JPH11226918A - Wood board and its manufacturing method - Google Patents
Wood board and its manufacturing methodInfo
- Publication number
- JPH11226918A JPH11226918A JP3146298A JP3146298A JPH11226918A JP H11226918 A JPH11226918 A JP H11226918A JP 3146298 A JP3146298 A JP 3146298A JP 3146298 A JP3146298 A JP 3146298A JP H11226918 A JPH11226918 A JP H11226918A
- Authority
- JP
- Japan
- Prior art keywords
- board
- acid amide
- wood
- water
- fatty acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002023 wood Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000005871 repellent Substances 0.000 claims abstract description 24
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 21
- 229930195729 fatty acid Natural products 0.000 claims abstract description 21
- 239000000194 fatty acid Substances 0.000 claims abstract description 21
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 239000012188 paraffin wax Substances 0.000 claims abstract description 15
- 230000002940 repellent Effects 0.000 claims abstract description 15
- 238000007731 hot pressing Methods 0.000 claims abstract description 11
- ZJOLCKGSXLIVAA-UHFFFAOYSA-N ethene;octadecanamide Chemical compound C=C.CCCCCCCCCCCCCCCCCC(N)=O.CCCCCCCCCCCCCCCCCC(N)=O ZJOLCKGSXLIVAA-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000839 emulsion Substances 0.000 claims description 12
- 239000004200 microcrystalline wax Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims 1
- 239000000835 fiber Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 239000002245 particle Substances 0.000 abstract description 5
- 239000011094 fiberboard Substances 0.000 abstract description 4
- 239000011859 microparticle Substances 0.000 abstract 1
- 239000001993 wax Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- 150000001408 amides Chemical class 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000011056 performance test Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OXDXXMDEEFOVHR-CLFAGFIQSA-N (z)-n-[2-[[(z)-octadec-9-enoyl]amino]ethyl]octadec-9-enamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)NCCNC(=O)CCCCCCC\C=C/CCCCCCCC OXDXXMDEEFOVHR-CLFAGFIQSA-N 0.000 description 1
- QRIKMBDKRJXWBV-CLFAGFIQSA-N (z)-n-[6-[[(z)-octadec-9-enoyl]amino]hexyl]octadec-9-enamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)NCCCCCCNC(=O)CCCCCCC\C=C/CCCCCCCC QRIKMBDKRJXWBV-CLFAGFIQSA-N 0.000 description 1
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- LDGZSKOAALVKLH-UHFFFAOYSA-N ethene octadecanoic acid Chemical compound C=C.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O LDGZSKOAALVKLH-UHFFFAOYSA-N 0.000 description 1
- HANVTCGOAROXMV-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine;urea Chemical compound O=C.NC(N)=O.NC1=NC(N)=NC(N)=N1 HANVTCGOAROXMV-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- QIJSQGXDFAYEAF-UHFFFAOYSA-N n,n'-dioctadecylhexanediamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCC(=O)NCCCCCCCCCCCCCCCCCC QIJSQGXDFAYEAF-UHFFFAOYSA-N 0.000 description 1
- ZZJXLPCLJWLLIZ-UHFFFAOYSA-N n-[(dodecanoylamino)methyl]dodecanamide Chemical compound CCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCC ZZJXLPCLJWLLIZ-UHFFFAOYSA-N 0.000 description 1
- WNCFYFLYHFIWIL-UHFFFAOYSA-N n-[2-(docosanoylamino)ethyl]docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCCCCCC WNCFYFLYHFIWIL-UHFFFAOYSA-N 0.000 description 1
- HETBCUMLBCUVKC-UHFFFAOYSA-N n-[2-(dodecanoylamino)ethyl]dodecanamide Chemical compound CCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCC HETBCUMLBCUVKC-UHFFFAOYSA-N 0.000 description 1
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 1
- LCZJLVYYBRTSAQ-UHFFFAOYSA-N n-[4-(octadecanoylamino)butyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCCCNC(=O)CCCCCCCCCCCCCCCCC LCZJLVYYBRTSAQ-UHFFFAOYSA-N 0.000 description 1
- OSJJOWRIYDWQPO-UHFFFAOYSA-N n-[[2-[(octadecanoylamino)methyl]phenyl]methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCC1=CC=CC=C1CNC(=O)CCCCCCCCCCCCCCCCC OSJJOWRIYDWQPO-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
(57)【要約】
【課題】 高温水に対して高い撥水効果を有する木質ボ
ード及びその製造方法を得る。
【解決手段】 パーティクルボード（ＰＢ）、中密度繊
維板（ＭＤＦ）、配向性ストランドボード（ＯＳＢ）、
ウエハーボード（ＷＢ）などのように、木材チップやフ
ァイバー、ストランド片のような木削片を接着剤と共に
熱圧成形して木質ボードを製造するに際して、撥水剤と
して、パラフィンワックス及び／又はマイクロワックス
に代えて、あるいはそれらと共に、脂肪酸アミド（好ま
しくは、エチレンビスステアリン酸アミド）を接着剤と
共に用いる。(57) Abstract: A wooden board having a high water-repellent effect against high-temperature water and a method for producing the same are provided. SOLUTION: Particle board (PB), medium density fiber board (MDF), oriented strand board (OSB),
When a wood board such as a wafer board (WB) is manufactured by hot-pressing wood chips such as wood chips, fibers, and strand pieces together with an adhesive to produce a wood board, paraffin wax and / or microparticles are used as water repellents. A fatty acid amide (preferably ethylene bisstearic acid amide) is used in place of or in conjunction with the wax, together with the adhesive.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高温水に対して高
い撥水効果を有する木質ボード及びその製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wooden board having a high water-repellent effect against high-temperature water and a method for producing the same.
【０００２】[0002]
【従来の技術】パーティクルボード（ＰＢ）、中密度繊
維板（ＭＤＦ）、配向性ストランドボード（ＯＳＢ）、
ウエハーボード（ＷＢ）などのように、木材チップやフ
ァイバー、ストランド片のような木削片を接着剤と共に
熱圧成形した木質ボードはひろく知られている。製造に
際して、製造される木質ボードの吸湿による変形を防止
する、すなわち、撥水性を付与するために、パラフィン
ワックスやマイクロワックスなどの撥水剤を、溶融状態
でそれら木削片に塗布したり、エマルジョンの状態で接
着剤に混入して木削片に塗布したりした後に、熱圧成形
することが行われる。得られた木質ボードの撥水性は塗
布する撥水剤の質や量に左右されるが、木削片の絶乾重
量ベースに対して、０．５〜２％程度の塗布量でもっ
て、実用上支障ない程度の撥水性は確保される。2. Description of the Related Art Particle board (PB), medium density fiber board (MDF), oriented strand board (OSB),
2. Description of the Related Art Wood boards, such as wafer boards (WB), obtained by hot-pressing wood chips such as wood chips, fibers, and strand pieces together with an adhesive are widely known. At the time of manufacture, to prevent deformation of the manufactured wooden board due to moisture absorption, that is, in order to impart water repellency, a water repellent such as paraffin wax or microwax is applied to the wood chips in a molten state, After being mixed with an adhesive in the state of an emulsion and applied to wood chips, hot pressing is performed. The water repellency of the obtained wood board depends on the quality and quantity of the water repellent to be applied, but it is practically used at a coating amount of about 0.5 to 2% based on the absolute dry weight of wood chips. Water repellency to the extent that it does not hinder is secured.
【０００３】[0003]
【発明が解決しようとする課題】近年、木質ボードの使
用範囲が拡大しており、例えば、厨房室等の床や壁の材
料や床暖房としての使用のように、通常の住環境での温
度範囲（０℃〜４０℃程度）を越えた高い温度環境の下
で使用される場合が起こってきている。本発明者らの実
験では、従来の撥水処理が施された木質ボードでは、木
質ボードの表面に接する水の温度が６０℃〜７０℃程度
の高温なると撥水効果が急激に低下して、吸水により大
きな寸法変化が起こることを経験した。その理由は、従
来撥水剤として使用されているパラフィンワックスやマ
イクロワックスは、融点が４０℃〜６０℃であり、それ
以上の高温水に接するとパラフィンワックスやマイクロ
ワックスが溶融してしまうためと推測される。本発明の
目的は、例えば６０℃以上のような高温水に長時間接し
ていても、高い撥水効果を維持することのできる木質ボ
ードとその製造方法を提供することにある。In recent years, the range of use of wooden boards has been expanded. For example, the temperature range of ordinary living environments such as the use of floor and wall materials in kitchen rooms and the like and floor heating is used. There is a case where it is used in a high temperature environment exceeding (about 0 ° C. to 40 ° C.). In the experiments of the present inventors, in a conventional wooden board subjected to a water-repellent treatment, when the temperature of water in contact with the surface of the wooden board becomes as high as about 60 ° C. to 70 ° C., the water-repellent effect rapidly decreases, Experienced large dimensional changes due to water absorption. The reason is that the melting point of paraffin wax or microwax conventionally used as a water repellent is 40 ° C to 60 ° C, and paraffin wax or microwax is melted when exposed to high-temperature water higher than that. Guessed. An object of the present invention is to provide a wooden board capable of maintaining a high water-repellent effect even when exposed to high-temperature water such as 60 ° C. or more for a long time, and a method for manufacturing the same.
【０００４】[0004]
【課題を解決するための手段】上記の課題を解決すべ
く、本発明者らは多くの実験を行うことにより、撥水剤
としてパラフィンワックスやマイクロワックスに代えて
脂肪酸アミドを用いる場合に、従来の製造方法と同様に
して製造された木質ボードは、低温水のみならず７０℃
程度の高温水に対しても十分な撥水性を示し、かつ、そ
れが維持されることを知った。In order to solve the above-mentioned problems, the present inventors have carried out a number of experiments to find that when a fatty acid amide is used instead of paraffin wax or microwax as a water repellent, Wood board manufactured in the same manner as in
It showed sufficient water repellency even with moderately high temperature water, and was found to be maintained.
【０００５】本発明は上記知見に基づくものであり、本
発明による木質ボードは、木削片に撥水剤として少なく
とも高融点の脂肪酸アミドを塗布したものを熱圧成形し
て得られたものであることを特徴とする。また、本発明
による木質ボードの製造方法は、木削片に撥水剤として
少なくとも脂肪酸アミドのエマルジョンを混入した接着
剤を塗布した後、熱圧成形することを特徴とする。[0005] The present invention is based on the above findings, and a wooden board according to the present invention is obtained by hot pressing a wood chip obtained by applying at least a high-melting fatty acid amide as a water-repellent agent. There is a feature. Further, the method for producing a wooden board according to the present invention is characterized in that a wood chip is coated with an adhesive containing at least an emulsion of a fatty acid amide as a water repellent, and then subjected to hot pressing.
【０００６】本発明において、「木質ボード」の言葉
は、パーティクルボード（ＰＢ）、中密度繊維板（ＭＤ
Ｆ）、配向性ストランドボード（ＯＳＢ）、ウエハーボ
ード（ＷＢ）などのように、木材チップやファイバー、
ストランド片のような木削片を接着剤と共に熱圧成形し
て作った木質ボードの全体をさすものとして用いてお
り、特に制限はない。また、「木削片」の言葉は、前記
「木質ボード」の原材料となる木材チップ、ファイバ
ー、ストランド片などのすべてのものを含むものとして
用いており、特に制限はない。In the present invention, the term "wood board" refers to particle board (PB), medium density fiberboard (MD)
F), wood chips and fibers, such as oriented strand board (OSB) and wafer board (WB).
It is used as an entirety of a wooden board made by hot-pressing wood chips such as strand pieces together with an adhesive, and is not particularly limited. Further, the term "wood shavings" is used to include all of wood chips, fibers, strand pieces, and the like as raw materials of the "wood board", and there is no particular limitation.
【０００７】本発明において、「脂肪酸アミド」は脂肪
酸から誘導される酸アミドであり、脂肪酸アミドおよび
Ｎ−置換脂肪酸アミドである。そのなかでも、Ｎ，Ｎ’
−エチレンビスラウリン酸アミド、Ｎ，Ｎ’−メチレン
ビスラウリン酸アミド、Ｎ，Ｎ’−エチレンビスステア
リン酸アミド、Ｎ，Ｎ’−エチレンビスオレイン酸アミ
ド、Ｎ，Ｎ’−エチレンビスベヘン酸アミド、Ｎ，Ｎ’
−エチレンビス−１２−ヒドロキシステアリン酸アミ
ド、Ｎ，Ｎ’−ブチレンビスステアリン酸アミド、Ｎ，
Ｎ’−ヘキサメチレンビスステアリン酸アミド、Ｎ，
Ｎ’−ヘキサメチレンビスオレイン酸アミド、Ｎ，Ｎ’
−キシリレンビスステアリン酸アミド、Ｎ，Ｎ’−ジス
テアリルアジピン酸アミド、Ｎ，Ｎ’−ジステアリルセ
バシン酸アミド、Ｎ，Ｎ’−ジステアリルテレフタル酸
アミド、Ｎ，Ｎ’−ジステアリルイソフタル酸アミドな
どは、融点が約１２０℃以上と高く、撥水効果も十分で
あることから、特に望ましい。In the present invention, "fatty acid amide" is an acid amide derived from a fatty acid, and is a fatty acid amide and an N-substituted fatty acid amide. Among them, N, N '
-Ethylenebislauric amide, N, N'-methylenebislauric amide, N, N'-ethylenebisstearic amide, N, N'-ethylenebisoleic amide, N, N'-ethylenebisbehenic amide , N, N '
-Ethylenebis-12-hydroxystearic acid amide, N, N'-butylenebisstearic acid amide,
N′-hexamethylenebisstearic acid amide, N,
N'-hexamethylenebisoleic amide, N, N '
-Xylylenebisstearic acid amide, N, N'-distearyladipamide, N, N'-distearylsebacic acid amide, N, N'-distearylterephthalic acid amide, N, N'-distearylisophthalic acid Amides and the like are particularly desirable because they have a high melting point of about 120 ° C. or more and have a sufficient water repellent effect.
【０００８】木質ボードの製造に当たって、脂肪酸アミ
ドは、従来法でのパラフィンワックスやマイクロワック
スと同様にして用いられる。すなわち、リファイナーや
リファイブレーター、削片機等を作動させて調製された
木削片に対して、エマルジョン化した脂肪酸アミドを接
着剤に混入し、それを接着剤塗布機で塗布してもよく、
溶融状態とした脂肪酸アミドをスプレー等の手法により
直接木削片に塗布してもよい。後者の場合には、別装置
の接着剤塗布機によって接着剤が塗布される。実験によ
れば、脂肪酸アミドの塗布量は木削片の絶乾重量ベース
に対して、好ましくは０．２〜２．０％程度、より好ま
しくは０．５〜１．０％である。０．２％より少ないと
所望の撥水効果は期待できず、２．０％より多いと接着
不良による木質ボードの剥離強さ・曲げ強さが低下す
る。脂肪酸アミドが塗布された木削片は、以下、従来の
木質ボードの場合と同様にして熱圧成形に付され、所望
の木質ボードとされる。In the production of wood boards, fatty acid amides are used in the same manner as paraffin wax and micro wax in the conventional method. That is, for a wood chip prepared by operating a refiner, a refiner, a chipper, etc., the emulsified fatty acid amide may be mixed into an adhesive, and the resulting mixture may be applied by an adhesive coater. ,
The fatty acid amide in a molten state may be directly applied to wood chips by a method such as spraying. In the latter case, the adhesive is applied by an adhesive applying machine of another device. According to experiments, the amount of fatty acid amide to be applied is preferably about 0.2 to 2.0%, more preferably 0.5 to 1.0%, based on the absolute dry weight of wood chips. If it is less than 0.2%, a desired water repellent effect cannot be expected, and if it is more than 2.0%, the peel strength and bending strength of the wooden board due to poor adhesion decrease. The wood chip to which the fatty acid amide has been applied is then subjected to hot pressing in the same manner as in the case of a conventional wood board to obtain a desired wood board.
【０００９】本発明において、撥水剤として、脂肪酸ア
ミド単独でなく、脂肪酸アミドとパラフィンワックスや
マイクロワックスとを併用したものを用いることもでき
る。この場合には、脂肪酸アミド単独で添加したときよ
りも４０℃未満の温水の撥水効果が向上するようなメリ
ットがもたらされる。併用する場合での脂肪酸アミドの
塗布量は０．０５〜１．９５％である。上記のようにし
て得られる木質ボードは、４０℃以上の高温水に対して
も高い撥水効果が得られ、床暖房や厨房室等高温水に触
れる場所での使用に有効な材料となる。In the present invention, as the water repellent, not only fatty acid amide alone but also a combination of fatty acid amide and paraffin wax or microwax can be used. In this case, there is an advantage that the water-repellent effect of warm water of less than 40 ° C. is improved as compared with the case where the fatty acid amide is added alone. The amount of the fatty acid amide to be applied when used in combination is 0.05 to 1.95%. The wood board obtained as described above has a high water-repellent effect even with high-temperature water of 40 ° C. or higher, and is an effective material for use in places where high-temperature water is exposed, such as floor heating and kitchen rooms.
【００１０】[0010]
【実施例】以下、本発明を実施例及び比較例により説明
する。 〔比較例１〕常法により、撥水剤として融点が５６℃で
あるパラフィンワックスエマルジョンを尿素・メラミン
ホルムアルデヒド接着剤に混ぜ合わせたものを用い、次
の条件で熱圧成形して、厚さ１５ｍｍのＰＢ（パーティ
クルボード）を製造した。 チップ：ラワン系木材チップをフレーカーにかけて粉砕
した。 ボード構成：３層構造とし、表層厚／内層厚＝１／２と
した。 ボード密度：０．７ｇ／ｃｍ3 熱圧プレス条件：１５０℃、２７ｋｇｆ／ｃｍ2 で５分
間とした。 接着剤塗布量：チップ絶乾重量の表層で１２％、内層で
８％とした。 パラフィンワックス塗布量：チップ絶乾重量の表層で１
％、内層で１％とした。The present invention will be described below with reference to examples and comparative examples. [Comparative Example 1] A mixture prepared by mixing a paraffin wax emulsion having a melting point of 56 ° C with a urea-melamine formaldehyde adhesive as a water repellent by a conventional method under the following conditions and hot-pressing to a thickness of 15 mm (Particle board) was manufactured. Chips: Rawan wood chips were crushed by a flaker. Board configuration: Three-layer structure, surface layer thickness / inner layer thickness = 1/2. Board density: 0.7 g / cm 3 Hot press conditions: 150 ° C., 27 kgf / cm 2 for 5 minutes. Adhesive coating amount: 12% for the surface layer and 8% for the inner layer of the chip dry weight. Amount of paraffin wax applied: 1 at the surface of the chip dry weight
%, And 1% for the inner layer.
【００１１】〔実施例１〕比較例１と同様の製法により
厚さ１５ｍｍのＰＢ（パーティクルボード）を得た。但
し、使用する撥水剤として、パラフィンワックスエマル
ジョンに代えて、エチレンビスステアリン酸アミドのエ
マルジョンを使用し、その添加量を〜のようにし
た。 表層、内層ともに、チップ絶乾重量の０．５％ 表層、内層ともに、チップ絶乾重量の１．０％ 表層、内層ともに、チップ絶乾重量のパラフィンワッ
クスエマルジョン０．５％、エチレンビスステアリン酸
アミドエマルジョン０．５％Example 1 A PB (particle board) having a thickness of 15 mm was obtained in the same manner as in Comparative Example 1. However, instead of the paraffin wax emulsion, an ethylene bisstearic acid amide emulsion was used as the water repellent, and the amount of addition was as follows. 0.5% of the absolute dry weight of the chips in both the surface layer and the inner layer 1.0% of the absolute dry weight of the chips in both the surface layer and the inner layer 0.5% of the paraffin wax emulsion of the absolute weight of the chips in both the surface layer and the inner layer, ethylene bisstearic acid Amide emulsion 0.5%
【００１２】〔試験〕比較例１及び実施例１〜１に
ついて、次の性能試験を行った。その結果を表１に示し
た。 性能試験（１）：５×５ｃｍの試験片を７０℃の温水に
浸漬し、気乾時の厚さと浸漬後の厚さから、膨潤率を５
分後、６０分後、１２０分後に測定し、厚さ変化をみ
た。なお、厚さ膨張率は（Ｔ1 −Ｔ0 ）／Ｔ0 ×１００
であり、ここで、Ｔ0 ＝気乾時の厚さ、Ｔ1 ＝浸漬後の
厚さを示す。 性能試験（２）：５×２０ｃｍの試験片を８０℃の温水
が入ったビーカーに入れ、５分後、６０分後、１２０分
後の吸い上げ高さ、すなわち、試験片表面での水面から
水の吸い上げ端までの距離（ｍｍ）を測定した。[Test] The following performance tests were performed on Comparative Example 1 and Examples 1 to 1. The results are shown in Table 1. Performance test (1): A test piece of 5 × 5 cm was immersed in warm water at 70 ° C., and the swelling ratio was 5 based on the thickness when air-dried and the thickness after immersion.
After 60 minutes, after 120 minutes, the thickness was measured, and the change in thickness was observed. The thickness expansion coefficient is (T 1 −T 0 ) / T 0 × 100.
Where T 0 = thickness when air-dried and T 1 = thickness after immersion. Performance test (2): A test piece of 5 × 20 cm was placed in a beaker containing warm water of 80 ° C., and after 5 minutes, 60 minutes, and 120 minutes, the suction height, that is, water from the water surface on the surface of the test piece The distance (mm) to the suction end was measured.
【００１３】[0013]
【表１】 [Table 1]
【００１４】〔比較例２〕常法により融点５６℃のパラ
フィンワックスを溶融状態で塗布したファイバーを用い
て、常法により尿素・メラミン共重合樹脂接着剤を塗布
し、次の条件で熱圧成形して、厚さ２．７ｍｍのＭＤＦ
（中密度繊維板）を製造した。ファイバー：杉チップを
１７０℃で蒸煮した後、リファイナーでリファイニング
した。 ボード構成：単層構造とした。 ボード密度：０．８ｇ／ｃｍ3 熱圧プレス条件：１８０℃、３０ｋｇｆ／ｃｍ2 で１分
間とした。 接着剤塗布量：ファイバー絶乾重量の１５％（固形分換
算）とした。 パラフィンワックス塗布量：チップ絶乾重量の１％（固
形分換算）とした。Comparative Example 2 Using a fiber coated with paraffin wax having a melting point of 56 ° C. in a molten state by a conventional method, a urea-melamine copolymer resin adhesive was applied by a conventional method, and hot-pressed under the following conditions. And 2.7mm thick MDF
(Medium density fiberboard). Fiber: Cedar chips were steamed at 170 ° C. and then refined with a refiner. Board configuration: Single layer structure. Board density: 0.8 g / cm 3 Hot pressing conditions: 180 ° C., 30 kgf / cm 2 for 1 minute. Adhesive application amount: 15% (in terms of solid content) of the fiber absolute dry weight. Paraffin wax coating amount: 1% of the absolute dry weight of chips (in terms of solid content).
【００１５】〔実施例２〕比較例２と同様の製法により
厚さ２．７ｍｍのＭＤＦを得た。但し、使用する撥水剤
として、実施例１と同様のエチレンビスステアリン酸ア
ミドのエマルジョンを使用し、それを接着剤に混入し
た。添加量を〜のようにした。 ファイバー絶乾重量の０．５％ ファイバー絶乾重量の１．０％ ファイバーチップ絶乾重量のパラフィンワックスエマ
ルジョン０．５％、エチレンビスステアリン酸アミドエ
マルジョン０．５％ 〔試験〕比較例２及び実施例２〜２について、実施
例１及び比較例１と同じ性能試験を行った。その結果を
表１に示した。Example 2 An MDF having a thickness of 2.7 mm was obtained in the same manner as in Comparative Example 2. However, the same ethylene bisstearic acid emulsion as in Example 1 was used as the water repellent to be used, and the emulsion was mixed with the adhesive. The amount of addition was as follows. 0.5% of fiber absolute dry weight 1.0% of fiber absolute dry weight Fiber chip absolute dry weight of 0.5% paraffin wax emulsion, ethylene bisstearic acid amide emulsion 0.5% [Test] Comparative Example 2 and practice For Examples 2 and 2, the same performance tests as in Example 1 and Comparative Example 1 were performed. The results are shown in Table 1.
【００１６】[0016]
【表２】 [Table 2]
【００１７】〔考察〕表１及び表２に示すように、本実
施例品は、比較例品（従来法により製造したＰＢ又はＭ
ＤＦ）と比較して、高温水（例えば、６０℃以上）に接
した場合に厚さ膨潤率及び吸い上げ高さが大きく低減し
ており、本発明品は高温水に対して高い撥水効果を有す
ることがわかる。[Consideration] As shown in Tables 1 and 2, the product of this example is a comparative product (PB or M produced by a conventional method).
DF), the thickness swelling ratio and the suction height are greatly reduced when exposed to high-temperature water (for example, 60 ° C. or higher). It can be seen that it has.
【００１８】[0018]
【発明の効果】本発明により、例えば、６０℃以上のよ
うな高温水に接した場合でも、吸水による膨潤を起こす
ことのない、高い撥水効果を有する木質ボードが得られ
る。According to the present invention, a wood board having a high water-repellent effect which does not cause swelling due to water absorption even when exposed to high temperature water such as 60 ° C. or higher can be obtained.
Claims (4)
の脂肪酸アミドを塗布したものを熱圧成形して得られた
木質ボード。1. A wood board obtained by applying a high pressure melting fatty acid amide as a water repellent to a wood chip and applying a hot-press molding.
えさらにパラフィンワックス及び／又はマイクロワック
スを塗布したものを熱圧成形して得られた請求項１記載
の木質ボード。2. The wood board according to claim 1, which is obtained by subjecting wood chips to a coating of paraffin wax and / or micro wax in addition to a fatty acid amide as a water repellent, by hot pressing.
酸アミドである請求項１又は２記載の木質ボード。3. The wood board according to claim 1, wherein the fatty acid amide is ethylene bisstearic acid amide.
アミドのエマルジョンを混入した接着剤を塗布した後、
熱圧成形することを特徴とする木質ボードの製造方法。4. After applying an adhesive mixed with at least a fatty acid amide emulsion as a water repellent to the wood chip,
A method for producing a wooden board, comprising hot-pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3146298A JPH11226918A (en) | 1998-02-13 | 1998-02-13 | Wood board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3146298A JPH11226918A (en) | 1998-02-13 | 1998-02-13 | Wood board and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11226918A true JPH11226918A (en) | 1999-08-24 |
Family
ID=12331937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3146298A Pending JPH11226918A (en) | 1998-02-13 | 1998-02-13 | Wood board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11226918A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000072145A (en) * | 2000-08-05 | 2000-12-05 | 이종석 | Synthetic resin reinforced board manufacturing method |
| WO2002068558A1 (en) * | 2001-02-22 | 2002-09-06 | Shin-Etsu Chemical Co., Ltd. | Water-based water repellant for treatment of substrates |
| KR100603126B1 (en) | 2004-06-22 | 2006-07-20 | 주식회사 엘지화학 | Particleboard coated with a novel waterproofing composition |
| JP2006517601A (en) * | 2003-01-21 | 2006-07-27 | エクソンモービル リサーチ アンド エンジニアリング カンパニー | Wax compositions for building board applications |
| JP2012045789A (en) * | 2010-08-25 | 2012-03-08 | Panasonic Electric Works Co Ltd | Method of manufacturing ligneous decorative plate |
| CN102825643A (en) * | 2011-06-13 | 2012-12-19 | 承泰丰木业有限公司 | Waterproof dense board |
-
1998
- 1998-02-13 JP JP3146298A patent/JPH11226918A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000072145A (en) * | 2000-08-05 | 2000-12-05 | 이종석 | Synthetic resin reinforced board manufacturing method |
| WO2002068558A1 (en) * | 2001-02-22 | 2002-09-06 | Shin-Etsu Chemical Co., Ltd. | Water-based water repellant for treatment of substrates |
| EP1362904A4 (en) * | 2001-02-22 | 2004-09-15 | Shinetsu Chemical Co | Water-based water repellant for treatment of substrates |
| US6916507B2 (en) | 2001-02-22 | 2005-07-12 | Shin-Etsu Chemical Co., Ltd. | Aqueous water repellent for substrate treatment, making method, preparation of modified plywood or modified laminated veneer lumber, and preparation of wooden fiberboard |
| JP2006517601A (en) * | 2003-01-21 | 2006-07-27 | エクソンモービル リサーチ アンド エンジニアリング カンパニー | Wax compositions for building board applications |
| KR100603126B1 (en) | 2004-06-22 | 2006-07-20 | 주식회사 엘지화학 | Particleboard coated with a novel waterproofing composition |
| JP2012045789A (en) * | 2010-08-25 | 2012-03-08 | Panasonic Electric Works Co Ltd | Method of manufacturing ligneous decorative plate |
| CN102825643A (en) * | 2011-06-13 | 2012-12-19 | 承泰丰木业有限公司 | Waterproof dense board |
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