JPH1126967A - Mounting structure of card type semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a mounting structure of a card type semiconductor device having good heat conduction efficiency. A high-heat-generating element is housed in a shell, and the card-type semiconductor device is plugged into a connector fixed to a main board, and a heat-dissipating device provided in the card-type semiconductor device. A heat radiating plate for transferring the heat of the heat transfer block to the device housing to radiate the heat generated by the high heat generating element, wherein the heat radiating plate stops at the heat transfer block for heat radiation of the card type semiconductor device; And the connector 3
At the same time, the card type semiconductor device 1 is also fastened to the main board 2 to prevent the card type semiconductor device 1 from coming off.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a mounting structure of a card type semiconductor device.

[0002]

2. Description of the Related Art In recent years, in manufacturing various control devices using a CPU, a card-type semiconductor device in which a basic circuit around the CPU is incorporated in advance is frequently used. This card type semiconductor device is formed in a card shape by housing a high heat generating element such as a CPU in an appropriate shell, and is used by being plugged into a connector mounted on a main board on the user system side. .

By the way, this card type semiconductor device is a CP type semiconductor device.
Since a high heat generating element such as U is accommodated in the shell, the heat radiation performance of the card itself is low, and an efficient heat radiation and cooling structure is required. FIG. 4 shows a conventional mounting structure of such a card-type semiconductor device 1, in which a connector 3 is mounted on a main board 2 fixed to a device housing 6,
The card type semiconductor device 1 is plugged in to the connector 3. The card-type semiconductor device 1 includes a heat-dissipating heat-transfer block 4 for cooling a high heat-generating element in the shell 10, and a heat-dissipating plate 5 is fixed to the heat-dissipating heat-transfer block 4.
The heat radiation rubber 7 is in contact with the rear surface of the device housing 6. Further, a stopper 70 is screwed to the main board 2 so that the card-type semiconductor device 1 does not fall out of the connector 3 unnecessarily when vibration is applied to the device.

[0004]

However, in the above-described conventional example, the heat radiating plate 5 is screwed to the heat radiating heat transfer block 4, but the contact area of both is small, and the heat radiating plate 5 is used for heat radiating. For example, when the device housing 6 is warped or is not kept exactly parallel between the device housing 6 and the main board 2 because the device housing 6 is fixed to the heat transfer block 4 in a balance shape. In addition, since the heat radiating plate 5 is inclined along the housing, the contact area between the heat radiating plate 5 and the heat radiating heat transfer block 4 becomes smaller, and the heat conduction efficiency is reduced.

The heat-dissipating heat transfer block 4 is generally arranged so as to contact the heat-dissipating surface of the high-heat-generating element in the shell 10, and the heat-dissipating plate 5 fixed to the heat-dissipating heat transfer block 4 is provided.
For example, when the device is tilted along the inner wall of the device housing 6, an excessive load is applied to a mounting board (not shown) in the shell 10 on which the high-heat-generating element is mounted, which causes a disconnection of the pattern. .

The present invention has been made to solve the above-mentioned drawbacks, and has as its object to provide a mounting structure of a card-type semiconductor device having good heat conduction efficiency.

[0007]

SUMMARY OF THE INVENTION According to the present invention, there is provided a card type semiconductor device in which a high heat generating element is housed in a shell and plugged into a connector fixed to a main board. 1 and a heat radiating plate 5 for transferring the heat of the heat radiating heat transfer block 4 provided in the card type semiconductor device 1 to the device housing 6 and radiating the heat generated by the high heat generating element. Provided is a mounting structure for a card-type semiconductor device which is fixed to a heat-dissipating heat transfer block 4 of the card-type semiconductor device 1 and is fastened together with the connector 3 to a main board 2 to also prevent the card-type semiconductor device 1 from coming off. It is achieved by doing.

The card type semiconductor device 1 has a C
A heat-dissipating heat transfer block 4 formed by housing a high heat-generating element such as a PU and drawing out heat generated by the high heat-generating element to the outside.
Is provided to be exposed to the outside from the shell 10. The heat radiating plate 5 fixed to the heat radiating heat transfer block 4 to radiate the heat guided to the heat radiating heat transfer block 4 to the device housing 6 is provided together with the connector 3 for mounting the card type semiconductor device 1. Fastened to the main board 2 together.

Therefore, in the present invention, since the heat radiating plate 5 is fixed to two places of the heat radiating heat transfer block 4 and the main board 2, the balance-like fixed state as in the conventional example is eliminated, and the radiating plate is shaken. Disappears. As a result, for example, even if the device housing 6 is warped, there is no change in the contact state between the heat radiating plate 5 and the heat radiating heat transfer block 4, so that a stable contact state is maintained and a heat radiating path is reliably secured. be able to. Further, even if the device housing 6 is warped or the like, an excessive force is not applied to the heat-dissipating heat transfer block 4. No excessive stress is generated at the mounting joint portion of (1), and there is no risk of pattern breakage or the like on the mounting substrate of the high heat generating element.

Further, since both the fixing part to the connector 3 and the fixing part to the heat-dissipating heat-transfer block 4 are integrally formed on the heat radiating plate 5, the dimensional management of both is easy, and the design specifications are met. Can exhibit the heat radiation performance.

In addition, since the operation of fixing only the connector 3 is not required, the number of steps and the number of components are reduced, and the stopper for preventing the card-type electronic component from being required, which is conventionally required, is also unnecessary.

In this case, as described in claim 2,
When the heat sink 5 is fastened together with the main board 2 to the device housing 6, the contact state can be further stabilized,
Further, the number of parts can be reduced.

According to the third aspect of the present invention, there is provided a heat sink 5 suitable for the above-mentioned mounting structure. That is, in the present invention, the heat radiating plate for mounting the card type semiconductor device is formed of a material having good heat conductivity, and is fixed to the heat radiating piece 50 to the device housing 6 and the top of the heat radiating heat transfer block 4. A heat transfer block contact piece 51, a connector 3 fixing piece 52 that is fastened together with the connector 3 to the main board 2, and a fixing leg 53 that is fastened together with the main board 2 to the device housing 6.
And is provided.

[0014]

FIG. 1 to FIG. 3 show an embodiment in which the present invention is applied to an information processing apparatus. The information processing device is configured by fixing the main board 2 in a device housing 6 formed by connecting upper and lower cover members 60 and 61, and the card type semiconductor device 1 is connected to a connector 3 fixed on the main board 2.
Is plugged in.

The card type semiconductor device 1 includes a CP (not shown).
A mounting board (not shown) on which a high heat-generating element such as U is mounted is covered with a shell 10 such as an aluminum plate. A heat-dissipating heat-transfer block 4 that contacts the heat-dissipating surface of the high heat-generating element is arranged.

As shown in FIGS. 2 and 3, the heat radiating plate 5 is formed of a material having good thermal conductivity such as aluminum, and has an elasticity and a heat radiating rubber 7 having excellent heat conductivity. The heat dissipating piece 50 that comes into contact with the cover body 60 is provided. Also,
At the center of the heat radiating piece 50, a heat transfer block abutting piece 51 abutting on the heat radiating heat transfer block 4 is formed in a concave shape, and the heat transfer block abutting piece 51 is formed on the heat radiating heat transfer block 4. A screw insertion hole 51a corresponding to the screw hole 40 is formed.

Further, a connector fixing piece 52 is formed adjacent to the heat transfer block contact piece 51. Connector fixing piece 5
2 is a heat transfer block contact piece 51 for dissipating heat transfer block 4
A screw insertion hole 52a having a height dimension to contact the upper surface of the connector 3 in a state where the connector 3 is in contact with the mounting hole 30 for fixing the connector 3 to the mounting board is provided.

A fixing leg 5 is provided on a side edge of the heat radiation piece 50.
3 is erected. The fixed leg 53 has a fixed seat 53b in which a screw insertion hole 53a that matches the housing mounting hole 20 of the main board 2 is drilled. The height from the fixed seat 53b to the connector fixing piece 52 is the height of the connector 3. The size is matched.

Therefore, in order to use the card type semiconductor device 1 in this embodiment, first, the card type semiconductor device 1 is plugged into the connector 3 to which the leads 31 are soldered on the main board 2. After that, the heat transfer block contact piece 51 is fixed to the heat dissipation heat transfer block 4 of the card type semiconductor device 1 by using a screw 8, and the connector fixing piece 52 is connected to the main board fixing portion 32 of the connector 3.
At the same time, the connector 3 is fixed on the main board 2 by jointly fastening to the main board 2, and the fixing leg 53 is jointly fastened to the lower cover body 61 of the device housing 6 together with the main board 2.

Next, the upper cover 60 may be fixed by interposing a heat radiation rubber 7 between the heat radiation plate 5 and the main board 2 and fixing the connector 3 to the housing.
Is completely completed than the fixing of the heat radiating plate 5. Further, since the card type semiconductor device 1 is fixed to the heat radiating plate 5 via the heat radiating heat transfer block 4, a separate stopper 70 of the card type electronic device is separately provided. The card-type electronic device does not detach from the connector 3 without being disposed.

[0021]

As is apparent from the above description, according to the present invention, the heat transfer block for heat dissipation and the heat dissipation plate can be accurately brought into contact with each other, so that the heat dissipation efficiency can be improved.

[Brief description of the drawings]

1A and 1B are diagrams showing the present invention, wherein FIG. 1A is a cross-sectional view, and FIG. 1B is a plan view showing a state where a connector is arranged on a main board.

FIG. 2 is an exploded perspective view of a main part of FIG.

FIG. 3 is a rear perspective view of a heat sink.

FIG. 4 is a diagram showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Card type semiconductor device 10 Shell 2 Main board 3 Connector 4 Heat transfer block for heat dissipation 5 Heat sink 50 Heat dissipation piece 51 Heat transfer block contact piece 52 Connector fixing piece 53 Fixed leg 6 Device housing

Claims (3)

[Claims] 1. A card type semiconductor device having a high heat generating element housed in a shell and plugged into a connector mounted on a main board, and a heat transfer block for heat dissipation provided on the card type semiconductor device. A heat radiating plate for transferring heat to the device housing to radiate heat generated by the high heat generating element, wherein the heat radiating plate is fixed to a heat radiating heat transfer block of the card type semiconductor device, and the main board is provided together with the connector. The mounting structure of a card-type semiconductor device which is also fastened together to prevent the card-type semiconductor device from coming off. 2. The mounting structure of a card type semiconductor device according to claim 1, wherein said heat radiating plate is fastened together with said main board to an apparatus housing. 3. A card type for dissipating heat of a high heat generating element by transferring heat of a heat dissipating heat transfer block provided in a card type semiconductor device plugged into a connector fixed to a main board to an apparatus housing. A heat sink for mounting a semiconductor device, the heat sink being formed of a material having good heat conductivity, and a heat dissipation piece to the device housing; and a heat transfer block contact piece fixed to a top portion of the heat dissipation block. A heat sink for mounting a card-type semiconductor device, comprising: a connector fixing piece that is fastened together with a connector to a main board; and fixing legs that are fastened together with the main board to a device housing.