JPH11259181A - Electronic instrument having heat radiation structure - Google Patents
Electronic instrument having heat radiation structureInfo
- Publication number
- JPH11259181A JPH11259181A JP10062813A JP6281398A JPH11259181A JP H11259181 A JPH11259181 A JP H11259181A JP 10062813 A JP10062813 A JP 10062813A JP 6281398 A JP6281398 A JP 6281398A JP H11259181 A JPH11259181 A JP H11259181A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- main body
- display
- electronic device
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 7
- 229920001971 elastomer Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 abstract description 3
- 230000000191 radiation effect Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ワープロや携帯型
コンピュータ等の本体部に発熱を伴うCPUなどの電子
部品を有する電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus having electronic parts such as a CPU that generates heat in a main body of a word processor or a portable computer.
【0002】[0002]
【従来の技術】従来、ワープロや携帯型コンピュータ等
の液晶表示装置等を収容された表示部を有する電子機器
では、本体部にCPUなどの動作時に発熱を伴う電子部
品が多く実装された主回路基板を内蔵しており、この発
熱により電子機器の本体部内部が高温になることによっ
て、共に内蔵されている補助記憶装置などに誤動作など
の悪影響を与えることを防止するため、放熱のための対
策がとられている。2. Description of the Related Art Conventionally, in an electronic device having a display unit accommodating a liquid crystal display device such as a word processor or a portable computer, a main circuit in which many electronic components such as a CPU that generate heat during operation are mounted. The board has a built-in board, and measures for heat dissipation are used to prevent the heat generated inside the main body of the electronic device from being heated, which may adversely affect the auxiliary memory device etc. that are built in the board. Has been taken.
【0003】図3に従来の放熱対策を施したコンピュー
タの構造を示す。図において、11は電子機器の本体部
で、発熱部品であるCPU12が実装された主回路基板
13、補助記憶装置であるハードディスクドライブ14
等が収納されている。15はヒンジ部16によって本体
部11に回転可能に取付けられ、液晶表示装置17が収
納される表示部である。主回路基板13と液晶表示装置
17は主回路基板13と信号線18により接続されてい
る。主回路基板13上に実装されたCPU12の上面に
は金属製のヒートシンク19が密着して取り付けられて
おり、さらに、本体部11の内部には、冷却用のファン
モーター20が設置されている。これにより、CPU1
2などが動作時に発生した熱は、ヒートシンク19から
の熱伝導による放熱と、ファンモーター20による強制
対流により、本体部11の外部に放熱され、CPUなど
動作時に発熱を伴う電子部品は冷却される。また、本体
部11内部も高温にならないため、共に内蔵されている
ハードディスクドライブ14等にも誤動作などの悪影響
を与えることはない。FIG. 3 shows the structure of a computer in which conventional heat dissipation measures are taken. In the figure, reference numeral 11 denotes a main body of an electronic device, a main circuit board 13 on which a CPU 12 as a heat generating component is mounted, and a hard disk drive 14 as an auxiliary storage device.
Etc. are stored. Reference numeral 15 denotes a display unit which is rotatably attached to the main body unit 11 by a hinge unit 16 and in which the liquid crystal display device 17 is housed. The main circuit board 13 and the liquid crystal display 17 are connected to the main circuit board 13 by signal lines 18. A metal heat sink 19 is closely attached to the upper surface of the CPU 12 mounted on the main circuit board 13, and a cooling fan motor 20 is installed inside the main body 11. Thereby, the CPU 1
The heat generated during operation of the heat sink 2 and the like is dissipated to the outside of the main body 11 by heat dissipation from the heat sink 19 and forced convection by the fan motor 20, and electronic components such as a CPU that generate heat during operation are cooled. . In addition, since the temperature inside the main body 11 does not become high, the hard disk drive 14 and the like built in the main body 11 do not have an adverse effect such as malfunction.
【0004】[0004]
【発明が解決しようとする課題】前述した従来の放熱構
造を有する電子機器では、放熱のためのファンモーター
を必要とするため、騒音、消費電力が増大する。The above-described electronic equipment having the conventional heat dissipation structure requires a fan motor for heat dissipation, so that noise and power consumption increase.
【0005】本発明は、本体部で発生した熱を表示部に
伝熱させることができ、ファンモーターを使用すること
なく、放熱効果を上げることのできる構造を有する電子
機器を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic apparatus having a structure capable of transmitting heat generated in a main body to a display section and increasing a heat radiation effect without using a fan motor. And
【0006】[0006]
【課題を解決するための手段】この課題を解決するため
に本発明は、電子機器の本体部の放熱板に柔軟性のある
熱伝導性材料の一端を接触させ、さらに、表示部の放熱
板に熱伝導性材料のもう一端を接触させ、表示部の回転
動作を妨げる事なく、任意の回転位置の状態でも熱伝導
性材料が表示部または本体部の金属筐体に幅広い範囲で
接触するように構成したものである。SUMMARY OF THE INVENTION In order to solve this problem, the present invention relates to a heat radiation plate of a main body of an electronic device, wherein one end of a flexible heat conductive material is brought into contact with the heat radiation plate. The other end of the heat conductive material is brought into contact with the display unit, so that the heat conductive material contacts the display unit or the metal housing of the main unit in a wide range even at any rotational position without hindering the rotation operation of the display unit. It is what was constituted.
【0007】これにより、本体部で動作中のCPU等の
発熱部品から発生する熱を表示部に伝熱し、表示部の広
い面積から放熱することができるため、放熱のためのフ
ァンモーターを使用せずに、補助記憶装置などの機能ユ
ニットに発熱の影響を与えにくくする効果が得られる。Thus, heat generated from a heat-generating component such as a CPU operating in the main body portion can be transmitted to the display portion and radiated from a large area of the display portion, so that a fan motor for radiating heat can be used. Instead, the effect of reducing the influence of heat generation on the functional units such as the auxiliary storage device can be obtained.
【0008】[0008]
【発明の実施の形態】本発明の請求項1に記載の発明
は、発熱部品を含む半導体部品が実装された主回路基板
等を収容する本体部と、液晶表示装置等を収容する表示
部と、前記本体部に前記表示部を回転可能に取付けるた
めのヒンジ部を有し、前記表示部と前記本体部とを、薄
い柔軟性のある熱伝導性の放熱材料で接続することを特
徴とする放熱構造を有する電子機器であり、表示部の開
閉を妨げることなく滑らかに、かつ、幅広い範囲で本体
部と表示部とを放熱材料によって接触させ、安定して伝
熱させられる作用を有する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a main body for accommodating a main circuit board or the like on which semiconductor components including heat-generating components are mounted, and a display for accommodating a liquid crystal display device or the like. A hinge portion for rotatably attaching the display portion to the main body portion, wherein the display portion and the main body portion are connected to each other with a thin flexible heat conductive heat dissipation material. An electronic device having a heat dissipation structure, which has a function of smoothly and stably transferring heat by bringing a main body portion and a display portion into contact with a heat dissipation material in a wide range without obstructing opening and closing of a display portion.
【0009】請求項2に記載の発明は、請求項1記載の
放熱構造を有する電子機器において、柔軟性のある放熱
材料を、熱伝導性を高めた放熱ゴムで構成したもので、
表示部の開閉を妨げることなく滑らかに、かつ、本体部
と表示部を安定して接触させることができるという作用
を有する。According to a second aspect of the present invention, there is provided an electronic device having the heat radiation structure according to the first aspect, wherein the flexible heat radiation material is formed of a heat radiation rubber having enhanced thermal conductivity.
This has the effect that the main unit and the display unit can be stably contacted without hindering the opening and closing of the display unit.
【0010】請求項3に記載の発明は、請求項1記載の
放熱構造を有する電子機器において、柔軟性のある放熱
材料を、熱伝導性を高めた金属で構成したもので、表示
部の開閉を妨げることなく滑らかで、かつ、本体部と表
示部を安定して接触させることができるという作用を有
する。According to a third aspect of the present invention, there is provided an electronic device having the heat radiation structure according to the first aspect, wherein the flexible heat radiation material is made of a metal having enhanced thermal conductivity. This has the effect that the body portion and the display portion can be stably brought into contact with each other without hindrance.
【0011】請求項4に記載の発明は、請求項2または
請求項3記載の放熱構造を有する電子機器において、柔
軟性の放熱材料を、柔軟性を高めたシート状やネット状
としたものであり、表示部の開閉を妨げることなく滑ら
かに、かつ、本体部と表示部を安定して接触させること
ができるという作用を有する。According to a fourth aspect of the present invention, there is provided an electronic device having the heat radiation structure according to the second or third aspect, wherein the flexible heat radiation material is formed into a sheet or a net having enhanced flexibility. In addition, there is an effect that the main body and the display unit can be stably contacted without hindering the opening and closing of the display unit.
【0012】請求項5に記載の発明は、表示部または本
体部の筐体は、金属などの熱伝導性が高く、放熱可能な
材料で形成され、接触する熱伝導性材料と熱的な伝導が
可能であることを特徴としており、ヒートパイプや放熱
板などの部材が必要なく、部品点数を削減し、かつ、放
熱面積および放熱効果が高められるという作用を有す
る。According to a fifth aspect of the present invention, the display unit or the housing of the main body is made of a material having high heat conductivity such as metal and capable of dissipating heat, and is thermally conductive with the heat conductive material in contact therewith. It is characterized by the fact that members such as a heat pipe and a heat radiating plate are not required, the number of parts is reduced, and a heat radiating area and a heat radiating effect are enhanced.
【0013】以下、本発明の実施の形態について、図1
および図2を用いて説明する。 (実施の形態1)図1は放熱構造を有する電子機器であ
る携帯型のコンピュータを示す斜視図で、表示部と本体
部を説明の都合上少し離して図示している。図2はその
断面図である。図において、1は半導体部品などが実装
された主回路基板2が収納されている本体部、3はヒン
ジ部4によって本体部1に回転可能に取付けられ、液晶
表示装置5が収納される表示部である。本体部1は、マ
グネシウムなどの金属で形成されている上部筐体1aと
下部筐体1bで構成され、上部筐体1aは、主回路基板
2に実装されたCPU6の動作時の発熱を受熱可能に密
着している。また、表示部の外郭もマグネシウムなどの
金属で形成されている表示部筐体3aで構成されてお
り、柔軟性のある熱伝導性を高めた放熱材料7の一端
は、本体部1の上部筐体1aと主回路基板2に実装され
た発熱部品であるCPU6の間に挟まれ密着しており、
放熱材料7のもう一端は、表示部3の表示部筐体3aに
熱伝導性のある接着剤8で密着している。放熱材料に
は、例えばシリコンゴムのような放熱ゴムや、銅のよう
な金属が使用される。さらに、柔軟性を高めるため、放
熱材料を薄いシート状や、さらに柔軟性を高めるためネ
ット状に構成している。Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. (Embodiment 1) FIG. 1 is a perspective view showing a portable computer which is an electronic device having a heat dissipation structure, in which a display unit and a main unit are slightly separated for convenience of explanation. FIG. 2 is a sectional view thereof. In the drawing, reference numeral 1 denotes a main body in which a main circuit board 2 on which semiconductor components and the like are mounted is housed, and 3 denotes a display unit which is rotatably attached to the main body 1 by a hinge part 4 and in which a liquid crystal display device 5 is housed. It is. The main body 1 includes an upper housing 1a and a lower housing 1b formed of a metal such as magnesium, and the upper housing 1a can receive heat generated when the CPU 6 mounted on the main circuit board 2 operates. Closely adhered to. The outer periphery of the display unit is also composed of a display unit housing 3a made of a metal such as magnesium. It is sandwiched and adhered between the body 1a and the CPU 6, which is a heat generating component mounted on the main circuit board 2,
The other end of the heat dissipating material 7 is in close contact with the display housing 3a of the display unit 3 with an adhesive 8 having thermal conductivity. As the heat radiation material, for example, a heat radiation rubber such as silicon rubber or a metal such as copper is used. Further, the heat dissipation material is formed in a thin sheet shape to enhance flexibility, or in a net shape to further enhance flexibility.
【0014】以上のように構成された電子機器におい
て、以下にその動作について図2を用いて説明する。図
2(a)は、表示部3が本体部1に対して開いている状
態、図2(b)は、閉じている状態を示している。ヒン
ジ部4により回動可能に本体1に取り付けられている表
示部3がどの角度に回動したときにおいても、放熱材料
7は、薄いシート状の柔軟性の高い材料から構成されて
いるため、表示部の開閉を妨げることなく滑らかに、か
つ、幅広い範囲で、本体部1と表示部3の放熱部材であ
る筐体間を安定して接触する。The operation of the electronic device configured as described above will be described below with reference to FIG. FIG. 2A shows a state in which the display unit 3 is open with respect to the main body unit 1, and FIG. 2B shows a state in which the display unit 3 is closed. Even when the display unit 3 rotatably attached to the main body 1 is rotated by the hinge unit 4 at any angle, the heat radiation material 7 is formed of a thin sheet-like highly flexible material. The body 1 and the housing, which is a heat dissipating member of the display unit 3, are stably contacted smoothly and in a wide range without hindering opening and closing of the display unit.
【0015】これにより、本体部1で発生したCPU6
の動作時の発熱は、放熱材料7を介し、上部筐体1aに
伝熱する。さらに、放熱材料7から表示部3の表示部筐
体3aに伝わる。この表示部筐体3aは、マグネシウム
などの金属で形成されているため、放熱効果も高く、か
つ、表示部3全体の面積で、放熱することができ、従来
の本体部1のみでの放熱構造に比べ非常に効果が大き
い。また、放熱効果を上げるのに本体部にファンモータ
ーを使用する必要がないため、騒音や消費電力を低減す
ることができる。Thus, the CPU 6 generated in the main body 1
The heat generated during the operation is transmitted to the upper housing 1a via the heat radiation material 7. Further, the heat is transmitted from the heat radiation material 7 to the display housing 3a of the display unit 3. Since the display unit housing 3a is formed of a metal such as magnesium, the display unit 3 has a high heat dissipation effect, and can radiate heat over the entire area of the display unit 3, and the conventional heat dissipation structure using only the main body 1 is used. It is very effective compared to. In addition, since it is not necessary to use a fan motor in the main body to increase the heat radiation effect, noise and power consumption can be reduced.
【0016】なお、以上の説明では、柔軟性のある熱伝
導性材料をシリコンゴムなどの放熱ゴムで構成した例で
説明したが、柔軟性のある熱伝導性材料であれば何でも
よい。また、柔軟性のある熱伝導性材料は、シート状で
構成した例で説明したが、柔軟性のある形状であれば何
でもよい。In the above description, an example has been described in which the flexible heat conductive material is formed of heat radiation rubber such as silicon rubber, but any flexible heat conductive material may be used. Also, the flexible heat conductive material has been described as an example in the form of a sheet, but any material having a flexible shape may be used.
【0017】また、本体部1の上部筐体1aと表示部3
の表示部筐体3aをマグネシウムなどの金属としたが、
どちらかを金属板などの他の放熱材料として、放熱材料
7をそれに接触される構成としてもよい。The upper housing 1a of the main body 1 and the display 3
Is made of metal such as magnesium.
Either one may be used as another heat dissipation material such as a metal plate, and the heat dissipation material 7 may be configured to be in contact therewith.
【0018】[0018]
【発明の効果】以上のように本発明によれば、表示部の
開閉を妨げることなく滑らかで、かつ、幅広い範囲での
本体部と表示部との放熱部材間を接触させ、安定して伝
熱させ、表示部から放熱することができる。さらに、放
熱のためのファンモーターを使用する必要がないため、
騒音の発生がなく消費電力も少なくでき、補助記憶装置
などの機能ユニットに発熱の影響を与えにくくする効果
が得られる。As described above, according to the present invention, the heat dissipating members of the main body and the display unit are brought into contact with each other in a smooth and wide range without hindering the opening and closing of the display unit, and the transmission is performed stably. Heat can be released from the display unit. Furthermore, there is no need to use a fan motor for heat dissipation,
No noise is generated, the power consumption can be reduced, and the effect of reducing the influence of heat generation on functional units such as the auxiliary storage device can be obtained.
【図1】本発明の一実施の形態によるコンピュータの斜
視図FIG. 1 is a perspective view of a computer according to an embodiment of the present invention.
【図2】本発明の一実施の形態によるコンピュータの断
面図FIG. 2 is a sectional view of a computer according to an embodiment of the present invention;
【図3】従来の放熱対策を施したコンピュータの斜視図FIG. 3 is a perspective view of a conventional computer with heat dissipation measures.
1 本体部 1a 上部筐体 2 主回路基板 3 液晶部 3a 表示部筐体 6 CPU 7 放熱材料 DESCRIPTION OF SYMBOLS 1 Main body part 1a Upper housing 2 Main circuit board 3 Liquid crystal part 3a Display housing 6 CPU 7 Heat dissipation material
Claims (6)
回路基板等を収容する本体部と、液晶表示装置等を収容
する表示部と、前記本体部に前記表示部を回転可能に取
付けるためのヒンジ部を有し、前記表示部と前記本体部
とを、薄い柔軟性のある熱伝導性の放熱材料で接続する
ことを特徴とする放熱構造を有する電子機器。1. A main body for accommodating a main circuit board or the like on which a semiconductor component including a heat-generating component is mounted, a display for accommodating a liquid crystal display device and the like, and a display for rotatably mounting the display on the main body. An electronic device having a heat dissipation structure, characterized in that the display portion and the main body portion are connected to each other with a thin and flexible heat conductive heat dissipation material.
た放熱ゴムであることを特徴とする請求項1記載の放熱
構造を有する電子機器。2. The electronic device having a heat radiating structure according to claim 1, wherein the heat radiating material having flexibility is a heat radiating rubber having enhanced thermal conductivity.
めたシート状やネット状であることを特徴とする請求項
2記載の放熱構造を有する電子機器。3. The electronic device having a heat radiating structure according to claim 2, wherein the heat radiating rubber having enhanced thermal conductivity is in the form of a sheet or a net having enhanced flexibility.
た金属であることを特徴とする請求項1記載の放熱構造
を有する電子機器。4. The electronic device having a heat radiating structure according to claim 1, wherein the flexible heat radiating material is a metal having enhanced thermal conductivity.
シート状やネット状であることを特徴とする請求項4記
載の放熱構造を有する電子機器。5. The electronic device having a heat dissipation structure according to claim 4, wherein the metal having enhanced thermal conductivity is a sheet or net having enhanced flexibility.
熱伝導性が高く、放熱可能な材料で形成され、接触する
熱伝導性材料と熱的な伝導が可能であることを特徴とす
る請求項1記載の放熱構造を有する電子機器。6. The display unit or the housing of the main body is formed of a material having high heat conductivity such as metal and capable of dissipating heat, and is capable of conducting heat with a heat conductive material in contact therewith. An electronic device having the heat dissipation structure according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10062813A JPH11259181A (en) | 1998-03-13 | 1998-03-13 | Electronic instrument having heat radiation structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10062813A JPH11259181A (en) | 1998-03-13 | 1998-03-13 | Electronic instrument having heat radiation structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11259181A true JPH11259181A (en) | 1999-09-24 |
Family
ID=13211166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10062813A Pending JPH11259181A (en) | 1998-03-13 | 1998-03-13 | Electronic instrument having heat radiation structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11259181A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6510052B2 (en) | 2000-09-21 | 2003-01-21 | Kabushiki Kaisha Toshiba | Cooling unit for cooling a heat generating component and electronic apparatus having the cooling unit |
JP2003110263A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Heat dissipation structure, package assembly and heat dissipation sheet |
JP2008022417A (en) * | 2006-07-14 | 2008-01-31 | Matsushita Electric Ind Co Ltd | Mobile terminal device |
-
1998
- 1998-03-13 JP JP10062813A patent/JPH11259181A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6510052B2 (en) | 2000-09-21 | 2003-01-21 | Kabushiki Kaisha Toshiba | Cooling unit for cooling a heat generating component and electronic apparatus having the cooling unit |
US6728102B2 (en) | 2000-09-21 | 2004-04-27 | Kabushiki Kaisha Toshiba | Electronic apparatus including a cooling unit for cooling a heat generating component |
US6751095B2 (en) | 2000-09-21 | 2004-06-15 | Kabushiki Kaisha Toshiba | Cooling unit including radiator for radiating heat of heat generating component, and electronic apparatus including the cooling unit |
US6920043B1 (en) | 2000-09-21 | 2005-07-19 | Kabushiki Kaisha Toshiba | Electronic apparatus including a circulation path for circulating cooling medium |
JP2003110263A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Heat dissipation structure, package assembly and heat dissipation sheet |
JP2008022417A (en) * | 2006-07-14 | 2008-01-31 | Matsushita Electric Ind Co Ltd | Mobile terminal device |
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