JPH11289146A - Compound wiring material and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance productivity, bonding stability and general purpose properties by shortening the time required for production at the time of flip-chip bonding where a wiring pattern on a substrate is bonded with a semiconductor element through a metallic material, e.g. solder. SOLUTION: The wiring material 1 comprises an insulating film 2 of resin material for die bonding, e.g. epoxy or polyimide, and a plurality of metal wires 3 of wiring metal, e.g. solder or gold, arranged in parallel while being supported by the insulating film 2. The metal wires 3 are exposed, by about 1/5-1/4 of the diameter thereof, from the surface and rear of the insulating film 2. The wiring material 1 is formed into a sheet or a ribbon and used while being cut freely in the lateral or longitudinal direction to include an arbitrary number and length of the metal wires 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite wiring material for connecting a semiconductor element and a wiring pattern on a substrate, and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 7 is a cross-sectional view showing a semiconductor device in which flip chip bonding is performed by using a conventional inner bump. In the figure, 4 is a semiconductor element, 5 is a substrate, 6 is a wiring pattern formed on the substrate 5, 7 is an inner bump made of a metal material such as solder for joining the semiconductor element 4 and the wiring pattern 6, and 8 is a sealing. Reference numeral 9 denotes an outer ball. Generally, in the conventional flip chip bonding, when the semiconductor element 4 and the wiring pattern 6 on the substrate 5 are bonded, the inner bumps 7 are formed of a metal material such as solder which is easily melted, and the inner bumps 7 are heated and melted. Electrical connection had been obtained.

[0003]

However, in the case of the structure shown in FIG. 7, the metal material to be the inner bumps 7 is formed one by one, and is temporarily formed on the substrate 5 or the semiconductor element 4 as a piece of metal. After being fixed in place,
Since electric bonding is performed by melting, there is a problem that time is required for production and productivity is low. In addition, there is a problem that bonding stability is low in the case of bonding using only the inner bumps 7 made of solder or the like.

In order to solve such a problem, for example, in Japanese Patent Laid-Open No. 5-29390, as shown in FIG.
A through hole is provided in the insulating film material 16 so that the solder ball 1
For example, a film-shaped composite wiring member in which inner bumps are arranged two-dimensionally by embedding 7 is proposed. Also,
Japanese Patent Application Laid-Open No. 5-206143 discloses a composite film for forming a transfer bump in which a metal body 19 penetrating through an insulating film 18 made of a polyimide resin or the like is detachably held on the front and back surfaces as shown in FIG. Has been proposed.
According to these composite wiring materials and composite films, simultaneous joining of a plurality of metal materials is possible.
In the case where the composite wiring material proposed in Japanese Patent No. 29390 is used, the gap between the semiconductor element and the substrate is joined by the film material 16, so that the joining stability is improved. However, the above-described composite wiring material and composite film have a problem that the manufacturing process is complicated and versatility is poor.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. In flip-chip bonding in which a wiring pattern on a substrate and a semiconductor element are bonded with a metal material such as solder, the time required for manufacturing is reduced. An object of the present invention is to provide a composite wiring material which is shortened, improves productivity, has high joining stability, and is highly versatile, and a method for manufacturing the same.

[0006]

The composite wiring material according to the present invention is made of a wiring metal such as solder or gold, and is made of a plurality of metal wires arranged in parallel with each other and a resin material for die bonding. An insulating film for holding the metal wire is provided, and the metal wire is exposed from the front and back surfaces of the insulating film. The metal wire is about 1/5 of the diameter.
１ ／ is exposed from each of the front and back surfaces of the insulating film. Furthermore, it is used by being cut freely in the width direction and the length direction so as to include metal wires of an arbitrary number and length.

Further, in the method of manufacturing a composite wiring material according to the present invention, a plurality of metal wires made of a metal for wiring such as solder or gold are provided in parallel with a plurality of grooves which hold about ４ of the diameter of the metal wire. Disposing the melted resin material for die bonding on the temporary fixing material on which the metal wire is disposed, and before the resin material is cured, the upper portion of the metal wire with a squeegee has a diameter of 1 mm. The manufacturing method includes a step of scraping an excess resin material so as to expose about / 4 and a step of curing the resin material remaining between the metal wires to form an insulating film. A step of arranging a metal wire made of a metal for wiring such as solder or gold on a temporary fixing material provided with a plurality of grooves parallel to each other and holding about 溝 of the diameter of the metal wire; Between the placed metal wires, a molten resin material for die bonding,
It is manufactured to include a step of applying from a small-diameter nozzle such that an upper portion of the metal wire is exposed to about 1/4 of a diameter, and a step of curing an resin material between the metal wires to form an insulating film. It is.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a composite wiring member according to the first embodiment of the present invention. In the figure, reference numeral 1 denotes a composite wiring member according to the present embodiment,
Is an insulating film made of a resin material for die bonding such as epoxy or polyimide, 3 is held by the insulating film 2, is made of a metal for wiring such as solder or gold, and is a plurality of metal wires arranged in parallel with each other. is there. Metal wire 3
, About ５〜 to の of the diameter is exposed from each of the front and back surfaces of the insulating film 2. The composite wiring member 1 is formed in a sheet shape or a ribbon shape, and is used by being freely cut in the width direction and the length direction so as to include an arbitrary number and length of metal wires 3. . The composite wiring member 1 according to the present embodiment shown in FIG.
It is a ribbon shape cut so as to include the book, the thickness of the insulating film 2 is, for example, 10 to 30 μm, the diameter of the metal wire 3 is, for example, 20 to 50 μm, and the interval between the metal wires 3 is, for example, 30 to 100 μm. is there.

FIG. 2A is a perspective view showing a state in which the ribbon-shaped composite wiring member 1 shown in FIG. 1 has been cut into a desired size. In the figure, reference numeral 1a denotes a composite wiring material including four metal wires 3 and cut in a length direction of the metal wires 3 with a width of, for example, about 30 to 100 μm. As shown in FIG. 2 (b), the composite wiring material 1a cut in this way may be arranged as it is in accordance with the wiring pattern 6 formed on the substrate 5, or may be further divided and arranged. Can be. In FIG. 2B, reference numeral 1b denotes a composite wiring member obtained by dividing the composite wiring member 1a into two parts.

Hereinafter, the composite wiring member 1 according to the present embodiment will be described.
The flip chip bonding process using “a” will be described with reference to FIG. In the figure, 4 is a semiconductor element, 5 is a substrate, 6
Is a wiring pattern formed on the substrate 5, 10 is a heat block, and 11 is a pickup tool. First, the composite wiring material 1 cut so as to correspond to the wiring pattern 6
a is arranged on the substrate 5 by the pickup tool 11,
For example, a load of about 1 to 10 kg is applied for several seconds, and the insulating film 2 made of the resin material for die bonding is temporarily fixed by utilizing the adhesiveness by heating. Since the glass transition temperature of the resin for die bonding is 70 to 150 degrees, the temperature of the heat block 10 at this time is 120 to 200 degrees (FIG. 3).
(A)). Next, the semiconductor element 4 is arranged in accordance with the wiring pattern 6, a load of about 50 to 100 g is applied for about 10 to 20 seconds, and pressure welding and heating are performed to promote the melting and joining of the 3 parts of the metal wire, thereby improving the insulating property. Die bonding with the film 2 and wiring work with the metal wire 3 are performed simultaneously. When the metal wire 3 is solder, the melting temperature of the solder is 190 to 220 degrees, so that the temperature of the heat block 10 at this time is 200 to 2 degrees.
The angle is set to 30 degrees (FIG. 3B). By the above process, the flip chip bonding is completed (FIG. 3C).

Although FIG. 1 shows the composite wiring member 1 in which the metal wires 3 are arranged at equal intervals, the arrangement method of the metal wires 3 is not limited to this. For example, as shown in FIG. The composite wire 1c in which the wire 3 is disposed at two intervals of L ₁ and L ₂ may be used, and the same effect is obtained. Further, in the present embodiment, an example in which one composite wiring member 1 is used has been described. However, for example, when it is desired to secure the height of the semiconductor element 4 bonded on the substrate 5, the composite wiring member 1 is used. Can also be used by overlapping two or three sheets. In the conventional flip chip bonding (FIG. 7), the height control was difficult because the inner bumps 7 were melted. However, according to the composite wiring material 1 according to the present embodiment, the die bonding between the metal wires 3 was performed. Since the insulating film 2 made of resin is used, there is an effect that height control can be easily performed by interposing the resin.

As described above, by using the composite wiring material 1 according to the present embodiment, when the semiconductor element 4 and the wiring pattern 6 on the substrate 5 are bonded, a plurality of metal wires 3 can be simultaneously bonded. As compared with the case where the conventional inner bump 7 is used, the time required for manufacturing is reduced, and the productivity is improved. In addition, by using a resin material for die bonding as the insulating film 2 holding the metal wire 3, the wiring by the metal wire 3 and the die bonding by the insulating film 2 can be performed simultaneously, and the bonding stability at the time of flip chip bonding is achieved. Is improved. Furthermore, according to the number and size of the electrodes and the wiring patterns to be joined, the sheet-shaped or ribbon-shaped composite wiring material 1 can be cut freely in the width direction and the length direction,
Since a plurality of sheets can be combined and arranged, or can be used by overlapping in the thickness direction, there is an advantage that versatility is high.

Embodiment 2 FIG. FIG. 5A is a schematic view illustrating a method for manufacturing a composite wiring member according to Embodiment 2 of the present invention. In the figure, reference numeral 12 denotes a temporary fixing material for temporarily fixing the metal wire 3 and ensuring exposure of the metal wire 3 and is made of, for example, wax or the like. Reference numeral 13 denotes a base material for ensuring flatness during manufacturing, and reference numeral 14 denotes a squeegee for removing resin on the metal wire 3 and is made of a soft material such as a rubber plate or a resin plate. In the drawings, the same or corresponding parts have the same reference characters allotted, and description thereof will be omitted.

A method for manufacturing the composite wiring member 1 according to the present embodiment will be described. First, a metal wire 3 made of a metal for wiring such as solder or gold is arranged on a temporary fixing material 12 provided with a plurality of grooves provided in parallel with each other to hold about １ ／ of the diameter of the metal wire 3. At this time, the temporary fixing material 12 is placed on the flat base material 13. Next, the temporary fixing material 1 on which the metal wire 3 is disposed
2 is coated with a melted resin material for die bonding, and before the resin material is cured, an excess resin material is scraped off by a squeegee 14 so that the upper portion of the metal wire 3 is exposed to about 1/4 of the diameter. Thereafter, the resin material remaining between the metal wires 3 is cured to form the insulating film 2 and the temporary fixing material 12 is formed.
Is removed, the sheet-like composite wiring member 1 in which a part of the metal wire 3 is exposed on the front and back surfaces is completed. When scraping the resin material, a squeegee 14a having a groove along the outer shape of the metal wire 3 as shown in FIG. 5B may be used. According to the present embodiment, the composite wiring material 1 having different numbers, diameters, intervals, and the like of the metal wires 3 can be easily formed only by changing the temporary fixing material 12 as necessary, and productivity can be improved. It has the advantage of being expensive.

Embodiment 3 FIG. 6 is a schematic view illustrating a method for manufacturing a composite wiring member according to Embodiment 3 of the present invention.
In the figure, reference numeral 15 denotes a small-diameter nozzle for applying a resin material forming the insulating film 2. In the drawings, the same or corresponding parts have the same reference characters allotted, and description thereof will be omitted.

A method for manufacturing the composite wiring member 1 according to the present embodiment will be described. First, a metal wire 3 made of a metal for wiring such as solder or gold is arranged on a temporary fixing material 12 provided with a plurality of grooves provided in parallel with each other to hold about １ ／ of the diameter of the metal wire 3. At this time, the temporary fixing material 12 is placed on the flat base material 13. Next, a molten resin material for die bonding is applied between the metal wires 3 arranged on the temporary fixing material 12 from the small-diameter nozzle 15 so that the upper portion of the metal wires 3 is exposed to about ４ of the diameter. Thereafter, the resin material between the metal wires 3 is cured, the insulating film 2 is formed, and the temporary fixing material 12 is removed, thereby forming a sheet-like composite wiring material in which a part of the metal wires 3 is exposed on the front and back surfaces. 1 is completed. According to the present embodiment, there is no scraping step after the resin material is applied from the small-diameter nozzle 15, so that the amount of the resin material applied can be controlled and the thickness of the insulating film 2 can be easily controlled. is there.

[0017]

As described above, according to the composite wiring material of the present invention, a plurality of metal wires made of a wiring metal such as solder or gold and arranged in parallel with each other are insulated by a resin material for die bonding. Since it is held with a conductive film,
When joining a semiconductor element and a wiring pattern on a substrate, a plurality of metal wires can be joined at the same time, thereby improving productivity.
In addition, the wiring using the metal wire and the die bonding using the insulating film can be performed simultaneously, and the bonding stability is improved.

Furthermore, according to the number and size of the electrodes and wiring patterns to be joined, a composite wiring material in the form of a sheet or ribbon can be cut freely in the width direction and the length direction. Since it can also be used in the thickness direction, there is an advantage that versatility is high.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a composite wiring member according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a state where the composite wiring member according to the first embodiment of the present invention is cut into a desired size.

FIG. 3 is a cross-sectional view illustrating a flip-chip bonding process using the composite wiring material according to the first embodiment of the present invention.

FIG. 4 is a perspective view showing another type of composite wiring member according to the first embodiment of the present invention.

FIG. 5 is a schematic view illustrating a method for manufacturing a composite wiring material according to a second embodiment of the present invention.

FIG. 6 is a schematic view illustrating a method for manufacturing a composite wiring material according to Embodiment 3 of the present invention.

FIG. 7 is a cross-sectional view showing a semiconductor device in which flip chip bonding is performed using a conventional inner bump.

FIG. 8 is a perspective view showing a structure of a conventional composite wiring member.

FIG. 9 is a sectional view showing a conventional composite film for forming a transfer bump.

[Explanation of symbols]

1, 1a, 1b, 1c Composite wiring material, 2 insulating film, 3 metal wire material, 4 semiconductor element, 5 substrate, 6 wiring pattern, 7 inner bump, 8 sealing material, 9 outer ball, 10 heat block, 11 pickup Tool, 12 Temporary fixing material, 13 Base material, 14, 14
a squeegee, 15 small diameter nozzle, 16 film material,
17 solder balls, 18 insulating film, 19 metal body.

Claims (5)

[Claims] 1. A wiring metal such as solder or gold,
A plurality of metal wires arranged in parallel with each other and a resin material for die bonding, comprising an insulating film holding the metal wire, wherein the metal wire is exposed from the front and back surfaces of the insulating film. A composite wiring material characterized by that: 2. The composite wiring material according to claim 1, wherein about 1/5 to 1/4 of the diameter of the metal wire is exposed from each of the front and back surfaces of the insulating film. 3. The composite wiring according to claim 1, wherein the composite wiring is used by being cut freely in a width direction and a length direction so as to include an arbitrary number and length of metal wires. Wood. 4. A step of arranging a metal wire made of a metal for wiring such as solder or gold on a temporary fixing material provided with a plurality of parallel grooves each holding about の of the diameter of the metal wire; A molten resin material for die bonding is applied to the temporary fixing material on which the metal wire is disposed, and before the resin material is hardened, an extra squeegee is used to expose the upper portion of the metal wire to about 1/4 of the diameter. Scraping the resin material, curing the resin material remaining between the metal wires,
A method for producing a composite wiring material, comprising a step of forming an insulating film. 5. A step of arranging a metal wire made of a metal for wiring such as solder or gold on a temporary fixing material provided with a plurality of parallel grooves each holding about を of a diameter of the metal wire. A step of applying a molten die-bonding resin material from a small-diameter nozzle between the metal wires disposed on the temporary fixing material so that the upper portion of the metal wire is exposed to about 1/4 of the diameter; Curing the resin material in between to form an insulating film.