JPH11224895A - Disc jig for removing particles and method for controlling particles using the jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a disc jig for removing particles, capable of inspecting and removing particles of a wafer conveyance means without wasting wafers, and using the same, to provide a method for controlling particles capable of preventing sudden increase of particles and the occurrence of an abnormal condition on the wafer holding surface of the wafer conveyance means. SOLUTION: A disc jig for removing particles 10 has a disc which can be held and conveyed, as well as a wafer by a wafer conveyance means, and the function of adsorbing particles on the surface 11a facing opposite to the wafer holding surface of the wafer conveyance means. The disc jig for 10 is conveyed by the wafer conveyance means to adsorb the particles on the wafer holding surface of the wafer conveyance means, and the adsorbed particles are detected, and particle adherence status is controlled on the basis of the detection data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk jig for removing particles and a particle management method using the disk jig, and more particularly, to a circle corresponding to a wafer that can be transferred by a wafer transfer means in the same manner as a wafer. It has a plate shape,
A particle removing disk jig having a particle suction function on a surface of the wafer transfer means opposed to the wafer holding surface, and transferring the disk jig to suck and adsorb particles on the wafer holding surface side of the transfer means. The present invention relates to a particle management method for managing a particle generation state based on detected particle detection data.

[0002]

2. Description of the Related Art At present, in the VLSI manufacturing technology, demands for higher precision, lower cost, and higher throughput of manufacturing equipment have been further increased, and higher integration has been pursued due to miniaturization of devices. Cost reduction is being promoted. When particles (dust) adhere to the surface of such a highly integrated LSI, the yield is reduced and the cost per chip is increased. Further, in the case of a finer pattern, even a small particle that has not been a problem until now is fatally affected.

[0003] Therefore, completely unmanned clean rooms,
Particles are reduced by various methods such as sealing of equipment and wafers. In the future, for more strict particle management, it is required to further actively reduce particles generated in the manufacturing apparatus.

As a method for removing particles in such a semiconductor manufacturing apparatus, see, for example, JP-A-3-1863.
No. 64, a wafer-type particle adsorber,
Alternatively, a particle adsorbing device disclosed in JP-A-3-185706 is known.

The above-mentioned wafer type particle adsorber is
`` An electrode for adsorbing particles and a power supply unit for applying a high DC voltage to the electrode are formed on a substrate having substantially the same shape as the semiconductor wafer, and a high DC voltage is applied to the electrode to generate an electrostatic field around the electrode. This causes the particles floating in the semiconductor manufacturing apparatus to be attracted to the electrode by the electrostatic field. "

[0006] Further, the above particle adsorbing device includes:
"A particle adsorber formed on a substrate having substantially the same shape as a semiconductor wafer, an electrode for adsorbing particles, and a photovoltaic element for applying a high DC voltage to the electrode, and applying light to the photovoltaic element. A light irradiator for irradiating the light, the light irradiator irradiates light to the photovoltaic element, and applies a high DC voltage to the electrode by the photovoltaic effect to generate an electrostatic field around the electrode, thereby producing a semiconductor. The particles floating in the apparatus are adsorbed to the electrodes by the electrostatic field. " Both the adsorber and the adsorption device adsorb and remove particles floating in the semiconductor manufacturing apparatus.

[0007] In a semiconductor manufacturing apparatus, particles peculiar to the processing are generated in various steps such as wafer transfer, heat treatment, application of a chemical solution, and exposure. Such particles may not only float in the air, but also adhere to various parts in the apparatus, become dust, and adhere again to the wafer. In particular, particles adhering to the wafer transfer device in the apparatus pose a problem since they are highly likely to be transferred to the wafer. Such a problem cannot be solved by the floating particle adsorption means described in the above-mentioned publication.

For example, in a spin coating apparatus used for resist coating, an arm for mounting, holding and transporting a wafer is provided for transferring the wafer to a coater cup, and a chuck for holding the wafer is provided on this arm. ing. The wafer is mounted and supported on the upper surface of the arm having the chuck, and transferred.
If foreign matter such as particles adheres to the upper surface of the arm (wafer holding surface), the particles move and adhere to the lower surface (back surface) of the wafer during transfer. Particles adhering to the back surface of the wafer are diffused to other processes by moving the wafer to another process, and as a result, cause particle contamination by the wafer in each processing process.

When the particles diffused in these portions adhere to the device forming surface of the wafer surface, they may give a fatal defect to the wafer, thereby lowering the yield. In addition, when particles adhere to the back surface of the wafer, the mounted wafer is tilted to cause, for example, a shift at the time of exposure.

Particles that become dust are generated by internal factors such as contamination of a chemical solution used for wafer processing, rubbing and abrasion of a belt used in a robot transfer device for transferring a wafer, or by humans during maintenance work of the device. It is caused by external factors such as dust brought in.

The generated particles are removed by down-flow of air in a clean room, filtering of a chemical solution or air, or cleaning during maintenance work. Further, with respect to the chemical solution used for wafer processing, the particle generation status is monitored using a particle monitor.

For particles adhering to a wafer holding surface such as an arm provided with a chuck for transferring a wafer to each processing step, an actual wafer is used when the apparatus is started at the start of processing or at regular intervals. The wafer is mounted on an arm and transported with the element forming surface (mirror surface) on the front side facing downward, and particles deposited on the wafer holding surface on the upper surface of the arm are attached to the wafer mirror surface and detected. Based on this particle inspection, we monitor the status of particle contamination on the transfer arm,
Particles were removed from the wafer holding surface of the transfer arm.

[0013]

However, when inspecting particles adhering to the wafer holding surface of the wafer transfer means by inspecting the state of particle adhesion using the wafer, the particles are attached to the inspection wafer once transferred. Since they adhere, they are discarded after the inspection, and new ones are used each time the inspection is performed, and the wafer is wasted. For this reason, the inspection of the state of adhesion of particles is performed at regular intervals in consideration of the waste of the wafer, and the discovery is delayed due to sudden increase of particles or occurrence of abnormalities on the wafer holding surface of the wafer transfer means. Appropriate measures may not be taken. If the discovery is delayed, it is actually unknown until it is detected by the inspection process on the wafer after the end of the manufacturing process. Therefore, when a large number of fatal defects occur, the influence on the lot is large, and the yield is greatly reduced.

The present invention has been made in consideration of the above-mentioned prior art, and has a particle removing disk jig capable of inspecting and removing particles on a wafer holding surface of a wafer transfer means without wasting a wafer. In addition, particles can be inspected and removed from the wafer holding surface of the wafer transfer means without wasting the wafer, and sudden increase in particles and occurrence of abnormalities on the wafer holding surface of the wafer transfer means can be prevented. An object of the present invention is to provide a particle management method using a disk jig for removing particles.

[0015]

In order to achieve the above object, the present invention provides a disk-shaped plate which can be held and transferred in the same manner as a wafer by wafer transfer means for transferring the wafer to each processing step in a semiconductor manufacturing apparatus. And a particle removing jig provided with a particle suction function on a surface of the wafer transfer means facing the wafer holding surface.

According to the above configuration, the particle removing disk jig is held by the wafer transfer means by bringing the surface having the particle suction function into contact with the wafer holding surface of the wafer transfer means. It is transported similarly. As a result, particles adhering to the wafer holding surface (upper surface) of the wafer transfer means are attracted to the surface (lower surface) of the disk jig mounted and held thereon, which has a particle suction function, and Since the particles are removed from the wafer holding surface, the state of particle adhesion can be inspected without using the wafer and wasting the wafer. At the same time as this inspection, the wafer holding surface of the wafer transfer means can be cleaned.

In order to achieve the above object, according to the present invention, there is provided a disk shape capable of holding and transporting a wafer in the same manner as a wafer by wafer transport means for transporting the wafer to each processing step in a semiconductor manufacturing apparatus, A wafer holding surface of the transfer unit is transported by the wafer transfer unit using a particle removing disk jig having a particle suction function on a surface of the wafer transfer unit facing the wafer holding surface. A particle removal jig which detects particles adsorbed on the disk jig, and manages a particle generation state in the semiconductor manufacturing apparatus based on the detection data. Provided particle management method.

According to the above arrangement, the particles are removed from the wafer holding surface of the wafer transfer means by transferring the disk jig for removing particles, and particle detection data is obtained from the removed particles. This makes it possible to increase the number of inspections of the state of particle adhesion without wasting the actual wafer, and to reliably monitor the state of particle adhesion on the wafer holding surface of the wafer transfer means, It is possible to prevent sudden increase in particles and occurrence of abnormalities on the wafer holding surface of the transfer means.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B show a disk jig for removing particles according to an embodiment of the present invention, wherein FIG. 1A is a plan view and FIG. 1B is a partial sectional view.

As shown in FIG. 1, a disk jig 10 for removing particles is moved in the same manner as a wafer by a wafer transfer means (not shown) including a robot arm for transferring a wafer to each processing step in a semiconductor manufacturing apparatus. It has the same shape as the wafer so that it can be held and transported,
For example, it is formed of a resin material or the like. Such a disk jig 10 is gripped and transported in the same manner as a wafer by an arm provided with a wafer gripper for transferring the wafer to a coater cup, for example, in a resist coating process.

This particle removing disk jig 10
A disk-shaped substrate 11 corresponding to a wafer;
1 and a particle adsorbing section 12 provided on a lower surface (a surface facing the arm) 11a (see (B)). The particle adsorbing section 12 is made of, for example, butyl rubber, a repetitively usable weak adhesive glue used for a peelable label or the like, or a vinyl chloride sheet charged by static electricity. It has an adsorption function. Particles adsorbed by the particle adsorption section 12 by the particle adsorption function can be easily removed by washing.

When inspecting the state of adhesion of particles on the wafer transfer arm and cleaning the same using the particle removing disk jig 10 having the above-described configuration, the arm can be used to make the disk jig similar to an actual wafer. And transported to each processing step of the semiconductor manufacturing apparatus. At this time, the processing is not performed in each processing step, and is simply conveyed so as to pass through the path of each processing step.

The disk removing jig 10 transported and moved in each processing step is held by the wafer transport means of each processing step each time the transporting movement is performed, and is carried out by the particle suction unit 1.
2 contacts the wafer holding surface of the wafer transfer means. The particles adhering to the wafer holding surface of the wafer transfer means are attracted to the particle suction unit 12 by the contact of the particle suction unit 12, and the particles are removed from the wafer holding surface of the wafer transfer means.

The particles adsorbed by the particle adsorbing section 12 are removed by washing, so that the particle removing disk jig 10 can be washed and used repeatedly.

Therefore, the disk jig 10 for removing particles
Can be used repeatedly to inspect and clean the state of particle adhesion on the wafer holding surface of the wafer transfer means, so that a new wafer is used every time the particle adhesion inspection is performed and the wafer is not discarded after use. Never waste anything. Also,
Particle removal work that removes particles from the wafer holding surface of the wafer transfer means can be performed for each inspection.
The particle inspection and the cleaning of the transporting means are performed simultaneously, so that maintenance can be performed efficiently. In addition, by periodically carrying the disk jig 10 for removing particles, it is possible to monitor the amount of particles accumulated on the wafer holding surface of the wafer carrying means so as not to exceed a certain amount.

Next, a method for managing particles using the above-described disk jig for removing particles will be described. FIG. 2 is an explanatory diagram showing a schematic configuration of a particle management system using the particle removing disk jig of FIG.
As shown in FIG. 2, the semiconductor manufacturing apparatus 13 includes a storage 14 in which wafers to be processed are stored for each lot, a wafer transfer means 15 such as a robot arm, and a processing unit 16. One or a plurality of processing units 16 are provided. When a plurality of processing units 16 are provided, the transport unit 15 is provided for each processing unit. By the semiconductor manufacturing apparatus 13, the wafer is taken out of the storage 14 via the wafer transfer means 15 and then transferred between the plurality of processing units 16, and passes through the semiconductor manufacturing process including each processing step. The semiconductor manufacturing apparatus 13 is provided with a dust inspection apparatus 17 and a cleaning apparatus 18 such as a wafer cleaning apparatus or a dedicated particle suction unit cleaning apparatus.

In the semiconductor manufacturing apparatus 13, each processing of one to several lots of wafers is performed, and then the particle removing disk jig 10 stored in the storage 14 is taken out by the wafer transfer means 15 to carry out wafer processing. It is transported so as to follow the same processing path. At this time, the processing in each processing step is not performed, and only the transport passing through the path of each processing is performed. After being conveyed, the particle jig 10 for particle removal is returned to the hangar 14, and then the dust inspection device 17.
As a result, the particles (dust) adsorbed on the particle adsorption unit 12 are inspected, and the particles adsorbed on the particle adsorption unit 12 after being cleaned by the cleaning device 18 are removed.

FIGS. 3 to 10 show first to eighth examples of the particle management method by the particle management system of FIG.
6 is a flowchart showing an example of the above.

(First Example) First of Particle Management Methods
In the example of FIG. 3, as shown in FIG. 3, after the wafer processing is completed, one particle removal disk jig is used to set the wafer processing path for all the processing units of the semiconductor manufacturing apparatus along the flow of the wafer processing. Transport is performed. By the transfer, the particles adhering to the wafer holding surface of the wafer transfer means of all the processing units are sucked to the particle suction surface of the particle removal disk jig,
Particles are removed from the wafer holding surface of the wafer transfer means.

After the transfer, the particle removing disk jig is manually operated (indicated by a dotted line in the figure, and the same applies hereinafter).
The particles are taken into the garbage inspection device and subjected to particle inspection.
By this particle inspection, the adsorbed particles are classified and weighed, and the type, the amount of adhesion, and the like of the particles are detected. Based on the detected data, the amount and cause of generation of particles at that time are confirmed, and countermeasures such as cleaning the semiconductor manufacturing apparatus or eliminating the generation of particles are taken. After the particle inspection, the particle removing disk jig is manually brought into the cleaning device, and the particles that have been washed and adsorbed are removed. After the particles are removed by cleaning, the disk jig for particle removal is stored in the hangar and reused.

As described above, since the state of adhesion of particles on the wafer holding surface of the wafer transfer means can be inspected without wasting the wafer, the number of inspections can be increased, and the detection data of the type and the amount of adhesion of the particles can be increased. The reliability can be improved, and the reliability of quality control can be improved. Furthermore, since the removal of particles from the wafer holding surface of the wafer transfer means can be performed at the same time, cleaning and maintenance can be performed efficiently, and sudden increase of particles and occurrence of abnormalities on the wafer holding surface of the wafer transfer means can be prevented. Can be prevented.

(Second Example) The second example of the particle management method
In the example of FIG. 4, as shown in FIG. 4, after the wafer processing, the wafer for one of all the processing units is processed by one particle removing disk jig along the flow of the wafer processing. The transport of the processing path is performed. By the transfer, the particles adhering to the wafer holding surface of the wafer transfer means of one unit that has been transferred are suctioned to the particle suction surface of the disk jig for particle removal.

After the transportation is completed, the particle removing disk jig is brought into the dust inspection device by hand as in the first example, and the particle inspection is performed. After the particle inspection, the cleaning device is manually inserted. The particles that have been brought into and washed and adsorbed are removed. Then, it is stored in the hangar. As a result, for each unit, the particles adhering to the wafer holding surface of the wafer transfer means,
The same operation and effect as those of the example are obtained.

(Third example) The third example of the particle management method
In the example, the dust inspection device and the cleaning device are built in the semiconductor manufacturing device, and controlled by control means (not shown),
The disk removing jig for particle removal is automatically transferred by the wafer transfer means. As shown in FIG. 5, the disk jig for removing particles after the transfer is automatically brought into the refuse inspection apparatus (indicated by a solid line in the figure; the same applies hereinafter), and then automatically sent to the cleaning apparatus. By being brought in and automatically stored in the hangar, in-line processing of the disk jig for particle removal becomes possible.

As a result, there is no need to manually bring the apparatus into the dust inspection apparatus and the cleaning apparatus, and the disk jig for particle removal can be automatically and periodically operated under any set conditions. As a result, the inspection of the state of adhesion of particles and the removal of particles from the wafer holding surface of the wafer transfer means can be performed efficiently without any trouble, and the frequency of inspection can be further increased, and the reliability and quality control of inspection can be improved. Reliability can be further improved. Other configurations,
The function and effect are the same as those of the first example.

(Fourth Example) The fourth example of the particle management method
In the example, the number of disk removing jigs corresponding to all the processing units is prepared. As shown in FIG. 6, the wafer processing path is simultaneously transferred to each of all the processing units by the all-particle-removing disk jig, and the particle-removing disk jig is simultaneously transferred to each of the processing units. It is processed. Therefore, the particle inspection of all the processing units is efficiently performed in a short time. This makes it possible to inspect each processing unit at a high frequency using the disk jig for removing particles. Other configurations, operations, and effects are the same as those of the second example.

(Fifth Example) Fifth Particle Management Method
In the example, the first example is applied to, for example, a coater developer or a stepper in a lithography process.

As shown in FIG. 7, the disk jig for removing particles passes through a first oven for dehydration and a first cooling plate (cooling plate) from an HMDS processing (surface resist adhesion processing) oven. It is sent to the coater developer for coating and is carried into the first coater cup. The disk jig for particle removal carried into the first coater cup passes through the second oven and the second cooling plate, and then passes through the second coater cup for top coating, and then the third oven and the third cooling. After being put on the plate, it is sent to the stepper.

The stepper is mounted on a stage using a transfer arm as a wafer transfer means, and then returns to the coater developer again by the transfer arm. The particle removal disk jig returned to the coater developer
After passing through the oven and the fourth cooling plate and being transported to the developing cup, the sheet passes through the fifth oven and the fifth cooling plate, and the conveyance is completed.

After the transportation is completed, the particle removing disk jig is brought into the dust inspection device by hand as in the first example, subjected to particle inspection, and further brought into the cleaning device through hand. The particles that have been washed and adsorbed are removed. Then, it is stored in the hangar.

As a result, in the coater developer or the stepper in the lithography process, the function and effect of the disk jig can be obtained as in the first example. In this case, the cost for managing particles adhering to the wafer holding surface of the wafer transfer means is reduced by about 40% as compared with the case where a conventional wafer is used.

(Sixth Example) The sixth example of the particle management method
In the example of (1), the cleaning device is attached to the coater cup of the coater developer using the dust inspection device provided in the stepper in the dust inspection device of the fifth example. Therefore, as shown in FIG. 8, the disc jig for removing particles after being conveyed is controlled by a control device (not shown) and is automatically brought into the refuse inspection device, and then, automatically, the jig cleaning device. And then automatically stored in the hangar, thereby enabling inline processing of the particle removing disk jig.

Therefore, it is possible to automatically and periodically operate the disk removing jig under arbitrary setting conditions.
Under the automatic operation, when the detection data indicates that particles having a predetermined threshold or more are generated, for example, a warning such as a sound or a light may be issued to notify the user of the occurrence. . As a result, the influence of the particles can be minimized, and the yield of the wafer is increased by about 2%. Other configurations, functions and effects are described in the fifth.
Is the same as in the example.

(Seventh Example) The seventh example of the particle management method
In the above example, the second example (see FIG. 4) is applied to, for example, a coater developer or a stepper in a lithography process.

As shown in FIG. 9, the wafer processing path is transported to any one of the units such as the HMDS oven, the third oven, and the fifth cooling plate by one disk removing jig. Done. By the transfer, the particles adhering to the wafer holding surface of the wafer transfer means of the transfer unit are sucked and removed from the particle suction surface of the particle removing disk jig. As a result, it is possible to obtain the function and effect of detecting and removing particles attached to the wafer holding surface of the wafer transfer means for each unit by using a disk jig as in the second example. In this case, in particular, it is possible to promptly respond to a sudden increase in particles, and it is possible to find the cause of the generation of the particles in about half the time required in the related art. In FIG. 9, the wafer after the transfer is passed through the unit to the inspection, cleaning, and hangars manually (see the dotted line). However, the wafer may be transferred automatically.

(Eighth example) Eighth example of the particle management method
In the seventh example, in the seventh example (see FIG. 9), the transport of the particle removing disk jig in the lithography process is performed simultaneously in parallel on the wafer processing paths of all the processing units.

As shown in FIG. 10, a total of 15 particle removing disk jigs corresponding to all the processing units are prepared. The breakdown is 5 sheets for the oven, 5 sheets for the cooling plate, 2 sheets for the coating cup, 1 sheet for the HMDS, 1 sheet for the stepper, and 1 sheet for the developing cup. With these particle removing disk jigs, all the processing units in the lithography process, such as the HMDS oven, the third oven, or the fifth cooling plate, are simultaneously transported in parallel to the wafer processing path. By this parallel transfer, particles adhering to the wafer holding surfaces of the wafer transfer means of the corresponding processing units are simultaneously sucked and removed from the particle suction surfaces of all the particle removing disk jigs.

As a result, when inspection is performed for each unit using one disk removing jig, inspection and cleaning of the particles adsorbed on the particle adsorption surface are required each time. Since the inspection of the next unit can be performed at the same time without waiting for the completion of such inspection or cleaning, efficient inspection can be performed, and high-speed inspection can be performed. Therefore, for the particles generated on the wafer holding surface of the wafer transfer means of all the processing units, the same operation and effect as in the seventh example are obtained by using the disc jig,
The time required for the processing can be reduced to about 1/10. Also in this example, the wafer after unit transfer may be automatically transferred without manual operation (see the dotted line).

As described above, according to the particle management method using the above-described disk jig for removing particles, in the semiconductor manufacturing process, the operation of removing particles adhering to the wafer holding surface of the wafer transfer means without wasting the wafer. Therefore, the number of times of the inspection process can be increased, the particle generation check can be reliably performed, the reliability of the detection data can be increased, and the reliability of quality control can be increased.
In addition, since the removal operation can be performed periodically or automatically as necessary, monitoring of the wafer holding surface of the wafer transfer means can be performed more reliably, and sudden increase in particles and occurrence of abnormalities can be prevented. It can be prevented beforehand.
Therefore, it is possible to prevent the occurrence of a large number of fatal defects in the wafer due to the adhesion of particles, which can greatly contribute to improvement in yield.

In the above embodiment, the lithography process is described as an example. However, the present invention is not limited to this, and the present invention is applicable to various other processes of the semiconductor manufacturing apparatus.

[0051]

As described above, according to the disk jig for removing particles according to the present invention, the disk jig for removing particles has a surface provided with a particle suction function and a wafer holding surface of the wafer transfer means. The wafers are held by the wafer transfer means in contact with the wafer, and are transferred to the respective processing steps in the same manner as the wafer, so that the particles adhering to the wafer holding surface of the wafer transfer means are suctioned to the surface having the particle suction function, and The particles are removed from the wafer holding surface. Therefore, the state of generation of particles can be inspected without wasting the wafer, and the removal operation can be performed at the same time. As a result, highly reliable inspection and efficient cleaning and maintenance can be achieved.

Further, according to the particle management method using the particle removing disk jig according to the present invention, the particles are removed from the wafer holding surface of the wafer transfer means by the particle removing disk jig. Particle detection data can be obtained from the collected particles, which makes it possible to inspect the adhesion state of the particles without wasting the wafer, and to reliably monitor the adhesion state of the particles on the wafer holding surface of the wafer transfer means. Can be. For this reason, the reliability of quality control is improved, and it is possible to prevent sudden increase in particles and occurrence of abnormalities on the wafer holding surface of the wafer transfer means.

[Brief description of the drawings]

1A and 1B show a disk jig for removing particles according to an embodiment of the present invention, wherein FIG. 1A is a plan view and FIG.

FIG. 2 is an explanatory view showing a schematic configuration of a particle management system using the particle removing disk jig of FIG. 1;

FIG. 3 is a flowchart showing a first example of a particle management method by the particle management system of FIG. 2;

FIG. 4 is a flowchart illustrating a second example of the particle management method by the particle management system in FIG. 2;

FIG. 5 is a flowchart illustrating a third example of the particle management method by the particle management system in FIG. 2;

FIG. 6 is a flowchart illustrating a fourth example of the particle management method by the particle management system in FIG. 2;

FIG. 7 is a flowchart illustrating a fifth example of the particle management method by the particle management system in FIG. 2;

FIG. 8 is a flowchart illustrating a sixth example of the particle management method by the particle management system in FIG. 2;

FIG. 9 is a flowchart illustrating a seventh example of the particle management method by the particle management system in FIG. 2;

FIG. 10 is a flowchart illustrating an eighth example of the particle management method by the particle management system in FIG. 2;

[Explanation of symbols]

10: disk jig for removing particles, 11: substrate, 11
a: surface facing the arm, 12: particle adsorption portion,
13: semiconductor manufacturing equipment, 14: hangar, 15: wafer transfer means, 16: processing unit, 17: refuse inspection device,
18: Cleaning device.

Claims (3)

[Claims] 1. A wafer transfer means for transferring a wafer to each processing step in a semiconductor manufacturing apparatus, having a disk shape capable of being held and transferred in the same manner as a wafer, and a surface opposed to a wafer holding surface of the wafer transfer means. A disk jig for removing particles, further comprising a particle absorbing function. 2. The disk jig for removing particles according to claim 1, wherein the particles adsorbed by the particle adsorbing function can be removed by washing. 3. A wafer transfer means for transferring a wafer to each processing step in a semiconductor manufacturing apparatus, having a disk shape capable of being held and transferred in the same manner as a wafer, and a surface facing the wafer holding surface of the wafer transfer means. A disc jig for removing particles having a particle adsorbing function, the disc jig is conveyed by the wafer conveyance means to adsorb particles on the wafer holding surface of the conveyance means, and the disc jig is A particle management method using a disk jig for removing particles, comprising detecting adsorbed particles and managing a particle generation state in the semiconductor manufacturing apparatus based on the detected data.