JPH11233992A - Electromagnetic shielding adhesive film and electromagnetic shielding structural body using the same, and display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the contact area with an outer electrode for grounding and realize an appropriate connection by having a geometrical diagram drawn by conductive metal, and providing a conductive frame part connecting electrically with the geometrical diagram around the outer circumference of the diagram. SOLUTION: A frame body 21 is fitted to a conductive frame part provided around the outer circumference of an electromagnetic shielding adhesive film and is fixed thereafter. The frame body 21 is fitted in its entirely to the exposed frame part, while it makes contact therewith. The frame body 21 is formed into an L shape and is provided to the frame part of the electromagnetic shielding adhesive film and the end side face of a plastic board only. A slightly hard metallic powder is placed on the conductive frame part while making it be fit, thereby improving the contact conductivity. A transparent layer is provided on the formation surface of the geometrical diagram of the electromagnetic shielding adhesive film and is piled on one side of the plastic board 11 via an adhesive agent layer 12 on the side of a plastic film 3, and furthermore a plastic film 13 is adhered to the other surface of the plastic board with the adhesive agent layer 12 in between.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding adhesive film having a shielding property of an electromagnetic wave generated from the front surface of a display such as a CRT, a PDP (plasma), a liquid crystal, an EL and the like, and an electromagnetic wave using the film. It relates to a shielding structure, a display.

[0002]

2. Description of the Related Art With the recent increase in the use of various types of electrical equipment and electronic equipment, electromagnetic noise interference (Electrically
o Magnetic Interference (EMI) is also on the rise. Noise can be roughly divided into conducted noise and radiated noise. As a measure against conduction noise, there is a method using a noise filter or the like. On the other hand, as a measure against radiation noise, it is necessary to insulate the space electromagnetically,
Methods such as making the housing a metal body or a high conductor, inserting a metal plate between circuit boards, and winding a cable with metal foil have been adopted. Although these methods can expect an electromagnetic wave shielding effect of a circuit or a power supply block, they are not suitable for shielding electromagnetic waves generated from the front surface of a display such as a CRT and a PDP because they are opaque.

As a method for achieving both the electromagnetic wave shielding property and the transparency, a method of forming a thin film conductive layer by depositing a metal or metal oxide on a transparent substrate (Japanese Patent Laid-Open No. 27880/1990).
No. 0, JP-A-5-323101). On the other hand, an electromagnetic wave shielding material in which a good conductive fiber is embedded in a transparent substrate (JP-A-5-327274,
JP-A-5-269912) or an electromagnetic wave shielding material in which a conductive resin containing metal powder or the like is directly printed on a transparent substrate (JP-A-62-57297, JP-A-2-5-5).
An electromagnetic wave shielding material in which a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm and a copper mesh pattern is formed thereon by electroless plating (see JP-A-5-283889). Further, there is an electromagnetic wave shielding structure (see Japanese Patent Application No. 9-145076) in which an adhesive film in which a geometric pattern is applied to a plastic film with a copper foil by a microlithography method is attached to a plastic plate. Proposed.

When the electromagnetic wave shielding structure is mounted on a display, it is necessary to ground the electromagnetic wave shielding structure by some method in order to reduce the leakage of the electromagnetic wave and to exhibit a good shielding property. As a configuration of the electromagnetic wave shielding structure for making a good connection with the external electrode for grounding, a conductive material such as a conductive tape is applied on the transparent conductive film bonded to both surfaces of the plastic plate or on the outer periphery of the plastic plate. A method in which the transparent conductive film is connected to an external electrode with low resistance (low impedance) (Japanese Patent Application Laid-Open No. 9-149)
No. 347), a method of protruding a metal net between two plastic plates, and sandwiching an exposed portion of the metal net between frames for external electrodes for grounding or the like (see Japanese Patent Application Laid-Open No. 9-147552) has been proposed. ing.

[0005]

As a method for achieving both the electromagnetic wave shielding property and the transparency, Japanese Patent Application Laid-Open No. 1-278800 has been disclosed.
In the method of forming a thin film conductive layer by depositing a metal or metal oxide on a transparent substrate disclosed in Japanese Patent Application Laid-Open No. (100 ° -2,000 °), the surface resistance of the conductive layer becomes too large, so that even if the conductive layer is attached to a display by the connection method with an external electrode for grounding disclosed in JP-A-9-149347, sufficient shielding performance is obtained. Could not be obtained. An electromagnetic wave shielding material in which a good conductive fiber is embedded in a transparent substrate (JP-A-5-327274, JP-A-5-327274)
In Japanese Patent Application Laid-Open No. 269912/1989, if the connection to an external electrode for grounding is made by the method disclosed in Japanese Patent Application Laid-Open No. 9-147752 or the like, the shielding effect is sufficient, but the conductive material is prevented from leaking electromagnetic waves. Since the fiber diameter required for regularly arranging the conductive fibers was the thinnest at 35 μm, which was too thick, the fibers were visible (hereinafter referred to as visibility), which was not suitable for display applications. JP 6
Similarly, in the case of an electromagnetic wave shielding material in which a conductive resin containing a metal powder or the like disclosed in JP-A-2-57297 and JP-A-2-52499 is directly printed on a transparent substrate, the line width is about 100 μm due to the limit of printing accuracy. This was not suitable because visibility was developed. In addition, Japanese Patent Application No. Hei 9-14
According to the method proposed in Japanese Patent No. 5076, it is possible to achieve both the electromagnetic wave shielding property and the transparency. However, since the method is a method in which a film is attached to a plastic plate, it is difficult to connect with an external electrode for grounding. In addition, since the plastic film and the adhesive layer are insulating layers, it is difficult to directly ground. On the other hand, for example, even if the film is attached so that the conductive material drawn with the geometrical figure is on the opposite side of the plastic plate, the geometrical figure is also drawn at the part in contact with the external electrode for grounding. Therefore, the contact area between the conductive material forming the geometrical figure and the external electrode is reduced, and good shielding properties cannot be obtained. Regarding the shielding property of the electromagnetic wave generated from the front of the display, in addition to the electromagnetic wave shielding function of 30 dB or more at 30 MHz to 1 GHz, the infrared of 900 to 1,100 nm generated from the front of the display is transmitted to other VTR devices controlled by remote control. It has to be shielded because it has an adverse effect. Further, not only is the visible light transmittance (visible light transmittance) large, but also in order to prevent leakage of electromagnetic waves, it is necessary that the external electrode for grounding and the electromagnetic wave shielding structure be well connected. However, there has not been obtained one that sufficiently satisfies the characteristics of electromagnetic wave shielding, infrared shielding, transparency and invisibility at the same time. In view of the above, the present invention provides a high electromagnetic wave shielding property, infrared shielding property, an electromagnetic wave shielding adhesive film having transparency and invisibility by taking good connection with an external electrode for grounding, and an electromagnetic wave shielding using the same. It is an object to provide a structure and a display.

[0006]

According to the first aspect of the present invention, there is provided an electromagnetic wave shield for increasing a contact area with an external electrode for grounding and improving a connection with the external electrode for grounding. In order to provide a conductive adhesive film, a plastic film with a conductive metal formed on a plastic film via an adhesive layer, has a geometric figure drawn with a conductive metal, and is drawn with a conductive metal. And a conductive frame electrically connected to the geometrical figure on the outer periphery of the geometrical figure. In order to reduce the contact resistance between the geometrical figure drawn with the conductive metal and the conductive frame located on the outer periphery of the geometrical figure, the frame is preferably made of a plastic with a conductive metal. The film is formed of a conductive metal. Claim 3
The invention described in the above, in the electromagnetic wave shielding adhesive film having a geometrical figure drawn with a conductive metal, in order to provide an electromagnetic wave shielding adhesive film that can be grounded from the plastic film surface side, at least the conductive frame portion It is characterized in that a part is exposed. According to the fourth aspect of the present invention, the adhesive layer and the plastic film that support the conductive picture frame are removed and at least a part of the picture frame is exposed, so that the adhesive layer and the plastic film are partially or entirely removed. However, the present invention is characterized in that it is excellent in workability and mass productivity, and is formed by using a laser which is a dry process. The invention according to claim 5 removes the adhesive layer and the plastic film that support the conductive frame portion and exposes at least a part of the frame portion. It is characterized by being formed using sand blast which is excellent in workability and mass productivity.

The invention according to claim 6 is characterized in that a transparent layer is provided on at least a part of the geometrical figure and at least a part of the frame portion via an adhesive layer in order to protect the geometrical figure. It is. The transparent layer protects a geometric figure drawn with a conductive metal such as a plastic film, a plastic plate, and a glass plate, and may be transparent. According to a seventh aspect of the present invention, there is provided an electromagnetic wave shielding adhesive film for improving the connection with an external electrode for grounding by a simple method. Is bent so that the conductive metal of the frame is exposed on the plastic film side. The invention according to claim 8 provides an electromagnetic wave shielding adhesive film that increases the contact area with an external electrode for grounding and improves the connection with the external electrode for grounding. The present invention is characterized in that a frame portion is formed by attaching a conductive tape to the outer periphery. A conductive tape may be attached, and a geometrical figure drawn with a conductive metal may extend to the outer periphery or the frame may be formed in order to perform the function of the frame. According to the ninth aspect of the present invention, in order to provide an electromagnetic wave shielding adhesive film that increases the contact area with an external electrode for grounding and improves the connection with the external electrode for grounding, The present invention is characterized in that a conductive three-dimensional network structure is formed on the outer periphery to form a frame portion.
Since the conductive three-dimensional network structure has a restoring force due to elasticity, it can be closely attached. According to a tenth aspect of the present invention, the width of the frame portion is set in a range of 1 to 40 mm in order to make a good connection with the external electrode for grounding.

[0010] The invention according to claim 11 is a plastic film with a conductive metal provided with a conductive metal on the surface of the plastic film via an adhesive layer in order to provide an electromagnetic wave shielding adhesive film excellent in workability. Wherein the geometrical figure formed of the conductive metal is formed by a microlithographic method. The invention according to claim 12 is characterized in that the conductive material is copper and at least its surface is blackened in order to provide an electromagnetic wave shielding adhesive film having a small fading property and a high contrast. It is. The invention according to claim 13 is transparent, inexpensive, to provide an electromagnetic shielding adhesive film having an electromagnetic shielding property and an infrared shielding property with good heat resistance and excellent handling properties,
The plastic film is a polyethylene terephthalate film or a polycarbonate film. The invention according to claim 14 is to provide an electromagnetic shielding adhesive film excellent in transparency and invisibility,
The line width of a geometric figure drawn with conductive metal is 40 μm.
Hereinafter, the line interval is 100 μm or more, and the line thickness is 40
μm or less. The invention according to claim 15 is excellent in workability and adhesion, in order to provide an inexpensive electromagnetic wave shielding adhesive film having electromagnetic wave shielding properties and invisibility, the thickness of the conductive metal is 0.5 to 40 μm. copper,
Aluminum or nickel is used. The invention according to claim 16 is characterized in that, in order to provide an electromagnetic shielding adhesive film having an infrared shielding property, an infrared absorbent is contained in any one of layers constituting the electromagnetic shielding adhesive film. Things.

According to the present invention, the electromagnetic wave shielding adhesive film is provided on at least one surface of a plastic plate in order to provide an electromagnetic wave shielding structure which is excellent in transparency and invisibility and has less warpage. It is characterized by the following. The invention according to claim 18 is to provide the electromagnetic wave shielding adhesive film on one surface of a plastic plate and a plastic material on the other surface in order to provide an electromagnetic wave shielding structure excellent in transparency and invisibility and with less warpage. A film is provided. The surface of the electromagnetic wave shielding adhesive film on which the geometric figure is formed may be in contact with the plastic plate or may be on the opposite surface. In addition, plastic films contain infrared absorbers, anti-glare treatment, anti-reflection treatment, anti-static treatment, hardening treatment for scratch resistance, pattern, anti-Newton ring treatment and heat-resistant film, protection It is preferably a film. The invention according to claim 19 provides the electromagnetic wave shielding adhesive film on one surface of a plastic plate, in order to provide an electromagnetic wave shielding structure excellent in transparency and invisibility and having less warpage, The frame portion is deformed so as to be bent, so that the frame portion reaches the opposite surface of the plastic plate. Claim 20
The invention described in (1) is to reduce the electromagnetic wave leakage due to good contact with the external electrode for grounding, to provide an electromagnetic wave shielding structure having a simple installation and an excellent appearance. A conductive tape is attached to a part of the frame of the adhesive film. The invention according to claim 21 is to reduce the electromagnetic wave leakage due to good contact with an external electrode for grounding, to provide an electromagnetic wave shielding structure having a simple installation and an excellent appearance. A conductive three-dimensional network structure is in contact with at least the frame of the electromagnetic wave shielding adhesive film of the body. Claim 22
The invention described in the above, in order to provide an electromagnetic wave shielding component having an electromagnetic wave shielding property and an infrared shielding property, at least any one of an electromagnetic wave shielding adhesive film, a plastic plate, a plastic film or an adhesive layer constituting the electromagnetic wave shielding component It is characterized by containing a crab infrared absorber. According to a twenty-third aspect of the present invention, a plastic film of an electromagnetic wave shielding adhesive film provided on a plastic plate or a plastic plate or the surface of a plastic film is provided to impart antiglare or antireflection to the electromagnetic wave shielding structure. It is characterized by being subjected to a glare treatment or an anti-reflection treatment. The invention according to claim 24 is characterized in that a frame is provided around the periphery of the electromagnetic wave shielding structure so as to be in contact with the frame in order to prevent leakage of the electromagnetic wave and improve aesthetic appearance.

The invention according to claim 25 uses an electromagnetic wave shielding adhesive film which has electromagnetic wave shielding properties and transparency and is well connected to an external electrode for grounding in order to reduce leakage of electromagnetic waves. It was what was. According to a twenty-sixth aspect of the present invention, an electromagnetic wave shielding structure having electromagnetic wave shielding properties and transparency and being well connected to an external electrode for grounding to reduce electromagnetic wave leakage is used for a display. .

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. Examples of the plastic film used in the present invention include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene, polypropylene, polystyrene and EVA; vinyl resins such as polyvinyl chloride and polyvinylidene chloride; and polysulfone. Preferably, the film is made of a plastic such as polyethersulfone, polycarbonate, polyamide, polyimide, or acrylic resin and has a total visible light transmittance of 70% or more and a thickness of 1 mm or less. These can be used as a single layer, but can also be used as a multilayer film combining two or more layers. Among the plastic films, a polyethylene terephthalate film or a polycarbonate film is preferable in terms of transparency, heat resistance, ease of handling, and price. The thickness of the plastic film is more preferably from 5 to 500 μm.
If it is less than 5 μm, the handleability becomes poor, and if it exceeds 500 μm, the transmittance of visible light decreases. 10-200μ
m is more preferable.

The plastic plate used in the present invention is a plate made of plastic, specifically, a polystyrene resin, an acrylic resin, a polymethyl methacrylate resin,
Polycarbonate resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyethylene resin, polypropylene resin, polyamide resin, polyamideimide resin, polyetherimide resin, polyetherketone resin, polyarylate resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate Thermoplastic polyester resin such as resin, cellulose acetate resin, fluororesin, polysulfone resin, polyethersulfone resin,
Thermoplastic resins and thermosetting resins such as polymethylpentene resin, polyurethane resin, and diallyl phthalate resin are exemplified. Among these, a polystyrene resin, an acrylic resin, a polymethyl methacrylate resin, a polycarbonate resin, a polyvinyl chloride resin, a polyethylene terephthalate resin, and a polymethyl pentene resin having excellent transparency are preferably used. The thickness of the plastic plate used in the present invention is 0.5 mm to 5 mm for protection and strength of the display,
It is preferable from the viewpoint of handling.

As the conductive metal of the present invention, metals such as copper, aluminum, nickel, iron, gold, silver, stainless steel, tungsten, chromium, titanium and the like, or alloys combining two or more kinds of metals can be used. . Copper, aluminum or nickel are suitable from the viewpoint of conductivity, circuit processing easiness and price, and metal foil with a thickness of 0.5 to 40 μm, plating metal, or metal formed under vacuum such as evaporation is used. Will be If the thickness exceeds 40 μm, it is difficult to form a thin line width or the viewing angle becomes narrow. If the thickness is less than 0.5 μm, the surface resistance tends to be large, and the electromagnetic wave shielding effect tends to be poor.

[0014] It is preferable that the conductive metal is copper and at least the surface thereof has been subjected to a blackening treatment because the contrast is high. Further, it is possible to prevent the conductive metal from being oxidized with time and discolored. The blackening process may be performed before and after the formation of the geometrical figure. However, after the formation, the blackening process can be performed by using a method used in the field of printed wiring boards. For example, sodium chlorite (31 g / l), sodium hydroxide (15 g / l), trisodium phosphate (12 g / l)
g / l) in an aqueous solution at 95 ° C for 2 minutes. In addition, it is preferable that the conductive metal is a paramagnetic metal because of excellent magnetic field shielding properties. The simplest method for bringing the conductive metal into close contact with the plastic film is to attach the conductive metal via an adhesive layer mainly composed of acrylic or epoxy resin and flowing by heating or pressing. When it is necessary to reduce the thickness of the conductive layer of the conductive metal, one or more of thin film forming techniques such as a vacuum deposition method, a sputtering method, an ion plate method, a chemical vapor deposition method, and an electroless / electroplating method are used. This can be achieved by a combination of methods. The thickness of the conductive metal is preferably 40 μm or less, and the thinner the thickness, the wider the viewing angle of the display is, which is preferable as an electromagnetic wave shielding material, and more preferably, 18 μm or less.

The geometric figures drawn with the conductive metal of the present invention include triangles such as equilateral triangles, isosceles triangles, right triangles, etc., squares, rectangles, rhombuses, parallelograms, trapezoids, etc., and (positive) hexagons. It is a pattern combining (positive) n-gons (n is a positive integer) such as square, (positive) octagon, (positive) dodecagon, (positive) octagon, etc., circle, ellipse, star, etc. ,
These units can be used alone or in combination of two or more. From the viewpoint of electromagnetic wave shielding, a triangle is most effective, but from the viewpoint of visible light transmission, if the number of (positive) n-gons is larger, the numerical aperture increases as the number of n increases. From the viewpoint, the aperture ratio is preferably 50% or more. The aperture ratio is 60%
The above is more preferred. The aperture ratio is a percentage of the ratio of the area obtained by subtracting the area of the conductive metal of the geometric figure drawn with the conductive metal from the effective area to the effective area of the electromagnetic wave shielding adhesive film. When the area of the display screen is defined as the effective area of the electromagnetic wave shielding adhesive film, the display screen is a visible ratio.

As a method of forming such a geometric figure, it is effective to produce a plastic film with a conductive metal by a microlithography method from the viewpoint of circuit processing accuracy and circuit processing efficiency. The microlithography includes a photolithography, an X-ray lithography, an electron beam lithography, an ion beam lithography, and the like, and also includes a screen printing method and the like. Among these, the photolithographic method is the most efficient in terms of its simplicity and mass productivity. Above all, a photolithography method using a chemical etching method is most preferable in terms of its simplicity, economy, circuit processing accuracy, and the like. Among the photolithographic methods, in addition to the chemical etching method, it is also possible to form a geometric figure by a method using electroless plating or electroplating, or a combination of electroless plating or electroplating and chemical etching.

The line width of such a geometric figure is 40 μm.
m or less, line spacing is 100 μm or more, line thickness is 4
It is preferable that the thickness be in the range of 0 μm or less. Further, from the viewpoint of invisibility of the geometric figure, the line width is more preferably 25 μm or less, and the line interval is more preferably 120 μm or more and the line thickness is 18 μm or less from the viewpoint of visible light transmittance. Line width is 40μ
m or less, preferably 25 μm or less, and if it is too small and thin, the surface resistance becomes too large and the shielding effect is inferior. Line thickness is 4
0 μm or less is preferable. If the thickness is too small, the surface resistance becomes too large and the shielding effect is inferior.
Or more, more preferably 1 μm or more.
The aperture ratio increases as the line interval increases, and the visible light transmittance increases. When used on the front of the display as described above, the aperture ratio is preferably 50% or more, more preferably 60% or more. If the line spacing becomes too large,
The line spacing is 100
It is preferably set to 0 μm (1 mm) or less. When the line interval is complicated by a combination of geometric figures and the like, the area is converted into a square area on the basis of a repeating unit, and the length of one side is set as the line interval.

The adhesive used as the adhesive layer in the present invention is:
The following are typical examples. It is preferable that the adhesive layer has a function of flowing when heated or pressurized and has an adhesive function. In the electromagnetic wave shielding adhesive film of the present invention, an adhesive layer is provided on a plastic film, and a geometrical figure drawn with a conductive metal thereon is formed. The adhesive layer adheres a plastic film and a geometric figure drawn with a conductive metal, and when this is further adhered to an adherend, a display, a plastic plate, a plastic film, a glass plate, etc., the adhesive layer is formed. Flows through the space where the geometrical figure is not formed and adheres to the adherend. For this reason, it is preferable that the adhesive layer flows by heating or pressing. Also, when the bonding surface of the conductive metal is roughened to form a geometric figure and improve the adhesiveness, the roughened surface is transferred to the adhesive layer, and light is irregularly reflected on the roughened surface. However, when the adhesive layer flows, the transfer shape of the roughened surface is eliminated by the flow, and the light transmittance can be improved. From these, the adhesive layer is heated,
It is necessary to flow under pressure, and an adhesive composition such as a thermoplastic, thermosetting, or actinic ray-curable resin is preferable.

As these adhesives, bisphenol A
Epoxy resin, bisphenol F epoxy resin, tetrahydroxyphenylmethane epoxy resin, novolak epoxy resin, resorcin epoxy resin, polyalcohol / polyglycol epoxy resin, polyolefin epoxy resin, alicyclic or halogenated bisphenol, etc. Epoxy resin can be used. Other than epoxy resin, natural rubber, polyisoprene, poly-
1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t
(Di) enes such as -butyl-1,3-butadiene, poly-1,3-butadiene, polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether, polyvinyl butyl ether, and polyvinyl acetate , Polyesters such as polyvinyl propionate, polyurethane,
Examples include ethyl cellulose, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, and phenoxy resin.
These exhibit a suitable visible light transmittance.

Examples of the curing agent for the adhesive include amines such as triethylenetetramine, xylenediamine, and diaminodiphenylmethane; and acids such as phthalic anhydride, maleic anhydride, dodecylsuccinic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic anhydride. Anhydride, diaminodiphenyl sulfone, tris (dimethylaminomethyl) phenol, polyamide resin, dicyandiamide, alkyl-substituted imidazole, and the like can be used. These may be used alone or as a mixture of two or more.
Also, it is not necessary to use it. These curing agents (crosslinking agents)
Is added to the polymer in an amount of 0.1 to 100 parts by weight.
It is preferred to select 50 parts by weight, preferably 1 to 30 parts by weight. If this amount is less than 0.1 part by weight, curing will be insufficient, and if it exceeds 50 parts by weight, excessive crosslinking will occur,
Adhesion may be adversely affected. The adhesive used in the present invention may optionally contain additives such as a diluent, a plasticizer, an antioxidant, an ultraviolet absorber, a filler and a tackifier. Then, this adhesive layer is applied to the surface of the plastic film, and a conductive metal is bonded to form a plastic film with a conductive metal.

In the present invention, the conductive frame portion is formed on the same surface as the geometrical figure drawn by the conductive metal, and is formed in a frame shape around the geometrical figure by the conductive material. . The frame is electrically connected to a geometric figure drawn with a conductive material, and is well connected to an external electrode for grounding. FIG. 1A is a plan view of the electromagnetic wave shielding adhesive film of the present invention. A conductive picture frame (1) is formed on the outer periphery of a geometric figure (2) drawn with a conductive metal. Hereinafter, the configuration of the electromagnetic wave shielding adhesive film will be exemplified by a cross-sectional view of the electromagnetic wave shielding adhesive film.
The configuration of the electromagnetic wave shielding adhesive film is, as shown in FIG. 1 (b), a geometric figure (2) drawn on a plastic film (3) via an adhesive layer (4) with a conductive metal.
Is formed, and a conductive frame portion (1) is formed on the outer periphery thereof. Further, as shown in FIG. 1 (c), a geometrical figure (2) drawn with a conductive metal is formed on the plastic film (3) via an adhesive layer (4), and a conductive figure is formed on the outer periphery thereof. Of the frame (1) is exposed. The configuration in which the frame portion (1) is exposed can be formed by removing part or all of the adhesive layer or the plastic film that supports the frame portion of the electromagnetic wave shielding adhesive film. As a method of removing a part or the whole of the adhesive layer or the plastic film, it can be easily performed by using a laser or a sandblast through a shielding jig. In the case of laser, in the case of a laser, a shielding jig is formed by processing a metal plate to provide a penetrating portion in the shape of a frame portion, placing the penetrating portion on the plastic surface of the electromagnetic wave shielding adhesive film in accordance with the position of forming the frame portion, A metal plate is used as a laser shield.
On the other hand, in the case of sandblasting, abrasion-resistant materials such as rubber and photoresist are used as shielding materials.
In order to form the conductive frame (1), a metal foil, a conductive tape, and a conductive three-dimensional mesh structure forming the frame are formed on the outer periphery of the geometric figure drawn with the conductive metal. It can also be performed by providing. The electrical connection between the conductive metal of the geometric figure and the frame is made by bonding the metal foil etc. as the frame with the adhesive layer of the electromagnetic wave shielding adhesive film, and the geometrical connection between the metal foil of the frame and the conductive metal The connection may be made by contact with a figure, or a solder paste may be applied to a geometric figure of a metal foil or a conductive metal, and the connection may be made by heating and melting. Further, bonding using a conductive adhesive may be used.

In FIG. 1 (d), a geometrical figure (2) drawn with a conductive metal is formed on a plastic film (3) via an adhesive layer (4), and a conductive metal is provided on the outer periphery thereof. A conductive frame (1) is formed of a conductive metal of a plastic film, and a transparent layer (5) is attached via an adhesive layer so as not to cover the entire frame on the geometric figure. An example is shown in which the frame is exposed. The transparent layer (5) is a plastic film, a plastic plate, a glass plate, or the like. In this configuration, the transparent layer (5) can be installed directly on the display or via a jig. FIG.
(E) is an example in which the conductive frame (1) is bent toward the plastic film (3) to expose the frame to the plastic film. FIG. 1F shows a plastic film (3) in which a geometrical figure (2) drawn by a conductive metal is formed via an adhesive layer (4), and a conductive adhesive or a conductive tape is formed on the outer periphery thereof. This is an example in which the frame portion (1) is formed of a conductive material (6) such as the above. FIG. 1 (g) shows a geometrical figure (2) drawn with a conductive metal on a plastic film (3) via an adhesive layer (4), and a conductive three-dimensional network structure on the outer periphery thereof. (7) Frame part (1)
This is an example in which is formed. 1 (a) to 1 (g) show examples of the electromagnetic wave shielding adhesive film of the present invention, but the present invention is not limited to these configurations. In the configuration of FIG. 1B, since the conductive metal forming the frame portion is connected to the conductive metal of the geometrical figure, the connection resistance with the external electrode for grounding is low and good electromagnetic wave shielding properties are obtained. Can be expressed. In the configuration of FIG. 1B, when a surface of a geometric figure drawn with a conductive metal on a plastic plate is bonded using the adhesive layer, the adhesive layer or the plastic layer below the frame portion is formed. Since the film serves as an insulating layer, it becomes difficult to electrically connect to an external electrode for grounding. The solution to this problem is the configuration of FIG. 1 (e). When the surface of the geometrical figure (2) drawn with a conductive metal is bonded to a plastic plate, the frame portion is bent, so that the outer layer side is formed. There is a frame portion serving as an electrode for grounding, which facilitates electrical connection. Regarding the bending method, the four corners may be folded as they are, but it is preferable to make cuts at the four corners and to bend, for example. Alternatively, the folded portion may be fixed by attaching a double-sided adhesive tape to the plastic film where the frame portion is formed. On the other hand, similarly, in the configuration of FIG. 1C, when the surface of the geometrical figure (2) drawn with a conductive metal is bonded to the plastic plate, the external electrode for grounding is exposed because the frame portion is exposed. Electrical connection with the device becomes easy. In the configuration shown in FIG. 1D, when the plastic film (3) side is bonded to a display or a plastic plate, the geometrical figure serving as the outer layer is protected by the transparent layer (5), and the outer side is connected to the external electrode for grounding. The frame is exposed for easy connection. The plastic film (3) or the transparent layer (5) to be bonded may be provided with an infrared shielding function, an antiglare function, and an antireflection function. In the configurations shown in FIGS. 1F and 1G, in order to reduce the connection resistance between the geometrical figure and the external electrode for grounding, a conductive material (6) such as a conductive adhesive or a conductive tape, or the like. Since the conductive frame (1) is formed on the conductive metal of the geometrical figure by the conductive three-dimensional network structure (7), it is easily controlled without being restricted by the size of the equipment to be used. A frame can be formed. In this configuration, the frame portion can be bent as shown in FIG. The width of the above-mentioned frame portion is preferably set to 1 to 40 mm in order to improve the connection with the external electrode for grounding. If it exceeds 20 mm, the width of the frame portion is too wide and the occupied area becomes large, so that it is preferably 5 to 15 mm. In the case of bending as shown in FIG. 1 (e), the width of the frame can be made wider.

The electromagnetic wave shielding structure of the present invention has a structure in which the electromagnetic wave shielding adhesive film having the structure shown in FIGS. 1A to 1G is provided on at least one surface of a plastic plate. In addition, an electromagnetic wave shielding adhesive film, an electromagnetic wave shielding structure in which a surface on which a conductive geometric figure is drawn is provided on a plastic plate via an adhesive layer, and a plastic film is provided on the other surface via an adhesive layer It is. Such an electromagnetic wave shielding component is preferably brought into contact with an external electrode for grounding in order to suppress leakage of electromagnetic waves and obtain good electromagnetic wave shielding properties. If the connection resistance between the external electrode for grounding and the electromagnetic wave shielding structure is high, or if the adhesion is insufficient, sufficient electromagnetic wave shielding properties cannot be obtained.

FIG. 2A is a perspective view of the electromagnetic wave shielding structure according to the present invention. This is a configuration example in which an electromagnetic wave shielding adhesive film (8) is attached to one surface of a plastic plate (11), and a plastic film (13) is attached to the other surface of the plastic plate (11) via an adhesive layer (12).
FIGS. 2B to 2E are cross-sectional views of the electromagnetic wave shielding structure. The configuration shown in FIG. 2B is a plastic plate (11).
Has a surface on which a geometrical figure of the electromagnetic wave shielding adhesive film (8) is drawn on one side and a plastic film (13) on the other side via an adhesive layer (12). 2C, the plastic film (3) of the electromagnetic wave shielding adhesive film (8) is attached to one side of the plastic plate (11) via an adhesive layer (12), and the plastic plate (11) is attached. Adhesive layer (1
A plastic film (13) is attached via 2). When the electromagnetic wave shielding structure is brought into contact with an external electrode for grounding, in order to improve the adhesion between the electromagnetic wave shielding structure and the external electrode for grounding, a conductive tape or a conductive three-dimensional network structure is used. It is preferable that the conductive material (6) having cushioning property is formed on the frame of the electromagnetic wave shielding structure (FIGS. 2D and 2E). FIG. 3 is an example in which a conductive frame (21) is provided in the frame of the electromagnetic wave shielding structure illustrated in FIG. The frame body (21) connects the conductive picture frame (1) electrically connected to the geometrical figure (2) drawn with the conductive metal and the external electrode for grounding, and provides an aesthetic appearance. Improve. In order to connect to external electrodes, the surface of the frame must be conductive, such as by plating metal or plastic where necessary, such as aluminum or brass; A material in which conductive materials such as fibers are dispersed may be used. It is preferable that the cross section of the frame has a U-shape because it can be fitted into and fixed to the electromagnetic wave shielding structure. Fixed
A restoring force due to deformation of the frame body may be used, or screws, screws, or adhesives may be used. If the cross section of the frame is a U-shape, insert a metal foil such as copper foil inside the concave part of the frame and fit it around the geometric figure drawn with conductive metal on the whole surface This is preferable because the metal foil of the frame can be pressed against the geometric figure. In this case, the metal foil in contact with the geometric figure becomes the frame.

FIG. 3A is a perspective view of the electromagnetic wave shielding structure provided with the frame (21), and FIG.
(G) is a sectional view thereof. FIG. 3A shows an electromagnetic wave shielding structure in which a frame (21) is fitted and fixed to a conductive frame provided on the outer periphery of the electromagnetic wave shielding adhesive film. FIG. 3 (b) shows a frame (21) on the entire exposed frame portion.
(C) is an example in which the frame (21) is fitted into and brought into contact with a part of the frame portion. FIG.
(D) shows a configuration in which the frame (21) is formed in an “L” shape, and the frame is provided only on the frame portion of the electromagnetic wave shielding adhesive film and the end side surface of the plastic plate. If the contact between the frame and the conductive part of the frame is not sufficient, place a metal powder that is slightly harder than the frame or the frame on the conductive frame and let the metal powder bite into the frame or the frame. It is also effective to increase the reliability of the contact conduction. The side surface of the end of the plastic plate and the frame were fixed with an adhesive. FIG. 3E shows the state shown in FIG.
This is an example in which a frame (21) is provided in the electromagnetic wave shielding structure of (1).
FIG. 3 (f) shows that the transparent layer (5) is provided on the surface of the electromagnetic wave shielding adhesive film (8) of FIG. 1 (d) where the geometric figure is formed, and the adhesive layer is provided on the plastic film (3) side. The adhesive layer (1) is laminated on one side of the plastic plate (11) via (12) and further on the other side of the plastic plate.
This is an example in which a frame is provided in an electromagnetic wave shielding structure (10) in which a plastic film (13) is bonded via 2).
The above-mentioned frame (21) is not limited to this, and may be made of a conductive material such as a metal foil, a conductive adhesive, or a conductive tape. The above configuration is an example, and there are many combinations.

On any surface of the above-mentioned electromagnetic wave shielding adhesive film or electromagnetic wave shielding structure, a layer having an infrared shielding property, a layer having an antireflection treatment, a layer having an antiglare treatment,
A layer having high surface hardness and abrasion resistance can be formed. These are examples, and can be used in other forms. An electromagnetic wave shielding adhesive film may be adhered to one surface of the glass plate, and this glass plate may be attached to the front surface of the display so that the glass surface is outside the display device.

In the present invention, it is preferable that the adhesive layer and the plastic film that support the conductive frame portion are removed by a laser so that at least a part of the frame portion is exposed.
Lasers include a YAG laser, a carbon dioxide laser, a TEA carbon dioxide laser, an argon ion laser, an excimer laser, etc. In this configuration, the removal area is large, and if the PET film and the adhesive layer are combined, it must be removed at a depth of 50 μm or more. YAG lasers, carbon dioxide lasers, and TEA carbon dioxide lasers are preferred because they must be processed in the shortest possible time in terms of mass production and mass productivity. To form a conductive frame that is electrically connected to the geometric figure drawn with conductive metal on the outer periphery of the electromagnetic wave shielding adhesive film, if the laser output of the processing surface processed from the plastic film side is small. The removal of the plastic film and the adhesive layer in the frame part was insufficient,
If it is too large, the conductive metal in the frame portion will be broken. Therefore, it is preferably 10 to 100 W, more preferably 20 to 40 W.

In the present invention, in order to form the frame portion, the adhesive layer and the plastic film supporting the conductive frame portion are removed by sandblasting, and at least a part of the frame portion is exposed. Sand blasting is performed by spraying an abrasive onto unmasked portions to selectively etch the non-masked portions. As a blast material used for sandblasting, glass beads, alumina, silica, silicon carbide, particle size of 0.1 to 0.3 zirconium oxide and the like
Fine particles of about 150 μm are used. In the present invention, a part or the whole other than the frame is covered with a mask material, and the plastic film and the adhesive in the frame are removed. The mask material is not limited as long as it can be protected from being damaged in the sandblasting process, such as rubber, photoresist, plastic film, plastic plate, metal, ceramic, and wood.

In the present invention, a conductive three-dimensional network structure in which a conductive picture frame electrically connected to a geometric figure drawn with a conductive metal is formed on the outer periphery of the geometric figure may be used. it can. The conductive three-dimensional network structure is prepared by pretreating a synthetic resin foam having a three-dimensional network structure such as urethane foam with an electroless metal plating catalyst or the like, and electrolessly forming a metal layer such as nickel or copper in a plating tank. Plating is used in combination with electroplating to increase the thickness of the plated metal, followed by baking to decompose and burn the resin, and transferring the shape of the foamed resin to a three-dimensional mesh structure of an electrodeposited metal or urethane foam. A synthetic resin foam having a three-dimensional network structure is immersed in a slurry prepared by mixing a metal powder, a thickening polymer, and a solvent, and the metal powder is applied to a skeleton of the foam, and then heat-treated to form a synthetic resin foam. Adhesive is applied to a synthetic resin foam having an open-cell structure, such as a three-dimensional network structure of a metal produced by transferring the shape of a foamed resin by decomposing and burning the metal powder and sintering the metal powder, and urethane foam. After impregnating and drying the liquid, the metal powder is attached to the synthetic resin foam by shaking, and then fired to decompose and burn off the resin, and sinter the metal powder to transfer the shape of the foamed resin. it can.

In the electromagnetic wave shielding adhesive film and the electromagnetic wave shielding structure of the present invention, the electromagnetic wave shielding adhesive film provided on the plastic plate may be provided on the plastic film or the surface of the plastic plate or the plastic film.
Preferably, an anti-glare treatment or an anti-reflection treatment has been performed. Hereinafter, formation of these processes on a plastic film will be described as a typical example. The same can be applied to a plastic plate or the like. The anti-reflection treatment
It refers to increasing the transmittance of visible light by preventing the reflection of visible light. In this antireflection treatment, the minimum reflection wavelength is defined by the coating thickness and the refractive index of the antireflection layer, and n
d = (m + ／) λ / 2 (n: refractive index, d: coating thickness, λ: wavelength, m = 0, 1, 2, 3,...). That is, since n is determined by the substance, the wavelength of the minimum reflectance (the maximum transmittance) can be selected by adjusting the film thickness. The antireflection layer has a single-layer structure having a refractive index different from that of the plastic film or a two-layer structure.
Some have a multilayer structure of more than one layer. In the case of a single-layer structure, a material having a smaller refractive index than a plastic film is selected. On the other hand, in the case of a multilayer structure which is superior in anti-reflection treatment, a material layer having a larger refractive index than a plastic film is provided, and a material layer having a smaller refractive index is provided thereon, so that the refractive index between adjacent layers is increased. Although the materials have different refractive indices, it is more preferable that the material has a multilayer structure of three or more layers such that the refractive index of the outermost layer is smaller than a virtual refractive index adjacent thereto. As a material for forming such an anti-reflection layer, any known material may be used.For example, CaF ₂ , MgF ₂ , NaAlF ₆ , Al ₂ O ₃ , SiOx (x = 1
~ 2), ThF ₄ , ZrO ₂ , Sh ₂ O ₃ , Nd ₂ O ₃ , SnO ₂ , TiO ₂ , etc., and the refractive index and the film thickness are appropriately selected so as to satisfy the above relationship. You.

The anti-glare treatment is intended to prevent flickering of the display and eye fatigue, and any known material may be used as a material for forming such an anti-glare treatment layer. Preferably, it is a layer containing inorganic silica. Such an inorganic silica layer is formed of an epoxy resin such as a bisphenol A epoxy resin, a bisphenol F epoxy resin, a novolak epoxy resin, a diene resin such as polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, and ethyl acrylate. Butyl acrylate, 2-ethylhexyl acrylate, t
-Polyacrylate copolymers such as butyl acrylate, polyvinyl acetate, polyester resins such as polyvinyl propionate, polyethylene,
A cured film dispersed and bound in a polyolefin-based resin such as polypropylene, polystyrene, and EVA and a curable resin such as a silicon-based resin is preferably used as the antiglare treatment layer.

In forming the film of the anti-glare treatment layer,
First, a composition in which various additives such as an antistatic agent and a polymerization initiator are added according to need by mixing silica particles in a resin,
Usually, an antiglare treatment agent having a solid content of about 20 to 80% by weight after dilution with a solvent is prepared. The silica particles used here are amorphous and porous, and a typical example thereof is silica gel. The average particle diameter is usually 30μ.
m, preferably about 2 to 15 μm.
The mixing ratio is preferably such that the silica particles are 0.1 to 10 parts by weight with respect to 100 parts by weight of the resin.
If the amount is too small, the antiglare effect will be poor. If the amount is too large, the visible light transmittance and the film strength will be reduced. The antiglare agent is applied to one surface of the plastic film by a suitable means such as a gravure coater, a reverse coater, or a spray coater, which is a general solution coating means, so that the film thickness after drying is usually about 5 to 30 μm. After drying by heating, it is preferable to cure by ultraviolet irradiation, electron beam irradiation or heating. The anti-glare treatment layer composed of the silica particle-containing coating obtained in this way, when a plastic film having this treatment layer is bonded to a plastic substrate, imparts a good anti-glare property to the substrate, and Since the hardness of the film is high and the scratch resistance is excellent, it greatly contributes to the improvement of the abrasion resistance of the plastic. Prior to the formation of such an anti-glare treatment layer, the surface to be adhered, that is, the surface of the plastic film may be subjected to a corona discharge treatment, a plasma treatment, a sputter etching treatment, or an easy adhesion treatment as a pretreatment. Thereby, the adhesion between the plastic film and the antiglare layer can be improved.

In the present invention, it is preferable that the electromagnetic wave shielding component such as the electromagnetic wave shielding adhesive film, the plastic film, and the adhesive layer provided on the plastic plate contains an infrared absorbing agent. The infrared absorbent preferably has a high infrared absorptance in a range of 900 to 1,100 nm, and includes a metal oxide such as iron oxide, cerium oxide, tin oxide, and antimony oxide, or indium-tin oxide (hereinafter, ITO); The above-mentioned adhesive layer including an organic infrared absorber such as tungsten hexachloride, tin chloride, cupric sulfide, chromium-cobalt complex salt, thiol-nickel complex or aminium compound, diimonium compound (manufactured by Nippon Kayaku Co., Ltd.), A composition contained in a plastic film or a plastic plate or dispersed in a binder resin can be used by being applied to one surface of a plastic. Among these infrared absorbing compounds, those having the effect of absorbing infrared rays most effectively are organic infrared absorbing agents such as cupric sulfide, ITO, aminium compounds and diimonium compounds. What should be noted here is the particle size of the primary particles of these compounds. If the particle size is too large than the wavelength of infrared rays, the shielding efficiency is improved, but irregular reflection occurs on the particle surface and haze is increased, so that transparency is reduced. On the other hand, if the particle size is too small compared to the wavelength of infrared rays, the shielding effect will be reduced. The preferred particle size is 0.01 to 5 μm, more preferably 0.1 to 3 μm. The infrared absorber is uniformly dispersed in the adhesive or binder resin of the adhesive layer. The optimum amount of the compound is 0.01 to 10 parts by weight of the infrared absorbent with respect to 100 parts by weight of the adhesive or the binder resin, and more preferably 0.1 to 5 parts by weight. If it is less than 0.01 part by weight, the infrared ray shielding effect is small, and if it exceeds 10 parts by weight, transparency is impaired.
In the case of a binder resin composition, it is applied to at least one surface of a plastic film in a thickness of 0.1 to 10 μm. The applied composition containing an infrared absorber may be cured using heat or UV. An adhesive layer can also be formed on the binder resin. It is preferable in terms of manufacturing simplicity that the infrared absorber is directly mixed with the adhesive composition to be the adhesive layer and used.

[0034]

EXAMPLES Next, the present invention will be described specifically with reference to Examples, but the present invention is not limited thereto. <Production Example 1 of Electromagnetic Wave Shielding Adhesive Film> A 50 μm-thick anti-glare polyethylene terephthalate film (Diahard EX-) was used as a plastic film.
205; trade name, manufactured by Reiko Co., Ltd.), and an electroconductive copper foil of 18 μm in thickness, which is a conductive metal, was formed on the roughened surface through a 20 μm-thick adhesive composition to be an adhesive layer described later. At 180 ° C, 30 kgf
/ Laminate under heat / lamination conditions and bond with copper foil
An ET film was obtained. Using a geometric film and a negative film having a 10 mm wide frame on the outer periphery of the geometric figure, a photolithography process (resist film pasting-exposure-development-chemical etching-resist) is applied to the obtained PET film with copper foil. After film peeling), line width 2
A copper grid pattern having a picture frame of 5 μm and a line interval of 250 μm is formed on a PET film, and then sodium chlorite 31 g / l and trisodium phosphate 12 g /
1 in an aqueous solution of sodium hydroxide 15 g / l at 95 ° C 2
After that, the surface of the copper was blackened to obtain an electromagnetic wave shielding adhesive film 1 (the configuration of FIG. 1B).

<Electromagnetic Wave Shielding Adhesive Film Production Example 2>
> Make the frame of the electromagnetic wave shielding adhesive film 1 PET
From the film side, laser processing was performed using IMPACT L500 (trade name, manufactured by Sumitomo Heavy Industries, Ltd.) under the conditions of a voltage of 20 kV, a frequency of 150 Hz, and a scan speed of 200 mm / min. This was removed to obtain an electromagnetic wave shielding adhesive film 2 (the configuration of FIG. 1C).

<Electromagnetic Wave Shielding Adhesive Film Production Example 3>
> PET film with anti-reflection treatment
300; trade name, manufactured by Nippon Yushi Co., Ltd., having a thickness of 50 μm) on the surface which has not been subjected to the antireflection treatment, using the adhesive composition used in Preparation Example 1 of the electromagnetic wave shielding adhesive film so that the dry coating thickness becomes 20 μm. The adhesive film produced by applying the adhesive on the geometrical figure of the electromagnetic wave shielding adhesive film 1 was placed at 180 ° C. so as not to cover the entire frame.
The laminate was heated and laminated under the condition of 30 kgf / cm and bonded to obtain an electromagnetic wave shielding adhesive film 3 (FIG. 1).
(D) Configuration).

<Electromagnetic Wave Shielding Adhesive Film Production Example 4>
> Thickness 2 through a 30 μm-thick adhesive layer to be described later on a 25 μm-thick transparent PET film
An aluminum foil of 5 μm was adhered. This PE with aluminum foil
Using a negative film having a width of 30 mm on the outer periphery of the T film and a photolithography process similar to that of the electromagnetic wave shielding adhesive film production example 1, a line width of 25 mm was used.
An aluminum grid pattern having a line width of 250 μm, a line interval of 250 μm, and a frame portion of 30 mm was formed on a PET film, and the frame portion was folded toward the PET film side to obtain an electromagnetic wave shielding adhesive film 4 (the configuration of FIG. 1E).

<Electromagnetic Wave Shielding Adhesive Film Production Example 5>
> An electroless nickel plating is formed in a grid on a 50 μm-thick PET film using a mask layer, so that a line width is 12 μm, a line interval is 500 μm, and a thickness is 2 μm.
A nickel lattice pattern of the above was formed on a PET film, and a conductive tape (CH
O-FOIL CCH (trade name, manufactured by Taiyo Mesh Co., Ltd.) was pasted at a width of 15 mm to form a frame portion, and an electromagnetic wave shielding adhesive film 5 was obtained (the configuration of FIG. 1 (f)).

<Electromagnetic Wave Shielding Adhesive Film Production Example 6>
> Using a PET film with a copper foil obtained in Preparation Example 1 of an electromagnetic wave shielding adhesive film, using a negative film having only a geometric figure, through a photolithography process similar to that of Preparation Example 1 of an electromagnetic wave shielding adhesive film, and forming a line with a width of 25 μm. A copper grid pattern with a spacing of 250 μm was formed on a PET film, and foamed metal copper (made by Hitachi Chemical Co., Ltd., thickness 5 mm) having a polyurethane foam as a base skeleton was formed on the outer periphery of the surface having a geometrical figure at room temperature and 5 kgf. / Cm ²
The film was pasted to a width of 15 mm to form a frame portion under the pressure described above, and an electromagnetic wave shielding adhesive film 6 was obtained (the configuration of FIG. 1 (g)).

<Adhesive Composition> A 500 cm ³ three-necked flask was charged with 200 cm ³ of toluene, 50 g of methyl methacrylate (MMA), 5 g of ethyl methacrylate (EA), 2 g of acrylamide (AM), and 250 mg of AIBN.
The mixture was stirred at 100 ° C. for 3 hours under reflux while bubbling with nitrogen. The polymer obtained by reprecipitation with methanol was filtered, and then dried under reduced pressure. The yield of the polyacrylate obtained was 75%. This was used as the main component of the adhesive composition. Polyacrylate (MMA / EA / AM = 88/9/3, Mw = 700,000) 100 parts by weight Toluene 450 parts by weight Ethyl acetate 10 parts by weight

<Composition Constituting Infrared Shielding Layer> Byron UR-1400 (trade name, manufactured by Toyobo Co., Ltd .; saturated polyester resin, Mn = 40,000) 100 parts by weight IRG-022 (infrared absorbent: Nippon Kayaku Co., Ltd.) Product name; aminium compound) 1.2 parts by weight MEK 285 parts by weight Cyclohexanone 5 parts by weight

(Example 1) PET after antireflection treatment
Infrared shielding obtained by applying the above-mentioned composition constituting an infrared shielding layer to a film (Realok 1300; trade name of Nippon Oil & Fats Co., Ltd.) not subjected to antireflection treatment so that the dry coating thickness is 10 μm. The surface of the adhesive film having adhesive properties and the surface on which the geometrical figure of the electromagnetic wave shielding adhesive film 2 is drawn are placed on a commercially available acrylic plate (como glass; manufactured by Kuraray Co., Ltd., 3 mm thick) at 110 ° C. for 3 hours.
An electromagnetic wave shielding component obtained by thermocompression bonding using a hot press under the conditions of 0 kgf / cm ² and 30 minutes was used as Example 1 (the configuration of FIG. 2B).

(Example 2) The surface of the electromagnetic wave shielding adhesive film 1 on which the above-mentioned adhesive composition was applied to the PET film side on which the geometrical figure was not drawn so as to have a dry applied thickness of 10 μm, and the antireflection The composition forming the above-mentioned infrared shielding layer was applied to a non-reflection-treated surface of a treated PET film (Realok 1300; trade name, manufactured by NOF CORPORATION) so that the dry coating thickness became 10 μm. Using a roll laminator, the adhesive surface of the adhesive film having infrared shielding properties obtained by using a roll laminator was applied to a commercially available acrylic plate (como glass; trade name, manufactured by Kuraray Co., Ltd., thickness 3 mm).
An electromagnetic wave shielding structure obtained by heating and pressing at 110 ° C. and 20 kgf / cm ² was used as Example 2 (FIG. 2C).
Configuration).

Example 3 An electromagnetic wave shielding component obtained in the same manner as in Example 2 except that the electromagnetic wave shielding adhesive film 5 was used was designated as Example 3 (the configuration of FIG. 2D).

(Example 4) An electromagnetic wave shielding component obtained in the same manner as in Example 2 except that the electromagnetic wave shielding adhesive film 6 was used was designated as Example 4 (the configuration of FIG. 2E).

(Example 5) A film having the frame portion, the side portion of the acrylic plate, and the infrared ray shielding layer of the electromagnetic wave shielding structure obtained in Example 1 formed on a 23 mm-wide conductive tape (CHO)
An electromagnetic wave shielding component obtained by covering in a frame shape with -FOIL CCH (trade name, manufactured by Taiyo Mesh Co., Ltd.) was used as Example 5 (FIG. 3B).

(Example 6) In place of the conductive tape, a foamed metal copper (manufactured by Hitachi Chemical Co., Ltd.) having a base frame of a polyurethane foam having a width of 23 mm and a thickness of 5 mm, which is a three-dimensional network structure, was used in Example 1. The electromagnetic wave shielding structure obtained by covering the frame of the electromagnetic wave shielding structure obtained in the above, the side of the acrylic plate, and the film on which the infrared shielding layer was formed in a frame shape and crimping at room temperature and 5 kgf / cm ² was obtained. 6.

(Embodiment 7) The conductive tape of Embodiment 5 was replaced with
An electromagnetic wave shielding component obtained in the same manner as in Example 5 except that the metal of the frame portion was exposed so as to expose 5 mm was designated as Example 7 (FIG. 3C).

Example 8 The conductive tape of Example 5 was replaced with
An electromagnetic wave shielding structure obtained by sticking so as to cover only the frame part and the side part of the acrylic plate was used as Example 8 (FIG. 3).
(D)).

Example 9 Using the electromagnetic wave shielding structure obtained in Example 2, a film having a frame portion of the electromagnetic wave shielding structure, a side portion of an acrylic plate, and an infrared light shielding layer having a width of 23 m was formed.
An electromagnetic wave shielding structure obtained by covering in a frame shape with m conductive tapes (CHO-FOIL CCH; trade name, manufactured by Taiyo Seimen Co., Ltd.) was used as Example 9 (FIG. 3 (e)).

(Example 10) An electromagnetic wave shielding structure obtained in the same manner as in Example 9 except that the electromagnetic wave shielding adhesive film 3 was used was designated as Example 10 (FIG. 3 (f)).

Example 11 An electromagnetic wave shielding component obtained in the same manner as in Example 5 except that the electromagnetic wave shielding adhesive film 4 was used was used as Example 11 (FIG. 3 (g)).

(Embodiment 12) The line width is changed from 25 μm to 3
An electromagnetic wave shielding component obtained in the same manner as in Example 5 except that the thickness was 5 μm was used as Example 12.

(Embodiment 13) The line width is changed from 25 μm to 1
An electromagnetic wave shielding component having a thickness of 2 μm and obtained in the same manner as in Example 5 was used as Example 13.

Example 14 An electromagnetic wave shielding structure obtained in the same manner as in Example 5 except that the line interval was changed from 250 μm to 500 μm was used as Example 14.

Example 15 An electromagnetic wave shielding structure obtained in the same manner as in Example 5 except that the line interval was changed from 250 μm to 150 μm was used as Example 15.

Example 16 An electromagnetic wave shielding structure obtained in the same manner as in Example 5 except that a regular triangular repetition pattern was produced instead of the lattice pattern formed in Example 2 of producing the electromagnetic wave shielding adhesive film was implemented. Example 16 was used.
Note that the equilateral triangle is as shown in FIG.

Example 17 Electromagnetic wave shielding structure obtained in the same manner as in Example 5 except that a repetitive pattern consisting of regular octagons and squares was prepared instead of the lattice pattern formed in Preparation Example 2 of electromagnetic wave shielding adhesive film. The body was designated as Example 17. Note that the regular octagon and square repetition patterns are as shown in FIG.

(Comparative Example 1) In place of a copper foil, an ITO deposited PET in which an ITO film was entirely deposited at 2,000Å was used.
Without forming a pattern, an adhesive composition having a thickness of 5 μm is applied to a film on the opposite side to the deposition surface, and a commercially available acrylic plate (como glass; manufactured by Kuraray Co., Ltd., 3 mm in thickness)
A conductive tape having a width of 23 mm was formed on the frame part and the side part and the peripheral part of the acrylic plate obtained by heat-pressing using a hot press machine at 110 ° C., 30 kgf / cm ² for 30 minutes. An electromagnetic wave shielding component obtained by covering in a frame shape with CHO-FOIL CCH (trade name of Taiyo Wire Mesh Co., Ltd.) was used as Comparative Example 1.

Comparative Example 2 In the same manner as in Comparative Example 1, an adhesive composition having a thickness of 5 μm was applied to the film on the opposite side of the deposition surface without forming a pattern while aluminum deposition (200 °) was performed on the entire surface instead of ITO. An electromagnetic wave shielding component obtained in the same manner as in Comparative Example 1 was used as Comparative Example 2.

Comparative Example 3 The same procedure as in Example 2 was conducted except that a negative film having only a geometric figure was used for the PET film with copper foil obtained in Preparation Example 1 of the electromagnetic wave shielding adhesive film.
The electromagnetic wave shielding component obtained in the same manner as in Comparative Example 3 was used as Comparative Example 3.

The aperture ratio, electromagnetic wave shielding property, visible light transmittance, invisibility, infrared ray shielding rate, and adhesive strength of the mesh of the electromagnetic wave shielding component obtained as described above were measured. The results are shown in Tables 1 and 2.

The electromagnetic wave shielding properties were measured by using a spectrum analyzer MS2601B and a standard signal generator MG3.
602B, using a measuring cell MA8602B (trade name of Advantest Co., Ltd.) with a frequency range of 10 MHz
The electromagnetic wave shielding property between z to 1 GHz was measured and 100
The values of MHz and 1 GHz are shown as representative values. The visible light transmittance was measured using a double beam spectrophotometer (Hitachi, Ltd., Model 200-10) at 400 to 700 n.
The average value of the transmittance in the region of m was used. The non-visibility is evaluated by observing the electromagnetic wave shielding structure in which the electromagnetic wave shielding adhesive film is attached to the acrylic plate from a place 0.5 m away, and by recognizing the geometric figure formed of the conductive metal. Those that could not be recognized were evaluated as good, and those that could be recognized were evaluated as NG. The measurement of the infrared shielding factor was performed using a double beam spectrophotometer (Hitachi, Ltd., U-3410), and the average value of the infrared shielding factor in the region of 900 to 1,100 nm was used. The adhesive force is measured by a tensile tester (trade name, manufactured by Toyo Baldwin Co., Ltd., Tensilon UTM-4-10).
0), width 10 mm, 90 ° direction, peeling speed 50
It was measured in mm / min.

[0064]

[Table 1]

[0065]

[Table 2]

A geometrical figure drawn with the conductive metal of the present invention has a conductive picture frame electrically connected to the geometrical figure around the geometrical figure drawn with the conductive metal. The example having a better electromagnetic wave shielding property than the comparative example 3 having no frame portion. In the embodiment, FIG.
In Examples 1, 2, 3, and 4 corresponding to the configurations of (b), (c), (d), and (e), respectively, the electromagnetic wave shielding property is 35.
Although it is about 42 dB, Examples 5 to 11 of the configuration shown in FIG. 3 provided with the frame body have the same aperture ratio and visible light transmittance, and the electromagnetic wave shielding property is 42 to 52 dB, which is excellent in the shielding effect. The line width of the geometric figure of Example 12 is 25 μm
When the thickness is reduced to 35 μm from (Example 5), the aperture ratio is reduced from 81% to 74%, and the visible light transmittance is also reduced from 62% to 56%. I do. Similarly, in Example 13, the line width is set to 25.
When the thickness is changed from μm (Example 5) to 12 μm, the aperture ratio is 81%.
To 91%, and the visible light transmittance from 62% to 70%
However, since the area of the conductive metal is reduced, the electromagnetic wave shielding property is reduced. Example 14 has a line spacing of 250
μm (Example 5) to 500 μm,
The aperture ratio and the light transmittance are improved, but the electromagnetic wave shielding performance is reduced. Similarly, in Embodiment 15, the line interval is set to 25.
0 μm (Example 5) to 125 μm,
The aperture ratio and the light transmittance are reduced, and the electromagnetic wave shielding property is improved. As described above, the tendency was shown by changing the line width and the line interval drawn with the conductive metal. However, the geometric figure of the electromagnetic wave shielding adhesive film has a line width of 40 μm or less and a line interval of 100 μm. that's all,
A conductive metal having a line thickness of 40 μm or less showed a preferable value. In Comparative Examples 1 and 2, ITO and Al were deposited, but the electromagnetic wave shielding properties were poor. The present invention has a geometric figure drawn with a conductive metal as shown in FIG.
In addition, by having a conductive frame electrically connected to the geometrical figure on the outer periphery of the geometrical figure drawn with the conductive metal, the electromagnetic wave shielding property is excellent, and as shown in FIG. By covering the frame, the electromagnetic wave shielding property is further improved.

[0067]

As is clear from the examples, the electromagnetic wave shielding adhesive film obtained by the present invention increases the contact area with the external electrode for grounding and improves the connection with the external electrode for grounding. In addition, since it can be easily attached to an adherend and used, and has excellent adhesion, there is no electromagnetic wave leakage, and the shielding function is particularly good over a wide frequency band.
In addition, optical characteristics such as visible light transmittance and invisibility are good, and there is little change in adhesive characteristics at a high temperature over a long period of time, so that an excellent electromagnetic shielding adhesive film can be provided. The frame part according to claim 2 is formed of a conductive metal of a plastic film with a conductive metal, so that the geometrical figure drawn with the conductive metal and the conductive frame located on the outer periphery of the geometrical figure are formed. The contact resistance of the part can be reduced and the electromagnetic wave shielding property is excellent. By exposing at least a part of the conductive frame portion according to the third aspect, it is possible to provide an electromagnetic wave shielding adhesive film that can be grounded from the plastic film surface side, thereby facilitating connection. By using a laser to remove a part or all of the adhesive layer and the plastic film according to claim 4, it is excellent in workability and mass productivity, and the process is simplified since it is a dry process. it can. A part or all of the adhesive layer and the plastic film is sandblasted in order to remove the adhesive layer and the plastic film supporting the conductive frame part according to claim 5 and expose at least a part of the frame part. Since it is formed, it has excellent workability and mass productivity.

By providing a transparent layer via an adhesive layer on at least a part of the geometric figure and at least a part of the picture frame according to the sixth aspect, the geometric figure can be protected.
The conductive metal frame of the plastic film with a conductive metal according to claim 7 is bent on the plastic film side to expose the conductive metal of the frame portion on the plastic film side. The connection with the external electrode can be improved. 9. A contact area with an external electrode for grounding is increased by attaching a conductive tape to the outer periphery of the geometrical figure according to claim 8 to form a frame portion, thereby connecting the external electrode for grounding. Can be improved. 10. A contact area with an external electrode for grounding is increased by forming a conductive three-dimensional network structure on the outer periphery of the geometrical figure according to claim 9 to form a frame portion, thereby forming an external part for grounding. Good connection with the electrodes can be achieved. The width of the frame part according to claim 10 is 1 to 4
By setting the range to 0 mm, good connection with an external electrode for grounding can be achieved.

A geometric pattern formed by a conductive metal of a plastic film with a conductive metal, wherein a conductive metal is provided on the surface of the plastic film according to claim 11 via an adhesive layer, is formed by a microlithographic method. Thereby, an electromagnetic shielding adhesive film excellent in processability can be provided. Since the conductive material according to claim 12 is made of copper and at least the surface thereof is blackened, it is possible to provide an electromagnetic wave shielding adhesive film having low fading and high contrast. By providing the plastic film according to claim 13 as a polyethylene terephthalate film or a polycarbonate film, it is possible to provide an electromagnetic wave shielding adhesive film having transparency, low cost, good heat resistance, excellent electromagnetic wave shielding properties and excellent infrared ray shielding properties. can do. The geometric figure drawn with the conductive metal according to claim 14 has a line width of 40 μm or less and a line interval of 10 μm.
By setting the line thickness to 0 μm or more and the line thickness to 40 μm or less, it is possible to provide an electromagnetic wave shielding adhesive film excellent in transparency and invisibility. An electromagnetic wave shield having excellent workability and adhesion, inexpensive electromagnetic wave shielding properties and invisibility by using copper, aluminum or nickel having a thickness of 0.5 to 40 μm of the conductive metal according to claim 15. An adhesive film can be provided.
An electromagnetic wave shielding adhesive film having infrared shielding properties can be provided by including an infrared absorber in any of the layers constituting the electromagnetic wave shielding adhesive film according to claim 16.

[0070] By providing the electromagnetic wave shielding adhesive film on at least one surface of the plastic plate according to the seventeenth aspect, it is possible to provide an electromagnetic wave shielding structure which is excellent in transparency and invisibility and has little warpage. . Claim 1
A surface on which a conductive geometric figure of the electromagnetic wave shielding adhesive film is drawn is provided on one side of the plastic plate described in 8 above via an adhesive layer on the plastic plate, and the other side is formed on the plastic plate via an adhesive layer. By providing the film, it is possible to provide an electromagnetic wave shielding component excellent in transparency and invisibility and with little warpage. 20. An electromagnetic wave shielding structure in which the electromagnetic wave shielding adhesive film is provided on one surface of the plastic plate according to claim 19, and the conductive frame is deformed so as to be bent, so that the frame reaches the opposite surface of the plastic plate. By providing a body, it is possible to provide an electromagnetic wave shielding component excellent in transparency and invisibility and with little warpage. 21. Good contact with an external electrode for grounding by making the electromagnetic wave shielding structure of the electromagnetic wave shielding structure according to claim 20 a conductive tape adhered to a part of a frame portion of the electromagnetic wave shielding adhesive film. Therefore, it is possible to provide an electromagnetic wave shielding structure having reduced electromagnetic wave leakage, simple installation, and excellent appearance. An electromagnetic wave shielding structure in which a conductive three-dimensional mesh structure is in contact with at least a frame of the electromagnetic wave shielding adhesive film of the electromagnetic wave shielding structure according to claim 21, so that the electromagnetic wave shielding structure can be connected to an external electrode for grounding. It is possible to provide an electromagnetic wave shielding component having a reduced electromagnetic wave leakage due to good contact, a simple mounting, and an excellent appearance. An electromagnetic wave shielding structure comprising the electromagnetic wave shielding adhesive film, the plastic plate, the plastic film, or the adhesive layer, which comprises the infrared absorbing agent, at least in any one of the electromagnetic wave shielding structures according to claim 22. It is possible to provide an electromagnetic wave shielding component having a property of shielding infrared rays.
24. An electromagnetic wave shielding structure comprising an electromagnetic wave shielding structure in which an anti-glare treatment or an anti-reflection treatment is applied to the plastic film of the electromagnetic wave shielding adhesive film provided on the plastic plate according to claim 23 or the surface of the plastic plate or the plastic film. An antiglare property or an antireflection property can be imparted to the structure. An electromagnetic wave shielding structure in which a frame is provided so as to be in contact with a frame around the electromagnetic wave shielding structure according to claim 24, thereby preventing leakage of electromagnetic waves, improving electromagnetic wave shielding properties, and improving appearance. An electromagnetic wave shielding structure can be provided.

[0071] By using the electromagnetic wave shielding adhesive film according to claim 25 for a display, it has electromagnetic wave shielding and transparency, reduces electromagnetic wave leakage, is excellent in infrared shielding, and has an external electrode for grounding. And a display that can be connected well.
By using the electromagnetic wave shielding structure according to claim 26 for a display, it has electromagnetic wave shielding properties and transparency,
It is possible to provide a display that reduces leakage of electromagnetic waves, has excellent infrared shielding properties, and can be favorably connected to an external electrode for grounding. Since the electromagnetic wave shielding adhesive film and the electromagnetic wave shielding structure of the present invention are excellent in electromagnetic wave shielding properties and transparency, in addition to a display, a measuring device, a measuring device, and a manufacturing device for generating or protecting from electromagnetic waves It can be used by providing it in windows and housings, especially windows such as windows where transparency is required.

[Brief description of the drawings]

FIG. 1 shows an electromagnetic wave shielding adhesive film of the present invention, wherein (a) is a front view of the electromagnetic wave shielding adhesive film, and (b) to (g) are cross-sectional views.

FIG. 2 shows an electromagnetic wave shielding structure of the present invention, wherein (a) is a perspective view, and (b) to (e) are cross-sectional views.

3A and 3B show an electromagnetic wave shielding structure of the present invention, wherein FIG. 3A is a perspective view, and FIGS. 3B to 3G are sectional views.

FIGS. 4A and 4B are explanatory diagrams of a geometric figure drawn by a conductive metal of the present invention.

[Explanation of Codes] 1. conductive frame 2. Geometric figures drawn with conductive metal Plastic film4. Adhesive layer 5. Transparent layer 6. Conductive material 7. 7. Conductive three-dimensional network structure Electromagnetic wave shielding adhesive film 10. Electromagnetic wave shielding structure 11. Plastic plate 12. Adhesive layer 13. Plastic film 21. Frame

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Aya Hiba Inventor 1500 Ogawa, Oaza, Shimodate-shi, Ibaraki Pref.

Claims (26)

[Claims] 1. A plastic film with a conductive metal formed on a plastic film via an adhesive layer, wherein the plastic film has a geometric figure drawn with a conductive metal, and
An electromagnetic wave shielding adhesive film having a conductive picture frame electrically connected to the geometrical figure around the geometrical figure drawn with a conductive metal. 2. A conductive frame which is electrically connected to a geometrical figure drawn with a conductive metal is formed of a conductive metal of a plastic film with a conductive metal. The electromagnetic wave shielding adhesive film according to 1. 3. The conductive frame according to claim 1, wherein at least a part of the conductive frame electrically connected to the geometrical figure drawn by the conductive metal is exposed. Electromagnetic wave shielding adhesive film. 4. The method according to claim 1, wherein the adhesive layer and the plastic film supporting the conductive frame portion are removed by a laser to expose at least a part of the frame portion.
The electromagnetic wave shielding adhesive film according to claim 3. 5. The method according to claim 1, wherein the adhesive layer and the plastic film supporting the conductive frame portion are removed by sandblasting to expose at least a part of the frame portion. The electromagnetic wave shielding adhesive film according to 1. 6. A conductive picture frame which is electrically connected to a geometric figure drawn with a conductive metal is formed of a conductive metal of a plastic film with a conductive metal, and the geometric figure portion and the frame portion are formed. The electromagnetic wave shielding adhesive film according to any one of claims 1 to 5, wherein a transparent layer is provided on a part thereof with an adhesive layer interposed therebetween. 7. A conductive picture frame electrically connected to a geometric figure drawn with a conductive metal is formed of a conductive metal of a plastic film with a conductive metal, and the picture frame is bent toward the plastic film. 3. The electromagnetic wave shielding adhesive film according to claim 1, wherein the conductive metal of the frame portion is exposed on the plastic film side. 8. The electromagnetic wave shielding adhesive according to claim 1, wherein the conductive frame electrically connected to the geometrical figure drawn by the conductive metal is a conductive tape formed on the outer periphery of the geometrical figure. the film. 9. The conductive three-dimensional network structure according to claim 1, wherein the conductive frame electrically connected to the geometrical figure drawn with the conductive metal is formed on the outer periphery of the geometrical figure. Electromagnetic wave shielding adhesive film. 10. A conductive frame electrically connected to a geometric figure drawn by a conductive metal has a width of 1 to 40 m.
The electromagnetic wave shielding adhesive film according to any one of claims 1 to 9, wherein m is m. 11. The electromagnetic wave shielding adhesive film according to claim 1, wherein a geometrical figure drawn by a conductive metal is formed by a microlithography method. 12. The method according to claim 1, wherein the conductive metal is copper, and at least its surface is blackened.
An electromagnetic wave shielding adhesive film according to any one of claims 11 to 11. 13. The electromagnetic wave shielding adhesive film according to claim 1, wherein the plastic film of the plastic film with a conductive metal is a polyethylene terephthalate film or a polycarbonate film. 14. A geometric figure drawn with a conductive metal has a line width of 40 μm or less, a line interval of 100 μm or more,
The electromagnetic wave shielding adhesive film according to any one of claims 1 to 13, wherein the line thickness is 40 µm or less. 15. The electromagnetic wave shielding adhesive film according to claim 1, wherein the conductive metal of the plastic film with a conductive metal is copper, aluminum or nickel having a thickness of 0.5 to 40 μm. . 16. The electromagnetic wave shielding adhesive film according to claim 1, wherein one of the layers constituting the electromagnetic wave shielding adhesive film contains an infrared absorbing agent. 17. An electromagnetic wave shielding structure comprising a plastic plate provided with the electromagnetic wave shielding adhesive film according to claim 1 on at least one surface thereof. 18. An electromagnetic wave shielding structure comprising a plastic plate provided with the electromagnetic wave shielding adhesive film according to claim 1 on one surface and a plastic film provided on the other surface. 19. An electromagnetic wave shielding adhesive film according to claim 1, which is provided on one surface of a plastic plate, and whose conductive frame reaches the opposite surface of the plastic plate. An electromagnetic wave shielding structure characterized by the following. 20. An electromagnetic wave shielding structure according to claim 17 or 18, wherein a conductive tape is attached to a part of a conductive frame of the electromagnetic wave shielding adhesive film of the electromagnetic wave shielding structure. 21. An electromagnetic wave shielding structure in which a conductive three-dimensional network structure is in contact with at least a frame portion of the electromagnetic wave shielding adhesive film of the electromagnetic wave shielding structure according to claim 17 or 18. 22. An electromagnetic wave shielding component comprising an electromagnetic wave shielding adhesive film, a plastic plate, a plastic film or an adhesive layer containing at least any one of an infrared absorbing agent. The electromagnetic wave shielding structure according to any one of the above. 23. An anti-glare treatment or an anti-reflection treatment is applied to the plastic film of the electromagnetic wave shielding adhesive film provided on the plastic plate or the surface of the plastic plate or the plastic film. 23. The electromagnetic wave shielding structure according to any one of 22. 24. An electromagnetic wave shielding structure, wherein a frame is provided around the periphery of the electromagnetic wave shielding structure according to claim 17 so as to be in contact with a frame portion. 25. A display using the electromagnetic wave shielding adhesive film according to any one of claims 1 to 16. 26. A display using the electromagnetic wave shielding structure according to claim 17. Description: