JPH11284342A - Package and its manufacturing method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To develop a package with a finer via size and higher wiring density. SOLUTION: (i) Wiring is formed on one or both surfaces of a plurality of insulating resin layers, and (ii) Each insulating resin layer on which the wiring is formed is appropriately laminated with a dummy insulating resin layer as necessary. (Iii) applying heat to the laminate to cure the insulating resin layer, and (iv) cutting the surface of the obtained laminate on which electronic components or printed wiring boards are mounted. And / or polishing, and (iv) bonding the core material in a direction perpendicular to the insulating resin layer of the laminate. An insulating resin layer is laminated in a direction perpendicular to the surface on which the electronic component or the printed wiring board is mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a package capable of responding to a high-speed response signal and a method of manufacturing the package. In detail, the present invention is different from the current build-up substrate that is sequentially laminated in the vertical direction, and sequentially builds up the insulating resin layers arranged vertically in the horizontal direction, and is provided on each insulating resin layer. The present invention relates to a package having a structure in which wiring functions as a via hole and a method of manufacturing the package.

[0002]

2. Description of the Related Art In recent years, with the rapid spread of OA equipment typified by small portable telephones and small personal computers, and high-speed and high-frequency response signals of electronic parts for driving them, the density of wiring has been increased, Reduction of size and miniaturization of via holes are important issues.

[0003] At present, a build-up board which can realize such a problem and enables high-density mounting has attracted attention. The method of manufacturing this build-up substrate is as follows.

As shown in FIG. 1, for example, a double-sided or laminated glass-epoxy substrate is used as a core substrate 10, and a photosensitive epoxy resin is applied as an insulating layer 12 to the core substrate 10, and a portion where a via is to be formed is exposed. . When developed and etched with a chemical, a hole for a via, that is, a via hole 14 is opened, and a lower conductive layer 16 is exposed in this portion. Next, Cu is plated as the conductor layer 18. Prior to this, irregularities of about 5 to 10 μm may be formed on the surface of the insulating layer by a roughening treatment.
This is because the Cu plating layer cuts into the insulating layer 12 to increase the via strength. Next, the electroless Cu plating and the electrolytic Cu plating are successively performed to form the conductor layer 18. The inside of the via hole is also plated, and is interlayer-connected to the lower conductor layer 16. The conductor surface is etched to form a wiring pattern. This is repeated to build up layers. In the example shown,
Further, one insulating layer 13 is provided. Finally, a hole (not shown) for through hole is opened, and a resist for soldering is
Form 22. Thus, the via hole is hollow in the conventional build-up substrate.

In the illustrated example, the insulating layers are laminated on both sides of the core substrate, but they may be laminated only on one side. In the build-up board manufactured by such a manufacturing method, when the wiring pattern is formed by etching the conductor surface, for example, the conductor on the side surface of the via hole 14 provided in each of the core substrate 10 and the insulating layers 12 and 13 is not etched. In order to mask the area around the via hole, a region called a land 24 made of a solder alloy is formed around the via hole 14 as schematically shown in FIG. In addition,
In the illustrated example, the conductor layer 18 is provided on the upper surface and the conductor layer 16 is provided on the lower surface.

[0006]

As described above, in such a build-up method, the wiring is routed, so that not only the manufacturing process becomes complicated, but also the lands must be formed, so that the pitch and the like are limited, and the wiring and the like are limited. There was a limit in increasing the density of Here, an object of the present invention is to provide a method of manufacturing a package with a simple manufacturing process and to provide a package capable of increasing the density of wiring.

[0007]

Means for Solving the Problems Here, the present inventors have
As a result of various studies to solve this problem,
The following findings have been obtained, and the present invention has been completed.

(1) With the increase in the density of electronic components, for example, the MPU, the package connecting the MPU is also required to have a high density. However, the build-up using an organic resin material which is becoming the mainstream of the semiconductor package is required. In the package, since lands are formed for each layer and wiring is routed, there has been a limit in increasing the density of wiring in manufacturing. In view of this, the idea of making the wiring in the package landless was considered, and it was thought that high-density wiring could be achieved by simplifying the wiring that had been routed in the past as much as possible during manufacturing. Revised from a method perspective.

(2) In order to realize a landless wiring, a package is formed by repeatedly forming an insulating layer like a build-up method and sequentially forming wiring from the MPU side to the printed wiring board side. Rather than fabricating, first, the wiring from the MPU side to the printed wiring board side is formed at once, and then the insulating resin layer on which the wiring is formed is
We considered stacking in the vertical direction (when viewed from the PU side or the printed wiring board side).

(3) Actually, when the insulating resin layers on which the wirings are formed are vertically stacked, unexpectedly, the interval between one wiring and another wiring is shortened, and the wiring density can be increased. I understood.

Here, the present invention is as follows. (1) Forming a wiring on one or both surfaces of a plurality of insulating resin layers, and laminating each insulating resin layer on which the wiring has been formed, if necessary, together with a dummy insulating resin layer as appropriate, to form a laminate. A package comprising: applying heat to the laminate to cure the insulating resin layer; and cutting and / or polishing the surface of the obtained laminate on which electronic components or printed wiring boards are mounted. Manufacturing method.

(2) Forming wiring on one or both surfaces of a plurality of insulating resin layers, and laminating each of the insulating resin layers on which the wirings are formed, if necessary, together with a dummy insulating resin layer as appropriate. Composing, applying heat to the laminate to cure the insulating resin layer, cutting and / or polishing the surface of the resulting laminate on which electronic components or printed wiring boards are mounted, and core material Is bonded in a direction perpendicular to the insulating resin layer of the laminate.

(3) Preparing an insulating resin layer, forming a wiring on the insulating resin layer, and forming the insulating resin layer a predetermined number of times to form a laminate, and Cutting and / or polishing a surface on which an electronic component or a printed wiring board is mounted, in a direction perpendicular to the lamination surface of the package.

(4) Preparing an insulating resin layer, forming a wiring on the insulating resin layer, and forming the insulating resin layer a predetermined number of times to form a laminate, Cutting and / or polishing a surface on which an electronic component or a printed wiring board is mounted in a direction perpendicular to the laminated surface, and bonding a core material in a direction perpendicular to the insulating resin layer of the laminate; , A package manufacturing method comprising:

(5) A package wherein an insulating resin layer is laminated at right angles to a surface on which electronic components or a printed wiring board is mounted. (6) A package characterized in that the wiring in the insulating resin layer is one-dimensionally arranged when viewed from the surface on which the electronic component or the printed wiring board is mounted.

(7) The insulating resin layers provided with the wiring on the surface are sequentially built up so that the wiring provided on each insulating resin layer functions as a via hole, and the side surface of the laminated insulating resin layer is A package with a structure on which components or printed wiring boards are mounted.

[0017]

Next, the present invention will be described in more detail with reference to the accompanying drawings. FIG. 3 is a schematic perspective view showing a package according to the present invention in a partial cross section. In the figure, the package 40 according to the present invention has an insulating resin layer 32 laminated in a direction perpendicular to a surface on which electronic components or a printed wiring board is mounted. Also, the wiring 30 in the insulating resin layer is
When viewed from the surface on which electronic components or printed wiring boards are mounted, they are arranged one-dimensionally. Here, the electronic component may be not only a semiconductor device such as an MPU but also an electronic component usually mounted directly on a printed wiring board such as a passive component such as a terminator resistor. Further, not only one of these electronic components but also a plurality of them may be mounted.

As described above, the package 40 according to the present invention
Is to sequentially build up the insulating resin layers 32 arranged in a vertical direction in the horizontal direction, to function the wiring 30 provided in each insulating resin layer 32 as a via hole, and to form the laminated insulating resin layers.
It has a structure in which 32 side surfaces are used for mounting electronic components (eg, MPU) or printed wiring boards.

That is, the insulating resin layers 32 having the wirings 30 formed on the permanent resist layer by a suitable means using a conductive metal (generally Cu) are stacked vertically, and as a whole, each insulating resin layer 32 The wiring 30 serves as a via in a conventional package.

Although not shown in FIG. 3 for clarity, a solder resist layer is provided above the insulating resin layer 32 and below the core material 34, and a conventional core material is provided on the core material 34. Similarly to the material, a via 36 and a conductive layer 38 (not shown) are provided. In FIG. 3, the upper part is the C4 side for connecting the electronic component (MPU), and the lower part, that is, the lower part of the core material is
This is the printed circuit board side where the BGA is provided and mounted.

Another feature is that, in the package according to the present invention, the wiring in the insulating resin layer is arranged one-dimensionally when viewed from the surface on which the electronic component or the printed wiring board is mounted. That is. By having this feature, the density can be much higher than that of a package manufactured by a build-up method in which vias and lands are included in the package and a large area must be occupied in the inner layer of the package.

Here, one-dimensional means substantially one-dimensional, and one-dimensional arrangement has a width when viewed from the surface on which the MPU or the printed wiring board is mounted.
That is, they are arranged so as to have a thickness necessary for forming the conductive metal.

FIG. 4 is a schematic sectional view of the package according to the present invention as shown in FIG. 3, for example, taken along the line IV-IV. However, in FIG. 4, the solder resist layer 44
Is provided.

As described above, since the insulating resin layer 32 is one-dimensionally arranged, when cut along the line IV-IV, the wiring 30 in the insulating resin layer 32 has no width. Although it can be observed linearly, it is shown with a certain width in FIG. 4 so that it can be easily grasped.

One insulating layer 32 is provided with a wiring 30 having the same function as a via, and a side in contact with the core material 34 is provided with a via hole 36 similar to the conventional one and an appropriate conductor portion 42. At this time, a solder resist layer 44 is provided on the upper and lower surfaces, and the via hole 46 on the printed wiring board side on which the BGA is provided is hollow as before, but the via 48 on the C4 side, that is, the upper side, is formed on the insulating layer. Provided conductor layer, that is, wiring
30 performs its function.

As described above, according to the present invention, the same effect as that of the via 48 is exerted by directly providing the wiring 30 which acts simultaneously with the via 48 in the insulating layer 32, and then the insulating layer 32 is formed. Since the package is formed by vertically stacking, the wiring 30 can be made one-dimensionally, so that it is possible to manufacture a package which is easy to manufacture and has a high density with a large number of terminals.

Hereinafter, the formation of the insulating resin layer and the core material will be described in detail. Formation of Insulating Resin Layer : As shown in FIG. 5A to be described later, the wiring 30 is formed on the insulating resin 50. At this time, the method of forming the wiring is not particularly limited. For example, after press-forming a metal foil on the insulating resin layer 30, a method of removing the metal foil of a portion not forming a wiring by a photoresist method, or forming a plating resist on a portion other than the wiring and plating to form the wiring. And the like. At this time, wiring may be formed on both surfaces of the insulating resin. Alternatively, necessary wiring may be formed by plating the entire surface of the insulating resin layer, forming a resist only in the wiring portion, etching, and removing the resist.

As the insulating resin, a thermosetting resin can be used, and examples thereof include epoxy, phenol, and polyimide resins. This may be used in combination with a reinforcing material such as glass. The type of the conductive metal used for the wiring is not particularly limited, but Cu having good electric conductivity is preferable. Also, it is sufficient to form the insulating resin layer by applying a resin in the same manner as in the conventional method.

The insulating resin layer provided with the wiring as described above is laminated, if necessary, with a dummy insulating resin layer on which no wiring is formed to obtain a laminated body [FIG. (c) See]. At this time, an adhesive may be used between the laminated insulating resin layers. Further, a roughening treatment may be appropriately performed to improve the adhesion of the insulating resin layer. The laminate thus obtained is integrally formed by hot pressing. At this time, it is preferable that the insulating resin is completely cured so that it does not shrink even if heat is applied later.

The surface of the thus obtained laminated body on which the electronic component or the printed wiring board is mounted, that is,
A surface orthogonal to the lamination surface is cut and / or polished to expose an end of the wiring 30. This is so that each mounted object can be mounted without any defect.

There are no particular restrictions on the method of cutting or polishing at this time. For example, the cutting method includes a method of cutting mechanically and a method of cutting using a laser. When a plurality of laminates are manufactured at one time, it is preferable to use these methods. In the polishing method, it is sufficient to use a rotary polishing machine that performs polishing in running water.

On the other hand, the formation of the insulating resin layer is not limited to the above method. The conventional build-up method may be performed by a simplified method. That is, a laminated body is obtained by repeatedly forming a wiring on the insulating resin layer by using a photolithography technique and then forming an insulating resin layer. At this time, according to the present invention, a step of forming a via hole unlike the conventional method is not required.

After that, the core material is adhered to the surface on which the above-mentioned object is mounted, if necessary. The bonding of the core material at this time can be performed in exactly the same manner as the bonding method of the insulating resin layer.

Core Material The core material is disposed at right angles to the insulating resin layer of the laminate as shown in FIG. This core material is not necessarily required if there is no problem with the wiring pitch of the laminate itself or if there is no problem with the strength. If there are these problems, connect the core material to the laminate.

The "core" of the core material is a nucleus (core) in the build-up substrate, and the core material is a substrate serving as a nucleus on which an insulating resin layer is deposited. The core material in the present invention is not used in this way,
Since the same material as the core material of the build-up substrate may be used, it is referred to as a core material for convenience. Specifically, the core material refers to a substrate that is electrically connected to the front and back surfaces of the core material through through holes. Wiring may be formed on the front surface or the back surface of the core material.

The method of connecting the core materials may be any method such as a method of connecting with an adhesive or a method of pressure bonding with a hot press. Also, after bonding the core material, a via hole may be formed by laser, and the via hole may be filled with plating to form a wiring on the core material.

[0037]

5 (a) to 5 (d) schematically show each step of the method for manufacturing a package according to the present invention. The present invention will be described below based on the drawings.

As shown in FIG. 5 (a), in order to form a thermosetting insulating resin layer 50 on which wirings 54 are formed, a Cu foil is hot pressed on a glass epoxy insulating resin layer 50 manufactured by a prepreg method. And crimped. Here, the prepreg resin used for forming the insulating resin layer is not finally cured. The final curing is for curing when the insulating resin layer (prepreg resin layer) 50 is multi-layered to form a laminate 58 in the step of FIG.

Next, after applying a positive photosensitive resist to the surface of the Cu foil, exposing and developing, a Cu conductor layer 54 having a predetermined wiring pattern was formed by etching. Finally, the photosensitive resist was removed. Although a positive photosensitive resist is used here, a negative photosensitive resist may be used as long as wiring can be formed. See FIG. 5 (a).

Next, as shown in FIG.
Each of the insulating resin layers 50 on which is formed is laminated, and further, a dummy insulating resin layer 52 is laminated, and finally, a laminated body 58 is formed [FIG. 3 (c)]. The insulating resin layers of the laminate 58 were brought into close contact with each other by vacuum hot pressing. At this time, the temperature was raised to 180 ° C. in order to finally cure the laminate 58. Thereafter, the terminal surfaces of the laminate 58 (the connection surface 60 on the electronic component side and the connection surface 62 on the printed wiring board side) were polished by a rotary polishing machine. After the polishing, the laminate 58 was cleaned using an ultrasonic cleaner.

After the cleaning, in order to secure the strength, a core material 64 prepared in advance and having a conductive upper and lower surface was bonded to the connection surface 62 of the laminate 58 on the printed wiring board side. The core member 64 does not need to be bonded if the strength of the laminate 58 is sufficient.

Finally, the connection surface 60 on the electronic component side of the laminate 58
A photosensitive resin was applied to the connection surface 66 of the core material 64 on the side of the printed wiring board, exposed, developed, and cured and baked to form a solder resist layer (not shown). Further, solder paste was printed on the connection surface 60 on the electronic component side, and solder bumps were formed by reflow processing.

According to the present invention, as compared with the conventional build-up method, a high-density wiring having no land and a wiring pitch of 100 μm or less can be easily manufactured with fewer steps than the conventional method. Could be manufactured.

As described above, the present invention is completely different from the conventional one in that a wiring having no land is formed, and the laminating direction of each insulating resin layer is defined as a horizontal direction. Is different from the lamination. Therefore, the operation of the present invention is not only capable of increasing the density by forming landless wiring, but also simplifying the manufacturing process in the manufacturing method, and is completely different from the prior art in this point.

[0045]

According to the present invention, the method for manufacturing a printed multilayer board is greatly simplified, and since the wiring in the semiconductor package has no lands, the density of the package itself can be increased. Moreover, since the wiring is arranged one-dimensionally, the density of the wiring is remarkably increased.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a conventional build-up laminate.

FIG. 2 is a schematic perspective view of a part of the surface of a conventional build-up laminate.

FIG. 3 is a schematic partial perspective view of a build-up laminate according to the present invention.

FIG. 4 is a sectional view of a built-up laminate according to the present invention.

FIGS. 5A to 5D are process diagrams of the manufacturing method according to the present invention.

Claims (7)

[Claims] 1. A wiring is formed on one or both surfaces of a plurality of insulating resin layers, and the respective insulating resin layers on which the wirings are formed are appropriately laminated with a dummy insulating resin layer as necessary to form a laminate. Applying heat to the laminate to cure the insulating resin layer, and cutting and / or polishing the surface of the obtained laminate on which electronic components or printed wiring boards are mounted. Package manufacturing method. 2. Forming a wiring on one or both sides of a plurality of insulating resin layers, and laminating each of the insulating resin layers on which the wirings are formed, if necessary, together with a dummy insulating resin layer as needed. Applying heat to the laminate to cure the insulating resin layer; cutting and / or polishing the surface of the obtained laminate on which electronic components or printed wiring boards are mounted; and removing the core material. A method for manufacturing a package, comprising: adhering in a direction perpendicular to the insulating resin layer of the laminate. Preparing an insulating resin layer, forming a wiring on the insulating resin layer, and forming the insulating resin layer a predetermined number of times to form a laminate;
And a step of cutting and / or polishing a surface on which the electronic component or the printed wiring board is mounted in a direction perpendicular to the lamination surface of the laminate. 4. A step of preparing an insulating resin layer, forming a wiring on the insulating resin layer and forming the insulating resin layer a predetermined number of times to form a laminate, and laminating the laminate. Cutting and / or polishing a surface on which an electronic component or a printed wiring board is mounted in a direction perpendicular to the surface; and bonding a core material in a direction perpendicular to the insulating resin layer of the laminate. Manufacturing method of a package composed of: 5. A package, wherein an insulating resin layer is laminated at right angles to a surface on which electronic components or a printed wiring board is mounted. 6. A package characterized in that the wiring in the insulating resin layer is one-dimensionally arranged when viewed from a surface on which an electronic component or a printed wiring board is mounted. 7. An insulating resin layer provided with wiring on the surface is sequentially built up, the wiring provided on each insulating resin layer functions as a via hole, and the side surface of the laminated insulating resin layer is used as an electronic component. Alternatively, a package having a structure on which a printed wiring board is mounted.