the entire surface of the substrate W by receiving the centrifugal force due to the rotation of the substrate W.

[0005] The thickness of the resist thin film applied and formed on the surface of the substrate W must be accurately controlled in order to form a fine pattern of the resist thin film on the substrate W. Also,
The thickness of the resist thin film depends on the discharge amount of the resist liquid supplied to the substrate W. For this reason, the discharge amount of the resist liquid from the resist nozzle 4 needs to be accurately controlled.

In the coating apparatus shown in FIG. 7, the discharge amount of the resist liquid is controlled as follows. First, before discharging to the substrate W, the time for driving the cylinder 21 by supplying the compressed air 27 to the cylinder 21, that is, the registration nozzle 4
The discharge time of the resist solution is set in various ways, and the discharge amount of the resist solution at that time is measured with a measuring container to obtain the relationship between the discharge time and the discharge amount of the resist solution in advance. Then, based on the measurement result, the discharge time of the resist solution, that is, the cylinder 21 is adjusted so that the discharge amount of the resist solution becomes a desired value.
Set the drive time of

At the time of actual discharge of the resist solution, the cylinder 2 is driven based on the driving time set by the above processing.
1 is driven, and the resist liquid is discharged from the resist nozzle 4 onto the surface of the substrate W. Then, when the set driving time has elapsed, the on-off valves 22 and 23 of the introduction conduits 28 and 29 are closed, and the driving of the cylinder 21 is stopped. Thus, the discharge of the resist liquid from the resist nozzle 4 is stopped.

[0008]

In the above-mentioned conventional rotary coating apparatus, the discharge amount of the resist solution is controlled by opening and closing the opening and closing valves 22, 23 of the introduction pipes 28, 29 to the cylinder 21. The opening and closing operations of the on-off valves 22 and 23 are performed using compressed air 27. Therefore, the on-off valve 22,
The opening / closing operation of the nozzle 23 is not always constant, which makes it difficult to accurately control the discharge amount of the resist solution.

The on-off valves 22 and 23 have their own flow characteristics. Therefore, the same type of on-off valve 2
The relationship between the discharge time and the discharge amount of the resist liquid differs for each rotary coating apparatus even in the rotary coating apparatuses using the coating apparatuses 2 and 23. Therefore, it is necessary to determine the relationship between the discharge time and the discharge amount of the resist liquid for each rotary coating apparatus and set the discharge time.

On the other hand, when changing the discharge amount of the resist liquid in the conventional rotary coating apparatus, not only the discharge time of the resist liquid but also the discharge speed of the resist liquid from the resist nozzle 4 must be changed. Is also possible. In this case, a flow control device (not shown) provided in a supply pipe of the compressed air 27 supplied to the cylinder 21
Was manually changed to adjust the supply amount of the compressed air 27. However, every time the discharge speed of the resist solution needs to be changed, it is necessary to manually readjust the flow control device of the compressed air 27, and it is difficult to change the discharge speed of the resist solution.

An object of the present invention is to provide a substrate processing apparatus capable of accurately setting a discharge amount of a processing liquid from a nozzle.

It is a further object of the present invention to provide a substrate processing apparatus that can easily change the operation of discharging a processing liquid from a nozzle.

[0013]

Means for Solving the Problems and Effects of the Invention (1)
A substrate processing apparatus according to a first aspect of the present invention is a substrate processing apparatus that performs a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate, and a substrate holding unit that holds the substrate. A nozzle for discharging the processing liquid to the substrate held by the substrate holding means, a pump for feeding the processing liquid from the processing liquid supply source to the nozzle, a motor for driving the pump, and controlling a discharging operation of the processing liquid from the nozzle. An input means for inputting control information and a control means for controlling the operation of the motor based on the control information input by the input means are provided.

[0014] In the substrate processing apparatus according to the first aspect of the invention, the pump for sending the processing liquid to the nozzle is driven by a motor. The rotation operation of the motor can be accurately controlled by the control means. Therefore, by accurately controlling the discharge amount of the processing liquid from the pump driven by the motor, the discharge amount of the processing liquid discharged from the nozzle can be set to a desired value. Further, control information for controlling the discharge operation of the processing liquid from the nozzles can be input from the input means, and the operation of the motor is controlled based on the input control information. Therefore, by inputting the control information from the input means, it becomes possible to easily change the discharge operation of the processing liquid from the nozzle.

(2) Second Invention In a substrate processing apparatus according to a second aspect of the present invention, in the configuration of the substrate processing apparatus according to the first aspect, the input means includes, as control information, a rotation indicating a change in rotation speed of the motor. The speed change pattern is input, and the control means controls the operation of the motor based on the rotation speed change pattern input from the input means.

In the substrate processing apparatus according to the second aspect, a rotation speed change pattern of the motor is input from the input means, and the rotation operation of the motor can be controlled according to the input rotation speed change pattern. Thus, the processing liquid can be discharged from the nozzle in a desired state.

(3) Third Invention In a substrate processing apparatus according to a third invention, in the configuration of the substrate processing apparatus according to the second invention, the rotation speed change pattern is a trapezoidal pattern, and the control means includes: The operation of the motor is controlled based on the control information of the rotation speed change pattern, the discharge amount of the processing liquid from the nozzle, the discharge time, the discharge speed, the acceleration time and the deceleration time of the motor.

In the substrate processing apparatus according to the third invention, it is possible to input a trapezoidal rotation speed change pattern, and the control means controls the rotation speed change pattern, the discharge amount of the processing liquid from the nozzle, and the discharge time. The operation of the motor can be controlled based on the control information of the discharge speed, the acceleration time and the deceleration time of the motor. Thereby, the discharge operation of the processing liquid from the nozzle can be accurately controlled.

(4) Fourth Invention In the substrate processing apparatus according to the fourth invention, in the configuration of the substrate processing apparatus according to the third invention, the input means includes: a discharge amount of the processing liquid from the nozzle, a discharge time, At least four of the five control information of discharge speed, motor acceleration time and motor deceleration time
Control information is input, and when four control information out of the five control information are input, the control means obtains the remaining control information out of the five control information, and determines the rotation speed change pattern and the five control information. The operation of the motor is controlled based on the two pieces of control information.

In the substrate processing apparatus according to the fourth aspect of the present invention, of the five control information necessary for controlling the operation of the motor,
When four pieces of control information are input, the control means can obtain the remaining control information and control the operation of the motor. Thereby, the input operation of the control information by the operator can be simplified.

(5) Fifth Invention A substrate processing apparatus according to a fifth invention is the substrate processing apparatus according to the second invention, wherein the rotation speed change pattern is:
When the motor accelerates and decelerates, the rotation speed changes in an S-shape when the rotation speed changes in an S-shape. The control unit controls the rotation speed change pattern, the discharge amount of the processing liquid from the nozzle, the discharge time,
The operation of the motor is controlled based on control information on the discharge speed, the acceleration time and the deceleration time of the motor.

In the substrate processing apparatus according to the fifth aspect of the present invention, an S-shaped pattern in which the rotation speed changes in an S-shape when the motor is accelerated and decelerated can be input. The rotation operation of the motor according to the S-shaped rotation speed change pattern can be controlled based on the control information of the liquid discharge amount, the discharge time, the discharge speed, the acceleration time and the deceleration time of the motor. Thus, the discharge operation of the processing liquid from the nozzle can be accurately controlled.

(6) Sixth invention A substrate processing apparatus according to a sixth aspect of the present invention is the substrate processing apparatus according to the fifth aspect, wherein the input means comprises: a discharge amount of the processing liquid from the nozzle, a discharge time; At least four of the five control information of discharge speed, motor acceleration time and motor deceleration time
Control information is input, and when four control information out of the five control information are input, the control means obtains the remaining control information out of the five control information, and determines the rotation speed change pattern and the five control information. The operation of the motor is controlled based on the two pieces of control information.

In the substrate processing apparatus according to the sixth aspect, the control means calculates the remaining control information when four of the five pieces of control information required for controlling the operation of the motor are input. Thus, the operation of the motor can be controlled. Thereby, the input operation of the control information by the operator can be simplified.

(7) Seventh Invention A substrate processing apparatus according to a seventh invention is a substrate processing apparatus for performing a predetermined processing by supplying a processing liquid guided from a processing liquid supply source to a substrate. A substrate holding means for holding, a nozzle for discharging a processing liquid to the substrate held by the substrate holding means, a pump for sending a processing liquid from a processing liquid supply source to the nozzle, a motor for driving the pump, and discharging from the nozzle Input means for inputting the discharge speed of the processing liquid, and control means for controlling the rotation speed of the motor based on the discharge speed of the processing liquid input from the input means.

In the substrate processing apparatus according to the seventh aspect, the discharge speed of the processing liquid is input by the input means, and the rotation speed of the motor can be controlled based on the input discharge speed. Thus, the processing liquid can be discharged from the nozzle at a desired discharge speed to the substrate.

(8) Eighth Invention A substrate processing apparatus according to an eighth invention is a substrate processing apparatus for performing a predetermined processing by supplying a processing liquid guided from a processing liquid supply source to a substrate. A substrate holding means for holding, a nozzle for discharging a processing liquid to a substrate held by the substrate holding means, a pump for sending a processing liquid from a processing liquid supply source to the nozzle, a motor for driving the pump, an acceleration time of the motor or Input means for inputting at least one of the deceleration time, and control means for controlling the acceleration or deceleration operation of the motor based on the acceleration time or deceleration time of the motor input by the input means.

In the substrate processing apparatus according to the eighth invention, at least one of the acceleration time and the deceleration time of the motor is input by the input means, and the acceleration or deceleration operation of the motor is performed based on the input acceleration time or deceleration time. Can be controlled. This makes it possible to control the initial and final discharge states of the processing liquid from the nozzles to desired states.

(9) Ninth Invention A substrate processing apparatus according to a ninth invention is a substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to the substrate. Substrate holding means for holding, a nozzle for discharging a processing liquid to a substrate held by the substrate holding means, a pump for sending a processing liquid from a processing liquid supply source to the nozzle, a motor for driving the pump, and a processing liquid from the nozzle Input means for inputting the discharge time of the processing liquid, and control means for controlling the time during which the motor drives the pump based on the discharge time of the processing liquid input by the input means.

In the substrate processing apparatus according to the ninth aspect, the discharge time for discharging the processing liquid is input by the input means, and the time for driving the pump by the motor can be controlled based on the input discharge time. . This makes it possible to control the discharge amount of the processing liquid by adjusting the discharge time of the processing liquid from the nozzle to a desired value.

(10) Tenth Invention A substrate processing apparatus according to a tenth invention is a substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate. A substrate holding means for holding, a nozzle for discharging a processing liquid to the substrate held by the substrate holding means, a pump for sending a processing liquid from a processing liquid supply source to the nozzle, a motor for driving the pump, and discharging from the nozzle Input means for inputting the discharge amount of the processing liquid, and control means for controlling the rotation operation of the motor based on the discharge amount of the processing liquid input by the input means are provided.

In the substrate processing apparatus according to the tenth aspect of the present invention, the discharge amount of the processing liquid to be discharged from the nozzle is input by the input means, and the rotation operation of the motor is controlled based on the input discharge amount of the processing liquid. be able to. This makes it possible to control the discharge amount of the processing liquid from the nozzle to a desired value.

(11) Eleventh Invention A substrate processing apparatus according to an eleventh invention is a substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate. A substrate holding means for holding, a nozzle for discharging a processing liquid onto the substrate held by the substrate holding means, a pump for sending a processing liquid from a processing liquid supply source to the nozzle, a motor for driving the pump, and a rotation speed of the motor. Input means for inputting a rotation speed change pattern indicating a change,
Control means for controlling the rotation operation of the motor based on the rotation speed change pattern input by the input means.

In the substrate processing apparatus according to the eleventh aspect, a rotation speed change pattern indicating a rotation speed change of the motor is input by the input means, and the rotation operation of the motor is controlled based on the input rotation speed change pattern. Can be. This makes it possible to control the discharge state of the processing liquid from the nozzle to an arbitrary pattern.

(12) Twelfth Invention A substrate processing apparatus according to a twelfth invention is a substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate. Substrate holding means for holding, a nozzle for discharging a processing liquid to a substrate held by the substrate holding means, a pump for sending a processing liquid from a processing liquid supply source to the nozzle, a motor for driving the pump, and a processing liquid from the nozzle Input means for inputting control information for controlling the discharge operation of the pump and correction information for correcting the control information in accordance with the characteristics of the pump, and correcting the control information input by the input means based on the correction information, And control means for controlling the discharge operation of the processing liquid from the nozzles based on the control information.

In the substrate processing apparatus according to the twelfth aspect, control information for controlling the discharge operation of the processing liquid from the nozzle by the input means and correction information for correcting the control information according to the characteristics of the pump are input. can do. The correction information includes information for correcting general-purpose control information according to characteristics unique to a pump of each substrate processing apparatus with respect to control information generally generated for a substrate processing apparatus having the same specification. Therefore, the control means corrects the control information based on the input correction information and controls the discharge operation of the processing liquid from the nozzles, whereby the discharge operation of the processing liquid can be accurately controlled to a desired state.

(13) Thirteenth Invention A substrate processing apparatus according to a thirteenth invention is a substrate processing apparatus for performing a predetermined processing by supplying a processing liquid guided from a processing liquid supply source to the substrate. A substrate holding means for holding, a nozzle for discharging a processing liquid to the substrate held by the substrate holding means, a pump for sending a processing liquid from a processing liquid supply source to the nozzle, a motor for driving the pump, and a predetermined processing. The processing procedure information in the plurality of processing steps and motor control information for controlling the rotation operation of the motor are stored, and the processing procedure information includes control information of the discharge time of the processing liquid from the nozzle in the processing liquid discharging step, Control means for controlling the operation of the motor to drive the pump based on the control information of the discharge time of the processing liquid from the nozzle in the procedure information and the motor control information.

In the substrate processing apparatus according to the thirteenth aspect, the processing procedure information includes control information of the discharge time of the processing liquid from the nozzle. For this reason, when changing the discharge amount of the processing liquid from the nozzle, the control information of the processing liquid discharge time included in the processing procedure information is changed, so that the processing liquid from the nozzle is not changed without changing the motor control information. The discharge amount can be easily changed.

[0039]

FIG. 1 is a schematic configuration diagram of a rotary coating apparatus as an example of a substrate processing apparatus according to an embodiment of the present invention. In FIG. 1, a rotary coating device is attached to a spin motor 1 and a tip of a rotation shaft of the spin motor 1,
The apparatus includes a substrate holding unit 2 that holds a substrate W in a horizontal posture and is driven to rotate. In addition, the rotary coating apparatus has a resist liquid supply system 30 that supplies a resist liquid to the substrate W. The resist solution supply system 30 includes a resist container 8 that stores the resist solution 9, a resist nozzle 4 that discharges the resist solution 9,
A resist supply line 5 for connecting the resist nozzle 4 and the resist container 8 is provided, and a discharge pump 6 and a pump drive motor 7 provided in the resist supply line 5.

The resist nozzle 4 is formed so as to be movable between a position above the substrate W and a standby position outside the substrate W.

The pump drive motor 7 is a pulse motor. In a pulse motor, the number of rotations can be accurately controlled by a drive pulse. The pump drive motor 7 composed of this pulse motor is driven to rotate by a drive pulse output from the motor controller 10 under the control of the main controller 11.

The discharge pump 6 receives the rotational force from the pump drive motor 7 and sends out the resist solution 9 from the inside of the resist container 8 to the resist nozzle 4 through the resist supply line 5.
Discharge from the resist nozzle 4.

The main controller 11 comprises an input unit 12, a control unit 13, and a display unit 14. Input unit 12
Inputs control information of the discharging operation of the resist liquid 9 from the resist nozzle 4 and control information of the rotating operation of the pump drive motor 7.

The control unit 13 has a sub-library for storing recipe data for storing control information for defining the processing procedure in the rotary coating apparatus and for storing control information for defining the operation of the pump drive motor 7. Each control information input from the input unit 12 is stored at a predetermined position in the recipe data and the sub-library. The control unit 13 controls the operation of each unit of the rotary coating apparatus with reference to the recipe data and the sub-library, and outputs a control signal to the motor controller 10 to control the rotation operation of the pump drive motor 7.

The display unit 14 displays control information input from the input unit 12, control information required by the control unit 13, and the like.

FIG. 2 is an explanatory diagram of the recipe data.
Is an explanatory diagram of a sub-library. FIG. 4 is a diagram showing a change in the rotation speed of the pump drive motor in the processing step of the rotary coating device.

As shown in FIG. 2 to FIG. 4, in the rotary coating apparatus, processing steps of a resist liquid discharging step, a rotary coating step, a substrate rinsing step, a drying step and a standby step are performed. In the recipe data 15 of FIG. 2, processing steps 15a corresponding to each processing step of the rotary coating apparatus, the number of substrate rotations 15b in each processing step, the processing time 15c in each processing step, and the movement timing information of the resist nozzle (shown in FIG. ) Is stored.

The sub-library 16 shown in FIG. 3 includes the discharge speed Vd of the resist solution from the resist nozzle 4, the acceleration time Ta and the deceleration time Tr of the pump drive motor 7, the discharge amount Q of the resist solution, the pump drive motor 7 And the correction value C of the discharge amount of the resist liquid are stored.

In the above embodiment, the substrate holding section 2 corresponds to the substrate holding means of the present invention, the resist nozzle 4 corresponds to the nozzle, the discharge pump 6 corresponds to the pump, and the pump drive motor 7 corresponds to the motor. The input unit 14 of the main controller 11 corresponds to an input unit, and the control unit 12 corresponds to a control unit. Further, the recipe data 15 corresponds to the processing procedure information, and the sub-library 16 corresponds to the motor control information.

The processing operation of the rotary coating apparatus having the above configuration will be described below. Usually, the recipe data 15 and the sub-library 16 of the rotary coating apparatus are created in advance and stored in the control unit 13 of the main controller 11. Then, the rotary coating apparatus performs each processing step with reference to the stored recipe data 15 and sub-library 16.

When a new processing operation is performed by changing the processing operation based on the control information stored in the recipe data 15 and the sub-library 16, the control information to be changed is input from the input unit 12 of the main controller 11. Enter Here, a case where the discharge operation of the resist nozzle 4 is changed will be described.

In this case, the worker inputs the resist liquid from the resist nozzle 4 through the input unit 12 at the discharge speed Vd, the acceleration time Ta and the deceleration time Tr of the pump drive motor 7, the discharge amount Q of the resist liquid, and the The drive pattern P, the correction value C of the discharge amount of the resist liquid, and the discharge time Td of the resist liquid are input. Of the input control information,
The resist liquid ejection time Td is stored as the time T3 within the processing time 15c of the processing step S3 of the recipe data 15 of FIG. 2, and the remaining control information is stored in the sub-library 16 of FIG.
Is stored at a predetermined position. As a result, the process enters a start state.

In the rotary coating apparatus of the present embodiment, it is not necessary to input all of the above seven control information from the input unit 12. For example, when controlling the rotation speed of the pump drive motor 7 with a trapezoidal drive pattern as shown in FIG. 5, the discharge amount Q of the resist solution 9, the discharge speed Vd, the discharge time Td, the acceleration time Ta, and the deceleration time At least four pieces of control information among the five pieces of control information of Tr may be input. In this case, the control unit 13 calculates the remaining control information based on the four pieces of input control information.

For example, when the discharge speed Vd and discharge time Td of the resist solution 9 and the acceleration time Ta and the deceleration time Tr of the pump drive motor 7 are input from the input unit 12, the control unit 13
Calculates the discharge amount Q of the resist solution,
And displayed on the display unit 14. Thereby, the operator can check the discharge amount Q of the resist liquid.

When the rotation speed of the pump drive motor 7 is controlled by an S-shaped drive pattern as shown in FIG. 6, at least four times as in the case of the trapezoidal drive pattern.
In addition to the two pieces of control information, control information of the S-shaped rotation speed at the time of acceleration and deceleration of the pump drive motor 7 may be input.

Further, when the correction value C of the discharge amount of the resist solution by the discharge pump 6 is input from the input unit 12, the control unit 13 corrects the rotation operation of the pump drive motor 7 based on the correction value C. Usually, the sub-library 16 is commonly used in a rotary coating apparatus using the discharge pump 6 and the pump drive motor 7 having the same specifications. However, even if the discharge pumps 6 have the same specifications, there is a device-specific difference in the discharge capacity of each pump. For example, when 2000 drive pulses are given to the pump drive motor 7, 1 ml
In a discharge pump 6 having a specification of discharging (milliliter) resist liquid, when a drive pulse of 2000 pulses is actually given to a pump drive motor 7 and the discharge amount of the discharge pump 6 is measured, it may be different from 1 ml.

Then, when the actually measured ejection amount per predetermined number of drive pulses is input from the input unit 12 as the correction value C,
The control unit 13 calculates the discharge amount of the resist liquid per one driving pulse. Then, the actual discharge amount from the resist nozzle 4 is calculated and displayed on the display unit 14. Thereby, the operator can confirm the actual discharge amount of the resist liquid from the resist nozzle 4.

When the actual discharge amount from the resist nozzle 4 is controlled so as to be the inputted discharge amount Q, the discharge time Td of the resist liquid is calculated based on the discharge amount calculated from the correction value C. The input value or the input value of the discharge speed Vd is corrected. Thereby, the discharge amount from the resist nozzle 4 can be set to the desired discharge amount Q that has been input.

When the input of the control information is completed, the control unit 13 receives the input information of the processing start from the operator, and
The resist nozzle 4 is moved above the substrate W based on the control information of the processing step S1 of the recipe data 15.

Next, a resist discharging process is performed based on the control information shown in processing steps S2 and S3. At this time, the control unit 13 causes the resist nozzle 4 to discharge a resist solution onto the substrate W based on the control information input from the input unit 12 and stored in the sub-library 16. For example, when a trapezoidal drive pattern P is input by the input unit 12, the control unit 13 drives the pump drive motor 7 to rotate as shown in FIG. 5 according to each control information. That is, the pump drive motor 7 is accelerated for a time Ta from the resist solution discharge time t1, and then rotated at a constant rotation speed Rm for a time (Td− (Ta + Tr)). Furthermore, T
The pump drive motor 7 is decelerated for the time r and stopped at the time t2. Thereby, the resist liquid 9 is discharged from the resist nozzle 4 onto the substrate W by a predetermined discharge amount Q at a predetermined discharge speed Vd.

Thereafter, based on the control information shown in the processing steps S3 to S5, the spin motor 1 rotates
4 and R5, the resist liquid 9 discharged onto the surface of the substrate W is spread over the entire surface.

Further, a rinsing process for the back surface of the substrate W and an edge cleaning process for the peripheral edge of the substrate W are performed based on the control information shown in the processing steps S6 to S8.

Further, based on the control information shown in the processing steps S9 to S10, the rinse liquid from the substrate W is shaken off and dried, and then a standby state is set.

As described above, in the rotary coating apparatus according to the present embodiment, control information on the discharge operation of the resist nozzle 4 and the rotation operation of the pump drive motor 7 can be input from the input unit 12 of the main controller 11. For this reason, the discharge amount of the resist liquid can be changed to an optimum amount according to the type of the resist liquid, the diameter of the substrate W, and the like.

Further, by driving the discharge pump 6 using a pump drive motor 7 composed of a pulse motor capable of accurate rotation control, the discharge amount of the resist liquid from the resist nozzle 4 can be accurately controlled. . In addition, by correcting the discharge operation from the resist nozzle 4 based on the correction value C obtained from the actual discharge amount of the discharge pump 6, the discharge characteristics of each discharge pump 6 even when the common sub-library 16 is used. And the discharge amount of the resist solution can be accurately controlled to a desired amount.

In the above embodiment, the drive pattern of the pump drive motor 7 can be not only a trapezoidal or S-shaped pattern but also other drive patterns.

Further, in the above embodiment, an example is described in which the processing time stored in the column of T3 time of the processing time 15c of the recipe data 15 is used as the discharge time Td of the resist liquid 9, but the discharge time Td May be stored in the sub-library 16.

It should be noted that the recipe data 1
If the ejection time Td is input to 5, when the ejection amount of the resist from the nozzle 4 is changed, the data in the sub-library 16 is changed by changing the ejection time in the recipe data 15. Without this, the discharge amount of the resist from the nozzle 4 can be easily changed.

Further, in the above embodiment, the resist supply system 30 of the resist nozzle 4 of the rotary coating apparatus has been described as an example. However, the present invention can be applied to a rinse liquid supply system of an edge cleaning nozzle. Further, the present invention can be applied to a substrate processing apparatus having another processing liquid supply system such as a cleaning apparatus and a developing apparatus.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a rotary coating apparatus as an embodiment of a substrate processing apparatus of the present invention.

FIG. 2 is an explanatory diagram of recipe data of the rotary coating device of FIG. 1;

FIG. 3 is an explanatory diagram of a sub-library of the rotary coating device in FIG. 1;

FIG. 4 is a diagram showing a change in the number of rotations of a spin motor of the rotary coating apparatus in FIG. 1;

FIG. 5 is an explanatory diagram of rotation speed control of the pump drive motor of FIG. 1;

FIG. 6 is a diagram illustrating another example of the rotation speed control of the pump drive motor of FIG. 1;

FIG. 7 is a schematic diagram showing a configuration of a conventional rotary coating device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 spin motor 2 substrate holder 4 resist nozzle 5 resist supply line 6 discharge pump 7 pump drive motor 8 resist container 9 resist solution 10 motor controller 11 main controller 12 control unit 13 display unit 14 input unit 15 recipe data 16 sub-library

Claims (13)

[Claims] 1. A substrate processing apparatus for performing a predetermined processing by supplying a processing liquid guided from a processing liquid supply source to a substrate, comprising: a substrate holding means for holding a substrate; and a substrate held by the substrate holding means. A nozzle for discharging a processing liquid from the processing liquid supply source to the nozzle, a motor for driving the pump, and control information for controlling a discharging operation of the processing liquid from the nozzle. A substrate processing apparatus comprising: an input unit; and a control unit that controls an operation of the motor based on the control information input by the input unit. 2. The input means inputs a rotation speed change pattern indicating a change in the rotation speed of the motor as the control information, and the control means is configured to input the rotation speed change pattern based on the rotation speed change pattern input from the input means. 3. The substrate processing apparatus according to claim 1, wherein the operation of the motor is controlled by a motor. 3. The rotation speed change pattern is a trapezoidal pattern, and the control means controls the rotation speed change pattern, a discharge amount of the processing liquid from the nozzle, a discharge time, a discharge speed, and an acceleration time of the motor. 3. The substrate processing apparatus according to claim 2, wherein the operation of the motor is controlled based on control information of the deceleration time. 4. The control device according to claim 1, wherein the input unit is configured to output at least four of five control information of a discharge amount of the processing liquid from the nozzle, a discharge time, a discharge speed, and an acceleration time and a deceleration time of the motor.
When four control information items among the five control information items are input, the control means obtains the remaining control information items among the five control information items, and determines the rotation speed. 4. The substrate processing apparatus according to claim 3, wherein the operation of the motor is controlled based on the change pattern and the five pieces of control information. 5. The rotation speed change pattern is an S-shaped pattern in which the rotation speed changes in an S-shape when the motor accelerates and decelerates, and the control unit controls the rotation speed change pattern and the nozzle. 3. The substrate processing apparatus according to claim 2, wherein the operation of the motor is controlled based on control information of a discharge amount, a discharge time, a discharge speed, and an acceleration time and a deceleration time of the motor. 6. The control device according to claim 1, wherein the input unit is configured to output at least four control information of five control information of a discharge amount of the processing liquid from the nozzle, a discharge time, a discharge speed, an acceleration time and a deceleration time of the motor.
Control information can be further input, and when four control information of the five control information are input, the control means obtains the remaining control information of the five control information, and The substrate processing apparatus according to claim 5, wherein the operation of the motor is controlled based on a speed change pattern and the five pieces of control information. 7. A substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate, comprising: a substrate holding unit for holding a substrate; and a substrate held by the substrate holding unit. A nozzle for discharging a processing liquid from the processing liquid supply source to the nozzle, a motor for driving the pump, and an input unit for inputting a discharge speed of the processing liquid discharged from the nozzle. And a control means for controlling a rotation speed of the motor based on a discharge speed of the processing liquid input from the input means. 8. A substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate, comprising: a substrate holding unit for holding a substrate; and a substrate held by the substrate holding unit. A nozzle for discharging the processing liquid from the processing liquid supply source to the nozzle; a motor for driving the pump; and input means for inputting at least one of an acceleration time and a deceleration time of the motor. A substrate processing apparatus comprising: control means for controlling acceleration / deceleration or deceleration of the motor based on the acceleration time or deceleration time of the motor input by the input means. 9. A substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate, comprising: a substrate holding unit for holding a substrate; and a substrate held by the substrate holding unit. A nozzle for discharging the processing liquid from the processing liquid supply source to the nozzle, a motor for driving the pump, an input unit for inputting a discharge time of the processing liquid from the nozzle, Control means for controlling a time during which the motor drives the pump based on a discharge time of the processing liquid input by an input means. 10. A substrate processing apparatus for performing a predetermined processing by supplying a processing liquid guided from a processing liquid supply source to a substrate, comprising: a substrate holding unit for holding a substrate; and a substrate held by the substrate holding unit. A nozzle for discharging the processing liquid from the processing liquid supply source to the nozzle, a motor for driving the pump, and an input unit for inputting a discharge amount of the processing liquid to be discharged from the nozzle. A substrate processing apparatus comprising: a control unit that controls a rotation operation of the motor based on a discharge amount of the processing liquid input by the input unit. 11. A substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate, comprising: a substrate holding unit for holding a substrate; and a substrate held by the substrate holding unit. A nozzle for discharging the processing liquid from the processing liquid supply source to the nozzle, a motor for driving the pump, and an input for inputting a rotation speed change pattern indicating a change in the rotation speed of the motor. Means for controlling the rotation of the motor based on the rotational speed change pattern input by the input means. 12. A substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate, comprising: a substrate holding unit for holding a substrate; and a substrate held by the substrate holding unit. A nozzle for discharging a processing liquid from the processing liquid supply source to the nozzle, a motor for driving the pump, control information for controlling a discharging operation of the processing liquid from the nozzle, and the pump Input means for inputting correction information for correcting the control information in accordance with the characteristics of the control information; and correcting the control information input by the input means based on the correction information, based on the corrected control information. A substrate processing apparatus comprising: a control unit configured to control a discharge operation of the processing liquid from the nozzle. 13. A substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate, comprising: a substrate holding unit for holding a substrate; and a substrate held by the substrate holding unit. A nozzle that discharges a processing liquid from the processing liquid supply source to the nozzle, a motor that drives the pump, processing procedure information in a plurality of processing steps for the predetermined processing, Storing motor control information for controlling the rotation operation of the motor, wherein the processing procedure information includes control information of a processing liquid discharge time from the nozzle in a processing liquid discharging step, and the processing procedure information from the nozzle is Substrate processing, comprising: control means for controlling an operation of the motor to drive the pump based on control information of a discharge time of the processing liquid and the motor control information. Location.