JPH11243266A - Substrate for semiconductor parts - Google Patents

Abstract

(57) [Problem] To use a semiconductor component substrate for both development and mass production, and to increase the mounting area of the semiconductor component. SOLUTION: On the input side of a microcomputer 7, a first input side printed wiring 8A whose end is a land, an input circuit 5
And a second input-side printed wiring 10A having lands opposite to the lands of the first input-side printed wiring 8A.
Form A. The first output side printed wiring 8B and the second output side printed wiring 1 are also provided on the output side of the microcomputer 7.
0B, and an output side connector member mounting portion 12B is formed by each land at the end. Connector member mounting part 1
A socket 13 for mounting an auxiliary substrate during development and a chip jumper 19 during mass production are selectively connected to 2A and 12B, respectively. Wiring for connecting the microcomputer 7 and the auxiliary board can be omitted on the circuit board 1, so that the mounting area of the semiconductor components is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a semiconductor component which is suitably used for both development and mass production, for example, for debugging a microcomputer.

[0002]

2. Description of the Related Art Generally, an internal combustion engine such as an automobile is provided with a control unit for controlling a fuel injection amount, an ignition timing, an automatic shift control, and the like. A circuit board as a semiconductor component substrate on which a computer (hereinafter, referred to as a microcomputer), an integrated circuit element (IC), a semiconductor component used as a transistor, a capacitor, a resistor, and the like are mounted.

In addition, two types of circuit boards are required: a development board for checking the operation state and the like in the microcomputer and a mass production board housed in the control unit during mass production of the vehicle. However, preparing two substrates increases costs in terms of design and manufacturing.
One circuit board was adapted for both development and mass production.

Here, a circuit board according to the prior art is provided with an insulating substrate on which a microcomputer, an integrated circuit element (IC), semiconductor components used as transistors, capacitors, resistors, and the like are mounted, and extending on the insulating substrate. And printed wiring for connecting the semiconductor components.
Further, an input side connector and an output side connector are provided at an end of the insulating substrate.

[0005] The printed wiring includes a mass-produced wiring connected to a microcomputer, an input connector, an output connector, and other semiconductor components.
It is roughly composed of wiring for mass production located on the output side and wiring for development extending to a lead frame provided at the end of the substrate.

At the time of development, a lead frame provided at an end of a circuit board is connected to an auxiliary board having an extension circuit and an external memory, and bus lines transmitted to and received from a microcomputer, input signals, and output signals Are stored in the external memory of the auxiliary board. Then, by monitoring information in the external memory, the operating state of the program in the microcomputer is checked.

On the other hand, when mass-producing a vehicle, a microcomputer completed by development is mounted on a circuit board using wiring for mass production, and the circuit board is housed in a control unit mounted on the vehicle. Was. This allows
In the conventional circuit board, one board is used for both development of the microcomputer and mass production of the vehicle.

[0008]

By the way, in the circuit board according to the prior art described above, the development wiring for connecting to the auxiliary board at the time of development is routed on the board, and this development wiring is also used during mass production. There is a problem that it is complicated because it exists, and that the area for mounting the semiconductor component is reduced by the wiring for development.

Further, the circuit board has a problem that the area of the circuit board is increased by the amount of wiring for development and the control unit in which the circuit board is housed is enlarged.

The present invention has been made in view of the above-described problems of the prior art, and the present invention provides a socket for connection during development and a connection portion for connection during mass production on a common land, thereby reducing the mounting area of semiconductor components. It is an object of the present invention to provide a semiconductor component substrate that can be increased.

[0011]

According to a first aspect of the present invention, there is provided an insulating substrate having a plurality of semiconductor components mounted thereon, and one of the semiconductor components. And a first printed wiring extending from the other semiconductor component on the insulating substrate, the end extending to the land of the first printed wiring. The present invention is configured to include a second printed wiring which is an opposing land, and a connector member for connecting between the land of the first printed wiring and the land of the second printed wiring.

With this configuration, for example, when one of the semiconductor components is a one-chip microcomputer in which an arithmetic element, a storage element, and an input / output element are packaged, a socket is connected between lands opposed to each other during development. Another board is provided in the socket, and the microcomputer is debugged by transmitting and receiving a bus line, an input signal, and an output signal between the other board and the microcomputer. On the other hand, at the time of mass production, a connection is made between the lands, thereby conducting between the first printed wiring and the second printed wiring. In this way, the socket used during development and the connection used during mass production can be connected to a common land.

According to the second aspect of the present invention, the connector member is constituted by a socket connected to a mating socket provided on another substrate.

With this configuration, the microcomputer and the other board can be connected through the socket, and the bus line, input signal, and output signal can be transmitted and received between the other board and the microcomputer.

According to a third aspect of the present invention, the connector member is constituted by a connecting portion for connecting the land of the first printed wiring and the land of the second printed wiring.

With this configuration, the lands that are opposed to each other are connected by the connecting portion during mass production, and the first printed wiring and the second printed wiring are conducted.

According to a fourth aspect of the present invention, the connecting portion is constituted by a chip jumper or a socket in which terminals are short-circuited.

With this configuration, the first printed wiring and the second printed wiring can be electrically connected to each other by a connecting portion including a chip jumper connecting lands or a socket having a short-circuit between terminals during mass production. Can be.

[0019]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a semiconductor component substrate according to an embodiment of the present invention; FIG.

Reference numeral 1 denotes a circuit board as a substrate for semiconductor components according to the present embodiment. The circuit board 1 is provided in a board accommodation space (neither is shown) of a control unit used for controlling an internal combustion engine such as an automobile. Is housed in

Reference numeral 2 denotes an insulating substrate serving as a base of the circuit board 1.
The insulating substrate 2 is formed as a flat multi-layer substrate using an insulating material such as glass-containing epoxy resin, and an integrated circuit device (I
C), a semiconductor component 3, such as a transistor, a capacitor, a resistor, and a connector 4 are mounted.

Here, the connector 4 is configured as an input / output socket connected to various sensors such as a temperature sensor, an oxygen sensor, and a crank angle sensor, and various actuators such as a fuel injection valve and an ignition coil, which are provided in the vehicle. ing. The connector 4 is shown in FIG. 3 separately for convenience as an input connector 4A and an output connector 4B.

The semiconductor component 3 mounted on the insulating substrate 2 is located, for example, between the microcomputer 7 and the input connector 4A, and between the microcomputer 7 and the output connector 4B. The output circuit 6 and the like are configured.

Reference numeral 7 denotes a microcomputer mounted on the insulating substrate 2 (hereinafter referred to as a microcomputer 7).
Is configured as a one-chip microcomputer provided with an arithmetic element, a storage element, and an input / output element (not shown) in one package. The storage element stores a program for performing fuel injection amount control, ignition timing control, automatic shift control, and the like, and various set values.

Are first input-side printed wiring lines 8A, 8A, 8A,..., Each of which is a microcomputer serving as one semiconductor component as shown in FIG. 7 extend on the insulating substrate 2 from the input side and are provided in parallel with each other. At the end of each first input side printed wiring 8A, a land 9A made of a conductor pattern used for connecting terminals is formed. Have been.

Reference numerals 8B, 8B,... Denote first output-side printed wiring lines comprising a plurality of wiring lines. Each of the first output-side printed wiring lines 8B extends from the output side of the microcomputer 7 onto the insulating substrate 2 and Lands 9B are formed at the ends of the first output-side printed wirings 8B.

Are second input-side printed wiring lines 10A, 10A, 10A,... Each of which is constituted by the other semiconductor component as shown in FIG. The input circuit 5 extends from the input circuit 5 on the insulating substrate 2 and is provided in parallel with each other. At the end of each second input-side printed wiring 10A, a land 9A of each first input-side printed wiring 8A is provided. Opposing lands 11A are formed. The land 9A and the land 11A form a connector member mounting portion 12A on the input side to which a socket 13 or a chip jumper 19 described later is selectively connected.

Are second output-side printed wiring lines composed of a plurality of wiring lines. Each of the second output-side printed wiring lines 10B is connected to an output circuit 6 composed of the other semiconductor component from an insulating substrate. 2 and are provided in parallel with each other, and each of the second output side printed wirings 10
At the end of B, a land 11B facing the land 9B of each first output-side printed wiring 8B is formed. The land 9B and the land 11B form an output-side connector member mounting portion 12B to which the socket 13 or the chip jumper 19 is selectively connected.

Reference numeral 13 denotes a socket. As shown in FIGS. 4 and 5, the socket 13 is a connector member mounting portion 1 on the input side.
The terminals 13A are soldered between the opposing lands 9A and 11A of the 2A and between the opposing lands 9B and 11B of the connector member mounting portion 12B on the output side, thereby being connected to the connector member mounting portions 12A and 12B. Things. Further, since the socket 13 is configured as a surface mount type female connector, an auxiliary board 14 described later at the time of development is provided.
Is mounted.

Reference numeral 14 denotes an auxiliary substrate as another substrate used at the time of development. The auxiliary substrate 14 is provided on an insulating substrate 15 and an upper surface of the insulating substrate 15 as shown in FIGS. It is roughly composed of an external memory 16 composed of a ROM and an extension circuit 17 composed of an integrated circuit element (IC) mounted on the lower surface.

Numerals 18 and 18 denote mating sockets provided on the lower surface of the auxiliary board 14. Each mating socket 18 is formed as a surface mount type male connector as shown in FIG. 18 is a socket 1 of the circuit board 1
3 is attached.

Reference numeral 19 denotes a chip jumper as a connecting portion used in mass production. As shown in FIGS. 8 and 9, the chip jumper 19 is connected between the lands 9A and 11A of the input side connector member mounting portion 12A. The first input-side printed wiring 8A and the second input-side printed wiring 10A are connected between the opposite lands 9B and 11B of the output-side connector member mounting portion 12B by soldering.
The first output-side printed wiring 8B and the second output-side printed wiring 10B are electrically connected to each other. And
The chip jumper 19 is formed by arranging lead wires in parallel to facilitate surface mounting.

The circuit board 1 according to the present embodiment is configured as described above. Next, the usage of the circuit board 1 will be described separately for development and mass production, and the operation will be described.

First, at the time of development, sockets 13 are respectively connected between the lands 9A and 11A of the input side connector member mounting portion 12A and between the lands 9B and 11B of the output side connector member mounting portion 12B. The mating sockets 18, 18 of the auxiliary board 14 are mounted on the auxiliary board 14. Thus, the auxiliary boards 14 are arranged on the circuit board 1 side by side.

Then, the circuit board 1 is accommodated in, for example, the accommodation space of the control unit, and the control unit is mounted on an actual vehicle.
Output signals and the like are stored in the external memory 16 of the auxiliary board. Further, by monitoring this information, the microcomputer 7
The program can be debugged after confirming the operation state and the like of the program inside the program.

On the other hand, when the vehicle is mass-produced, between the lands 9A and 11A of the input side connector member mounting portion 12A,
The lands 9B and 11 of the output side connector member mounting portion 12B.
B, chip jumpers 19 are respectively connected, and the respective input lands 9A, 9A are connected by the respective chip jumpers 19.
A is conducted between A and the lands 9B and 11B on the output side. Thereby, the input side of the microcomputer 7 is connected to various sensors through the first input side printed wiring 8A, the second input side printed wiring 10A, the input side connector 4A, etc., and the output side of the microcomputer 7 is connected to the first side. It can be connected to various actuators through the output side printed wiring 8B, the second output side printed wiring 10B, the output side connector 4B and the like.

Thus, the circuit board 1 according to the present embodiment
A first input-side printed wiring 8A extending from the input side of the microcomputer 7 onto the insulating substrate 2 and a land 11A facing the land 9A of the first input-side printed wiring 8A from the input circuit 5 side. And two input-side printed wirings 10A, and the input-side connector member mounting portion 12A is formed by the lands 9A and 11A. Further, on the circuit board 1, a first output side printed wiring 8B extending from the output side of the microcomputer 7 onto the insulating substrate 2 and a land 9B of the first output side printed wiring 8B from the output circuit 6 side are opposed. Second output-side printed wiring 10B having land 11B
And the output side connector member mounting portion 12B is formed by the lands 9B and 11B. Thus, the socket 13 can be selectively connected to the connector member mounting portions 12A and 12B during development, and the chip jumper 19 can be selectively connected during mass production. As a result, the socket 13 and the chip jumper 19 are connected to the common input lands 9A, 1A.
1A and the lands 9B and 11B on the output side.

On the other hand, when the microcomputer 7 is developed for debugging or the like, the mating socket 18 on the auxiliary board 14 is replaced with the socket 1 connected to the connector member mounting portions 12A, 12B.
3, the auxiliary board 14 is mounted on the circuit board 1.
Can be juxtaposed. Since the gap between the substrates 1 and 14 is about the height of the socket 13 and the mating socket 18, it can be easily accommodated in the substrate accommodation space of the control unit.

The auxiliary board 14 is provided with a socket 13, 1
Since the auxiliary substrate 14 is fixed on the circuit board 1 by the spacer 8, the spacers, lead frames, fixing screws, etc., which are necessary for fixing the auxiliary substrate 14 to the circuit board 1, can be omitted, and the space can be saved. Moreover, the attachment and detachment of the auxiliary board 14 to and from the circuit board 1 can be easily performed by the sockets 13 and 18.

Further, the socket 13 has a common connector member mounting portion 1 on which a chip jumper 19 is provided during mass production.
2A, 12B, the sockets 13, 18
Signals can be transmitted and received between the microcomputer 7 and the auxiliary board 14 through the microcomputer. In addition, it is possible to eliminate the wiring of the development wiring conventionally formed on the substrate and eliminate the complicated printed wiring. Thereby, the mounting area of the semiconductor component 3 mounted on the circuit board 1 can be increased.

On the other hand, in the circuit board 1, the wiring for development which has been conventionally formed is omitted, so that the circuit board 1 is not used.
And the control unit in which the circuit board 1 is housed can be reduced in size.

In the embodiment, the connecting portions connecting between the lands 9A and 11A of the connector member mounting portion 12A and the connecting portions connecting between the lands 9B and 11B of the connector member mounting portion 12B use the chip jumper 19. The present invention is not limited to this, and instead, as in a modified example shown in FIG. 10, while the socket 13 is connected to the circuit board 1, a terminal for short-circuiting the terminal on the socket 13 side to the socket 13 is provided. A mating socket 21 having 21A may be attached.

In the embodiment, the case where the circuit board 1 is used as a control unit for controlling an internal combustion engine of an automobile has been described. However, the present invention is not limited to this, and a microcomputer or an integrated circuit used for various controls may be used. Circuit element (I
It can be used for a substrate on which a semiconductor component such as C) is mounted.

[0044]

As described in detail above, according to the first aspect of the present invention, the first printed wiring extending from one semiconductor component to the insulating substrate and having an end as a land, and the other printed wiring. A second printed wiring provided extending from the semiconductor component on the insulating substrate and having an end facing the land of the first printed wiring; a land of the first printed wiring and a second printed wiring For example, if one of the semiconductor components is a one-chip microcomputer in which an arithmetic element, a memory element, and an input / output element are packaged, the land opposed to the land at the time of development is used. A socket as a connector member is connected therebetween, another board is provided in the socket, and a bus line, an input signal, and an output signal are transmitted and received between the other board and the microcomputer. By Ukoto, perform the debugging of the microcomputer. On the other hand, at the time of mass production, by connecting a connection between lands, the first printed wiring and the second
Between the printed wiring and the printed wiring.

As described above, the socket used at the time of development and the connection part used at the time of mass production can be connected to a common land, and the development wiring conventionally formed on the substrate is omitted. It is possible to increase the mounting area of the semiconductor component on the substrate, reduce the substrate area, and reduce the size of the case that houses the semiconductor component substrate.

According to the second aspect of the present invention, since the connector member is constituted by a socket connected to a mating socket provided on another board, the microcomputer is connected to the other board through the socket, and the other board is connected. Bus lines, input signals, and output signals can be transmitted and received between the board and the microcomputer.

According to the third aspect of the present invention, since the connector member is constituted by the connecting portion for connecting the land of the first printed wiring and the land of the second printed wiring, the space between the lands opposed by the connecting portion during mass production is provided. By connecting, the first printed wiring and the second printed wiring can be conducted.

According to the fourth aspect of the present invention, since the connection portion is constituted by the chip jumper or the socket in which the terminals are short-circuited, the first printed wiring and the second printed wiring can be conducted.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a circuit board according to an embodiment.

FIG. 2 is an enlarged plan view showing the periphery of a microcomputer on a circuit board.

FIG. 3 is a circuit block diagram showing a circuit constituted by semiconductor components mounted on a circuit board.

FIG. 4 is a perspective view showing a state where a socket is connected to a circuit board.

FIG. 5 is a sectional view of a main part showing a state where the socket is connected to a land.

FIG. 6 is a perspective view showing a state before an auxiliary board is provided on the circuit board.

FIG. 7 is a side view showing a state before an auxiliary board is provided on the circuit board.

FIG. 8 is a perspective view showing a state in which a chip jumper is connected to a circuit board.

FIG. 9 is a sectional view of a main part showing a state where a chip jumper is connected to a land.

FIG. 10 is an essential part cross-sectional view showing a state before a socket in which terminals are short-circuited is mounted on a socket of a circuit board according to a modified example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board (substrate for semiconductor components) 2 Insulating substrate 3 Semiconductor component 7 Microcomputer (one semiconductor member) 8A First input-side printed wiring 8B First output-side printed wiring 9A, 9B, 11A, 11B Land 10A First 2 Input-side printed wiring 10B 2nd output-side printed wiring 12A, 12B Connector member mounting portion 13 Socket 14 Auxiliary substrate (other substrate) 18 Mating socket 19 Chip jumper (connecting portion) 21 Mating socket (connecting portion)

Claims (4)

[Claims] An insulating substrate on which a plurality of semiconductor components are mounted; and a first semiconductor component extending from one of the semiconductor components and extending over the insulating substrate and having a land at an end.
And a second printed wiring provided extending from the other semiconductor component on the insulating substrate and having an end facing the land of the first printed wiring.
And a connector member for connecting between the land of the printed wiring and the land of the second printed wiring. 2. The semiconductor component substrate according to claim 1, wherein said connector member is constituted by a socket connected to a mating socket provided on another substrate. 3. The semiconductor component substrate according to claim 1, wherein said connector member is constituted by a connecting portion that connects a land of the first printed wiring and a land of the second printed wiring. 4. The semiconductor component substrate according to claim 3, wherein said connecting portion is constituted by a chip jumper or a connector in which terminals are short-circuited.