JPH11289148A - Substrate surface treatment method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily take out a surface-treated substrate, regardless of the size of the substrate which can be positioned easily. SOLUTION: In this method, an elastic substrate 2 is placed on a table 1, the substrate 2 is surface-treated, and then the substrate 2 is taken out from the table 1. The surface of the table 1 has an arc-shaped recessed shape. For surface treatment, the substrate 2 is deflected into an arc shape along the arc- shaped recessed surface 11 of the table 1. Then, the substrate 2 is surface- treated. Subsequently, the substrate 2 is formed almost rectilinear by coursing the deflection to be eliminated. Then, the side face 21 of the substrate 2 is held by a chuck, and the substrate is taken out from the table 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment method that can easily carry out a substrate when performing surface treatment on a substrate such as a printed wiring board.

[0002]

2. Description of the Related Art As a surface treatment for a substrate, for example, there is a solder resist printing on a printed wiring board. Conventionally, the following method has been adopted as the printing method. That is, as shown in FIG. 7, the substrate 2 is placed on a table 9 provided with a central plate 91 having a large number of suction holes 8. Next, the substrate 2 is positioned and fixed by suction through the suction holes 8. Next, the screen 5 is lowered thereon, and a solder resist is printed using a squeegee 51.

After printing, the screen 5 is taken up, and as shown in FIG. 8, only the center plate 91 of the table 9 is moved while the substrate 2 is attracted. Next, the substrate 2 that has released the suction and protrudes from the table center plate 91
The two side surfaces 21 are carried out by the chuck 95 to carry out to the next step.

[0004]

However, the above conventional method has the following problems. That is, when the substrate is smaller than the width of the table center plate, both sides of the substrate cannot be gripped by the chuck during the unloading operation. This is because when the entire surface of the substrate is placed at the center of the table, there is no protruding portion of the substrate and no portion that can be gripped by the chuck. Therefore, it is very difficult to treat a substrate smaller than a certain size by the conventional substrate surface treatment method.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and is intended to facilitate the positioning of a substrate after the surface treatment, regardless of the size of the substrate. It is intended to provide a surface treatment method.

[0006]

According to a first aspect of the present invention, there is provided a surface treatment method for mounting and fixing an elastic substrate on a table, performing a surface treatment on the surface of the substrate, and then carrying out the substrate from the table. The surface of the table has an arcuate concave surface, and in the surface treatment, the substrate is bent in an arc shape along the arcuate concave surface of the table, and then the surface of the substrate is subjected to a surface treatment. The substrate surface treatment method is characterized in that the bent state is eliminated, the substrate is made substantially linear, and then the side surface of the substrate is gripped and carried out of a table.

The most notable point in the present invention is that the surface of the table has an arcuate concave surface, and in the surface treatment, the substrate is bent in an arc along the arcuate concave surface of the table. After the processing, the substrate is returned to the original state, that is, substantially straight, and the substrate is held and carried out in this state.

As a method of bending the substrate, for example, there is a method of providing a movable pin on the table and moving the pin toward the center of the table.

Next, the operation and effect of the present invention will be described.
In the present invention, first, a force is applied to the substrate toward the upper surface of the table, and the substrate is bent along the arcuate concave surface of the table as described above so as to be brought into contact therewith. Then, a surface treatment is performed on the substrate. Then, the bent state is eliminated.

At this time, since the surface of the table has an arcuate concave surface, as described above, when the bent state is eliminated and the substrate is made substantially linear, the central portion of the substrate is bent. It will be floating above the table. That is, the elastic substrate becomes substantially linear due to its restoring force. Then, on the table having the arcuate concave surface, the substrate is in a state in which the center portion is floating. For this reason, the center of both sides of the substrate can be gripped by a chuck or the like, and the substrate can be easily transported after the surface treatment.

Therefore, according to the present invention, there is provided a substrate surface treatment method which facilitates positioning and allows easy carrying out of a substrate after surface treatment irrespective of the size of the substrate.

Next, as in the second aspect of the present invention, the substrate can be a printed wiring board. In this case, the surface treatment of the thin printed wiring board can be easily and efficiently performed.

Next, the surface treatment may be printing of a solder resist on a printed wiring board. In this case, the solder resist can be easily and efficiently printed on the printed wiring board.

Next, the surface treatment may be performed by laser marking on the substrate. In this case, marking by laser on the substrate can be performed easily and efficiently. In addition, since the substrate can be placed in an arc shape, the irradiation distance of the laser becomes constant, and marking can be performed more accurately.

Next, it is preferable that the surface treatment is a resist exposure in forming a pattern on a printed wiring board. In this case, resist exposure in pattern formation on the printed wiring board can be performed easily and efficiently.

Further, by disposing the substrate in an arc shape, the distance from the light source at each point on the substrate can be made uniform. Furthermore, since light irradiation is performed perpendicular to the substrate, problems such as overexposure, underexposure, and exposure fogging are less likely to occur, and more accurate pattern formation can be performed.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 A substrate surface treatment method according to Embodiment 1 of the present invention will be described with reference to FIGS. In this example,
A method of printing a solder resist as a surface treatment on a printed wiring board as a substrate will be described.

First, as shown in FIGS. 1A and 1B,
A substrate 2 having elasticity is placed on a table 1. next,
As shown in FIG. 1 (C), an arc-shaped concave surface 1 of the table 1 is provided.
The substrate 2 is bent in an arc shape along 1.

Next, as shown in FIG.
The screen 5 having the shape along the arcuate concave surface 11 is dropped on the surface of the substrate, and after printing a solder resist using a squeegee 51, the screen 5 is picked up. Then, FIG.
As shown in FIG. 3B, the substrate 2 is made substantially linear by eliminating the bending state. Then, as shown in FIG. 2C, the side surface 21 of the substrate 2 is gripped by the chuck 3, and the substrate 2 is carried out of the table 1 to the next step.

Next, an apparatus and a method for implementing the above will be described in detail. According to the present invention,
As shown in FIGS. 3 and 4, the printing table 1 has an arcuate concave surface 11 on its surface. The arcuate concave surface 11 is provided with two positioning pins 4 movable at one end and two fixed pins 40 fixed at the other end. The two positioning pins 4 are slidably provided in the elongated hole 42.

That is, as shown in FIG.
1 has an elongated hole 42 through which the positioning pin 4 slides. And the positioning pin 4
The horizontal rail 4 is located below the arcuate concave surface 11.
4 is fixed to a pedestal 43 slidably mounted on the pedestal 43. Further, the base 43 is provided with a hydraulic cylinder 6.
Attached to the rod 61. The positioning pins 4 and the fixing pins 40 are provided so as to be able to expand and contract vertically.

Next, the operation and effect of this embodiment will be described. That is, in printing, the substrate 2 is first placed on the table 1 as shown in FIGS. At this time, the substrate 2 is positioned between the positioning pins 4 and the fixing pins 40.

Then, as shown in FIG. 1C, the rod 61 is extended by the cylinder 6, the positioning pin 4 is moved toward the center of the table 1, and the substrate 2 is pressed in the direction of the fixing pin 40. This causes the substrate 2 to bend. Since the substrate 2 is a thin plate and has elasticity, it is originally slightly bent in the direction of the arcuate concave surface 11 of the table 1. Therefore, the positioning pin 4 easily bends onto the arcuate concave surface 11 of the table 1.

Next, as shown in FIG. 2A, the screen 5 is lowered onto the substrate 2 on the arcuate concave surface 11 and solder resist printing is performed using a squeegee 51 as described above. At this time, the positioning pins 4 and the fixed pins 40 are lowered together with the screen 5.

Next, the screen 5 is taken up, and FIG.
Return the positioning pins 4 as shown in FIG. Thereby, the bent state of the substrate 2 is eliminated, and the substrate 2 becomes substantially linear due to the restoring force. The surface of the table 1 has an arcuate concave surface 1.
As shown in FIG. 2 (B), when the bent state is eliminated and the substrate 2 is made substantially linear as shown in FIG.
The central portion 22 of the substrate 2 is in a state of floating above the table 1.

That is, when the positioning pins 4 return to the outside, the substrate 2 becomes substantially linear due to the restoring force of the substrate 2 having elasticity. Then, on the table 1 having the arcuate concave surface 11, the substrate 2 is in a state where the central portion 22 thereof is floating. Then, as shown in FIG. 2 (C), the center of both sides 21 of the substrate 2 is gripped by the chuck 3 and carried out. Therefore, conveyance after printing can be easily performed.

By moving the positioning pins 4 toward the center as described above, the substrate 2 can be easily brought into close contact with the table 1. Therefore, the substrate 2 can be fixed without using means such as sucking the substrate 2 using a suction device, and the apparatus is simple.

Therefore, according to the present invention, there is provided a method for printing a printed wiring board, which can easily perform positioning and can easily carry out the processed substrate regardless of the size of the substrate.

Embodiment 2 As shown in FIG. 5, this embodiment shows an example in which marking is performed on a printed wiring board by laser. That is, first, the substrate 2 is fixed to the table 1 by bending the substrate 2 along the arcuate concave surface 11 of the table 1 in the same manner as in the first embodiment. Next, as shown in FIG. 5, the laser irradiation source 7 performs marking on the substrate 2 by laser irradiation. The arc-shaped concave surface has an arc shape. Other configurations are the same as those of the first embodiment.

In this case, the distance between each point of the substrate 2 and the laser irradiation source 7 can be equalized by arranging the laser irradiation source 7 at the center position of the arc of the arc-shaped concave surface. Therefore, the marking by the laser can be performed more accurately. Others have the same operation and effects as the first embodiment.

Embodiment 3 As shown in FIG. 6, this embodiment shows an example in which resist exposure is performed in forming a pattern on a printed wiring board. That is, first, as shown in FIG.
The substrate 2 on which the surface 4 is applied is fixed to the table 1 by bending along the arcuate concave surface 11 of the table 1 in the same manner as in the first embodiment. The arc-shaped concave surface 11 has an arc shape. Next, a mask film 25 for pattern formation is set on the substrate 2 while performing alignment.
Thereafter, light is emitted from the light source 71 to perform exposure. Other configurations are the same as those of the first embodiment.

In this case, by arranging the light source 71 at the same position as in the second embodiment, the distance between each point of the substrate 2 and the light source 71 can be equalized. Further, the light irradiation angle can be made perpendicular to the mask film 25 and the substrate 2 at each point.

Therefore, there is no difference in the amount of light between the central portion 22 and the end portion 23 of the substrate, so that overexposure or underexposure can be easily suppressed. Furthermore, mask film 2
Since the light irradiation is performed perpendicularly to 5, the exposure fogging and the like hardly occur, and more accurate pattern formation can be performed. Others have the same operation and effects as the first embodiment.

[0034]

As described above, according to the present invention, there is provided a method of treating a surface of a substrate which can be easily positioned and which can easily carry out the substrate after the surface treatment irrespective of the size of the substrate. What you want to do.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a process from placement of a substrate to positioning of the substrate according to the first embodiment.

FIG. 2 is an explanatory view of a process from surface treatment of the substrate to unloading according to the first embodiment.

FIG. 3 is a perspective view of a surface treatment table according to the first embodiment.

FIG. 4 is a plan view and a side view of the surface treatment table according to the first embodiment.

FIG. 5 is an explanatory diagram of marking by laser irradiation according to the second embodiment.

FIG. 6 is an explanatory diagram of resist exposure according to a third embodiment.

FIG. 7 is a cross-sectional view illustrating a method of printing a printed wiring board according to a conventional example.

FIG. 8 is a plan view showing a state of carrying out a substrate after printing a printed wiring board according to a conventional example.

[Explanation of symbols]

 1. . . Table, 11. . . 1. arcuate concave surface; . . Substrate, 21. . . Aspect, 3. . . Chuck, 4. . . Positioning pin, 40. . . Fixing pin, 5. . . Screen, 6. . . cylinder,

Claims (5)

[Claims] 1. An elastic substrate is placed on a table,
In the surface treatment method of fixing and subjecting the surface of the substrate to surface treatment, and then carrying out the substrate from the table, the surface of the table has an arcuate concave surface. The substrate is bent along an arcuate concave surface in an arc shape, then the surface of the substrate is subjected to a surface treatment, and then the bent state is eliminated to make the substrate substantially linear, and then the side surface of the substrate is gripped. A substrate surface treatment method, wherein the substrate is carried out from a table. 2. The invention according to claim 1, wherein the substrate is
A method for treating a surface of a substrate, which is a printed wiring board. 3. The method according to claim 1, wherein said surface treatment is printing of a solder resist on a printed wiring board. 4. The method according to claim 1, wherein the surface treatment is marking on the substrate with a laser. 5. The method according to claim 1, wherein the surface treatment is resist exposure in forming a pattern on a printed wiring board.